CN220653632U - Printing jig for reflow soldering of semiconductor element - Google Patents
Printing jig for reflow soldering of semiconductor element Download PDFInfo
- Publication number
- CN220653632U CN220653632U CN202321871629.4U CN202321871629U CN220653632U CN 220653632 U CN220653632 U CN 220653632U CN 202321871629 U CN202321871629 U CN 202321871629U CN 220653632 U CN220653632 U CN 220653632U
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- CN
- China
- Prior art keywords
- printing
- jig
- reflow soldering
- semiconductor elements
- steel mesh
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- 238000007639 printing Methods 0.000 title claims abstract description 86
- 238000005476 soldering Methods 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 25
- 239000010959 steel Substances 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010146 3D printing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a printing jig for reflow soldering of a semiconductor element, which comprises a substrate carrier, a substrate placed at the far end of the substrate carrier, a steel mesh arranged at the far end of the substrate, and a jig arranged at the far end of the steel mesh, wherein a plurality of printing holes are formed in the steel mesh, a avoidance area is formed in the position, corresponding to the substrate, of the jig, a printing area is formed in the position, corresponding to the printing holes, of the jig, the avoidance area is mutually separated from the printing area, the printing area is used for adding printing paste, the printing paste is coated on a position to be printed of the substrate through the printing holes, the structure is simple, the equipment cost is low, meanwhile, the design freedom degree is high, and printing of any pattern and quantitative control of the printing paste can be realized.
Description
Technical Field
The utility model relates to the technical field of semiconductor module packaging, in particular to a printing jig for reflow soldering of a semiconductor element.
Background
In the module production and manufacturing process, a traditional process is to coat solder paste on the upper and lower surfaces of the ceramic chip and place the ceramic chip on a substrate, so that the welding is convenient, and the traditional process is to manually coat the solder paste on the front and back surfaces of the ceramic chip by using a scraper, so that the method is used for many years, but has the defects that firstly, the manual coating has uneven thickness coating of the solder paste; secondly, the coating effect of different workers is large in difference; thirdly, the production efficiency is low, and the labor cost is high; in addition, if there is a narrow area on the coated surface of the tile that does not need to be coated, the difficulty of coating increases.
In the semiconductor module packaging process, the soldering of the components such as the copper pillar and the thermistor is generally performed after the chip sintering process. The common methods for applying the solder paste for soldering copper pillars are 3D printing, dispensing or directly using soldering lug. The 3D printing technology is formed in japan, but the printing needs to use COBmask and a special doctor blade, so that the equipment cost is high, the design size of the COBmask is difficult to change, and the plate supply period is long. For the dispensing process, the control requirement on the solder paste amount in the solder paste dispensing process is high, the welding combination is poor if the solder paste amount is too small, and the copper column is easy to be blocked by the solder paste if the solder paste amount is too large. The use amount of the soldering lug can be controlled, but the soldering lug is lighter, so that the yield is lower in the soldering lug pasting process, and the efficiency is poor. Therefore, in order to solve the above problems, it is necessary to design a jig for applying the solder paste for soldering copper columns.
Disclosure of Invention
In view of the foregoing drawbacks of the prior art, an object of the present utility model is to provide a printing jig for reflow soldering of semiconductor devices, which solves one or more of the problems of the prior art.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides a semiconductor component is printing jig for reflow soldering, includes the base plate carrier, places the base plate of base plate carrier distal end, set up the steel mesh of base plate distal end, set up the tool of steel mesh distal end, offer a plurality of printing holes on the steel mesh, the district is dodged to the department of seting up corresponding base plate on the tool, the district is dodged to the printing district of seting up corresponding printing hole department on the tool, dodge district and printing district and separate each other, and the printing district is used for adding printing thick liquids, makes printing thick liquids pass through printing hole coating to the base plate treat the printing department.
Further, dodge the district and include a plurality of rectangle frameworks, the printing district includes two rectangle frameworks, and one of them rectangle framework has a plurality of branch frameworks along length direction.
Further, six screw holes are formed in the jig along the length direction, and the printing jig for reflow soldering of the semiconductor element further comprises a fixing piece which penetrates through the screw holes to be in threaded connection with the steel mesh.
Furthermore, the jig and the steel mesh are connected by bonding or welding.
Further, the jig is connected with the substrate carrier through pin connection.
Further, at least three positioning holes are respectively formed in the jig and the substrate carrier, and the positioning holes penetrate through the positioning pieces.
Further, the jig is connected with the substrate carrier in a clamping way.
Further, the jig is made of an aluminum alloy material with the thickness of 5 mm.
Further, a doctor blade is used to coat the printing paste, and the width of the doctor blade is matched with the jig.
Compared with the prior art, the utility model has the following beneficial technical effects:
according to the printing jig for reflow soldering of the semiconductor element, the jig is fixed with the steel mesh, and the printing area and the avoiding area which are separated from each other are formed in the jig, so that printing paste is printed on the corresponding area on the substrate only through the printing holes of the steel mesh in the printing area during printing, the structure is simple, the equipment cost is low, the design freedom degree is high, and printing of any pattern and quantitative control of the printing paste can be realized.
And (II) the jig and the substrate carrier are in pin joint or clamping connection, so that the printing position accuracy is high, and the printing yield is good.
And thirdly, further, the jig and the steel mesh are in threaded connection or adhesive connection or welded connection, so that the substrate can be smoothly separated from the mesh, and the printing yield is good.
Drawings
Fig. 1 is an isometric view of a printing jig for reflow soldering of semiconductor devices according to an embodiment of the utility model.
Fig. 2 is a schematic structural diagram of a printing jig for reflow soldering of semiconductor devices according to an embodiment of the present utility model.
Fig. 3 is a schematic structural diagram of a printing jig for reflow soldering of semiconductor devices according to an embodiment of the present utility model.
Fig. 4 is a schematic structural diagram of a printing jig for reflow soldering of semiconductor devices according to an embodiment of the present utility model.
The reference numerals in the drawings:
1. a jig; 11. a printing area; 12. an avoidance zone; 13. a screw hole; 14. positioning holes; 2. a steel mesh; 21. printing holes; 3. a substrate; 4. a substrate carrier; 5. a positioning piece; 6. and a fixing piece.
Detailed Description
For a better understanding of the utility model with objects, features and advantages, refer to the drawings. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that any modifications, changes in the proportions, or adjustments of the sizes of structures, proportions, or otherwise, used in the practice of the utility model, are included in the spirit and scope of the utility model which is otherwise, without departing from the spirit or essential characteristics thereof.
In the description of the present utility model, the positional or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. are based on the positional or positional relationship shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In order to more clearly describe the structure of the printing jig for reflow soldering of semiconductor elements, the present utility model defines terms of "distal end" and "proximal end", specifically, "distal end" means an end far from the operation table surface, "proximal end" means an end close to the operation table surface, taking fig. 2 as an example, the lower end of the fixing member 6 is the proximal end in fig. 2, and the upper end of the fixing member 6 is the distal end in fig. 2.
Example 1
Referring to fig. 1, 2, 3 and 4, a printing jig for reflow soldering of semiconductor elements comprises a substrate carrier 4, a substrate 3 placed at the far end of the substrate carrier 4, a steel mesh 2 arranged at the far end of the substrate 3, and a jig 1 arranged at the far end of the steel mesh 2, wherein a plurality of printing holes 21 are formed in the steel mesh 2, a avoiding area 12 is formed in the position, corresponding to the substrate 3, of the jig 1, a printing area 11 is formed in the position, corresponding to the printing holes 21, of the jig 1, the avoiding area 12 is mutually separated from the printing area 11, the printing area 11 is used for adding printing paste, and the printing paste is coated on a position to be printed of the substrate 3 through the printing holes 21.
The printing paste is used for welding copper columns and semiconductor elements, and can be tin paste, copper paste, silver paste and the like.
The specific structure of the jig 1 is described as follows:
referring to fig. 1, 3 and 4, further, the avoiding area 12 includes a plurality of rectangular frames, and the printing area 11 includes two rectangular frames, wherein one rectangular frame has a plurality of branch frames along the length direction.
Referring to fig. 1, 2, 3 and 4, further, the jig 1 is provided with six screw holes 13 along the length direction, the printing jig for reflow soldering of semiconductor elements further includes a fixing member 6, and the fixing member 6 passes through the screw holes 13 to be in threaded connection with the steel mesh 2. Preferably, in the printing jig for reflow soldering of semiconductor elements according to the first embodiment of the present utility model, the fixing member 6 is preferably an m2×8 bolt. The jig 1 and the steel mesh 2 may be connected by adhesion or welding, so long as the substrate 3 can be smoothly separated from the mesh, and the utility model is not limited.
Referring to fig. 1, 2, 3 and 4, in the printing jig for reflow soldering of semiconductor elements according to the first embodiment of the present utility model, the jig 1 and the carrier of the substrate 3 are preferably connected by pin connection. At least three positioning holes 14 are respectively formed in the jig 1 and the substrate 3 carrier, and the positioning holes 14 penetrate through the positioning piece 5. The three positioning holes 14 are arranged in a right triangle, and are firmly fixed and accurately positioned. The positioning piece 5 is specifically a positioning pin. Of course, in other embodiments of the present utility model, the fixture 1 and the substrate 3 carrier may be connected by a snap connection, for example, a snap fit and a snap groove, which only needs to be able to satisfy the positioning between the fixture 1 and the substrate 3 carrier, which is not limited in the present utility model.
Referring to fig. 1, 2 and 4, further, the jig 1 is made of an aluminum alloy material with a thickness of 5 mm.
Referring to fig. 1, 2, 3 and 4, further, a doctor blade is used to apply a printing paste, the width of the doctor blade being matched to the jig 1. Preferably, the blade width is 10mm.
The specific working procedure of the utility model is as follows:
and step 1, six M2 multiplied by 8 bolts penetrate through the screw holes 13 to fixedly connect the steel mesh 2 with the jig 1.
Step 2, placing the substrate 3 to be printed on the substrate carrier 4.
Step 3, the positioning pin passes through the positioning hole 14 to position the jig 1 and the substrate carrier 4, and the substrate 3 is located in the avoidance area 12 of the jig 1.
And 4, taking a proper amount of solder paste, and placing the solder paste at the edge of the printing area 11 of the jig 1.
And 5, printing the solder paste by using a scraper.
And 6, taking down the jig 1 and the locating pins to separate the steel mesh 2 from the substrate 3.
And 7, cleaning the jig 1, the steel mesh 2 and the scraper, and finishing printing.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (9)
1. A printing jig for reflow soldering of semiconductor elements is characterized in that: including the base plate carrier, place the base plate of base plate carrier distal end, set up the steel mesh of base plate distal end, set up the tool of steel mesh distal end, offer a plurality of printing holes on the steel mesh, the district is dodged to the department of corresponding base plate on the tool, the district is dodged to the printing district of correspondence printing hole department on the tool, dodge district and printing district and separate each other, and the printing district is used for adding printing thick liquids, makes printing thick liquids pass through printing hole coating to the base plate treat the printing department.
2. The printing jig for reflow soldering of semiconductor elements as recited in claim 1, wherein: the avoidance area comprises a plurality of rectangular frame bodies, the printing area comprises two rectangular frame bodies, and one rectangular frame body is provided with a plurality of branch frame bodies along the length direction.
3. The printing jig for reflow soldering of semiconductor elements as recited in claim 2, wherein: six screw holes are formed in the jig along the length direction, and the printing jig for reflow soldering of the semiconductor element further comprises a fixing piece which penetrates through the screw holes to be in threaded connection with the steel mesh.
4. The printing jig for reflow soldering of semiconductor elements as recited in claim 2, wherein: the jig is connected with the steel mesh in an adhesive mode or in a welding mode.
5. The printing jig for reflow soldering of semiconductor elements as recited in claim 1, wherein: the jig is connected with the substrate carrier in a pin joint mode.
6. The printing jig for reflow soldering of semiconductor elements of claim 5, wherein: at least three positioning holes are respectively formed in the jig and the substrate carrier, and the positioning holes penetrate through the positioning pieces.
7. The printing jig for reflow soldering of semiconductor elements as recited in claim 1, wherein: the jig is connected with the substrate carrier in a clamping way.
8. The printing jig for reflow soldering of semiconductor elements as recited in claim 1, wherein: the jig is made of an aluminum alloy material with the thickness of 5 mm.
9. The printing jig for reflow soldering of semiconductor elements as recited in claim 1, wherein: and coating printing slurry by using a scraper, wherein the width of the scraper is matched with the jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321871629.4U CN220653632U (en) | 2023-07-17 | 2023-07-17 | Printing jig for reflow soldering of semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321871629.4U CN220653632U (en) | 2023-07-17 | 2023-07-17 | Printing jig for reflow soldering of semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220653632U true CN220653632U (en) | 2024-03-22 |
Family
ID=90295674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321871629.4U Active CN220653632U (en) | 2023-07-17 | 2023-07-17 | Printing jig for reflow soldering of semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220653632U (en) |
-
2023
- 2023-07-17 CN CN202321871629.4U patent/CN220653632U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |