US20050272277A1 - Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate - Google Patents
Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate Download PDFInfo
- Publication number
- US20050272277A1 US20050272277A1 US11/203,988 US20398805A US2005272277A1 US 20050272277 A1 US20050272277 A1 US 20050272277A1 US 20398805 A US20398805 A US 20398805A US 2005272277 A1 US2005272277 A1 US 2005272277A1
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- United States
- Prior art keywords
- wiring substrate
- light emitting
- shape
- zonal
- arcuate
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/04—Circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/034—Portable transmitters
- H04B1/0346—Hand-held transmitters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/062—LED's
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S385/00—Optical waveguides
- Y10S385/901—Illuminating or display apparatus
Definitions
- the present invention concerns a method of manufacturing an annular oblique light illumination apparatus having a frustconical inner circumferential surface as a light emitting device arranging surface, and a flexible wiring substrate used therefor.
- LED annular oblique light illumination apparatus are used, for example, in product inspection.
- a light emitting device arranging surface 3 having a frustconical surface is formed inside an annular frame F, and a wiring substrate 41 having LED 9 , 9 , - - - , as light emitting device, mounted thereon is attached to the arranging surface 4 .
- an arcuate zonal flexible wiring substrate 41 conforming an arcuate zonal wiring pattern 42 is supported in a planar state, electrodes of LED 9 , 9 , - - - are inserted into through holes 11 therein and soldered, and then ends of the arcuate zonal flexible wiring substrate 41 are joined to each other to form a frustconical shape, which was then fixed to the arranging surface 3 (refer to Japanese Patent No. 2975893).
- the shape of the wiring substrate 41 is not symmetrical, the shape of the jig is also complicated.
- the wiring substrate 41 is supported on a square frame it is slackened or distorted at not retained end edges by the weight of the LED 9 , 9 - - - , to result in a problem of soldering failure.
- an annular oblique light illumination apparatus having a frustconical inner circumferential surface as a light emitting device arranging surface, which comprises;
- a flexible wiring substrate in which arcuate zonal wiring patterns are formed continuously on a base film of a determined shape is normalized in accordance with the shape of a jig irrespective of the arcuate shape of the wiring pattern, there is no requirement for providing plural kinds of jigs.
- a general purpose square frame can be used as the jig and the manufacturing cost for the jig can be decreased.
- the base film can be supported simply by merely stretching and setting the film and since the entire circumference thereof can be supported reliably, soldering failure is scarcely caused by the slackening or distortion of the wiring substrate.
- a circuit can be formed from one end to the other end thereof, and LED mounted to each of the patterns can be lit at the instance soldering is completed thereby enabling product inspection all at once.
- FIG. 1 is an explanatory view showing a flexible wiring substrate according to the present invention
- FIG. 2 is an explanatory view showing an annular oblique light illumination apparatus
- FIG. 3 is an explanatory view showing the dimension of an arcuate zonal pattern shape
- FIG. 4 is an explanatory view showing a portion of a manufacturing step
- FIG. 5 is an explanatory view showing a portion of a manufacturing step
- FIG. 6 is an explanatory view showing a portion of a manufacturing step
- FIG. 7 is an explanatory view showing another flexible wiring substrate
- FIG. 8 is an explanatory view showing other flexible wiring substrate.
- FIG. 9 is an explanatory view showing the prior art.
- a flexible wiring substrate 1 shown in FIG. 1 is used for forming an LED array (light emitting device array) 4 attached to a light emitting device arranging surface 3 having a frustconical inner circumferential surface formed inside an annular frame F of an annular oblique light illumination apparatus 2 (refer to FIG. 2 ).
- a plurality of arcuate zonal wiring patterns 6 , 6 , - - - for mounting light emitting devices each in the form of a developed frustconical shape when cut along the pattern are serpiginously formed continuously by way of connecting wiring patterns 7 to/on a base film 5 of a determined shape.
- Such serpiginous patterns 8 are formed in a plurality of rows.
- the base film 5 used has normalized shape and size such that it can be attached, for example, to a carrier (jig) C of a flow soldering apparatus, for example, as shown in FIG. 4 , irrespective of the shape of the arcuate zonal wiring pattern 6 .
