CN219718655U - Flexible tool for chip assembly process - Google Patents

Flexible tool for chip assembly process Download PDF

Info

Publication number
CN219718655U
CN219718655U CN202320231195.5U CN202320231195U CN219718655U CN 219718655 U CN219718655 U CN 219718655U CN 202320231195 U CN202320231195 U CN 202320231195U CN 219718655 U CN219718655 U CN 219718655U
Authority
CN
China
Prior art keywords
chip
tool
accommodating groove
main body
chip accommodating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202320231195.5U
Other languages
Chinese (zh)
Inventor
江楚玲
李全龙
钟光恒
朱建钢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
China South Industries Group Automation Research Institute
Original Assignee
China South Industries Group Automation Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by China South Industries Group Automation Research Institute filed Critical China South Industries Group Automation Research Institute
Priority to CN202320231195.5U priority Critical patent/CN219718655U/en
Application granted granted Critical
Publication of CN219718655U publication Critical patent/CN219718655U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The utility model discloses a flexible tool for a chip assembly process, which comprises a tool main body, wherein the tool main body is made of synthetic stone; the tool main body is provided with a plurality of chip accommodating groove groups, each chip accommodating groove group comprises a plurality of chip accommodating grooves, and each chip accommodating groove is used for accommodating one chip to be processed; the tool can realize the same tool for different working procedures such as chip inspection, chip gold removal, chip cleaning, chip baking, chip mounting and the like, reduces turnover waste of chips in different working procedures, prevents the chips from being damaged due to mismatching between common tools and the chip size, causes quality loss, avoids high material taking error rate in the mounting process, and improves the production efficiency. Meanwhile, one tool can be used for placing chips with different sizes, so that the universality of the tool is improved.

