CN216632943U - A coating steel mesh smelting tool for solder paste for in module production - Google Patents
A coating steel mesh smelting tool for solder paste for in module production Download PDFInfo
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- CN216632943U CN216632943U CN202123344446.0U CN202123344446U CN216632943U CN 216632943 U CN216632943 U CN 216632943U CN 202123344446 U CN202123344446 U CN 202123344446U CN 216632943 U CN216632943 U CN 216632943U
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- solder paste
- module production
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model provides a solder paste is with coating steel mesh smelting tool for in module production, includes the bottom plate, the steel mesh subassembly, the bottom plate is provided with long waist hole and a plurality of base plate standing grooves crossing with long waist hole, is provided with the coating punch combination on the steel mesh spare, the base plate is arranged in the base plate standing groove, the solder paste sees through the coating punch combination coating on the steel mesh spare on base plate and ceramic chip subassembly, once can accomplish the location and the solder paste coating of multiunit base plate with the ceramic chip subassembly, the uniformity of solder paste coating shape and thickness can be guaranteed to the coating punch combination on the steel mesh subassembly, can improve the coating quality that improves the solder paste and can also improve coating efficiency, practice thrift manufacturing cost.
Description
Technical Field
The utility model relates to the technical field of soldering paste, in particular to a steel mesh coating jig for soldering paste used in module production.
Background
In the production and manufacturing process of a module, the upper surface and the lower surface of a ceramic chip are coated with soldering paste and placed on a substrate to facilitate welding, the traditional process is to manually coat the soldering paste on the front surface and the back surface of the ceramic chip by using a scraper, and the method is used for many years, but has the defects that firstly, the thickness of the soldering paste is unevenly coated due to manual coating; secondly, the difference of the coating effects of different workers is large; thirdly, the production efficiency is low, and the labor cost is high; in addition, if the tile is coated with a narrow area that is not to be coated, the difficulty of coating is increased.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is to provide a steel mesh coating jig for solder paste in module production, so as to overcome the defect of manual solder paste coating in the background technology and improve the coating quality and the coating efficiency of the solder paste.
In order to solve the technical problem, the utility model provides the following technical scheme: a coated steel mesh jig for soldering paste used in module production comprises a bottom plate and a steel mesh assembly, wherein a long waist hole and a plurality of substrate placing grooves crossed with the long waist hole are formed in the center of the upper end face of the bottom plate, and the height of a substrate is larger than the depth of the substrate placing grooves; the steel mesh component comprises a first steel mesh component and a second steel mesh component, wherein a plurality of first coating hole combinations are arranged on the first steel mesh component, a plurality of second coating hole combinations are arranged on the second steel mesh component, each substrate placement groove is respectively corresponding to one first coating hole combination and one second coating hole combination, solder paste is coated on the substrate through the second coating hole combinations on the second steel mesh component, the lower end surface of the tile component is arranged on the solder paste on the substrate, the solder paste is coated on the upper end surface of the tile component through the first coating hole combinations on the first steel mesh component, the shape and the size of each first coating hole combination are consistent with the shape and the size of the upper end surface coating area of the tile component, the shape and the size of each second coating hole combination are consistent with the shape and the size of the lower end surface coating area of the tile component, the substrate and the ceramic chip component are both parts to be coated with solder paste.
Preferably, the difference between the height of the substrate and the depth of the substrate placing groove is 0.5 mm.
Preferably, the long waist holes are perpendicularly crossed with the substrate placing grooves, and the distances between the adjacent substrate placing grooves are equal.
Preferably, a pair of positioning pins is arranged at opposite corners of the bottom plate, and the first steel mesh member and the second steel mesh member are respectively provided with positioning holes corresponding to the positioning pins.
Preferably, the first coating hole combination is located in a rectangular first concave coating area arranged on the first steel mesh member, and the second coating hole combination is located in a rectangular first concave coating area arranged on the second steel mesh member.
Preferably, the hole thickness in the first coated hole combination and the second coated hole combination is 0.2-0.3 mm.