- a substantially square film of a size capable of being mounted on a general purpose carrier used upon soldering a general purpose substrate is used.
- Through holes 11 for inserting the electrodes 10 of LED (light emitting device) 9 , 9 , - - - are formed to the arcuate zonal wiring pattern 6 , and a land 12 for soldering the electrode 10 is formed at the back for each of the through holes 11 .
- Each of the wiring patterns 6 , 6 . . . is designed such that a closed circuit for inspection is established in a state of mounting LED 9 , 9 , - - - and inspection terminals 13 are formed to the base film 5 .
- perforations 14 are formed along both sides of the pattern 8 , and cut out lines 15 are drawn between the arcuate zonal wiring patterns 6 and the connecting wiring patterns 7 .
- the flexible wiring substrate 1 is attached to the square frame-like carrier (jig) C in a stretched state.
- the base film 5 for the flexible wiring substrate 1 is formed as a substantially square shape, the base film 5 can be reliably fixed by fixing at four sides while stretching the base film.
- the base film 5 is normalized in accordance with the shape of the carrier C, one kind of the carrier C may suffice.
- electrodes of LED 9 , 9 , - - - are successively inserted into the through holes 11 of the arcuate zonal wiring pattern 6 and, after inserting LED 9 , 9 , - - - into all through holes 11 , the electrodes 10 are soldered to the lands 12 .
- test time can be shortened.
- any one of the LED is not lit, since there may be considered a circuit failure or device failure, they may be sent to a re-inspection station for detailed inspection.
- an arcuate zonal LED array 4 is formed.
- the pattern may be cut along the perforations 14 formed on both sides of the serpiginous pattern by using pincers or cutters and the arcuate zonal pattern 6 and the connecting wiring patterns 7 may be cut out from the cut out lines 15 .
- the perforations 14 may be formed by weakening the base film peelably, for example, using a radio frequency sewing machine or it may be a printed cut out lines.
- FIG. 7 shows another flexible wiring substrate according to the invention. Those portions identical with FIG. 1 carry same reference numerals for which detailed explanations will be omitted.
- a plurality of annular stripe wiring patterns 22 for mounting light emitting devices each in the form of an arcuate shape that can be mounted to the LED arranging surface 3 when cut at a predetermined center angle ⁇ are formed to a predetermined square base film 5 .
- the annular stripe pattern 22 may be a circular or elliptic shape.
- one annular stripe wiring pattern 22 is divided into two arcuate zonal parts 24 .
- the annular oblique light illumination apparatus 2 can be manufactured by using the flexible wiring substrate 21 in the same manner as described above by fixing the wiring substrate 21 to the carrier C, inserting the electrodes 10 of LED 9 , 9 , - - - into the through holes 11 formed to the arcuate zonal parts 24 of the wiring pattern 22 , soldering the electrodes 10 to the wiring pattern 22 , then supplying electric power from the inspection terminals 13 to effect conduction inspection, then cutting out the arcuate zonal part 24 mounted with LED 9 , 9 , - - - to form an LED array 4 , connecting the ends of the LED array 4 to each other into a frustconical shape and fixing the same to the LED arranging surface 3 .
- FIG. 8 shows other wiring substrate according to the invention. Those portions identical with FIG. 1 carry same reference numerals for which detailed descriptions are to be omitted.
- one or more arcuate zonal wiring patterns 32 for mounting light emitting devices each in the form of a developed frustconical shape of the arranging surface 3 when cut along cut out lines 33 and perforations 14 are formed to a predetermined square base film 5 .
- Each of the arcuate zonal wiring patterns 32 is formed so as to have a center angle ⁇ of about 90° in a case where the angle ⁇ of inclination of the arranging surface is 75°.