Description

Flexible tool for chip assembly process
Technical Field
The utility model relates to the technical field of electric mounting processes, in particular to a flexible tool for a chip assembly process, which is high in universality and practicability.
Background
All chips are required to be dehumidified and baked before the electronic board is welded, the baking temperature is 125 ℃, the temperature is 8-48 hours, and the nonstandard fixture is not high-temperature resistant, so that the chips are required to be transferred to the high-temperature resistant fixture when being baked, the time is wasted, and the risk of damaging the chips due to the unmatched fixture exists.
Meanwhile, before welding, gold-plated chip pins are required to be removed, chips are required to be cleaned after gold removal, unmatched chip tools lead to messy placement of gold-removed field materials, chip loss and pin deformation are easy to cause, and the chip cleaning efficiency is very low.
In addition, when chip mounting is carried out on a chip, the chip needs to be placed on the tool, and the error rate of material taking is high in the mounting process possibly caused by unmatched tools, so that the product quality and the production efficiency are affected.
Therefore, how to provide a tool for different processes such as chip inspection, chip gold removal, chip cleaning, chip baking, chip mounting, etc. is a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
In view of the above, the present utility model provides a flexible tool for a chip assembly process for overcoming or at least partially solving the above problems. Through the statistics to general chip size merges, designs, the flexible frock, and the frock can place multiple unidimensional chip simultaneously, and flexible frock adopts high temperature resistant synthetic stone, realizes that different processes such as chip inspection, chip remove gold, chip washs, chip toasts, chip paste dress and uses same frock, and frock commonality, practicality are strong.
The utility model provides the following scheme:
a flexible tooling for a chip assembly process, comprising:
the tool comprises a tool main body, wherein the tool main body is made of synthetic stone;
the tool main body is provided with a plurality of chip accommodating groove groups, each chip accommodating groove group comprises a plurality of chip accommodating grooves, and each chip accommodating groove is used for accommodating one chip to be processed;
wherein the internal outline sizes of the chip accommodating grooves contained in different chip accommodating groove groups are the same or different; the bottom of every the chip holding groove all is provided with the through-hole that runs through frock main part upper and lower surface.
Preferably: each chip accommodating groove is provided with two opposite notches, and a part of each of two opposite side edges of the chip to be treated in the chip accommodating groove is exposed by the two notches.
Preferably: two adjacent chip accommodating grooves which are positioned in the same row or the same column in the same chip accommodating groove group share the same notch.
Preferably: the internal outline size and the shape of the chip accommodating groove are determined according to the external outline size and the shape of the chip to be processed.
Preferably: the inner contour shape of the chip accommodating groove is matched with the outer contour shape of the chip to be processed.
According to the specific embodiment provided by the utility model, the utility model discloses the following technical effects:
the flexible tool for the chip assembly process provided by the embodiment of the utility model can realize the same tool for different processes such as chip inspection, chip gold removal, chip cleaning, chip baking, chip mounting and the like, reduces turnover waste of chips in different processes, prevents the chips from being damaged due to mismatching of common tools and chip sizes, prevents quality loss, avoids high material taking error rate in the mounting process, and improves production efficiency. Meanwhile, one tool can be used for placing chips with different sizes, so that the universality of the tool is improved.
Of course, it is not necessary for any one product to practice the utility model to achieve all of the advantages set forth above at the same time.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the present utility model and that other drawings may be obtained from these drawings by those of ordinary skill in the art without inventive effort.
Fig. 1 is a schematic structural diagram of a flexible tool for a chip assembly process according to an embodiment of the present utility model.
In the figure: the fixture comprises a fixture body 1, a chip accommodating groove 11, a through hole 12, a notch 13 and a chip 2 to be processed.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the utility model, fall within the scope of protection of the utility model.
Referring to fig. 1, a flexible tool for a chip assembly process according to an embodiment of the present utility model, as shown in fig. 1, may include:
the tool comprises a tool main body 1, wherein the tool main body 1 is made of synthetic stone;
the tool main body 1 is provided with a plurality of chip accommodating groove groups, each chip accommodating groove group comprises a plurality of chip accommodating grooves 11, and each chip accommodating groove 11 is used for accommodating one chip 2 to be processed; in the actual processing and manufacturing process of the tool main body, the periphery and the bottom surface of the tool accommodating groove are polished and leveled, and the chip device is ensured not to be damaged.
Wherein the internal outline sizes of the chip accommodating grooves 11 contained in different chip accommodating groove groups are the same or different; the bottom of each chip accommodating groove 11 is provided with a through hole 12 penetrating through the upper surface and the lower surface of the tool main body 1.
The flexible tool for the chip assembly process provided by the embodiment of the utility model is characterized in that the tool main body is made of synthetic stone, wherein the synthetic stone is green and environment-friendly stone, and is formed by mixing more than 95% of natural stone powder, a small amount of polyester and an adhesive in vacuum, pressurizing and vibration molding. The synthetic stone has the advantages of high temperature resistance, stable performance, no deformation after passing through a furnace, no foaming, no fuzzing, no layering, 380-DEG C resistance and good mechanical strength. Therefore, the tooling main body provided by the embodiment of the utility model can meet the long-time high-temperature baking of 48 hours of the chip device placed on the upper part of the tooling main body without deformation.
Meanwhile, as the internal outline sizes of the chip accommodating grooves contained in different chip accommodating groove groups are the same or different, the same fixture can be used for simultaneously accommodating chips with different sizes. In addition, as the bottom of each chip accommodating groove is provided with the through holes penetrating through the upper surface and the lower surface of the tool main body, the flow of the cleaning liquid can be prevented from being influenced when the chip devices are cleaned in batches.
Therefore, the flexible tool for the chip assembly process provided by the embodiment of the utility model can meet the use requirements of different processes in the chip assembly process, and ensures that the chip is not required to be transferred in the operation and processing process among the processes, and only the tool is required to be transferred. The labor intensity of workers can be greatly reduced, and the generation efficiency can be improved.
In order to achieve the purpose of rapid picking and placing, the embodiment of the utility model can provide that each chip accommodating groove 11 is provided with two opposite notches 13, and a part of each of two opposite sides of the chip 2 to be processed in the chip accommodating groove 11 is exposed by the two notches 13. Two notches are designed in the tool placement groove, so that the device can be conveniently inspected and quickly taken and placed in the gold removing process. The two opposite notches provided can enable the two opposite sides of the chip to be exposed, and the clamp is convenient to clamp.
In order to further improve the number requirements of the accommodating grooves of the tooling, the embodiment of the utility model can also provide that two adjacent chip accommodating grooves which are positioned in the same row or the same column in the same chip accommodating groove group share the same notch.
In order to ensure that the chip can be stably placed in the accommodating groove and can meet the sucking requirement, the embodiment of the utility model can provide that the internal outline size and shape of the chip accommodating groove 11 are determined according to the external outline size and shape of the chip 2 to be processed. Specifically, the internal contour shape of the chip accommodating groove 11 is adapted to the external contour shape of the chip 2 to be processed. The size of the universal device is counted in actual manufacturing and is used as a basis for designing the size of the flexible tool groove, the size of the accommodating groove of the tool is matched with the size of the universal device, the chip device is not easy to move in the tool, and the chip device can be easily sucked from the tool by the chip mounter.
In a word, the flexible tooling for the chip assembly process provided by the utility model can realize the same tooling for different processes such as chip inspection, chip gold removal, chip cleaning, chip baking, chip mounting and the like, reduce turnover waste of chips in different processes, prevent the chips from being damaged due to mismatching of common tooling and chip size, avoid quality loss, avoid high material taking error rate in the mounting process and improve the production efficiency. Meanwhile, one tool can be used for placing chips with different sizes, so that the universality of the tool is improved.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
From the above description of embodiments, it will be apparent to those skilled in the art that the present utility model may be implemented in software plus a necessary general hardware platform. Based on such understanding, the technical solution of the present utility model may be embodied essentially or in a part contributing to the prior art in the form of a software product, which may be stored in a storage medium, such as a ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute the method described in the embodiments or some parts of the embodiments of the present utility model.
In this specification, each embodiment is described in a progressive manner, and identical and similar parts of each embodiment are all referred to each other, and each embodiment mainly describes differences from other embodiments. In particular, for a system or system embodiment, since it is substantially similar to a method embodiment, the description is relatively simple, with reference to the description of the method embodiment being made in part. The systems and system embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present utility model without undue burden.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model are included in the protection scope of the present utility model.

Claims (4)

1. The utility model provides a flexible frock is used to chip assembly process which characterized in that includes:
the tool comprises a tool main body, wherein the tool main body is made of synthetic stone;
the tool main body is provided with a plurality of chip accommodating groove groups, each chip accommodating groove group comprises a plurality of chip accommodating grooves, and each chip accommodating groove is used for accommodating one chip to be processed;
wherein the internal outline sizes of the chip accommodating grooves contained in different chip accommodating groove groups are the same or different; the bottom of every the chip holding groove all is provided with the through-hole that runs through frock main part upper and lower surface.
2. The flexible tooling for the chip assembling process according to claim 1, wherein each chip accommodating groove is provided with two opposite notches, and a part of each of two opposite sides of the chip to be processed positioned in the chip accommodating groove is exposed by the two notches.
3. The flexible tool for chip assembling process according to claim 2, wherein two adjacent chip accommodating grooves in the same row or column in the same chip accommodating groove group share the same notch.
4. The flexible tool for chip assembling process according to claim 1, wherein an inner contour shape of the chip accommodating groove is adapted to an outer contour shape of the chip to be processed.
CN202320231195.5U 2023-02-16 2023-02-16 Flexible tool for chip assembly process Active CN219718655U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320231195.5U CN219718655U (en) 2023-02-16 2023-02-16 Flexible tool for chip assembly process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320231195.5U CN219718655U (en) 2023-02-16 2023-02-16 Flexible tool for chip assembly process

Publications (1)

Publication Number Publication Date
CN219718655U true CN219718655U (en) 2023-09-19

Family

ID=87982816

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320231195.5U Active CN219718655U (en) 2023-02-16 2023-02-16 Flexible tool for chip assembly process

Country Status (1)

Country Link
CN (1) CN219718655U (en)

Similar Documents

Publication Publication Date Title
US4399610A (en) Assembling an electronic device
CN219718655U (en) Flexible tool for chip assembly process
US6787382B1 (en) Method and system for singulating semiconductor components
CN208353738U (en) Tooling for FPC attachment pcb board
CN113242654B (en) Copper block embedding process of multilayer circuit board
CN213459654U (en) Chip replanting ball clamp
CN216632943U (en) A coating steel mesh smelting tool for solder paste for in module production
JP6644845B2 (en) Particle removal tip and index type particle removal device using the same
DE112013007641B4 (en) Method for manufacturing a semiconductor device
CN112397425A (en) Quartz boat for processing silicon wafers
CN213997142U (en) Semiconductor etching equipment silicon ring class spare part washs tool
CN214721264U (en) CSOP device removes gold device in batches
CN104582284B (en) The preparation method of package substrate
CN209778988U (en) Cleaning and meltallizing protection jig for components in semiconductor vapor deposition device
US6296169B1 (en) Flux-application fixture for a ball-grid-array (BGA) assembly process
CN213426797U (en) Wafer dish loading tool
CN203910769U (en) Wafer cooling chamber
CN219633654U (en) Wafer clamp disassembling workbench
CN217641234U (en) Fixing tool for wafer
CN208889629U (en) Wafer Cleaning is mostly used the gaily decorated basket
JPH07297210A (en) Manufacture of semiconductor element
CN212610860U (en) A clean all-in-one for wicking
CN220420559U (en) Carrier and adsorption structure
CN219873432U (en) Chassis jig
CN209785875U (en) cleaning and meltdown protection tool for photoresist rotary shielding cover component of semiconductor equipment

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant