CN209746089U

CN209746089U - Test socket with PCB inverted on upper surface of test seat

Info

Publication number: CN209746089U
Application number: CN201920279516.2U
Authority: CN
Inventors: 戴娟; 王传刚
Original assignee: Fatty Precision Technology (suzhou) Co Ltd
Current assignee: Suzhou Fatedi Technology Co ltd
Priority date: 2019-03-06
Filing date: 2019-03-06
Publication date: 2019-12-06
Anticipated expiration: 2029-03-06

Abstract

The utility model discloses a test socket with PCB inverted on the upper surface of a test seat, which comprises a test seat and a chip supporting plate, wherein the test seat can be clamped above the chip supporting plate, a plurality of chip clamping grooves for placing chips are arranged in the chip supporting plate, a through groove is arranged at the central position of the test seat, a probe cover plate is fixed in the through groove, a plurality of pin grooves are arranged on the probe cover plate, and a test pin is correspondingly inserted in each pin groove; a PCB test board is fixedly connected above the test seat, one end of the test pin is communicated with the PCB test board, and the other end of the test pin is communicated with a chip placed in the chip clamping groove. The PCB and the test seat are fixed into a whole and can be clamped above the chip supporting plate, communication is completed through the test contact pin, and the flip-chip test of the chip is realized.

Description

Test socket with PCB inverted on upper surface of test seat

Technical Field

The utility model relates to a semiconductor integrated circuit testing arrangement's technical field, in particular to test socket of test seat upper surface is invertd in to PCB.

Background

In recent years, artificial intelligence, unmanned driving and VR technology are rapidly advanced, performances of CPU and GPU related to the technology are developed in a crossing manner, and various chips are produced. The semiconductor integrated circuit test is vital, the existing test sockets are inserted above a PCB test board for testing, the chip is placed in the test socket in the forward direction, and a test cover needs to be tightly pressed on the chip, so that the chip is tightly contacted with the PCB test board to complete the test. For chips needing inverted test, no special test socket exists at present, so that the test is very inconvenient.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above disadvantages, an object of the present invention is to provide a test socket having an inverted PCB on the upper surface of a test socket.

In order to achieve the above purpose, the utility model discloses a technical scheme is: the test device comprises a test seat and a chip supporting plate, wherein the test seat can be clamped above the chip supporting plate, a plurality of chip clamping grooves are formed in the chip supporting plate, a through groove is formed in the center of the test seat, a probe cover plate is fixed in the through groove, a plurality of pin grooves are formed in the probe cover plate, and a test pin is correspondingly inserted into each pin groove; the PCB test board is fixedly connected above the test seat, one end of the test pin is communicated with the PCB test board, and the other end of the test pin is communicated with a chip inserted into the chip clamping groove.

The beneficial effects of the utility model are that, PCB surveys test panel and test seat fixed connection forms integratively, but the joint is in chip backup pad top, and the chip can be invertd in the chip backup pad, communicates with each other through test contact pin and PCB board communication to realize the inversion test of chip, the contact reliability is high, and test stability is good.

Preferably, four corners of the PCB test board are provided with first threaded holes, four corners of the test seat are provided with second threaded holes corresponding to the first threaded holes, and the first threaded holes and the second threaded holes are fixed through first bolts. The PCB test board and the test seat are connected into a whole through the first bolt.

Preferably, the first bolt is sleeved with a spring, and a buffering effect is achieved between the PCB testing board and the testing seat.

Preferably, the test seat both sides are articulated to have the hasp, chip backup pad both sides are provided with the draw-in groove that corresponds with the hasp. Through the cooperation of hasp and draw-in groove, can be with the test socket joint in the chip backup pad.

Preferably, the lock catch comprises a pressing part positioned at the upper part and a clamping part positioned at the lower part, the pressing part and the clamping part rotate around the rotating shaft, and a clamping block protruding from the bottom of the clamping part is clamped into the clamping groove. The clamping is convenient for testing and the chip is convenient to release.

Preferably, grooves for the pressing to pass through and rotate are arranged on two sides of the PCB test board.

Preferably, the four corners of the probe cover plate are provided with third threaded holes, the test seat is provided with fourth threaded holes corresponding to the third threaded holes, and the test seat and the third threaded holes are fixed through second bolts. And fixing the probe cover plate on the test seat through a second bolt.

Preferably, the test pins are spring-type precision probes, so that the test pins flexibly contact the chip and the PCB test board.

Drawings

Fig. 1 is an exploded view of a test socket in which a PCB of this embodiment is inverted on an upper surface of a test socket.

FIG. 2 is a cross-sectional view of the test socket with the PCB inverted on the upper surface of the test socket according to the present embodiment.

Fig. 3 is an external view of the test socket of the present embodiment with the PCB inverted on the upper surface of the test socket.

Detailed Description

The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.

Referring to fig. 1-3, a test socket with a PCB inverted on the upper surface of a test socket comprises a test socket 1 and a chip support plate 2, wherein the test socket 1 can be clamped above the chip support plate 2, a plurality of chip clamping grooves 3 are arranged in the chip support plate 2, and the chip clamping grooves 3 are used for placing chips 4. A through groove is formed in the center of the test seat 1, a probe cover plate 5 is fixed in the through groove, a plurality of pin grooves 6 are formed in the probe cover plate 5, and a test pin 7 is correspondingly inserted into each pin groove 6. A PCB test board 8 is fixedly connected above the test seat 1, one end of a test pin 7 is communicated with the PCB test board 8, and the other end of the test pin is communicated with a chip 4 inserted into the chip card slot 3. The test pins 7 correspond to the test PADs on the chip 4 one by one, and the PADs on the PCB test board 8 correspond to the test pins 7 one by one, so that the PCB test board 8 is loaded to the chip 4 through the test pins 7, and the test of the chip 4 is completed. The test contact pin 7 is a spring type precision probe and has good contact.

The PCB testing board 8 four corners is provided with first screw hole 9, and 1 four corners of test seat is provided with the second spiral shell screw hole 10 that corresponds with first screw hole 9, and both are fixed through first bolt 11, make test seat 1 and PCB testing board 8 even as a whole. The first bolt 11 is sleeved with a spring to play a role in buffering. And third threaded holes are formed in four corners of the probe cover plate 5, fourth threaded holes corresponding to the third threaded holes are formed in the test base 1, and the third threaded holes and the fourth threaded holes are fixed through second bolts, so that the probe cover plate 5 is fixed on the test base 1.

The two sides of the test seat 1 are hinged with the lock catches 12, and the two sides of the chip supporting plate 2 are provided with clamping grooves 13 corresponding to the lock catches 12. The latch 12 includes a pressing portion 122 at the upper portion and a clamping portion 123 at the lower portion, which rotate around the rotating shaft 121, and a clamping block protruding from the bottom of the clamping portion 123 is clamped into the clamping groove 13. The PCB test board 8 is provided at both sides thereof with grooves 14 through which the pressing portions 122 pass and move.

During testing, the lock catch 12 is firstly opened to take down the test seat 1 (the test pin 7 and the PCB test board 8 are fixed), the chip 4 is placed in the chip clamping groove 3 corresponding to the chip placing frame 2, then the test seat 1 is covered on the chip placing frame 2 and is locked by the lock catch 12, and at the moment, a signal of the chip 4 is directly transmitted to the PCB test board 8 through the test pin 7; after the test is finished, the lock catch 12 is opened, the test base 1 is taken down, the chip 4 is taken out, and the test is finished once.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims

1. The utility model provides a PCB inverts test socket in test socket upper surface, includes test socket (1) and chip backup pad (2), its characterized in that: the test seat (1) can be clamped above the chip supporting plate (2), a plurality of chip clamping grooves (3) for placing chips (4) are formed in the chip supporting plate (2), a through groove is formed in the center of the test seat (1), a probe cover plate (5) is fixed in the through groove, a plurality of pin grooves (6) are formed in the probe cover plate (5), and a test pin (7) is correspondingly inserted into each pin groove (6); the PCB testing board (8) is fixedly connected to the upper portion of the testing seat (1), one end of the testing pin (7) is communicated with the PCB testing board (8), and the other end of the testing pin is communicated with a chip (4) placed in the chip clamping groove (3).

2. The test socket according to claim 1, wherein the PCB is inverted on the upper surface of the test socket, and the PCB comprises: the PCB testing board is characterized in that first threaded holes (9) are formed in four corners of the PCB testing board (8), second threaded holes (10) corresponding to the first threaded holes (9) are formed in four corners of the PCB testing board, and the PCB testing board are fixed through first bolts (11).

3. The test socket of claim 2, wherein the PCB is inverted on the upper surface of the test socket, and the PCB comprises: the first bolt (11) is sleeved with a spring.

4. The test socket according to claim 1, wherein the PCB is inverted on the upper surface of the test socket, and the PCB comprises: the testing seat is characterized in that lock catches (12) are hinged to two sides of the testing seat (1), and clamping grooves (13) corresponding to the lock catches (12) are arranged on two sides of the chip supporting plate (2).

5. The test socket according to claim 4, wherein the PCB is inverted on the upper surface of the test socket, and the PCB comprises: the lock catch (12) comprises a pressing portion (122) located on the upper portion and a clamping portion (123) located on the lower portion, the pressing portion and the clamping portion rotate around the rotating shaft (121), and a clamping block protruding from the bottom of the clamping portion (123) is clamped into the clamping groove (13).

6. The test socket of claim 5, wherein the PCB is inverted on the upper surface of the test socket, and the PCB comprises: grooves (14) for the pressing parts (122) to pass through and rotate are formed in two sides of the PCB test board (8).

7. The test socket according to claim 1, wherein the PCB is inverted on the upper surface of the test socket, and the PCB comprises: and third threaded holes are formed in four corners of the probe cover plate (5), fourth threaded holes corresponding to the third threaded holes are formed in the test seat (1), and the test seat are fixed through second bolts.

8. The test socket according to claim 1, wherein the PCB is inverted on the upper surface of the test socket, and the PCB comprises: the test contact pin (7) is a spring type precision probe.