CN213991184U - Ultra-thick PCB resistance welding development follow-up base plate - Google Patents
Ultra-thick PCB resistance welding development follow-up base plate Download PDFInfo
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- CN213991184U CN213991184U CN202023039407.5U CN202023039407U CN213991184U CN 213991184 U CN213991184 U CN 213991184U CN 202023039407 U CN202023039407 U CN 202023039407U CN 213991184 U CN213991184 U CN 213991184U
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- thick pcb
- super thick
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- support frame
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pallets (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a super thick PCB hinders and welds development retinue backing plate, include: the PCB comprises a base plate and a support frame arranged on the base plate, wherein a first rectangular through hole and a second rectangular through hole which are communicated with each other are formed in the middle of the base plate and the support frame, the diagonal line of the first rectangular through hole and the diagonal line of the second rectangular through hole are slightly smaller than the diagonal line of an ultra-thick PCB, an annular fixing groove is formed in the support frame, the fixing groove is wound on the second rectangular through hole, and the width of the fixing groove is 4-6 mm. The utility model discloses a super thick PCB hinders and welds development retinue backing plate and is provided with annular fixed slot on the support frame, places super thick PCB through the fixed slot, hinders to weld and makes super thick PCB hinder and welds development retinue backing plate and transport the processing together along with super thick PCB among the development process, realizes having filled up super thick PCB, and the super thick PCB that significantly reduces receives the influence of gyro wheel in development in-process bottom surface, improves the production quality of product.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to super thick PCB hinders and welds development retinue backing plate.
Background
Super thick PCB is in process of production, because the thick 4.0mm that is greater than or equal to of board, through the silk screen printing, bake in advance, after the exposure, printing ink on the face is not fully solidified yet, and printing ink hardness is still not high enough, make when crossing the developing machine, the face will be atred in horizontal gyro wheel (upper and lower gyro wheel will wholly extrude the face), simultaneously down the face still need bear the influence of self gravity, it is serious to lead to face printing ink to receive the extrusion easily, and the part is not dry printing ink, receive the gyro wheel adhesion easily, lead to that the large tracts of land drops or the great printing ink of hardness receives to extrude the phenomenon that forms the development on one side unclean, yield in the greatly reduced super thick PCB production process, increase enterprise manufacturing cost.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem that the easy pressurized of above-mentioned super thick PCB development in-process face printing ink drops or warp, the utility model provides an improve super thick PCB of development process product yield and hinder and weld development retinue backing plate.
The utility model discloses a super thick PCB hinders and welds development retinue backing plate, include: the PCB comprises a base plate and a support frame arranged on the base plate, wherein a first rectangular through hole and a second rectangular through hole which are communicated with each other are formed in the middle of the base plate and the support frame, the diagonal line of the first rectangular through hole and the diagonal line of the second rectangular through hole are slightly smaller than the diagonal line of an ultra-thick PCB, an annular fixing groove is formed in the support frame, the fixing groove is wound on the second rectangular through hole, and the width of the fixing groove is 4-6 mm.
According to the utility model discloses an embodiment, bottom plate and support frame all adopt the aluminum alloy material.
According to the utility model discloses an embodiment, fixed slot bight adopts fillet structure.
According to the utility model discloses an embodiment, the fixed slot surface covering has the silica gel layer.
According to the utility model discloses an embodiment is provided with the unloading of being adjoined with the fixed slot on the support frame and keeps away the dead slot.
According to the utility model discloses an embodiment, it is provided with a plurality of holes of dodging to run through along the horizontal direction on the bottom plate.
The utility model discloses a super thick PCB hinders and welds development retinue backing plate and is provided with annular fixed slot on the support frame, places super thick PCB through the fixed slot, hinders to weld and makes super thick PCB hinder and welds development retinue backing plate and transport the processing together along with super thick PCB among the development process, realizes having filled up super thick PCB, and the super thick PCB that significantly reduces receives the influence of gyro wheel in development in-process bottom surface, improves the production quality of product.
Drawings
FIG. 1 is the utility model discloses well super thick PCB hinders and welds the plan view that develops the pallet.
Fig. 2 is the utility model discloses well super thick PCB hinders and welds the side view of development pallet.