- the annular oblique light illumination apparatus 2 can be manufactured by using the flexible wiring substrate 31 in the same manner as described above, by attaching the wiring substrate 31 to the carrier C, inserting the electrodes 10 of LED 9 , 9 , - - - into the through holes 11 formed in the wiring pattern 32 , soldering the electrodes 10 to the wiring pattern 32 , then supplying electric power from the inspection terminals 13 to apply conduction inspection, cutting out the wiring pattern 32 mounted with LED 9 , 9 , - - - to form the LED array 4 , connecting the ends of the LED array 4 to each other into a frustconical shape and fixing the same to the LED arranging surface 3 .
- any of the printed wiring substrates 21 and 31 shown in FIG. 7 and FIG. 8 since the base film is formed into a substantially square shape, four sides thereof can reliably be fixed by the carrier C.
- the base film 5 has a predetermined shape having no concern with the shape of the annular zonal wiring pattern 22 or the arcuate zonal wiring pattern 32 , one kind of jig may suffice also in a case of fixing the same by using the jig.
- the wiring substrate of a predetermined shape for example, a square shape formed with arcuate zonal wiring patterns is used instead of using the arcuate zonal wiring substrate and the wiring substrate can be supported reliably using only one kind of the jig irrespective of the shapes of the wiring patterns, troublesome exchange or handling of jigs can be saved.
- the wiring substrate is less slackened or distorted upon soldering by using the flow soldering apparatus, it can provide an excellent effect of not resulting in product deficiency caused by soldering failure.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Structure Of Printed Boards (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
A flexible wiring substrate forms a light emitting device array attached to a frustoconical inner circumferential surface that serves as a light emitting device arranging surface of an annual oblique light illumination apparatus. A plurality of arcuate zonal wiring patterns for mounting light emitting devices are provided. Each wiring pattern is in the form of a developed frustoconical shape. The wiring patterns are serpiginously provided continuously directly or by way of connecting wiring patterns to a base film of a predetermined shape.
Description
- This application is a divisional of pending U.S. patent application Ser. No. 10/806,284, filed on Mar. 23, 2004, entitled “Method of Annular Oblique Light Illumination Apparatus and Flexible Wiring Substrate” in the names of Makoto Toyota et al., the disclosure of which is expressly incorporated by reference herein in its entirety.
- 1. Field of the Invention
- The present invention concerns a method of manufacturing an annular oblique light illumination apparatus having a frustconical inner circumferential surface as a light emitting device arranging surface, and a flexible wiring substrate used therefor.
- 2. Statement of Related Art
- LED annular oblique light illumination apparatus are used, for example, in product inspection. In an existent LED annular oblique light illumination apparatus, as shown in
FIG. 2 , a light emittingdevice arranging surface 3 having a frustconical surface is formed inside an annular frame F, and awiring substrate 41 havingLED surface 4. - In a case of manufacturing an annular oblique
light illumination apparatus 2 for a substrate, as shown inFIG. 9 , an arcuate zonalflexible wiring substrate 41 conforming an arcuatezonal wiring pattern 42 is supported in a planar state, electrodes ofLED holes 11 therein and soldered, and then ends of the arcuate zonalflexible wiring substrate 41 are joined to each other to form a frustconical shape, which was then fixed to the arranging surface 3 (refer to Japanese Patent No. 2975893). - According to the constitution described above, since all
LED wiring substrate 41 in the planer state, this can save troublesome operation of solderingindividual LED - However, for reliably supporting the arcuate
zonal wiring substrate 41 in the planer state, it requires a special jig used exclusively therefor. In addition, since the arcuate zonal shape of thewiring pattern 42 is different depending on the diameter, width, and slanting of thearranging surface 3, jigs of shapes different on every arcuate zonal shapes have to be provided. - Further, upon automatic feeding of them to a flow soldering apparatus while fixing them on a conveyer or the like, since special jigs are necessary by the number of about several tens on every kinds of arcuate shapes in view of the production efficiency, a number of jigs have to be provided as a whole.
- Further, in a case where operation of conducting soldering for a
wiring substrate 41 of a certain shape has been completed and then soldering for anotherwiring substrate 41 of a different shape is started, it needs troublesome operation that all the jigs have to be exchanged. - Further, since the shape of the
wiring substrate 41 is not symmetrical, the shape of the jig is also complicated. When thewiring substrate 41 is supported on a square frame it is slackened or distorted at not retained end edges by the weight of theLED 9,9 - - - , to result in a problem of soldering failure. - In view of the above, it is intended in the present invention to enable reliable support for a wiring substrate without using a special jig conforming the arcuate shape of a wiring pattern to which LEDs are mounted, thereby improving the operation efficiency of soldering, as well as saving the troublesome exchange and handling of jigs and, further, avoid occurrence of product deficiency even in a case of applying soldering by a flow soldering apparatus.
- The foregoing subject can be attained in accordance with the present invention by a method of manufacturing an annular oblique light illumination apparatus having a frustconical inner circumferential surface as a light emitting device arranging surface, which comprises;
-
- using a flexible wiring substrate in which a plurality of arcuate zonal wiring pattern parts for mounting light emitting devices each in the form of a developed frustconical shape are serpiginously formed continuously to a base film of a predetermined shape, inserting electrodes of light emitting devices into the arcuate zonal wiring pattern parts and soldering them then, cutting out the arcuate zonal wiring patterns to form a light emitting device arrays, and fixing each light emitting device array to the arranging surface.
- According to the present invention, since a flexible wiring substrate in which arcuate zonal wiring patterns are formed continuously on a base film of a determined shape is normalized in accordance with the shape of a jig irrespective of the arcuate shape of the wiring pattern, there is no requirement for providing plural kinds of jigs.
- In this case, when the base film is formed, for example, in a square shape, a general purpose square frame can be used as the jig and the manufacturing cost for the jig can be decreased.
- Further, since the base film can be supported simply by merely stretching and setting the film and since the entire circumference thereof can be supported reliably, soldering failure is scarcely caused by the slackening or distortion of the wiring substrate.
- Further, since a plurality of arcuate zonal wiring patterns for mounting light emitting devices are formed on one base film, the production efficiency is improved.
- Further, since the wiring patterns are continued with each other directly or by way of a connection wiring pattern to form a serpiginous stripe wiring pattern, a circuit can be formed from one end to the other end thereof, and LED mounted to each of the patterns can be lit at the instance soldering is completed thereby enabling product inspection all at once.
-
FIG. 1 is an explanatory view showing a flexible wiring substrate according to the present invention; -
FIG. 2 is an explanatory view showing an annular oblique light illumination apparatus, -
FIG. 3 is an explanatory view showing the dimension of an arcuate zonal pattern shape, -
FIG. 4 is an explanatory view showing a portion of a manufacturing step; -
FIG. 5 is an explanatory view showing a portion of a manufacturing step; -
FIG. 6 is an explanatory view showing a portion of a manufacturing step; -
FIG. 7 is an explanatory view showing another flexible wiring substrate; -
FIG. 8 is an explanatory view showing other flexible wiring substrate; and -
FIG. 9 is an explanatory view showing the prior art. - The present invention is to be described by way of the preferred embodiments referring to the accompanying drawings.
- A
flexible wiring substrate 1 shown inFIG. 1 is used for forming an LED array (light emitting device array) 4 attached to a light emittingdevice arranging surface 3 having a frustconical inner circumferential surface formed inside an annular frame F of an annular oblique light illumination apparatus 2 (refer toFIG. 2 ). - In the
flexible wiring substrate 1, a plurality of arcuatezonal wiring patterns wiring patterns 7 to/on abase film 5 of a determined shape. Suchserpiginous patterns 8 are formed in a plurality of rows. - The
base film 5 used has normalized shape and size such that it can be attached, for example, to a carrier (jig) C of a flow soldering apparatus, for example, as shown inFIG. 4 , irrespective of the shape of the arcuatezonal wiring pattern 6. In this embodiment, a substantially square film of a size capable of being mounted on a general purpose carrier used upon soldering a general purpose substrate is used. - The shape of the
