CN214852589U

CN214852589U - Ejector plate for unloading SMT carrier

Info

Publication number: CN214852589U
Application number: CN202121597728.9U
Authority: CN
Inventors: 刘小琴; 吴坤; 朱豫
Original assignee: Xiangyang Donghe Electronic Technology Co ltd
Current assignee: Xiangyang Donghe Electronic Technology Co ltd
Priority date: 2021-07-14
Filing date: 2021-07-14
Publication date: 2021-11-23
Anticipated expiration: 2031-07-14

Abstract

An ejector pin plate for unloading an SMT carrier comprises an ejector pin base with the overall dimension larger than that of a PCB device plate, wherein a plurality of ejector pin groups are arranged on the ejector pin base, each group of ejector pin groups corresponds to a bearing groove on the PCB device plate one by one, each group of ejector pin group at least comprises more than two ejector pins, and each ejector pin in the same ejector pin group corresponds to a heat dissipation hole in the corresponding bearing groove; more than two positioning columns are arranged on the thimble base, and positioning holes which are matched and positioned with the positioning columns in a one-to-one correspondence manner are arranged on the PCB device board; the middle of the two end parts of the thimble base is inwards concaved to form an abdicating notch for abdicating the PCB device board; the periphery of the upper end face of the thimble base is provided with two groups of positioning rod groups for positioning the placement direction of the PCB device board, the two groups of positioning rod groups are arranged on two adjacent side edges of the thimble base, and the two adjacent side edges of the PCB device board are abutted against and positioned by the two groups of positioning rod groups. The production quality and the production efficiency are effectively improved, and the utilization rate of the carrier is improved.

Description

Ejector plate for unloading SMT carrier

Technical Field

The utility model belongs to the technical field of circuit board production, concretely relates to thimble board for SMT carrier uninstallation.

Background

With the development of the electronic technology industry, the assembly of electronic products is developed toward high density, high precision, automation, miniaturization and low cost. In the related art, the surface mount technology is a new generation of electronic assembly technology adapted to the technology development. In SMT production, many work tools need to be used in the PCB circuit board manufacturing process, such as reflow soldering carriers, wave soldering carriers, cross stove carriers and the like, after each step of process is completed, the PCB circuit board needs to be taken out from each carrier, so that subsequent process flows are facilitated, but the PCB circuit board is taken out manually from the carrier at present, so that a clearance groove is formed in the existing carrier to facilitate manual operation, the clearance groove is arranged to cause waste of carrier space, the position of the PCB circuit board can be prevented from being greatly reduced on one carrier, the utilization rate of the carrier is affected, and meanwhile, the production efficiency of the PCB circuit board is invisibly affected. Meanwhile, due to the adoption of manual blanking, the circuit board and the carrier can be scratched to damage the PCB, and the circuit boards are required to be taken out one by one through the manual blanking, so that the working efficiency is low.

Disclosure of Invention

An object of the utility model is to solve the not enough of above-mentioned prior art to a thimble board for SMT carrier uninstallation is provided, effectual production quality and the production efficiency of having improved improves the utilization ratio of carrier.

An ejector plate for unloading an SMT carrier is used for ejecting a PCB loaded in the SMT carrier and comprises an ejector pin base with the overall dimension larger than that of a PCB device plate, a plurality of ejector pin groups are arranged on the ejector pin base, each group of ejector pin groups corresponds to a bearing groove on the PCB device plate one by one, each group of ejector pin groups at least comprises more than two ejector pins, and each ejector pin in the same ejector pin group corresponds to a heat dissipation hole in the corresponding bearing groove; more than two positioning columns are arranged on the thimble base, and positioning holes which are matched and positioned with the positioning columns in a one-to-one correspondence manner are arranged on the PCB device board; the middle of the two end parts of the thimble base is inwards concaved to form an abdicating notch for abdicating the PCB device board; the periphery of the upper end face of the thimble base is provided with two groups of positioning rod groups for positioning the placement direction of the PCB device board, the two groups of positioning rod groups are arranged on two adjacent side edges of the thimble base, and the two adjacent side edges of the PCB device board are abutted against and positioned by the two groups of positioning rod groups.

Each group of thimble group consists of two thimbles, and the two thimbles correspond to the two heat dissipation holes at the two ends of the corresponding bearing groove.

After the PCB device board is positioned and placed on the ejector pin base, the top end of the ejector pin protrudes out of the upper end face of the PCB device board, and two side edges of the PCB device board protrude out of the inner side wall of the abdicating notch

The thimble base and the PCB device board are rectangular boards, and the length and the width of the thimble base are both correspondingly larger than those of the PCB device board.

Each group of positioning rod group consists of two positioning rods, and the height of each positioning rod is consistent and higher than that of the positioning column.

The thimble base is made of a thin plate made of a PUM material with the thickness of 10 mm.

The surface of the thimble base is subjected to oxidation treatment.

Four right angles around the bottom of the thimble base are provided with four trapezoidal foot pads with the same size.

The utility model discloses the thimble board that sets up can once only go to pick up the PCB circuit board group that is ejected with the manual work ejecting with PCB circuit board group on the monoblock carrier, great improvement work efficiency to two at least thimbles of every PCB circuit board group simultaneously, can the horizontally ejecting with PCB circuit board group, prevent that PCB circuit board and carrier production are cut to the right and are rubbed, improved the yields of production. Set up two sets of positioner of locating lever and reference column, can the accurate positioning, prevent to fix a position inaccurately, lead to SMT carrier unevenness and cause PCB circuit board group to drop and produce badly.

The utility model discloses simple structure, the simple operation. The production quality and the production efficiency are effectively improved.

Drawings

Fig. 1 is a top view of the present invention;

fig. 2 is a bottom view of the present invention;

FIG. 3 is a view of the present invention;

FIG. 4 is a structural view of a PCB assembly board;

in the figure: 1, PCB assembly board; 2. a thimble base; 3. a bearing groove; 4, positioning columns; 5. heat dissipation holes; 6, positioning holes; 7. a abdication gap; 8. a thimble; 9. a foot pad; 10. positioning a rod; 11. and a positioning column.

Detailed Description

In order to make the objects, technical solutions and advantageous technical effects of the present invention clearer, the present invention is further described in detail below with reference to the accompanying drawings.

In FIG. 1, the thimble base 2 is made of a thin plate of a PUM material having a thickness of 10mm, and the surface of the thimble base 2 is subjected to oxidation treatment. The thimble base 2 and the PCB assembly board 1 are consistent and are all rectangular structures, a thimble group is arranged on the thimble base plate 2, each thimble group at least comprises two thimbles 8, the thimble base plate 2 is provided with 3 positioning columns 11, wherein the two positioning columns 11 are erected on a short edge of the thimble base plate 2 side by side, the other positioning column 11 is erected on a long edge of the thimble base plate 2 and is positioned on one side away from the other two positioning columns 11, two groups of positioning rod groups are arranged on the periphery of the thimble base 2, the two groups of positioning rod groups are respectively arranged on two adjacent edges of the thimble base, each group of positioning rod group comprises two positioning rods 10, and the height of each positioning rod 10 is consistent and higher than the positioning columns 11. The lower position of the PCB device board 1 can be preliminarily positioned all around, so that the phenomenon that the PCB carrier is not flat and the PCB circuit board group falls to cause bad positioning is avoided. The middle positions of two short sides of the thimble base plate 2 are respectively provided with an inward concave U-shaped abdicating notch 7, so that the PCB device board 1 can be conveniently held by hand, the PCB device board 1 is vertically and stably arranged on the thimble base 2, the PCB device board 1 is positioned and placed on the thimble base 2, and the two side edges of the PCB device board 1 protrude out of the inner side wall of the abdicating notch 7.

In fig. 2, four trapezoidal foot pads 9 with the same size are arranged at four right angles around the bottom of the thimble base 2.

In fig. 3 and 4, the PCB device board 1 of the SMT carrier is also a rectangular board, the length of the thimble base 2 is greater than that of the PCB device board 1, the width of the thimble base 2 is greater than that of the PCB device board 1, a plurality of bearing grooves 3 for placing a PCB circuit board are uniformly distributed on the PCB device board 1 side by side, each group of thimble groups corresponds to the bearing groove 3 on the PCB device board 1 one by one, a plurality of heat dissipation holes 5 are uniformly distributed in the bearing groove 3, two thimbles 8 of each group of thimble groups correspond to two heat dissipation holes 5 at two ends of the corresponding bearing groove 3, the PCB device board 1 is positioned and placed on the thimble base 2, and the top ends of the thimbles 8 protrude out of the upper end surface of the PCB device board 1. The PCB circuit board group on the whole carrier can be ejected out at one time, the ejected PCB circuit board group is picked up only by manpower, the working efficiency is greatly improved, meanwhile, the PCB circuit board group can be horizontally ejected out aiming at least two ejector pins of each PCB circuit board group, the PCB circuit boards and the carrier are prevented from being cut by the fingers and rubbed, and the yield of production is improved. The PCB device board 1 is provided with positioning holes 6 which are matched and positioned with the three positioning columns 11 in a one-to-one correspondence mode, and two adjacent side edges of the PCB device board 1 are abutted against and positioned by the two groups of positioning rod groups. Set up two sets of positioner of locating lever and reference column, can the accurate positioning, prevent to fix a position inaccurately, lead to SMT carrier unevenness and cause PCB circuit board group to drop and produce badly.

