TWI387766B - Can be used for different probe card IC test machine - Google Patents

Description

IC test machine that can be replaced with different probe cards

The present invention relates to an IC test machine, and more particularly to an IC test machine suitable for use with different probe cards.

Figure 1 is a perspective view of a conventional IC test machine. The test machine shown in Figure 1 is a test machine with 256 input/output channels and 16 DPSs. The test carrier on the machine. 9. The probe holder 91 and the probe card 92 are all designed according to the above specifications.

Due to the rapid changes in electronic products and the increasing degree of functional integration, the types of signals involved are becoming more and more complex. In order to improve the test capacity in response to industry demand, the testing capability of the test machine has also been improved. Therefore, the specifications have been upgraded from the original 256 input/output channels and 16 DPS to 512 input/output channels and 32 groups. DPS.

To this end, in addition to repurchasing a new machine with 512 input/output channels and 32 DPS specifications, the test manufacturer can also be engaged in hardware from the original 256 input/output channels and 16 DPS old machines. Or software modifications to meet the needs.

If you only purchase or modify the machine for the new specifications, it will cost a lot of money. If you can adapt the functions of the new and old machines after the modification, you can make the modified machine to its fullest effect.

Therefore, an interface that can be compatible with new and old machines is needed to improve the shortcomings of the aforementioned one machine for single specification testing.

The present invention relates to an IC test machine that can be replaced with different probe cards, including a base, a tester, a first probe card, and a second probe card.

The base is provided with a stage on which a card holder is disposed, and at least two positioning tips protrude from the receiving groove. The tester is detachably disposed above the carrying platform of the base, and a test board (load board) and a probe tower (pogo tower) are disposed under the test head, and the probe base is set in the test load. The plate is corresponding to the receiving groove of the base, and the probe base is provided with a plurality of inner ring probes, a plurality of outer ring probes, a plurality of inner ring probes, and a plurality of outer ring probes and respectively tested The carrier board is electrically connected.

The first probe card includes a plurality of annular contacts and at least two positioning holes. The second probe card is larger than the first probe card, and the second probe card includes a plurality of inner ring contacts, a plurality of outer ring contacts, and at least two positioning through holes.

The accommodating slot of the pedestal is selectively accommodating the first probe card, and at least two locating holes of the first probe card are correspondingly positioned on at least two locating tips of the pedestal. The plurality of annular contacts of the first probe card are electrically connected to the plurality of inner ring probes respectively corresponding to the test head.

The accommodating slot of the pedestal or the second probe card is selectively received, and at least two positioning through holes of the second probe card are correspondingly positioned on at least two positioning ends of the pedestal. a plurality of inner loop contacts of the second probe card are respectively correspondingly connected to the plurality of inner loop probes of the test head, and are electrically connected, and the plurality of outer loop contacts of the second probe card are respectively correspondingly coupled to A plurality of outer loop probes of the test head are electrically connected.

In summary, the probe cards of different sizes can be selectively placed in the receiving slots on the base, which are positioned by the three common positioning tips; the different probe cards have the same and corresponding multiples. The ring contact point can be electrically connected to the plurality of inner ring probes provided by the probe base on the test head, and the plurality of outer ring contacts on the periphery of the larger probe card are respectively respectively connected. The plurality of outer loop probes connected to the probe holder should be electrically connected.

Therefore, an IC test machine can be replaced with two different sizes of probe cards for testing, without the need to replace the test carrier, and modify the internal software of the test machine, which can achieve the purpose of quickly replacing different probe cards. It can reduce the cost of cross-machine testing of products and enhance the competitiveness of test machines.

In addition, the IC test machine may include a rotating arm. One end of the rotating arm is fixed on the base and the other end is set on the test head. The test head is rotated by the rotating arm to approach or away from the base of the base.

The test carrier of the test head may include a plurality of inner ring contacts and a plurality of outer ring contacts, and the plurality of inner ring contacts respectively correspond to a plurality of inner ring probes electrically connected to the probe base, and the plurality of outer ring probes respectively The loop contacts respectively correspond to a plurality of outer loop probes electrically connected to the probe holder. The probe holder can be disposed on the test carrier through an adapter structure.

The adapter structure may include an inner locking ring and an outer locking ring. The inner locking ring may include two inner guiding columns and two outer guiding columns, and the outer locking ring may include two oblique guiding grooves and an outer locking ring. The screw is fixed on the test carrier, and the circumference of the bottom of the probe base includes two oblique ring grooves, and the inner guide posts on the inner side of the inner locking ring are slidably disposed in the two oblique ring grooves of the probe base, and are internally locked. The two outer guide columns on the outer side of the ring are slidably disposed in the two oblique guide grooves of the outer locking ring.

In addition, the test head may include a lock ring correspondingly to the probe base, the verification card includes at least two positioning pins, and at least two positioning pins are selectively inserted into the first probe card. The at least two positioning holes are inserted into the at least two positioning through holes of the second probe card in a corresponding manner.