arranging surface 3 and the shape of each of the arcuatezonal wiring patterns 6 are represented by the following relations:
R 1 =r/cosine θ (1)
R 1 −R 2 =h/sine (2)
r/R 1=α/2π (3)
in which θ is an angle of inclination of thearranging surface 3, r is a radius for the opening at the bottom, and h is a height (refer toFIG. 2 ), and R1 is an outer radius of the arcuatezonal wiring pattern 6, R2 is an inner radius thereof, and α is the center angle (refer toFIG. 3 ). - For example, assuming the angle of inclination of the
arranging surface 3 as: θ=60°, the radius for the opening at the bottoms as: r=2.5 cm, the height as: h=1.5 cm, the arcuate zonal pattern is determined such as the outer radius of the arcuatezonal wiring pattern 6 as: R1=5 cm, the inner radius thereof as: R2≈3.3 cm, and the center angle as: α=180°. - Through
holes 11 for inserting theelectrodes 10 of LED (light emitting device) 9, 9, - - - are formed to the arcuatezonal wiring pattern 6, and aland 12 for soldering theelectrode 10 is formed at the back for each of the throughholes 11. - Each of the
wiring patterns LED inspection terminals 13 are formed to thebase film 5. - Further, for easily cutting out the
serpiginous pattern 8 simply from thebase film 5,perforations 14 are formed along both sides of thepattern 8, and cut outlines 15 are drawn between the arcuatezonal wiring patterns 6 and the connectingwiring patterns 7. - In a case of manufacturing the annular
oblique illumination apparatus 2 by using theflexible wiring substrate 1, as shown inFIG. 4 , theflexible wiring substrate 1 is attached to the square frame-like carrier (jig) C in a stretched state. - Since the
base film 5 for theflexible wiring substrate 1 is formed as a substantially square shape, thebase film 5 can be reliably fixed by fixing at four sides while stretching the base film. - Further, since the
base film 5 is normalized in accordance with the shape of the carrier C, one kind of the carrier C may suffice. - Then, electrodes of
LED holes 11 of the arcuatezonal wiring pattern 6 and, after insertingLED holes 11, theelectrodes 10 are soldered to thelands 12. - In this case, as shown in
FIG. 5 , when the rear face of thewiring substrate 1 fixed to the carrier C is in contact with a solder liquid surface in a flow soldering apparatus, soldering can be conducted simply. In addition, since thebase film 5 is reliably supported in a planar state under stretching, the arcuatezonal pattern 6 is neither slackened nor distorted irrespective of the weight ofLED - Then, at the instance, the
LED inspection terminals 13 and when lighting up for theLED zonal wiring patterns 6 on everywiring substrate 1 simultaneously. - When all
LED patterns 6 have passed the conduction inspection, the test time can be shortened. - Further, if any one of the LED is not lit, since there may be considered a circuit failure or device failure, they may be sent to a re-inspection station for detailed inspection.
- Then, when a portion of the arcuate
zonal pattern 6 that has passed the conduction inspection is cut out, an arcuatezonal LED array 4 is formed. - In this case, the pattern may be cut along the
perforations 14 formed on both sides of the serpiginous pattern by using pincers or cutters and the arcuatezonal pattern 6 and the connectingwiring patterns 7 may be cut out from the cut outlines 15. Theperforations 14 may be formed by weakening the base film peelably, for example, using a radio frequency sewing machine or it may be a printed cut out lines. - Finally, as shown in
FIG. 6 , when the ends of the arcuatezonal pattern 6 are connected to each other, since theLED array 4 forms a frustconical shape, it is fixed to the light emittingdevice arranging surface 3 and necessary electric connection is applied to complete the annular obliquelight illumination apparatus 2. -
FIG. 7 shows another flexible wiring substrate according to the invention. Those portions identical withFIG. 1 carry same reference numerals for which detailed explanations will be omitted. - In a
flexible wiring substrate 21 of this embodiment, a plurality of annularstripe wiring patterns 22 for mounting light emitting devices each in the form of an arcuate shape that can be mounted to theLED arranging surface 3 when cut at a predetermined center angle α are formed to a predeterminedsquare base film 5. - The
annular stripe pattern 22 may be a circular or elliptic shape. In a case where the angle of inclination of the arrangingsurface 3 is, for example, θ=60°, since the center angle is: α=180°, they may be opposed to each other as a circular shape, or as an elliptic shape by way of a connectingwiring pattern 7. When it is cut along the cut outline 23 and theperforations 14, one annularstripe wiring pattern 22 is divided into two arcuatezonal parts 24. - The annular oblique
light illumination apparatus 2 can be manufactured by using theflexible wiring substrate 21 in the same manner as described above by fixing thewiring substrate 21 to the carrier C, inserting theelectrodes 10 ofLED holes 11 formed to the arcuatezonal parts 24 of thewiring pattern 22, soldering theelectrodes 10 to thewiring pattern 22, then supplying electric power from theinspection terminals 13 to effect conduction inspection, then cutting out the arcuatezonal part 24 mounted withLED LED array 4, connecting the ends of theLED array 4 to each other into a frustconical shape and fixing the same to theLED arranging surface 3. - Further,
FIG. 8 shows other wiring substrate according to the invention. Those portions identical withFIG. 1 carry same reference numerals for which detailed descriptions are to be omitted. - In the
flexible wiring substrate 31 of this embodiment, one or more arcuatezonal wiring patterns 32 for mounting light emitting devices each in the form of a developed frustconical shape of the arrangingsurface 3 when cut along cut outlines 33 andperforations 14 are formed to a predeterminedsquare base film 5. Each of the arcuatezonal wiring patterns 32 is formed so as to have a center angle α of about 90° in a case where the angle θ of inclination of the arranging surface is 75°. - The annular oblique
light illumination apparatus 2 can be manufactured by using theflexible wiring substrate 31 in the same manner as described above, by attaching thewiring substrate 31 to the carrier C, inserting theelectrodes 10 ofLED holes 11 formed in thewiring pattern 32, soldering theelectrodes 10 to thewiring pattern 32, then supplying electric power from theinspection terminals 13 to apply conduction inspection, cutting out thewiring pattern 32 mounted withLED LED array 4, connecting the ends of theLED array 4 to each other into a frustconical shape and fixing the same to theLED arranging surface 3. - In any of the printed
wiring substrates FIG. 7 andFIG. 8 , since the base film is formed into a substantially square shape, four sides thereof can reliably be fixed by the carrier C. - Further, since the
base film 5 has a predetermined shape having no concern with the shape of the annularzonal wiring pattern 22 or the arcuatezonal wiring pattern 32, one kind of jig may suffice also in a case of fixing the same by using the jig. - Further, when soldering is applied by bringing the rear face of the
wiring substrate base film 5 is firmly supported in a stretched state, the annularzonal wiring pattern 22 or the arcuatezonal wiring pattern 32 is neither slackened nor distorted even by the weight ofLED - The foregoing descriptions have been made to a case of applying soldering by the flow soldering apparatus, but the invention is not restricted only thereto and can also provide an advantageous effect of providing good operation efficiency even in a case of manual soldering since the
wiring substrate 1 can be fixed easily. - As has been described above according to the present invention, since the wiring substrate of a predetermined shape, for example, a square shape formed with arcuate zonal wiring patterns is used instead of using the arcuate zonal wiring substrate and the wiring substrate can be supported reliably using only one kind of the jig irrespective of the shapes of the wiring patterns, troublesome exchange or handling of jigs can be saved. In addition, since the wiring substrate is less slackened or distorted upon soldering by using the flow soldering apparatus, it can provide an excellent effect of not resulting in product deficiency caused by soldering failure.
Claims (6)
1. A flexible wiring substrate for forming a light emitting device array attached to a frustoconical inner circumferential surface serving as a light emitting device arranging surface of an annular oblique light illumination apparatus, wherein
a plurality of arcuate zonal wiring patterns for mounting light emitting devices each in the form of a developed frustoconical shape are serpiginously provided continuously directly or by way of connecting wiring patterns to a base film of a predetermined shape.
2. A flexible wiring substrate for forming a light emitting device array attached to a frustoconical inner circumferential surface serving as a light emitting device arranging surface of an annular oblique light illumination apparatus, wherein
one or more annular zonal wiring patterns for mounting light emitting devices each in the form of a developed frustoconical shape when cut at a predetermined center angle are provided on a base film of a predetermined shape.
