KR20050032180A - Method and apparatus for laminating film onto wafer in the back grinding process - Google Patents

Method and apparatus for laminating film onto wafer in the back grinding process Download PDF

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Publication number
KR20050032180A
KR20050032180A KR1020030068194A KR20030068194A KR20050032180A KR 20050032180 A KR20050032180 A KR 20050032180A KR 1020030068194 A KR1020030068194 A KR 1020030068194A KR 20030068194 A KR20030068194 A KR 20030068194A KR 20050032180 A KR20050032180 A KR 20050032180A
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wafer
film
protective film
film liquid
rotating
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KR1020030068194A
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Korean (ko)
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이근화
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동부아남반도체 주식회사
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Priority to KR1020030068194A priority Critical patent/KR20050032180A/en
Publication of KR20050032180A publication Critical patent/KR20050032180A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A method and apparatus of attaching a wafer protecting film are provided to prevent the damage of a wafer due to a roller and a cutter by forming uniformly the wafer protecting film on the wafer using a spin coating manner. A wafer(W) is rotated at a predetermined speed. A predetermined amount of film solution is supplied to the wafer by using a film solution dispense nozzle(50). The supplied film solution is uniformly coated on the wafer by using centrifugal force. Unnecessary residuals of the film solution is exhausted through an exhaust port(70). A protecting film is completed on the wafer due to solidification.

Description

웨이퍼 보호용 보호필림 부착방법 및 장치{METHOD AND APPARATUS FOR LAMINATING FILM ONTO WAFER IN THE BACK GRINDING PROCESS}Method and device for attaching protective film for wafer protection {METHOD AND APPARATUS FOR LAMINATING FILM ONTO WAFER IN THE BACK GRINDING PROCESS}

본 발명은 반도체 웨이퍼(wafer)의 이면연마(back grinding) 공정전, 웨이퍼의 앞면 보호를 위한 보호필림을 부착시키는 기술에 관한 것으로써, 더욱 상세하게는 롤러와 커터에 의한 손상을 동시에 방지하도록 스핀 코팅(spin coating) 방식으로 보호필림 같은 역할을 생성시키는 웨이퍼 보호용 보호필림 부착방법 및 장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for attaching a protective film for protecting the front surface of a wafer before a back grinding process of a semiconductor wafer, and more particularly, spins to prevent damage caused by a roller and a cutter at the same time. The present invention relates to a method and apparatus for attaching a protective film for protecting a wafer, which creates a protective film-like role by a spin coating method.

일반적으로, 반도체 웨이퍼 제조공정에서 칩(chip)화하기 이전에 웨이퍼의 두께 축소 및 웨이퍼 뒷면의 이물 제거를 위해 이면연마를 하게 되는데, 이때 전처리 작업으로 웨이퍼 앞면의 회로패턴을 보호하기 위하여 보호필림을 웨이퍼 앞면에 접착시키는 라미네이팅(laminating) 작업이 실시된다.In general, back grinding is performed to reduce the thickness of the wafer and remove foreign substances on the back side of the wafer before chipping in the semiconductor wafer manufacturing process. A laminating operation is performed to bond the wafer front side.

도 1을 참조로, 상술한 라미네이팅 작업을 설명하면 다음과 같다.Referring to Figure 1, the above-described laminating operation will be described.

웨이퍼(W)의 상면이 상방을 향하도록 척 테이블(chuck table)(2)에 안착된 상태에서 보호필림(4)을 웨이퍼(W)의 상면으로 진행시키고, 롤러(roller)(6)를 이용하여 보호필림(4)을 압착시킴으로써, 웨이퍼(W)의 상면에 보호필림(4)이 부착되도록 하며, 부착이 완료된 보호필림(4)은 직선 이동용과 회전용 커터(cutter)(8)에 의해 웨이퍼(W)의 플랫존(flat zone)과 가장자리에 맞도록 웨이퍼(W)의 모양대로 커팅되게 된다.The protective film 4 is advanced to the upper surface of the wafer W while the upper surface of the wafer W is seated on the chuck table 2 so that the upper surface of the wafer W faces upward, and the roller 6 is used. By pressing the protective film 4, the protective film 4 is attached to the upper surface of the wafer (W), the protective film 4 is completed by the linear movement and the rotating cutter (8) The wafer W is cut in the shape of the wafer W so as to conform to the flat zone and the edge of the wafer W.

그러나, 이러한 라미네이팅 작업이 진행되는 과정에서 보호필림(4)과 웨이퍼(W)의 상면 사이에 접착력이 증대되도록 롤러(6)를 가압하며, 이는 웨이퍼(W)에 손상을 줄 수 있는 원인이 되며, 특히 보호필림(4) 아래에 파티클(particle) 존재시 가압되는 롤러(6)로 인한 웨이퍼(W) 깨짐(broken)이 발생될 수 있다.However, during the laminating process, the roller 6 is pressed to increase the adhesive force between the protective film 4 and the upper surface of the wafer W, which may cause damage to the wafer W. In particular, a crack in the wafer W may occur due to the roller 6 being pressed in the presence of particles under the protective film 4.

그리고, 상태가 양호하지 않은 커터(8)의 사용시 웨이퍼(W)의 에지(edge)부가 칼날에 의해 손상을 받게 되어 이후 진행되는 이면연마 공정에서 웨이퍼(W)에 크랙(crack)이 발생되게 되며, 특히 커터(8)에 의한 웨이퍼(W) 칩핑(chipping)의 문제도 간헐적으로 발생된다.In addition, when the cutter 8 is in poor condition, the edge portion of the wafer W is damaged by the blade, and cracks are generated in the wafer W in the subsequent back polishing process. In particular, the problem of chipping the wafer W by the cutter 8 also occurs intermittently.

나아가, 원활한 작업을 위해서는 롤러(6)의 정렬(align) 상태 및 커터(8) 칼날의 예리함(sharpness) 정도의 관리가 매우 중요하므로, 그 관리에 많은 노력이 소요되고 있는 실정이다.Furthermore, since the management of the alignment state of the roller 6 and the degree of sharpness of the cutter 8 is very important for smooth operation, much effort is required for the management.

본 발명은 상기와 같은 제반 문제점을 해결하기 위하여 창안된 것으로써, 롤러와 커터로 인한 손상을 방지하기 위하여 액체상태의 필림액을 스핀 코팅(spin coating) 방식으로 웨이퍼상에 균일하게 도포하여 고형화되도록 함으로써 보호필림을 생성시키는 웨이퍼 보호용 보호필림 부착방법 및 장치를 제공하는데 그 목적이 있다.The present invention was devised to solve the above problems, and in order to solidify by uniformly applying the liquid film liquid on the wafer by spin coating to prevent damage caused by rollers and cutters. It is an object of the present invention to provide a method and an apparatus for attaching a protective film for wafer protection, thereby producing a protective film.

상술한 목적을 달성하기 위한 본 발명은, 반도체 웨이퍼의 이면연마(back grinding) 공정전, 상기 웨이퍼의 앞면 보호를 위한 보호필림을 부착시키는 방법에 있어서, 상기 웨이퍼가 회전되는 단계와, 일정한 속도를 유지한 상기 웨이퍼상에 소정량의 필림액이 공급되는 단계와, 상기 웨이퍼상에 공급된 상기 필림액이 원심력에 의해 균일하게 퍼져 코팅되는 단계와, 누출된 상기 필림액은 배출되는 단계와, 상기 웨이퍼상에 코팅된 상기 필림액이 고형화되어 보호필림이 생성되는 단계를 포함하는 웨이퍼 보호용 보호필림 부착방법을 제공한다.The present invention for achieving the above object, in the method of attaching a protective film for protecting the front surface of the wafer, before the back grinding process of the semiconductor wafer, the step of rotating the wafer and a constant speed Supplying a predetermined amount of film liquid onto the held wafer, coating the film liquid supplied on the wafer uniformly by coating by centrifugal force, discharging the leaked film liquid, and It provides a method for attaching a protective film for wafer protection comprising the step of solidifying the film liquid coated on the wafer to produce a protective film.

또한, 상술한 목적을 달성하기 위한 본 발명은, 반도체 웨이퍼의 이면연마 공정전, 상기 웨이퍼의 앞면 보호를 위한 보호필림을 부착시키는 장치에 있어서, 상기 웨이퍼를 회전시키는 회전수단과, 회전되는 상기 웨이퍼상에 소정량의 필림액을 공급하는 필림액 공급수단을 포함하는 웨이퍼 보호용 보호필림 부착장치를 제공한다.In addition, the present invention for achieving the above object, in the apparatus for attaching a protective film for protecting the front surface of the wafer before the back polishing process of the semiconductor wafer, the rotating means for rotating the wafer, and the wafer to be rotated Provided is a protective film attaching device for protecting a wafer, which comprises a film supplying means for supplying a predetermined amount of film to the film.

바람직하게, 상기 회전수단은, 상부가 개방된 용기형상의 보울 내부에 위치되고 상기 웨이퍼를 고정하는 웨이퍼 척과, 상기 웨이퍼 척에 체결되고 상기 보울의 하면을 관통하여 회전 가능하게 설치되는 회전축과, 전원이 인가되면 구동되어 상기 회전축을 회전시키도록 구비되는 구동부로 구성될 수 있다.Preferably, the rotating means includes a wafer chuck positioned inside the bowl-shaped bowl of which the upper part is open and fixing the wafer, a rotating shaft fastened to the wafer chuck and rotatably installed through the bottom surface of the bowl, and a power source. When it is applied may be composed of a drive unit is driven to rotate the rotary shaft.

그리고, 상기 필림액 공급수단은, 상기 웨이퍼 척상의 상기 웨이퍼에 필림액을 공급하도록 상기 웨이퍼 척으로부터 이격된 상부에 구비되는 필림액 디스펜스 노즐로 구성될 수 있다.The film liquid supplying means may be configured as a film liquid dispense nozzle disposed above the wafer chuck so as to supply the film liquid to the wafer on the wafer chuck.

본 발명의 상기 목적과 여러가지 장점은 이 기술분야에 숙련된 사람들에 의해 첨부된 도면을 참조하여 아래에 기술되는 발명의 바람직한 실시예로부터 더욱 명확하게 될 것이다.The above objects and various advantages of the present invention will become more apparent from the preferred embodiments of the invention described below with reference to the accompanying drawings by those skilled in the art.

이하, 첨부된 도면을 참조로 본 발명의 바람직한 실시예를 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 2는 본 발명의 바람직한 실시예에 따른 웨이퍼 보호용 보호필림 부착장치를 개략적으로 나타낸다.Figure 2 schematically shows a protective film attachment device for a wafer protection according to a preferred embodiment of the present invention.

본 발명에 따르면, 액체상태의 필림액을 웨이퍼(W)상에 도포하여 고형화되도록 함으로써 보호필림을 생성시키게 되며, 필림막의 엄격한 두께 조절 및 균일한 코팅을 위해 스핀 코팅(spin coating) 방식의 부착장치가 이용된다.According to the present invention, by applying the liquid film in the liquid state on the wafer (W) to solidify to produce a protective film, spin coating (spin coating) attachment device for strict thickness control and uniform coating of the film Is used.

상기 부착장치는 도시된 바와 같이, 상부가 개방된 보울(bowl)(60) 내부에 웨이퍼(W)가 놓여지는 웨이퍼 척(wafer chuck)(20)과, 웨이퍼 척(20)의 하부에 체결되고 보울(60) 하면을 관통하여 회전 가능하게 구비된 회전축(30)과, 회전축(30)의 다른 일단에 연결되어 웨이퍼 척(20)상에 놓여진 웨이퍼(W)를 회전시키기 위해 구동되는 구동부(40)와, 웨이퍼 척(20)으로부터 이격된 상부에 수직방향으로 상하로 이동 가능하게 위치하여 필림액을 공급하는 필림액 디스펜스 노즐(dispense nozzle)(50)을 포함한다.The attachment device is fastened to a wafer chuck 20 and a lower portion of the wafer chuck 20 in which the wafer W is placed inside a bowl 60 having an open top as shown. The driving unit 40 is driven to rotate the wafer 30 placed on the wafer chuck 20 connected to the other end of the rotary shaft 30 and the rotary shaft 30 rotatably provided through the bowl 60. And a film liquid dispensing nozzle 50 which is positioned so as to be movable upward and downward in the vertical direction on the upper part spaced apart from the wafer chuck 20 to supply the film liquid.

보울(60)은 상부가 개방된 용기형상으로, 상단이 웨이퍼 척(20)보다 높게 위치되어 필림액 코팅시 필림액이 외부로 튀는 것을 방지하는 형상을 갖으며, 그 하면을 관통하여 누출된 필림액을 배출하기 위한 배출구(70)가 적어도 하나 이상 구비된다.Bowl 60 is an open top of the container shape, the top is positioned higher than the wafer chuck 20 has a shape that prevents the film liquid from splashing to the outside when the film coating liquid coating, leaked through the lower surface of the film At least one outlet 70 for discharging the liquid is provided.

이러한 구성을 갖는 스핀 코팅 방식의 보호필림 부착장치의 작동을 간단히 설명하면, 보울(60)내의 웨이퍼 척(20)상에 웨이퍼(W)가 놓여져 고정되면, 전원이 인가됨으로써 회전되는 구동부(40)와 연동하여 회전축(30)이 회전되고, 이에 따라 웨이퍼 척(20)상에 고정된 웨이퍼(W)도 회전된다.When the operation of the spin coating protective film attaching device having such a configuration is briefly described, when the wafer W is placed and fixed on the wafer chuck 20 in the bowl 60, the driving unit 40 is rotated by applying power. In conjunction with the rotating shaft 30 is rotated, and thus the wafer (W) fixed on the wafer chuck 20 is also rotated.

이후, 웨이퍼(W)의 회전속도가 증가하여 일정해지면, 필림액 디스펜스 노즐(50)이 하방으로 이동하고, 필림액 디스펜스 노즐(50)을 통해 소정량의 필림액이 웨이퍼(W)상에 공급된다. 이때, 웨이퍼(W)는 일정속도로 고속 회전하고 있으므로 원심력에 의해 필림액이 웨이퍼(W)상에 균일하게 퍼져 코팅된다.Thereafter, when the rotational speed of the wafer W increases and becomes constant, the film liquid dispense nozzle 50 moves downward, and a predetermined amount of film liquid is supplied onto the wafer W through the film liquid dispense nozzle 50. do. At this time, since the wafer W rotates at a high speed at a constant speed, the film liquid is uniformly spread on the wafer W by the centrifugal force and coated.

또한, 원심력에 의해 웨이퍼(W)로부터 흩어져 누출된 필림액은 보울(60) 하부의 배출구(70)를 통해 배출된다.In addition, the film liquid scattered from the wafer W by the centrifugal force is discharged through the outlet 70 under the bowl 60.

여기서, 필림액이 웨이퍼(W)에 코팅되면, 필림액은 자체적으로 급속히 고형화되어 보호필림을 생성하며, 한편 필림액 디스펜스 노즐(50)은 상방으로 이동하고, 웨이퍼 척(20)의 회전이 정지되면, 보호필림이 생성된 웨이퍼(W)는 다음 공정으로 이송되게 된다.Here, when the film liquid is coated on the wafer W, the film liquid solidifies itself rapidly to produce a protective film, while the film liquid dispense nozzle 50 moves upward, and the rotation of the wafer chuck 20 is stopped. When the protective film is generated, the wafer W is transferred to the next process.

이상, 상기 내용은 본 발명의 바람직한 일 실시예를 단지 예시한 것으로 본 발명의 당업자는 본 발명의 요지를 변경시킴이 없이 본 발명에 대한 수정과 변경을 가할 수 있음을 인지해야 한다.In the foregoing description, it should be understood that those skilled in the art can make modifications and changes to the present invention without changing the gist of the present invention as merely illustrative of a preferred embodiment of the present invention.

본 발명에 따르면, 롤러와 커터에 의한 손상으로부터 자유로워져 웨이퍼의 생산수율이 크게 향상되는 효과가 달성될 수 있다.According to the present invention, the effect of freeing the damage caused by the rollers and the cutters and greatly improving the production yield of the wafer can be achieved.

도 1은 종래의 보호필림 부착장치를 도시한 개략도,1 is a schematic view showing a conventional protective film attachment device,

도 2는 본 발명에 따른 보호필림 부착장치를 도시한 개략도이다.Figure 2 is a schematic diagram showing a protective film attachment device according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

W : 웨이퍼(wafer) 2 : 척 테이블(chuck table)W: wafer 2: chuck table

4 : 보호필림(film) 6 : 롤러(roller)4: protective film (film) 6: roller (roller)

8 : 커터(cutter) 20 : 웨이퍼 척(wafer chuck)8 cutter 20 wafer chuck

30 : 회전축 40 : 구동부30: rotation shaft 40: drive unit

50 : 필림액 디스펜스 노즐(dispense nozzle)50: film liquid dispense nozzle

60 : 보울(bowl) 70 : 배출구60: bowl 70: outlet

Claims (4)

반도체 웨이퍼의 이면연마(back grinding) 공정전, 상기 웨이퍼의 앞면 보호를 위한 보호필림을 부착시키는 방법에 있어서,In the method of attaching a protective film for protecting the front surface of the wafer, before the back grinding process of the semiconductor wafer, 상기 웨이퍼가 회전되는 단계와,Rotating the wafer; 일정한 속도를 유지한 상기 웨이퍼상에 소정량의 필림액이 공급되는 단계와,Supplying a predetermined amount of film liquid onto the wafer at a constant speed; 상기 웨이퍼상에 공급된 상기 필림액이 원심력에 의해 균일하게 퍼져 코팅되는 단계와,Spreading and coating the film solution supplied on the wafer by centrifugal force; 누출된 상기 필림액은 배출되는 단계와,The leaked film solution is discharged, 상기 웨이퍼상에 코팅된 상기 필림액이 고형화되어 보호필림이 생성되는 단계를 포함하는 웨이퍼 보호용 보호필림 부착방법.And a protective film is formed by solidifying the film liquid coated on the wafer. 반도체 웨이퍼의 이면연마 공정전, 상기 웨이퍼의 앞면 보호를 위한 보호필림을 부착시키는 장치에 있어서,In the device for attaching a protective film for protecting the front surface of the wafer, before the back polishing process of the semiconductor wafer, 상기 웨이퍼를 회전시키는 회전수단과,Rotating means for rotating the wafer; 회전되는 상기 웨이퍼상에 소정량의 필림액을 공급하는 필림액 공급수단을 포함하는 웨이퍼 보호용 보호필림 부착장치.And a film liquid supplying means for supplying a predetermined amount of film liquid onto the rotated wafer. 제 2항에 있어서,The method of claim 2, 상기 회전수단은,The rotating means, 상부가 개방된 용기형상의 보울 내부에 위치되고 상기 웨이퍼를 고정하는 웨이퍼 척과,A wafer chuck positioned inside the bowl-shaped bowl of which the top is open and fixing the wafer; 상기 웨이퍼 척에 체결되고 상기 보울의 하면을 관통하여 회전 가능하게 설치되는 회전축과,A rotating shaft fastened to the wafer chuck and rotatably installed through a lower surface of the bowl; 전원이 인가되면 구동되어 상기 회전축을 회전시키도록 구비되는 구동부로 구성되는 것을 특징으로 하는 웨이퍼 보호용 보호필림 부착장치.The protective film attachment device for a wafer protection, characterized in that consisting of a drive unit which is driven when the power is applied to rotate the rotating shaft. 제 3항에 있어서,The method of claim 3, wherein 상기 필림액 공급수단은,The film liquid supply means, 상기 웨이퍼 척상의 상기 웨이퍼에 필림액을 공급하도록 상기 웨이퍼 척으로부터 이격된 상부에 구비되는 필림액 디스펜스 노즐로 구성되는 것을 특징으로 하는 웨이퍼 보호용 보호필림 부착장치.And a film liquid dispensing nozzle disposed above the wafer chuck so as to supply the film liquid to the wafer on the wafer chuck.
KR1020030068194A 2003-10-01 2003-10-01 Method and apparatus for laminating film onto wafer in the back grinding process KR20050032180A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100975094B1 (en) * 2010-05-25 2010-08-11 한국기계연구원 Pattern printing device and patter printing method
CN103658986A (en) * 2012-09-26 2014-03-26 株式会社迪思科 Laser processing device and protecting film covering method
CN110361455A (en) * 2019-06-18 2019-10-22 航天科工防御技术研究试验中心 A kind of mantle ultrasonic probe and preparation method thereof
CN114523210A (en) * 2020-11-04 2022-05-24 大族激光科技产业集团股份有限公司 Rotary cutting device and cutting method for wafer protective film

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100975094B1 (en) * 2010-05-25 2010-08-11 한국기계연구원 Pattern printing device and patter printing method
CN103658986A (en) * 2012-09-26 2014-03-26 株式会社迪思科 Laser processing device and protecting film covering method
CN103658986B (en) * 2012-09-26 2016-09-14 株式会社迪思科 Laser processing device and protecting film covering method
CN110361455A (en) * 2019-06-18 2019-10-22 航天科工防御技术研究试验中心 A kind of mantle ultrasonic probe and preparation method thereof
CN110361455B (en) * 2019-06-18 2022-03-08 航天科工防御技术研究试验中心 Soft film ultrasonic probe and preparation method thereof
CN114523210A (en) * 2020-11-04 2022-05-24 大族激光科技产业集团股份有限公司 Rotary cutting device and cutting method for wafer protective film

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