Please refer to FIG. 2 and FIG. 3. FIG. 2 is a state diagram of the position of the test head relative to the base according to a preferred embodiment of the present invention. 3 is a perspective view of a test head and a base in accordance with a preferred embodiment of the present invention. The relative position of the test head and the base shown in FIG. 3 is a state diagram of the position B indicated in FIG. 2. As shown in the figure, this embodiment is an IC test machine that can be replaced with different probe cards, including a base 1, a test head 2, a first probe card 23, and a second probe card 24. .

As shown in FIG. 3, the base 1 is provided with a loading platform 11 . The receiving base 11 is provided with a receiving slot 111 , and the positioning slot 112 protrudes from the receiving slot 111 .

As shown in FIG. 2 and FIG. 3, the IC test machine includes a rotating arm 3. One end of the rotating arm 3 is fixed on the base 1, and the other end is set on the test head 2. The test head 2 is transmitted through the rotating arm 3. Rotate to approach or away from the carrier 11 of the susceptor 1.

When the test head 2 is in the position B of FIG. 2, the test head 2 is detachably disposed above the carrier 11 of the susceptor 1. A test carrier 21 and a probe holder 22 are disposed under the test head 2, wherein The test carrier 21 of the test head 2 is a circuit board. The probe base 22 is disposed on the test carrier 21 and corresponds to the receiving slot 111 of the base 1. The probe base 22 is provided with a plurality of inner loops. The needle 221 and the plurality of outer loop probes 222, the inner loop probe 221, and the outer loop probe 222 are electrically connected to the test carrier 21, respectively.

The first probe card 23 includes a plurality of annular contacts 231 and three positioning holes 232. The outer diameter of the first probe card 23 is smaller than the outer diameter of the receiving slot 111 of the base 1.

The second probe card 24 is larger than the first probe card 23, and the second probe card 24 includes a plurality of inner loop contacts 241, a plurality of outer loop contacts 242, and three positioning through holes 243, wherein the second probe The inner diameter and the outer diameter of the inner ring 241 of the card 24 are equal to the inner diameter and the outer diameter of the annular contact 231 of the first probe card 23. The outer diameter of the second probe card 24 is slightly smaller than the base. The outer diameter of the accommodating groove 111 of the seat 1 is such that when the second probe card 24 is placed in the accommodating groove 111 of the pedestal 1, it is just accommodated in the accommodating groove 111.

The accommodating slot 111 of the pedestal 1 is selectively accommodating the first probe card 23, and the three positioning holes 232 of the first probe card 23 are correspondingly sleeved on the positioning pins 112 of the pedestal 1 Positioning.

The plurality of annular contacts 231 of the first probe card 23 are respectively electrically connected to the inner ring probes 221 of the test head 2, and the signals outputted by the test carrier 21 are transmitted to the first probe card. 23 ring contacts 231.

The accommodating slot 111 of the pedestal 1 or the second probe card 24 is selectively accommodated, and the third positioning hole 243 of the second probe card 24 is correspondingly received on the locating tip 112 of the pedestal 1 Positioning.

The plurality of inner ring contacts 241 of the second probe card 24 are respectively electrically connected to the inner ring probes 221 of the test head 2, and the plurality of outer ring contacts 242 of the second probe card 24 are respectively Correspondingly, the plurality of outer ring probes 222 connected to the test head 2 are electrically connected, thereby transmitting the signal outputted by the test carrier 21 to the inner ring contact 241 of the second probe card 24, and the outer ring contact. 242.

The plurality of probes 225 of the probe holder 22 are spring-loaded spring probes that can respond to the depth of contact between the probe holder 22 and the first probe card 23 or the second probe card 24. The height of each probe 225 is adjusted by itself.

2 and 4 are perspective views of a test head according to a preferred embodiment of the present invention. The test head position shown in FIG. 4 is a state diagram of the position A indicated in FIG. 2.

As shown in FIG. 4, the test head 2 also includes a verification card 25 for correspondingly covering the probe base 22. The verification card 25 includes three positioning pins 251, wherein the positioning pins 251 are selectively inserted in the first The three positioning holes 232 of the probe card 23 are selectively inserted into the three positioning through holes 243 of the second probe card 24 .

Please refer to FIG. 4 and FIG. 5. FIG. 5 is an exploded view of a test head according to a preferred embodiment of the present invention. As shown, the probe holder 22 is assembled to the test carrier 21 via an adapter structure 210. The adapter structure 210 includes an inner locking ring 213 and an outer locking ring 214. The inner locking ring 213 includes two inner guiding columns 215 and two outer guiding columns 216. The outer locking ring 214 includes two oblique guiding grooves 217. The outer locking ring 214 is fixed on the test carrier 21 by screws (not shown). The circumference of the bottom of the probe base 22 includes two oblique ring grooves 226, and two inner guiding columns 215 inside the inner locking ring 213. The two outer guide posts 216 on the outer side of the inner locking ring 213 are slidably disposed in the two guiding slots 217 of the outer locking ring 214, and then the test carrier is locked by screws. 21 and the outer locking ring 214, therefore, the probe holder 22 is fixed to the test carrier 21.