3. A flexible wiring substrate for forming a light emitting device array attached to a frustoconical inner circumferential surface serving as a light emitting device arranging surface of an annular oblique light illumination apparatus, wherein
one or more arcuate zonal wiring patterns each corresponding to a developed frustoconical shape are provided to a base film of a predetermined shape.
4. A flexible wiring substrate according to claim 1 , wherein the base film of the predetermined shape has a substantially square shape.
5. A flexible wiring substrate according to claim 2 , wherein the base film of the predetermined shape has a substantially square shape.
6. A flexible wiring substrate according to claim 3 , wherein the base film of the predetermined shape has a substantially square shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/203,988 US20050272277A1 (en) | 2003-03-24 | 2005-08-16 | Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003079330A JP4198498B2 (en) | 2003-03-24 | 2003-03-24 | Manufacturing method of annular oblique illumination device and flexible wiring board |
JP2003-79330 | 2003-03-24 | ||
US10/806,284 US6972207B2 (en) | 2003-03-24 | 2004-03-23 | Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
US11/203,988 US20050272277A1 (en) | 2003-03-24 | 2005-08-16 | Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/806,284 Division US6972207B2 (en) | 2003-03-24 | 2004-03-23 | Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
US20050272277A1 true US20050272277A1 (en) | 2005-12-08 |
Family
ID=33156604
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/806,284 Expired - Fee Related US6972207B2 (en) | 2003-03-24 | 2004-03-23 | Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
US11/203,988 Abandoned US20050272277A1 (en) | 2003-03-24 | 2005-08-16 | Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/806,284 Expired - Fee Related US6972207B2 (en) | 2003-03-24 | 2004-03-23 | Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
Country Status (4)
Country | Link |
---|---|
US (2) | US6972207B2 (en) |
JP (1) | JP4198498B2 (en) |
KR (1) | KR101014222B1 (en) |
CN (1) | CN100544541C (en) |
Families Citing this family (9)
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US8967838B1 (en) | 2004-03-13 | 2015-03-03 | David Christopher Miller | Flexible LED substrate capable of being formed into a concave LED light source, concave light sources so formed and methods of so forming concave LED light sources |
KR100885894B1 (en) | 2006-09-29 | 2009-02-26 | 폴리트론 테크놀로지스 인크 | Plane structure of light-emitting diode lighting apparatus |
JP5538671B2 (en) * | 2007-09-19 | 2014-07-02 | シャープ株式会社 | Light emitting device and LED lamp |
CN103032696A (en) * | 2011-09-30 | 2013-04-10 | Tss株式会社 | Lighting device and light source substrate used in lighting device |
JP5644024B2 (en) * | 2013-04-09 | 2014-12-24 | 住友電工プリントサーキット株式会社 | Flexible printed wiring board, lighting device and manufacturing method thereof |
US9429310B2 (en) * | 2013-05-17 | 2016-08-30 | Erogear, Inc. | Fabric-encapsulated light arrays and systems for displaying video on clothing |
DE202015104272U1 (en) * | 2015-08-13 | 2016-11-15 | Zumtobel Lighting Gmbh | Printed circuit board with at least two areas for assembly with components |
GB2545906A (en) * | 2015-12-23 | 2017-07-05 | Univ Southampton | Modular electronic structures |
JP2018137052A (en) * | 2017-02-20 | 2018-08-30 | 京都電機器株式会社 | Manufacturing method of luminaire |
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- 2004-03-23 KR KR1020040019724A patent/KR101014222B1/en not_active IP Right Cessation
- 2004-03-23 US US10/806,284 patent/US6972207B2/en not_active Expired - Fee Related
- 2004-03-24 CN CNB2004100315544A patent/CN100544541C/en not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
CN100544541C (en) | 2009-09-23 |
US20040206968A1 (en) | 2004-10-21 |
JP2004288476A (en) | 2004-10-14 |
JP4198498B2 (en) | 2008-12-17 |
US6972207B2 (en) | 2005-12-06 |
CN1533226A (en) | 2004-09-29 |
KR20040084727A (en) | 2004-10-06 |
KR101014222B1 (en) | 2011-02-14 |
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Legal Events
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STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |