CN210025470U - Film cutting device - Google Patents

Film cutting device Download PDF

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Publication number
CN210025470U
CN210025470U CN201920342978.4U CN201920342978U CN210025470U CN 210025470 U CN210025470 U CN 210025470U CN 201920342978 U CN201920342978 U CN 201920342978U CN 210025470 U CN210025470 U CN 210025470U
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China
Prior art keywords
cutting
driving
assembly
lead screw
driving module
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CN201920342978.4U
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Chinese (zh)
Inventor
谢军
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Guangdong Siwo advanced equipment Co.,Ltd.
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Luoyang Sowo Precision Machinery Co Ltd
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Priority to CN201920342978.4U priority Critical patent/CN210025470U/en
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Abstract

The utility model discloses a film cutting device, which comprises a cutting component and a moving driving component for driving the cutting component to move; the mobile driving assembly comprises a supporting table, a first driving module arranged on the supporting table, a second driving module connected with the output end of the first driving module, and a third driving module connected with the output end of the second driving module; the cutting assembly comprises a cutting fixing platform, a cutter assembly and a cutting driving assembly which is arranged on the cutting fixing platform and used for driving the cutter assembly to complete cutting action. Remove drive assembly and drive cutting assembly and stretch into the clearance between last die cavity and the lower die cavity of pad pasting device, cutting assembly waits for the cutting product to cut the membrane to the wafer that accomplishes the pad pasting, realizes the separation of wafer and dry film with the dry film cutting along the boundary of waiting to cut the product, also need not to pull wafer and dry film from the clearance between last die cavity and the lower die cavity and can accomplish the cutting of dry film, has simplified the step of cutting the membrane, has promoted the efficiency of cutting the membrane.

Description

Film cutting device
Technical Field
The utility model relates to a cutting equipment is last field especially relates to a cut membrane device.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions.
In the existing production process of products such as wafers and the like, film pasting treatment needs to be carried out on finished products, generally, a dry film with a larger size is attached to the surfaces of the products such as the wafers and the like under the pressing action of matching an upper cavity and a lower cavity, then the wafers and the dry film are pulled away from a gap between the upper cavity and the lower cavity, and finally the products such as the wafers and the like are cut and separated from the dry film by using a film cutting mechanism. Because the wafer and the dry film need to be pulled away from the gap between the upper cavity and the lower cavity, the step of cutting the film is added, and the processing efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a cut membrane device aims at solving prior art, follows the problem of inefficiency of dry film cutting separation with products such as wafers.
To achieve the purpose, the utility model adopts the following technical proposal:
the film cutting device comprises a cutting assembly and a movement driving assembly for driving the cutting assembly to move; the mobile driving assembly comprises a supporting table, a first driving module arranged on the supporting table, a second driving module connected with the output end of the first driving module, and a third driving module connected with the output end of the second driving module; the cutting assembly comprises a cutting fixing table, a cutter assembly and a cutting driving assembly, wherein the cutting fixing table is connected with the output end of the third driving module, and the cutting driving assembly is arranged on the cutting fixing table and used for driving the cutter assembly to complete cutting action.
Further, the first driving module comprises a first driving motor arranged on the supporting table, a first lead screw shaft in transmission connection with the first driving motor, and a first lead screw nut matched with the first lead screw shaft; the second driving module is connected with the first lead screw nut.
Further, the second driving module comprises a first moving plate connected with the first lead screw nut, a second driving motor arranged on the first moving plate, a second lead screw shaft in transmission connection with the second driving motor, and a second lead screw nut matched with the second lead screw shaft; and the third driving module is connected with the second lead screw nut.
Further, the third driving module comprises a second moving plate connected with the second lead screw nut, a third driving motor arranged on the second moving plate, a third lead screw shaft in transmission connection with the third driving motor, and a third lead screw nut matched with the third lead screw shaft; the fixed platform is connected with the third lead screw nut.
Further, the first screw shaft and the second screw shaft are both arranged along the horizontal direction, and the first screw shaft and the second screw shaft are arranged vertically to each other; the third screw shaft is arranged along the vertical direction.
Furthermore, the cutting assembly also comprises a mounting plate arranged between the cutting driving assembly and the cutter assembly, and the cutter assembly is rotatably connected with the mounting plate; the cutting assembly further comprises a film breaking driving assembly used for driving the cutter assembly to rotate relative to the mounting plate so that the cutter assembly is abutted to the boundary of a product to be cut.
Further, the cutter assembly comprises a cutter holder rotatably connected with the mounting plate and a cutter fixedly mounted on the cutter holder.
Furthermore, the film breaking driving assembly comprises a rotating block which is rotatably connected with the tool apron and a driving cylinder of which the movable end is connected with the rotating block; the stiff end of drive actuating cylinder with the mounting panel rotates to be connected.
Furthermore, a first rotating seat is arranged on the cutter seat; the rotating block is rotatably connected with the first rotating seat.
Furthermore, a second rotating seat is arranged on the mounting plate; the fixed end of the driving cylinder is rotatably connected with the second rotating seat.
The utility model has the advantages that: remove drive assembly and drive cutting assembly and stretch into the clearance between last die cavity and the lower die cavity of pad pasting device, cutting assembly waits for the cutting product to cut the membrane to the wafer that accomplishes the pad pasting, realizes the separation of wafer and dry film with the dry film cutting along the boundary of waiting to cut the product, also need not to pull wafer and dry film from the clearance between last die cavity and the lower die cavity and can accomplish the cutting of dry film, has simplified the step of cutting the membrane, has promoted the efficiency of cutting the membrane.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic structural diagram of a film cutting device in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a first view angle of a cutting assembly according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a second view angle of the cutting assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a third viewing angle of the cutting assembly according to an embodiment of the present invention;
in the figure:
80. a cutting assembly; 90. a movement drive assembly; 901. a support table; 902. a first driving module; 9021. a first drive motor; 903. a second driving module; 9031. a first moving plate; 9032. a second drive motor; 904. a third driving module; 9041. a second moving plate; 9042. a third drive motor; 1. mounting a plate; 11. a second rotating base; 2. a cutter assembly; 21. a tool apron; 211. a first rotating base; 22. a cutter; 3. a rupture drive assembly; 31. rotating the block; 32. a driving cylinder; 4. a cutting drive assembly; 5. a connecting plate; 6. a product to be cut; 7. drying the film; 8. and (4) cutting the fixed table.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It will be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
The following describes the implementation of the present invention in detail with reference to specific embodiments.
As shown in fig. 1-4, an embodiment of the present invention provides a film cutting device, which includes a cutting assembly 80, and a movement driving assembly 90 for driving the cutting assembly 80 to move; the mobile driving assembly 90 comprises a support table 901, a first driving module 902 arranged on the support table 901, a second driving module 903 connected with the output end of the first driving module 902, and a third driving module 904 connected with the output end of the second driving module 903; the cutting assembly 80 comprises a cutting fixing table 8 connected with the output end of the third driving module 904, a cutter assembly 2, and a cutting driving assembly 4 arranged on the cutting fixing table 8 and used for driving the cutter assembly 2 to complete the cutting action.
The utility model discloses an in the embodiment, the membrane process of cutting membrane device does: remove drive assembly 90 and drive cutting assembly 80 and stretch into the clearance between last die cavity and the lower die cavity of pad pasting device, cutting assembly 80 waits for cutting product 6 to cut the membrane to the wafer that accomplishes the pad pasting, along waiting to cut the separation that the product 6's boundary realizes wafer and dry film 7 with the dry film 7 cutting, also need not to pull wafer and dry film 7 from the clearance between last die cavity and the lower die cavity and can accomplish the cutting of dry film 7, the step of cutting the membrane has been simplified, the efficiency of cutting the membrane has been promoted. Specifically, the second driving module 903 can drive the third driving module 904 to extend into a gap between the upper cavity and the lower cavity, so that the cutting assembly 80 connected with the output end of the third driving module 904 is positioned in the gap between the upper cavity and the lower cavity and finishes cutting the dry film 7 on the boundary of the wafer, the first driving module 902 can drive the second driving module 903 to multiple processing positions, and therefore, for a plurality of wafers, film sticking is finished between the upper cavity and the lower cavity at the same time, and film cutting can be finished on the plurality of wafers in sequence.
Further, please refer to fig. 1, as a specific embodiment of the film cutting device provided by the present invention, the first driving module 902 includes a first driving motor 9021 disposed on the supporting platform 901, a first lead screw shaft in transmission connection with the first driving motor 9021, and a first lead screw nut matched with the first lead screw shaft; the second driving module 903 is connected to the first lead screw nut. The first driving motor 9021 drives the second driving module 903 to integrally move through a screw pair formed by the first screw shaft and the first screw nut.
Further, please refer to fig. 1, as a specific embodiment of the film cutting device provided by the present invention, the second driving module 903 includes a first moving plate 9031 connected to the first lead screw nut, a second driving motor 9032 disposed on the first moving plate 9031, a second lead screw shaft in transmission connection with the second driving motor 9032, and a second lead screw nut matched with the second lead screw shaft; the third drive module 904 is coupled to the second lead screw nut. The first driving module 902 drives the second driving module 903 to integrally move through the first moving plate 9031, and the second driving motor 9032 drives the third driving module 904 to integrally move through a screw pair composed of the second screw shaft and the second screw nut.
Further, please refer to fig. 1, as a specific embodiment of the film cutting device provided by the present invention, the third driving module 904 includes a second moving plate 9041 connected to the second lead screw nut, a third driving motor 9042 disposed on the second moving plate 9041, a third lead screw shaft in transmission connection with the third driving motor 9042, and a third lead screw nut matched with the third lead screw shaft; the fixed platform is connected with the third screw nut. The second driving module 903 drives the third driving module 904 to integrally move through the second moving plate 9041, and the third driving motor 9042 drives the cutting assembly 80 to move through a screw pair composed of a third screw shaft and a third screw nut.
Further, referring to fig. 1, as a specific embodiment of the film cutting device provided by the present invention, the first screw shaft and the second screw shaft are both disposed along the horizontal direction, and the first screw shaft and the second screw shaft are disposed perpendicular to each other; the third screw shaft is arranged along the vertical direction. That is, the first driving module 902, the second driving module 903, and the third driving module 904 can drive the cutting assembly 80 to move in the horizontal plane and the vertical direction, so as to complete the driving of the cutting assembly 80 to extend into the gap between the upper cavity and the lower cavity of the film sticking device and drive the cutting assembly 80 to reach the preset cutting height in the vertical direction.
Further, referring to fig. 2-4, as a specific embodiment of the film cutting device provided by the present invention, the cutting assembly 80 further includes a mounting plate 1 disposed between the cutting driving assembly 4 (which may be a motor) and the cutter assembly 2, and the cutter assembly 2 is rotatably connected to the mounting plate 1; the cutting assembly 80 further comprises a rupture drive assembly 3 for driving the cutter assembly 2 to rotate relative to the mounting plate 1 so as to enable the cutter assembly 2 to abut against the boundary of the product to be cut. In the initial state of the cutting assembly 80, the cutter assembly 2 is inclined towards the direction far away from the product 6 to be cut, and the cutter assembly 2 is positioned above the dry film 7 with a small gap; the film breaking driving assembly 3 drives the cutter assembly 2 to rotate towards the direction close to the product 6 to be cut, the rotating process of the cutter assembly 2 has two partial motions in the horizontal direction and the vertical direction, the vertical partial motion enables the cutter assembly 2 to break the dry film 7 and enables the end part of the cutter assembly 2 to be lower than the product to be cut, and the horizontal partial motion enables the cutter assembly 2 to move towards the direction close to the product 6 to be cut until the horizontal partial motion is abutted against the boundary of the product 6 to be cut; therefore, the cutter assembly 2 can be abutted against the boundary of the product to be cut 6 after being lower than the product to be cut, and the product to be cut 6 cannot be damaged. The mode that directly moves down from vertical direction for cutter unit 2 and cut dry film 7 and with the border butt of waiting to cut product 6 can avoid cutter unit 2 directly to damage waiting to cut product 6 when moving down from vertical direction. The mounting plate 1 may be connected to the output of the cutting drive assembly 4 by a connecting plate 5.
Further, referring to fig. 2-4, as an embodiment of the film cutting device provided by the present invention, the cutter assembly 2 includes a cutter seat 21 rotatably connected to the mounting plate 1, and a cutter 22 fixedly mounted on the cutter seat 21. The tool holder 21 rotates relative to the mounting plate 1 to drive the tool 22 to rotate. The cutter component 2 can also be a cutter which is directly connected with the mounting plate 1 in a rotating way. The cutter 22 is provided with an inclined cutting edge, and the cutter 22 is provided with a plurality of mounting positions connected with the cutter seat 21 so as to realize the adjustment of the length of the cutter 22 extending out of the cutter seat 21.
Further, referring to fig. 2-4, as a specific embodiment of the film cutting device provided by the present invention, the film breaking driving assembly 3 includes a rotating block 31 rotatably connected to the tool post 21, and a driving cylinder 32 having a movable end connected to the rotating block 31; the fixed end of the driving cylinder 32 is rotatably connected with the mounting plate 1. The process that the membrane rupturing driving component 3 drives the cutter component 2 to rotate is as follows: the telescopic process of the movable end of the driving cylinder 32 drives the rotating block 31 to move, and the rotating block 31 drives the cutter assembly 2 to rotate in the moving process.
Further, referring to fig. 3, as a specific embodiment of the film cutting device provided by the present invention, a first rotating seat 211 is disposed on the knife seat 21; the rotating block 31 is rotatably connected to the first rotating base 211. The first rotating base 211 can be two opposite guide plates arranged at intervals, and a rotating shaft can be arranged between the rotating block 31 and the guide plates of the first rotating base 211 to realize rotating connection.
Further, please refer to fig. 3, as a specific embodiment of the film cutting device provided by the present invention, a second rotating seat 11 is disposed on the mounting plate 1; the fixed end of the driving cylinder 32 is rotatably connected with the second rotating base 11. The second rotating base 11 can be two opposite guide plates arranged at intervals, and a rotating shaft can be arranged between the fixed end of the driving cylinder 32 and the guide plates of the second rotating base 11 to realize rotating connection.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.

Claims (10)

1. The film cutting device is characterized by comprising a cutting assembly and a moving driving assembly for driving the cutting assembly to move; the mobile driving assembly comprises a supporting table, a first driving module arranged on the supporting table, a second driving module connected with the output end of the first driving module, and a third driving module connected with the output end of the second driving module; the cutting assembly comprises a cutting fixing table, a cutter assembly and a cutting driving assembly, wherein the cutting fixing table is connected with the output end of the third driving module, and the cutting driving assembly is arranged on the cutting fixing table and used for driving the cutter assembly to complete cutting action.
2. The film cutting device according to claim 1, wherein the first driving module comprises a first driving motor arranged on the supporting table, a first lead screw shaft in transmission connection with the first driving motor, and a first lead screw nut matched with the first lead screw shaft; the second driving module is connected with the first lead screw nut.
3. The film cutting device according to claim 2, wherein the second driving module comprises a first moving plate connected with the first lead screw nut, a second driving motor arranged on the first moving plate, a second lead screw shaft in transmission connection with the second driving motor, and a second lead screw nut matched with the second lead screw shaft; and the third driving module is connected with the second lead screw nut.
4. The film cutting device according to claim 3, wherein the third driving module comprises a second moving plate connected with the second lead screw nut, a third driving motor arranged on the second moving plate, a third lead screw shaft in transmission connection with the third driving motor, and a third lead screw nut matched with the third lead screw shaft; the fixed platform is connected with the third lead screw nut.
5. The film cutting device according to claim 4, wherein the first screw shaft and the second screw shaft are both arranged in a horizontal direction, and the first screw shaft and the second screw shaft are arranged perpendicular to each other; the third screw shaft is arranged along the vertical direction.
6. The film cutting device according to any one of claims 1 to 5, wherein the cutting assembly further comprises a mounting plate arranged between the cutting driving assembly and the cutter assembly, and the cutter assembly is rotatably connected with the mounting plate; the cutting assembly further comprises a film breaking driving assembly used for driving the cutter assembly to rotate relative to the mounting plate so that the cutter assembly is abutted to the boundary of a product to be cut.
7. The film cutting device as claimed in claim 6, wherein the cutter assembly comprises a cutter holder rotatably connected with the mounting plate, and a cutter fixedly mounted on the cutter holder.
8. The film cutting device according to claim 7, wherein the film breaking driving assembly comprises a rotating block rotatably connected with the tool apron and a driving cylinder with a movable end connected with the rotating block; the stiff end of drive actuating cylinder with the mounting panel rotates to be connected.
9. The film cutting device according to claim 8, wherein the tool holder is provided with a first rotating seat; the rotating block is rotatably connected with the first rotating seat.
10. The film cutting device according to claim 8, wherein a second rotating seat is arranged on the mounting plate; the fixed end of the driving cylinder is rotatably connected with the second rotating seat.
CN201920342978.4U 2019-03-18 2019-03-18 Film cutting device Active CN210025470U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920342978.4U CN210025470U (en) 2019-03-18 2019-03-18 Film cutting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920342978.4U CN210025470U (en) 2019-03-18 2019-03-18 Film cutting device

Publications (1)

Publication Number Publication Date
CN210025470U true CN210025470U (en) 2020-02-07

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920342978.4U Active CN210025470U (en) 2019-03-18 2019-03-18 Film cutting device

Country Status (1)

Country Link
CN (1) CN210025470U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116000998A (en) * 2023-01-12 2023-04-25 厦门海辰储能科技股份有限公司 Film cutting device of electroplating equipment and electroplating equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116000998A (en) * 2023-01-12 2023-04-25 厦门海辰储能科技股份有限公司 Film cutting device of electroplating equipment and electroplating equipment

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Address after: 523000 building 13, No. 2, Xingye Road, Songshanhu Park, Dongguan City, Guangdong Province

Patentee after: Guangdong Siwo advanced equipment Co.,Ltd.

Address before: 523000 1st floor, building a, No.1 Rd Rd Rd, Songshanhu hi tech Industrial Park, Dongguan City, Guangdong Province

Patentee before: GUANGDONG SOWOTECH Co.,Ltd.