Detailed Description
The ultra-thick PCB solder mask development pallet of the present invention will be described in further detail with reference to the following embodiments and the accompanying drawings.
Please refer to fig. 1 to 2.
The utility model provides a super thick PCB hinders and welds development retinue backing plate, mainly used pads up super thick PCB, reduce super thick PCB and receive the influence of gyro wheel in development in-process bottom surface, super thick PCB hinders and welds development retinue backing plate and mainly includes bottom plate 100 and set up support frame 200 on bottom plate 100, bottom plate 100 and support frame 200 middle part set up the first rectangle through-hole 110 and the second rectangle through-hole 210 of mutual intercommunication, utilize first rectangle through-hole 110 and second rectangle through-hole 210 to guarantee that super thick PCB bottom exposes, be convenient for process the upper and lower two sides of super thick PCB simultaneously in the development process. In this application, bottom plate 100 and support frame 200 all adopt the aluminum alloy material, and greatly reduced super thick PCB hinders and welds development retinue board weight, and the operating personnel of being convenient for hinders to super thick PCB and welds grabbing of development retinue board and hold, improves the convenience in its use.
Wherein first rectangle through-hole 110 and second rectangle through-hole 210 diagonal slightly is less than super thick PCB diagonal for after super thick PCB placed on super thick PCB hinders to weld and develops the pallet, can't drop from first rectangle through-hole 110 and second rectangle through-hole 210, guarantee the fixed effect to super thick PCB.
The supporting frame 200 is provided with an annular fixing groove 220, wherein the fixing groove 220 is wound around the second rectangular through hole 210, in other words, the fixing groove 220 is adjacent to the second rectangular through hole 210, and the width of the fixing groove 220 is 4-6 mm, so that an active space is reserved on the fixing groove 220 for the ultra-thick PCB, and the ultra-thick PCB is conveniently loaded onto the fixing groove 220.
Use the utility model discloses a super thick PCB hinders when welding development retinue backing plate, hinder the exposure back at super thick PCB, place super thick PCB on super thick PCB hinders the fixed slot 220 who welds development retinue backing plate, then hinder the development in-process, super thick PCB hinders to weld development retinue backing plate in super thick PCB and transports the walking together, and super thick PCB accomplishes the development processing back, takes off super thick PCB and hinders to super thick PCB and welds development retinue backing plate and wash, waits for one time of use down.
Further, fixed slot 220 bight adopts the fillet structure, protects super thick PCB through the fillet structure, prevents effectively that super thick PCB from causing in fixed slot 220 and scraping the damage. It is worth noting that fixed slot 220 surface covering has the silica gel layer, and super thick PCB passes through the silica gel layer to be placed on fixed slot 220, utilizes the silica gel layer to increase the coefficient of friction between super thick PCB and the fixed slot 220, strengthens the fixed effect of super thick PCB on fixed slot 220, prevents to cause the scratch to super thick PCB face through the silica gel layer simultaneously, further improves the production quality of product.
Further, the support frame 200 is provided with a blanking clearance groove 230 adjacent to the fixing groove 210, wherein the blanking clearance groove 230 is the same as the human fingers in clearance, so that the fingers of the operating personnel can jack up the ultra-thick PCB for blanking from the blanking clearance groove 230, thereby effectively improving the blanking rate of blanking the ultra-thick PCB and improving the production efficiency.
Still further, it is provided with a plurality of holes of dodging 120 to run through along the horizontal direction on bottom plate 100, and wherein a plurality of holes of dodging 120 distribute in bottom plate 100 both ends, and wherein hinder to weld the super thick PCB and develop the pallet and grasp the time, pass through holes of dodging 120 through the finger, effectively consolidate and hinder to weld the development pallet and grasp the fastness to the operating personnel to super thick PCB to the transport of being convenient for the operating personnel to hinder to weld the development pallet to super thick PCB.
To sum up, the utility model discloses a super thick PCB hinders and welds development retinue backing plate and is provided with annular fixed slot on the support frame, places super thick PCB through the fixed slot, hinders to weld and makes super thick PCB hinder and weld development retinue backing plate and transport the processing together along with super thick PCB among the development process, realizes having filled up super thick PCB, and the super thick PCB that significantly reduces receives the influence of gyro wheel in development in-process bottom surface, improves the production quality of product.
In the description of the present invention, it is to be understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, all such alternatives, modifications, and variations are intended to be included within the spirit and scope of the present invention.
Claims (6)
1. The utility model provides a super thick PCB hinders and welds development pallet, its characterized in that includes: the bottom plate and set up in support frame on the bottom plate, first rectangle through-hole and the second rectangle through-hole of mutual intercommunication are seted up at bottom plate and support frame middle part, first rectangle through-hole and second rectangle through-hole diagonal slightly are lighter than super thick PCB diagonal, be provided with annular fixed slot on the support frame, the fixed slot is around locating second rectangle through-hole, the fixed slot width is 4~6 mm.
2. The ultra-thick PCB solder mask development pallet of claim 1, wherein the base plate and the support frame are made of aluminum alloy.
3. The ultra-thick PCB solder mask development pallet according to claim 1, wherein the corner of the fixing groove is rounded.
4. The ultra-thick PCB solder mask development pallet according to claim 1, wherein the surface of the fixing groove is covered with a silicone layer.
5. The ultra-thick PCB solder mask development pallet according to claim 1, wherein the support frame is provided with a blanking clearance groove adjacent to the fixing groove.
6. The ultra-thick PCB solder mask development pallet according to any one of claims 1 to 5, wherein a plurality of avoiding holes are arranged on the bottom plate in a penetrating manner along a horizontal direction.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023039407.5U CN213991184U (en) | 2020-12-17 | 2020-12-17 | Ultra-thick PCB resistance welding development follow-up base plate |
| PCT/CN2021/129326 WO2022127436A1 (en) | 2020-12-17 | 2021-11-08 | Accompanying backing plate for solder-resisting development of ultra-thick pcb |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023039407.5U CN213991184U (en) | 2020-12-17 | 2020-12-17 | Ultra-thick PCB resistance welding development follow-up base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213991184U true CN213991184U (en) | 2021-08-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023039407.5U Active CN213991184U (en) | 2020-12-17 | 2020-12-17 | Ultra-thick PCB resistance welding development follow-up base plate |
Country Status (2)
| Country | Link |
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| CN (1) | CN213991184U (en) |
| WO (1) | WO2022127436A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114190001A (en) * | 2021-11-16 | 2022-03-15 | 广州兴森快捷电路科技有限公司 | Developing protection device |
| WO2022127436A1 (en) * | 2020-12-17 | 2022-06-23 | 广东科翔电子科技股份有限公司 | Accompanying backing plate for solder-resisting development of ultra-thick pcb |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115038250A (en) * | 2022-07-06 | 2022-09-09 | 广州美维电子有限公司 | Jig for manufacturing fine circuit board |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3330997B2 (en) * | 1993-03-29 | 2002-10-07 | 株式会社フジクラ | Exposure equipment for circuit board formation |
| CN207090124U (en) * | 2017-06-13 | 2018-03-13 | 广州美维电子有限公司 | A kind of thousand layer frames |
| CN207884989U (en) * | 2018-03-13 | 2018-09-18 | 厦门市铂联科技股份有限公司 | A kind of double-surface screen printing jig |
| CN111800955B (en) * | 2020-07-17 | 2024-06-11 | 景旺电子科技(龙川)有限公司 | Method for double-sided solder resist printing of 5G power amplification plate sheet |
| CN213991184U (en) * | 2020-12-17 | 2021-08-17 | 广东科翔电子科技股份有限公司 | Ultra-thick PCB resistance welding development follow-up base plate |
-
2020
- 2020-12-17 CN CN202023039407.5U patent/CN213991184U/en active Active
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2021
- 2021-11-08 WO PCT/CN2021/129326 patent/WO2022127436A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022127436A1 (en) * | 2020-12-17 | 2022-06-23 | 广东科翔电子科技股份有限公司 | Accompanying backing plate for solder-resisting development of ultra-thick pcb |
| CN114190001A (en) * | 2021-11-16 | 2022-03-15 | 广州兴森快捷电路科技有限公司 | Developing protection device |
| CN114190001B (en) * | 2021-11-16 | 2024-06-11 | 广州兴森快捷电路科技有限公司 | Developing protection device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022127436A1 (en) | 2022-06-23 |
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