When the PCB positioning device is used, the matched PCB circuit board group is placed into the corresponding bearing groove 3 of the PCB device board 1, and the positioning hole device at the lower end of the PCB circuit board group is placed on the positioning column 4 in the bearing groove 3. The same variety of PCB circuit board groups can be loaded into 9 blocks at one time. After 9 PCB circuit boards are assembled, the PCB device board 1 assembled with the PCB circuit boards is taken out and pressed on the rectangular thimble base 2 by a worker after the completion of the processing of the PCB circuit boards, the worker holds the middle positions at the two end parts of the PCB device board 1 with both hands during the pressing, the PCB device board 1 is horizontally moved downwards, the front, the back, the left and the right positions of the PCB device board 1 are preliminarily positioned by 4 positioning rods, the PCB device board 1 is continuously moved downwards until the PCB device board 1 is stably positioned on the thimble base 2, at the moment, two thimbles 8 of each group are correspondingly inserted into two heat dissipation holes 5 in the corresponding bearing grooves 3, the PCB circuit boards are horizontally jacked up, all the PCB circuit boards can be protruded from the bearing grooves 3 of the PCB device board 1 after the operation, the worker directly takes out the circuit boards, and the working efficiency is greatly improved.

Claims

1. An ejector plate for unloading an SMT carrier, which is used for ejecting a PCB circuit board loaded in the SMT carrier, is characterized in that: the ejector pin group structure comprises an ejector pin base (2) with the outline dimension larger than that of a PCB (printed circuit board) device board (1), wherein a plurality of ejector pin groups are arranged on the ejector pin base (2), each ejector pin group corresponds to a bearing groove (3) on the PCB device board (1) one by one, each ejector pin group at least comprises more than two ejector pins (8), and each ejector pin (8) in the same ejector pin group corresponds to a heat dissipation hole (5) in the corresponding bearing groove (3); more than two positioning columns (11) are arranged on the thimble base (2), and positioning holes (6) which are matched and positioned with the positioning columns (11) in a one-to-one correspondence manner are arranged on the PCB device board (1); the middle of two end parts of the thimble base (2) is recessed inwards to form an abdicating notch (7) for abdicating the PCB device board (1); the periphery of the upper end face of the thimble base (2) is provided with two groups of positioning rod groups used for positioning the placement direction of the PCB device board (1), the two groups of positioning rod groups are arranged on two adjacent side edges of the thimble base (2), and the two adjacent side edges of the PCB device board (1) are abutted against and positioned by the two groups of positioning rod groups.

2. An ejector plate for SMT carrier unloading according to claim 1, wherein: each group of thimble group consists of two thimbles (8), and the two thimbles (8) correspond to the two heat dissipation holes (5) at the two ends of the corresponding bearing groove (3).

3. An ejector plate for SMT carrier unloading according to claim 1, wherein: after the PCB (1) is positioned and placed on the ejector pin base (2), the top end of the ejector pin (8) protrudes out of the upper end face of the PCB (1), and two side edges of the PCB (1) protrude out of the inner side wall of the abdicating notch (7).

4. An ejector plate for SMT carrier unloading according to claim 1, wherein: the thimble base (2) and the PCB assembly board (1) are rectangular plates, and the length and the width of the thimble base (2) are both correspondingly larger than those of the PCB assembly board (1).

5. An ejector plate for SMT carrier unloading according to claim 1, wherein: each group of positioning rod group consists of two positioning rods (10), and the height of each positioning rod (10) is consistent and higher than that of the positioning column (11).

6. An ejector plate for SMT carrier unloading according to claim 1, wherein: the thimble base (2) is made of a thin plate made of a PUM material with the thickness of 10 mm.

7. An ejector plate for SMT carrier unloading according to claim 1, wherein: the surface of the thimble base (2) is oxidized.

8. An ejector plate for SMT carrier unloading according to claim 1, wherein: four right angles around the bottom of the thimble base (2) are provided with four trapezoidal foot pads (9) with the same size.