CN209785969U

CN209785969U - LED module board tool

Info

Publication number: CN209785969U
Application number: CN201920751107.8U
Authority: CN
Inventors: 高海波; 甘训静
Original assignee: Zhejiang Uniview Technologies Co Ltd
Current assignee: Zhejiang Uniview Technologies Co Ltd
Priority date: 2019-05-23
Filing date: 2019-05-23
Publication date: 2019-12-13
Anticipated expiration: 2029-05-23

Abstract

The utility model belongs to the technical field of electronic component produces and makes, a LED module board tool is disclosed. This LED module board tool includes: the printing tray is internally provided with a supporting strip; the reflow soldering tray is configured to be selectively arranged inside the printing tray, the supporting bars penetrate through the reflow soldering tray and abut against the bottom of the LED module board, and the tops of the supporting bars and the top of the reflow soldering tray are jointly used for bearing the LED module board. This LED module board tool uses through the cooperation of printing tray and reflow soldering tray, need not to have enough to meet the need LED module board between the tray, when guaranteeing the production finished product qualification rate, avoids extravagant because of the energy and the material that wash the board again and lead to, has reduced manufacturing cost, and adopts one set of LED module board tool just can realize printing simultaneously, paste dress and reflow soldering three process requirement, has practiced thrift the turnaround time, has improved production efficiency effectively.

Description

LED module board tool

Technical Field

The utility model relates to an electronic component produces and makes technical field, especially relates to a LED module board tool.

Background

The small-space LED module board is a high-density surface-mounted PCB board and is widely applied to the fields of liquid crystal displays and the like. The existing LED module board needs to be produced by using two sets of tools, namely a printing tray and a reflow soldering tray, and sequentially carrying out three processes of solder paste printing, LED lamp bead mounting and reflow soldering. The printed tray and the reflow soldering tray are provided with clamping edges for clamping and positioning the LED module board in the production process. The bottom of the printing tray is provided with a support bar, and the support bar is used for bearing the LED module plate and plays a role in supporting. After the printing tray is used for completing the printing and mounting processes of the LED module board, the LED module board is transferred to a reflow soldering tray for reflow soldering.

the following drawbacks exist if only a printing tray is used: 1) because the support bars arranged at the bottom of the printing tray can generate shadow effect on the LED lamp beads, the situation of chromatic aberration of the surfaces of the LED lamp beads is easily caused. 2) Because lamp pearl self is higher to the temperature sensitivity, easily receive tray frock influence during reflow soldering, however the area of contact of printing the edge of tray and LED module board is great for there is the difference in temperature at edge position and central point position in LED module board, thereby influences the display effect of LED module board.

If only the reflow soldering tray is adopted, the following defects exist: 1) the bottom fretwork of reflow soldering tray lacks the support for LED module board appears warping, seal tin scheduling problem partially thick easily in the printing process, can't guarantee the uniformity of printing quality. 2) Even reflow soldering tray and the printing tray of taking the support bar use of mutually supporting, LED module board need follow the printing tray on transferring to the reflow soldering tray, the turnover of tray can cause LED lamp pearl off normal, wipe defects such as board, need print again and paster after washing the board to the whole board this moment, influence production efficiency, and the lamp pearl can't be retrieved, has caused the lamp pearl extravagant, leads to the qualification rate of processing lower.

Therefore, the conventional tray cannot be compatible with the normal development of the reflow soldering process while ensuring that the printing and mounting processes are smoothly completed.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a LED module board tool need not LED module board turnover and just can accomplish printing, subsides dress and reflow soldering whole production process, has improved production efficiency and finished product quality.

To achieve the purpose, the utility model adopts the following technical proposal:

An LED module board jig, comprising:

The printing tray is internally provided with a supporting strip;

The reflow soldering tray is configured to be selectively arranged inside the printing tray, the supporting bars penetrate through the reflow soldering tray and abut against the bottom of the LED module board, and the top of the supporting bars and the top of the reflow soldering tray are jointly used for bearing the LED module board.

Preferably, a stepped groove used for placing the reflow soldering tray is formed in the printing tray, and the support bars are arranged at the bottom of the stepped groove.

Preferably, a central through hole is formed in the reflow soldering tray, and the supporting bar penetrates through the central through hole.

Preferably, a supporting block is arranged on the reflow soldering tray along the circumferential direction of the central through hole, and the supporting block is used for bearing the LED module board.

Preferably, the supporting block is provided with a first heat dissipation through hole for dissipating heat to the inner side of the LED module board.

