CN215731614U

CN215731614U - BGA chip tin ball implanting module

Info

Publication number: CN215731614U
Application number: CN202122190967.9U
Authority: CN
Inventors: 黎艺华
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-09-10
Filing date: 2021-09-10
Publication date: 2022-02-01
Anticipated expiration: 2031-09-10

Abstract

The utility model discloses a BGA chip tin ball implanting module which comprises a substrate, wherein a tin ball implanting area is arranged on the upper surface of the substrate, the surface of the tin ball implanting area is sunken downwards to form a tin ball groove, positioning blocks are arranged on four sides of the tin ball implanting area, and a hole releasing hole is formed in the side edge of the substrate. The utility model provides a module which can facilitate the chip to implant the solder balls, and the solder balls can be implanted through the module to achieve the effects of plump solder balls, avoiding insufficient soldering and the like.

Description

BGA chip tin ball implanting module

Technical Field

The utility model belongs to the field of chip mounting, and particularly relates to a BGA chip solder ball mounting module.

Background

When electronic products such as a mobile phone are maintained in daily life, a plurality of relatively dense chips such as a CPU (central processing unit) and the like for dismounting pins in a BGA (ball grid array) are frequently encountered, at present, maintenance personnel often plant tin by using a traditional steel mesh, the traditional steel mesh tin planting method is to place a chip on a desktop plane, place a steel mesh on the chip, align holes of the steel mesh with welding point pins of the chip, then smear a layer of tin paste on the holes of the steel mesh, blow hot air to the steel mesh and heat the chip by using a hot air gun until the tin paste is melted and welded with the chip pins and attached, the whole process needs to hold tweezers with hands to press and stabilize the steel mesh, so that deviation and bulging of the steel mesh are prevented, the operation is troublesome, time consumption and non-uniformity are realized, and more importantly, physical damage of the chip caused by pressing of the tin planting mesh is increased.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a BGA chip solder ball implanting module, which aims to solve the problems in the background technology. In order to realize the purpose, the utility model adopts the technical scheme that:

the utility model provides a BGA chip plants tin ball module, includes the base plate, the upper surface of base plate is equipped with plants the tin ball district, the surface undercut in planting the tin ball district forms the tin ball groove, the four sides in planting the tin ball district are equipped with the locating piece, the side of base plate has been seted up and has been taken off the pore.

Preferably, the upper surface of the substrate is provided with a plurality of parallel tin ball implanting regions.

Preferably, the lower surface of the substrate is provided with a plurality of nameplate positions which are arranged side by side and are used for inscribing the names of the tin-implanted ball areas.

Preferably, the base plate is connected with a hand holding position.

The utility model has the beneficial effects that:

1. the alignment can be avoided in the process of coating the tin mud, and the automatic correction can be realized;

2. the pressing can be avoided in the tin soldering process, and tin beads are full and uniform;

3. the effects of time saving, high efficiency and safety can be achieved.

Drawings

FIG. 1 is a schematic top view of a BGA chip solder ball mounting module according to an embodiment of the present invention;

FIG. 2 is a schematic view of a bottom surface of a BGA chip solder ball mounting module according to an embodiment of the present invention;

FIG. 3 is a schematic side view of a BGA chip solder ball mounting module according to an embodiment of the present invention;

wherein, in the figures, the respective reference numerals:

1. a substrate; 11. a tin ball planting region; 111. a tin ball groove; 112. positioning blocks; 12. plate hole removing; 13. a nameplate position; 2. and (4) holding the position by hand.

Detailed Description

To facilitate an understanding of the utility model, the utility model will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. As used herein, the terms "vertical," "horizontal," "left," "right," and the like are for illustrative purposes only and do not represent the only embodiments, and as used herein, the terms "upper," "lower," "left," "right," "front," "rear," and the like are used in a positional relationship with reference to the drawings.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

As shown in fig. 1 to 3, an embodiment of the utility model provides a BGA chip solder ball implanting module, which includes a substrate 1, a solder ball implanting region 11 is disposed on an upper surface of the substrate 1, a solder ball groove 111 is formed by a downward depression of a surface of the solder ball implanting region 11, positioning blocks 112 are disposed on four sides of the solder ball implanting region 11, and a hole releasing hole 12 is disposed on a side of the substrate 1.

In the present embodiment, the upper surface of the substrate 1 is provided with a plurality of parallel solder ball implantation regions 11.

In the embodiment, the bottom surface of the substrate 1 is provided with a plurality of nameplate locations 13 arranged side by side, and the nameplate locations 13 are used for inscribing the names of the solder ball implantation regions 11.

In this embodiment, the substrate 1 is connected to the hand-held position 2.

The working principle is as follows:

before tin planting, cleaning the substrate 1 and a chip to be mounted, smearing tin paste in the tin ball groove 111, filling the designed tin ball groove 111 with the tin paste, wiping off redundant tin paste by using dust-free cloth, placing the chip above the tin ball groove 111, and positioning the chip by using the positioning block 112. The method comprises the following steps of placing a substrate 1 on a heating table, enabling the lower surface of the substrate 1 to be a plane, enabling the substrate 1 to be flatly placed on the heating table, enabling the substrate to be uniformly heated by the heating table, enabling a chip to absorb tin ball tin balls along with temperature rise, and clamping the substrate 1 and the chip away from the heating table after heating. The chip can be gently pried from the releasing hole 12 by using tweezers to release from the substrate 1, and the chip is placed on the main board for installation after several seconds.

The substrate 1 and the chip are conveniently translated by using the holding position 2 in the process of placing the substrate 1 on the heating table.

A substrate 1 can be provided with a plurality of tin ball implanting regions 11, and the arrangement of the tin ball grooves 111 of each tin ball implanting region 11 can be designed for tin implanting of different chips. The back of basic 1 sets up data plate position 13, inscriptions the model that plants tin ball district 11 and correspond on data plate position 13, can carry out the mark of model to the planting tin ball district 11 of different chips, conveniently distinguishes.

The above embodiments are only for illustrating the utility model and are not to be construed as limiting the utility model, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the utility model, therefore, all equivalent technical solutions also belong to the scope of the utility model, and the scope of the utility model is defined by the claims.

Claims

1. A BGA chip solder ball implanting module is characterized in that: the tin ball planting structure comprises a substrate, the upper surface of base plate is equipped with plants tin ball district, the surface undercut in planting tin ball district forms the tin ball groove, the four sides in planting tin ball district are equipped with the locating piece, the side of base plate has been seted up and has been taken off the diaphragm orifice.

2. The BGA chip solder ball mounting module of claim 1, wherein: the upper surface of the substrate is provided with a plurality of parallel tin-implanted ball regions.

3. The BGA chip solder ball mounting module of claim 2, wherein: the lower surface of the substrate is provided with a plurality of nameplate positions which are arranged side by side and are used for inscribing the names of the tin-implanted ball areas.

4. The BGA chip solder ball mounting module of any one of claims 1-3, wherein: the base plate is connected with a hand holding position.