The utility model has the beneficial effects that:
according to the coated steel mesh jig for the soldering paste in the module production, provided by the utility model, the plurality of substrate placing grooves are arranged on the bottom plate, the positioning of a plurality of groups of substrates and ceramic chip assemblies and the coating of the soldering paste can be completed at one time, the coating hole combination on the steel mesh assembly can ensure the consistency of the coating shape and thickness of the soldering paste, the coating quality of the soldering paste can be improved, the coating efficiency can also be improved, and the production cost can be saved; in addition, the shape of the coating hole can be designed according to the shape of the coating area of the ceramic chip assembly, so that the coating difficulty of an irregular and complex coating area is reduced, and the application range is wide; also has the advantages of convenient use, simple manufacturing process and the like.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a perspective view of the second steel member in FIG. 1;
FIG. 3 is a perspective view of the first steel member in FIG. 1;
in the figure: 1. a base plate; 11. a long waist hole; 12. a substrate placement groove; 13. positioning pins; 2. a first steel mesh component; 21. a first recess coated region; 22. a first coated aperture combination; 6. positioning holes; 3. a second steel mesh component; 31. a second recess coated region; 32. a second coating hole combination; 4. a substrate; 5. a tile assembly.
Detailed Description
As shown in fig. 1, a coated steel mesh jig for solder paste used in module production comprises a base plate 1 and a steel mesh assembly, wherein a long waist hole 11 and a plurality of substrate placing grooves 12 intersecting with the long waist hole are arranged in the center of the upper end surface of the base plate 1, and the height of a substrate 4 is greater than the depth of the substrate placing grooves 12; the steel mesh component comprises a first steel mesh component 2 and a second steel mesh component 3, wherein a plurality of first coating hole combinations 22 are arranged on the first steel mesh component 2, a plurality of second coating hole combinations 32 are arranged on the second steel mesh component 3, each substrate placing groove 12 corresponds to one first coating hole combination 22 and one second coating hole combination 32 respectively, solder paste is coated on the substrate 4 through the second coating hole combinations 32 on the second steel mesh component 3, the lower end surface of the ceramic tile component 5 is arranged on the solder paste on the substrate 4, the solder paste is coated on the upper end surface of the ceramic tile component 5 through the first coating hole combinations 22 on the first steel mesh component 2, the shape and the size of the first coating hole combinations 22 are consistent with the shape and the size of the upper end surface coating area of the ceramic tile component 5, the shape and the size of the second coating hole combinations 32 are consistent with the shape and the size of the lower end surface coating area of the ceramic tile component 5, the substrate 4 and the ceramic chip assembly 5 are both parts to be coated with solder paste.
In order to ensure the coating effect, the upper end surface of the substrate 4 must be closely attached to the lower end surface of the second steel mesh 3, otherwise, the solder paste may overflow, which affects the coating effect, and therefore, the height of the substrate 4 should be greater than the depth of the substrate placing groove 12, and therefore, it is preferable that the difference between the height of the substrate 4 and the depth of the substrate placing groove 12 is 0.5 mm.
The long waist holes 11 mainly have two functions, namely, the long waist holes are used as positioning references of the substrate placing grooves 12, and the substrates 4 are convenient to take and place, so that the substrate placing grooves 12 need to be separated by a certain distance, and the substrates 4 are convenient to take and place; further, it is preferable that the long waist holes 11 and the substrate placing grooves 12 are arranged to intersect perpendicularly, and the distances between the adjacent substrate placing grooves 12 are equal, so that the arrangement can facilitate the processing and the handling.
Because every base plate standing groove 12 corresponds a first coating hole combination 22 on the first steel mesh 2 and a second coating hole combination 32 on the second steel mesh 3 respectively, so in order to save time, raise the efficiency, further, the opposite angle of bottom plate 1 can set up a pair of locating pin 13, first steel mesh 2 sets up the locating hole 6 corresponding with locating pin 13 respectively with second steel mesh 3, when assembling, only need insert locating pin 13 in locating hole 6, alright accomplish the quick location of base plate standing groove and coating hole combination.
Further, a rectangular first concave coating region 21 may be provided on the first steel mesh member 2, a first coating hole combination 22 is located in the first concave coating region 21, a rectangular second concave coating region 31 is provided on the second steel mesh member 3, and a second coating hole combination 32 is located in the second concave coating region 31; after the arrangement, the coating operation can be carried out in the coating area, so that the collection and the repeated use of redundant soldering paste are facilitated; in addition, the thickness of the coating hole combination is the coating thickness of the soldering paste, and the coating thickness of the soldering paste is thinner, so that the coating hole combination is arranged in the concave coating area, the thickness requirement can be met, the periphery of the projection of the steel mesh can be conveniently taken and placed, and the strength of the whole steel mesh is ensured.
On the basis of the above embodiment, the hole thickness of the first coating hole combination 22 and the second coating hole combination 32 is preferably 0.2-0.3 mm, which can meet the requirement of the solder paste amount required by welding and save resources.
The using method comprises the following steps: as shown in fig. 2, the substrate 4 is placed in the substrate placement groove 12, the positioning holes 6 of the second steel mesh 3 are aligned with the positioning pins 13 of the base plate 1 for assembly, the substrate 4 is attached to the lower end surface of the second steel mesh 3, the second coating hole assembly 32 is filled with solder paste in the second concave coating area 31, and excess solder paste is scraped off, the second steel mesh 3 is removed, as shown in fig. 3, the lower end surface of the tile assembly 5 is placed on the solder paste of the substrate 4, the positioning holes 6 of the first steel mesh 2 are aligned with the positioning pins 13 of the base plate 1 for assembly, the upper end surface of the tile assembly 5 is attached to the lower end surface of the first steel mesh 2, the first coating hole assembly 22 is filled with solder paste in the first concave tile coating area 21, and excess solder paste is scraped off, the first steel mesh 2 is removed, coating is completed, and the solder paste connection body of the substrate 4 and the tile assembly 5 is removed.
The above description is only a preferred embodiment of the present application and the explanation of the technical principle used, and it should be understood by those skilled in the art that the scope of the present application is not limited to the technical solution of the specific combination of the above technical features, and also covers other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the inventive concept, for example, the technical solutions formed by mutually replacing the above technical features (but not limited to) having similar functions disclosed in the present application.
Claims (6)
1. The utility model provides a soldering paste is with coating steel mesh smelting tool for in module production which characterized in that: the steel mesh plate comprises a bottom plate (1) and a steel mesh assembly, wherein a long waist hole (11) and a plurality of substrate placing grooves (12) crossed with the long waist hole (11) are formed in the center of the upper end face of the bottom plate (1), and the height of a substrate (4) is larger than the depth of the substrate placing grooves (12); the steel mesh assembly comprises a first steel mesh component (2) and a second steel mesh component (3), wherein a plurality of first coating hole combinations (22) are arranged on the first steel mesh component (2), a plurality of second coating hole combinations (32) are arranged on the second steel mesh component (3), and each substrate placing groove (12) corresponds to one of the first coating hole combinations (22) and one of the second coating hole combinations (32).
2. The coated steel jig for solder paste used in module production as claimed in claim 1, wherein: the difference between the height of the substrate (4) and the depth of the substrate placing groove (12) is 0.5 mm.
3. The coated steel jig for solder paste used in module production as claimed in claim 1, wherein: the long waist holes (11) are vertically crossed with the substrate placing grooves (12), and the distances between the adjacent substrate placing grooves (12) are equal.
4. The coated steel jig for solder paste used in module production as claimed in claim 1, wherein: a pair of positioning pins (13) is arranged on opposite corners of the bottom plate (1), and the first steel mesh piece (2) and the second steel mesh piece (3) are respectively provided with positioning holes (6) corresponding to the positioning pins (13).
5. The coated steel jig for solder paste used in module production as claimed in claim 1, wherein: the first coating hole combination (22) is positioned in a rectangular first concave coating area (21) arranged on the first steel mesh component (2), and the second coating hole combination (32) is positioned in a rectangular second concave coating area (31) arranged on the second steel mesh component (3).
6. A coated steel jig for solder paste used in module production according to any one of claims 1 to 5, characterized in that: the hole thickness in the first and second coating hole combinations (22, 32) are each set to 0.2-0.3 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123344446.0U CN216632943U (en) | 2021-12-28 | 2021-12-28 | A coating steel mesh smelting tool for solder paste for in module production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123344446.0U CN216632943U (en) | 2021-12-28 | 2021-12-28 | A coating steel mesh smelting tool for solder paste for in module production |
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| CN216632943U true CN216632943U (en) | 2022-05-31 |
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| CN202123344446.0U Active CN216632943U (en) | 2021-12-28 | 2021-12-28 | A coating steel mesh smelting tool for solder paste for in module production |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116673704A (en) * | 2023-08-03 | 2023-09-01 | 常州恒创热管理有限公司 | Liquid cooling plate processing technology and brazing flux coating equipment |
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2021
- 2021-12-28 CN CN202123344446.0U patent/CN216632943U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116673704A (en) * | 2023-08-03 | 2023-09-01 | 常州恒创热管理有限公司 | Liquid cooling plate processing technology and brazing flux coating equipment |
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