Preferably, a second heat dissipation through hole is formed in the reflow soldering tray along the circumferential direction of the central through hole, and is used for dissipating heat to the outer side of the LED module board.

Preferably, the printing tray and the reflow soldering tray are positioned by positioning pins.

preferably, the number of the positioning pins is three, and the three positioning pins are distributed in an L shape.

Preferably, first taking and placing grooves are respectively formed in two sides of the printing tray.

Preferably, second picking and placing grooves are respectively arranged on two sides of the reflow soldering tray.

The utility model has the advantages that:

the utility model provides a LED module board tool, when LED module board need print and paste the dress, place the reflow soldering tray in the printing tray and place LED module board on the reflow soldering tray, form overall structure and accomplish printing and paste the dress process, when LED module board need carry out reflow soldering, break away from the reflow soldering tray with the attached LED module board of reflow soldering tray from the printing tray to accomplish the reflow soldering process.

at printing and subsides dress in-process, through set up the support bar in the printing tray, the support bar wears to establish the reflow soldering tray and direct and the bottom looks butt of LED module board, plays the effect that supports LED module board, reduces the deformation of LED module board and the uneven problem of seal tin to the uniformity of printing quality has been guaranteed. Meanwhile, the support bars are arranged in the printing tray and are not directly arranged at the bottom of the reflow soldering tray, and after the reflow soldering tray is separated from the printing tray, the LED module board is not in contact with the support bars, so that the LED module board cannot cause the shadow effect of the LED lamp beads due to the fact that the LED lamp beads are shielded by the support bars in the reflow soldering process, and the phenomenon of color difference of the LED lamp beads is avoided.

Through the cooperation of printing tray and reflow soldering tray, because the LED module board is placed always on the reflow soldering tray, compare with the mode that both trays of prior art are supporting to be used, need not to have enough to meet the need LED module board between the tray, LED lamp pearl offset has been reduced, the condition such as daub the board, when guaranteeing the production finished product qualification rate, avoid extravagant because of washing the energy and the material that board and paster lead to again, and the production cost is reduced, and adopt one set of LED module board tool just can realize the printing simultaneously, paste the three process requirements of dress and reflow soldering, the turnaround time has been practiced thrift, the production efficiency is effectively improved.

Drawings

Fig. 1 is a schematic structural view of an LED module board fixture of the present invention;

Fig. 2 is a schematic structural view of a printing tray in the LED module board jig of the present invention;

Fig. 3 is a schematic structural view of a reflow soldering tray in the LED module board jig of the present invention.

In the figure:

100. An LED module board;

1. A printing tray; 2. a reflow tray; 3. positioning pins;

11. A supporting strip; 12. a stepped groove; 13. a first pick-and-place slot; 14. a first positioning hole;

21. A central through hole; 22. a support block; 23. a first heat dissipating through hole; 24. a second heat dissipating through hole; 25. a second pick-and-place slot; 26. and a second positioning hole.

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

the technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

The embodiment provides a LED module board tool, can be used for the process of printing, subsides dress and reflow soldering simultaneously. As shown in fig. 1, the LED module board fixture comprises a printing tray 1 and a reflow soldering tray 2, wherein the printing tray 1 and the reflow soldering tray 2 are both similar to a rectangular tray structure, the printing tray 1 and the reflow soldering tray 2 adopt a nested mode, and the reflow soldering tray 2 can be selectively arranged inside the printing tray 1. Be provided with support bar 11 in printing tray 1, reflow soldering tray 2 wears to locate support bar 11 for the top of support bar 11 and reflow soldering tray 2's top are used for bearing LED module board 100 jointly.

The LED module board tool that this embodiment provided, when LED module board 100 need print and paste the dress, place reflow soldering tray 2 in printing tray 1 and place LED module board 100 on reflow soldering tray 2, form overall structure and accomplish printing and paste the dress process, when LED module board 100 needs to carry out reflow soldering, break away from LED module board 100 with reflow soldering tray 2 subsidiary LED module board from printing tray 1 to accomplish the reflow soldering process.

at printing and subsides dress in-process, through set up support bar 11 in printing tray 1, support bar 11 wears to establish reflow soldering tray 2 and direct and LED module board 100's bottom looks butt, plays the effect that supports LED module board 100, reduces LED module board 100's deformation and the uneven problem of seal tin to the uniformity of printing quality has been guaranteed. Simultaneously, because support bar 11 sets up in printing tray 1 and does not directly set up in the bottom of reflow soldering tray 2, after reflow soldering tray 2 breaks away from printing tray 1, LED module board 100 does not contact with support bar 11 for LED module board 100 can not arouse LED lamp pearl shadow effect because of receiving support bar 11 to shelter from at the reflow soldering in-process, avoids the condition that the colour difference appears in LED lamp pearl.

Through the cooperation use of printing tray 1 and reflow soldering tray 2, because LED module board 100 is placed on reflow soldering tray 2 always, compare with the mode that both trays of prior art are supporting to be used, need not to have enough to meet the need LED module board 100 between the tray, LED lamp pearl offset has been reduced, condition such as daub, when guaranteeing the production finished product qualification rate, avoid extravagant because of washing energy and the material that board and paster lead to again, production cost is reduced, and adopt one set of LED module board tool just can realize the printing simultaneously, paste the three process requirements of dress and reflow soldering, the turnaround time has been practiced thrift, the production efficiency is effectively improved.

As shown in fig. 1-2, the printing tray 1 is an outermost base, the height H of the printing tray 1 is about 8mm, a stepped groove 12 is formed in the printing tray 1, and the stepped groove 12 is used for accommodating the reflow soldering tray 2. The stepped groove 12 specifically includes a first through groove and a second through groove, and the first through groove and the second through groove are coaxially disposed and are communicated with each other. The cross-sectional dimension of the first through slot is greater than and above the cross-sectional dimension of the second through slot, and the height h1 of the first through slot and the height h2 of the second through slot are both approximately 2.5 mm.

The tank bottom that leads to the groove in the second of ladder groove 12 is provided with support bar 11, support bar 11's height h3 is about 3.2mm for support bar 11's top distance is about 1.8mm apart from the top of printing tray 1, LED module board 100's height h4 is about 2mm, ensure that the bottom surface of LED module board 100 and support bar 11's top surface contact, played the supporting role, prevent that LED module board 100 from appearing the condition of warping when printing and pasting. In order to further reduce the deformation of the LED module board 100, the cross section of the supporting bars 11 is gradually reduced from the bottom to the top, and a tapered structure is adopted to ensure the stability of the bottom. Meanwhile, according to the different shape structures of the LED module board 100, the number of the supporting bars 11 may be set to a plurality, the cross sections of the plurality of supporting bars 11 may be circular structures, rectangular structures, etc., and the specific number and the structural shape may be adjusted according to actual production needs.

As shown in fig. 2, in order to facilitate carrying the printing tray 1 and the reflow soldering tray 2 together for printing and pasting, first picking and placing grooves 13 are respectively arranged on two sides of the printing tray 1, and both hands of an operator can be placed in the first picking and placing grooves 13, so that the printing tray 1 can be transferred and conveyed conveniently.

As shown in fig. 1 and 3, since the reflow soldering tray 2 is nested in the printing tray 1, the external dimensions of the reflow soldering tray 2 need to be matched with the stepped grooves 12 of the printing tray 1. Specifically, the overall height of reflow soldering tray 2 is about 5mm, and is the same as the sum of the heights of the first through groove and the second through groove of printing tray 1, so that reflow soldering tray 2 is just accommodated in stepped groove 12 of printing tray 1, and the top surface of reflow soldering tray 2 and the top surface of printing tray 1 are flush with each other. Meanwhile, the third through grooves are formed in two sides of the bottom surface of the reflow soldering tray 2, the depth of each third through groove is about 2.5mm, and each third through groove is located at the edge position, so that each third through groove of the reflow soldering tray 2 is just located at the step between each first through groove and each second through groove in the printing tray 1, and good spacing between the reflow soldering tray 2 and the printing tray 1 is achieved.

As shown in fig. 3, a central through hole 21 is formed in the center of the reflow soldering tray 2, and by adopting the hollow design, when printing and mounting are performed, the support bars 11 can penetrate through the central through hole 21 and contact with the LED module board 100, so that the support effect of the support bars 11 on the LED module board 100 is ensured; when reflow soldering is carried out, the contact area between the central position of the reflow soldering tray 2 and the LED module board 100 is reduced, so that the shadow effect on the LED lamp beads caused by shielding is reduced, and the uniformity and consistency of the color of the surfaces of the LED lamp beads are ensured.

Because the central through hole 21 of the reflow soldering tray 2 is large in size, in order to ensure that the reflow soldering tray 2 can better support the LED module board 100, a supporting block 22 is arranged on the reflow soldering tray 2 along the circumferential direction of the central through hole 21, and the supporting block 22 is used for bearing the LED module board 100. According to actual production needs, the reflow soldering tray 2 extends to a direction close to the central through hole 21 to form a plurality of supporting blocks 22, the plurality of supporting blocks 22 form an annular structure along the circumference of the central through hole 21, and the supporting blocks 22 play a role in mainly supporting the LED module board 100.

by adopting the multi-point supporting mode, the stability and the balance of the support of the LED module board 100 are ensured, and compared with the mode of directly supporting the reflow soldering tray 2, the contact area with the LED module board 100 is reduced, so that the temperature difference of the LED module board 100 at the edge position and the central position is reduced, and the display effect of the LED module board 100 is ensured.

in order to ensure the heat dissipation effect of the LED module board 100, the supporting block 22 is provided with a first heat dissipation through hole 23 for dissipating heat to the inner side of the LED module board 100, and the reflow soldering tray 2 is provided with a second heat dissipation through hole 24 along the circumference of the central through hole 21 for dissipating heat to the outer side of the LED module board 100, so that the two sides of the LED module board 100 can both obtain better heat dissipation, the LED module board 100 is prevented from being heated unevenly, and the influence of heat effect is reduced.

Because printing tray 1 and reflow soldering tray 2 adopt split type setting, when reflow soldering tray 2 nestification is on printing tray 1, in order to guarantee the positioning accuracy between the two, fix a position through locating pin 3 between printing tray 1 and the reflow soldering tray 2. Specifically, the printing tray 1 is provided with first positioning holes 14 along the circumferential direction thereof, the reflow tray 2 is provided with second positioning holes 26 corresponding to the first positioning holes 14, and each positioning pin 3 penetrates one first positioning hole 14 and one second positioning hole 26 corresponding thereto.

Wherein, the quantity of locating pin 3 is three, and three locating pin 3 is L shape and distributes, adopts this kind of distribution setting, when guaranteeing positioning accuracy, is used for the direction suggestion, for example: one side that has a locating pin 3 is the left side, and one side that has two locating pins 3 is the right side, prevents that the direction from obscuring, has played the foolproof effect.

in order to place reflow soldering tray 2 in printing tray 1 or break away from printing tray 1, be provided with the second respectively in reflow soldering tray 2's both sides and get and put groove 25, operating personnel's both hands can be placed in the second and get and put groove 25, are convenient for reflow soldering tray 2's transfer and transport.

In the description herein, it is to be understood that the terms "upper", "lower", "right", and the like are used in an orientation or positional relationship based on that shown in the drawings for convenience of description and simplicity of operation, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used merely for descriptive purposes and are not intended to have any special meaning.

In the description herein, references to the description of "an embodiment," "an example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

In addition, the foregoing is only the preferred embodiment of the present invention and the technical principles applied thereto. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail with reference to the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the scope of the present invention.

Claims

1. The utility model provides a LED module board tool which characterized in that includes:

a printing tray (1), wherein a support strip (11) is arranged in the printing tray (1);

reflow soldering tray (2), it is configured as the selectivity set up in inside the printing tray (1), support bar (11) wear to locate reflow soldering tray (2) and butt in the bottom of LED module board (100), make the top of support bar (11) with the top of reflow soldering tray (2) is used for bearing LED module board (100) jointly.

2. the LED module board jig as claimed in claim 1, wherein a stepped groove (12) for placing the reflow soldering tray (2) is formed on the printing tray (1), and the support bar (11) is disposed at the bottom of the stepped groove (12).

3. The LED module board jig as claimed in claim 1, wherein a central through hole (21) is formed on the reflow soldering tray (2), and the support bar (11) is inserted into the central through hole (21).

4. The LED module board jig according to claim 3, wherein a support block (22) is arranged on the reflow soldering tray (2) along the circumference of the central through hole (21), and the support block (22) is used for bearing the LED module board (100).

5. The LED module board jig as claimed in claim 4, wherein the support block (22) is provided with a first heat dissipating through hole (23) for dissipating heat from the inside of the LED module board (100).

6. The LED module board jig as claimed in claim 5, wherein a second heat dissipating through hole (24) is provided on the reflow tray (2) along a circumferential direction of the central through hole (21) for dissipating heat from an outer side of the LED module board (100).

7. The LED module board jig as claimed in claim 1, wherein the printing tray (1) and the reflow soldering tray (2) are positioned by positioning pins (3).

8. The LED module board jig as claimed in claim 7, wherein the number of the positioning pins (3) is three, and the three positioning pins (3) are distributed in an L shape.

9. The LED module board jig as claimed in claim 1, wherein first pick-and-place grooves (13) are respectively provided at both sides of the printing tray (1).

10. The LED module board jig according to claim 1, wherein second pick-and-place grooves (25) are respectively provided on both sides of the reflow soldering tray (2).