In addition, the test carrier 21 of the test head 2 includes a plurality of inner ring contacts 211 and a plurality of outer ring contacts 212. The plurality of inner ring contacts 211 of the test head 2 are electrically connected to the probe base 22 respectively. a plurality of inner ring probes 221, and a plurality of outer ring contacts 212 of the test head 2 respectively corresponding to the plurality of outer ring probes 222 electrically connected to the probe base 22, so that the signals output by the test carrier 21 can be respectively Correspondingly, it is transmitted to the inner ring probe 221 and the outer ring probe 222 of the probe holder 22.

Please also refer to Figure 2 and Figure 4. Wherein, when the test head 2 is placed in the state of the position A indicated in FIG. 2, the wafer module to be tested (not shown) can be placed on the verification card 25 in FIG. 4 to facilitate the engineering verification of the test head 2. Test to confirm that the test function of test head 2 is working correctly.

As shown in FIG. 6, after the verification of the project is completed, the verification card 25 is removed from the test head 2, and the first probe card 23 or the second probe card 24 is selectively placed on the base 1. In the slot 111, the test head 2 is finally rotated to the position C (shown in FIG. 2), and the probe base 22 is electrically connected to the first probe card 23 to facilitate wafer sorting. This is the so-called CP (chip process) test.

In view of the above, referring to FIG. 3 and FIG. 6, the probe cards 23, 24 of different sizes are selectively placed in the receiving slots 111 of the base 1, which are positioned by the three common positioning tips 112; The different probe cards 23, 24 have the same and corresponding plurality of annular contacts 231, or inner ring contacts 241, and can be combined with the plurality of inner ring probes of the probe holder 22 on the test head 2. 221 respectively correspondingly and electrically connected, in addition, a plurality of outer ring contacts 242 on the periphery of the larger probe card 24 are respectively correspondingly coupled to the plurality of outer ring probes 222 of the probe base 22 and electrically connected .

Therefore, an IC test machine can be replaced with two different size probe cards for testing. No need to modify any test carrier board 21 and modify the internal software of the test machine, it can achieve the purpose of quickly replacing different probe cards, which can reduce the cost of cross-machine testing of products and improve the test machine. Competitiveness.

The above-mentioned embodiments are merely examples for convenience of description, and the scope of the claims is intended to be limited to the above embodiments.

1‧‧‧Base

11‧‧‧Loading station

111‧‧‧ accommodating slots

112‧‧‧ positioning tips

2‧‧‧Test head

21‧‧‧Test carrier

211‧‧‧ Inner ring contacts

212‧‧‧Outer ring contacts

213‧‧‧Interlocking ring

214‧‧‧ external locking ring

215‧‧‧ inner guide column

216‧‧‧External guide column

217‧‧‧ oblique guide

22‧‧‧ probe holder

221‧‧‧ Inner ring probe

222. . . Outer ring probe

225. . . Probe

226. . . Oblique ring groove

twenty three. . . First probe card

231. . . Ring contact

232. . . Positioning hole

twenty four. . . Second probe card

241. . . Inner ring contact

242. . . Outer ring contact

243. . . Positioning through hole

25. . . Verification card

251. . . Positioning

A. . . position

B. . . position

C. . . position

210. . . Transfer structure

Figure 1 is a perspective view of a conventional test machine.

2 is a diagram showing the state of the test head relative to the base of a preferred embodiment of the present invention.

3 is a perspective view of a test head and a base in accordance with a preferred embodiment of the present invention.

4 is a perspective view of a test head in accordance with a preferred embodiment of the present invention.

Figure 5 is an exploded view of a test head in accordance with a preferred embodiment of the present invention.

Figure 6 is a cross-sectional view of the probe holder in contact with the probe card.

1. . . Pedestal

11. . . Carrying platform

111. . . Locating slot

112. . . Positioning tip

2. . . Test head

twenty one. . . Test carrier

twenty two. . . Probe holder

221. . . Inner loop probe

222. . . Outer ring probe

225. . . Probe

twenty three. . . First probe card

231. . . Ring contact

232. . . Positioning hole

twenty four. . . Second probe card

241. . . Inner ring contact

242. . . Outer ring contact

243. . . Positioning through hole

210. . . Transfer structure

Claims (6)

An IC testing machine that can be replaced with a different probe card, comprising: a base having a carrying platform, the receiving platform is provided with a receiving slot, and the receiving slot protrudes at least two positioning tips; The test head is detachably disposed above the carrier of the pedestal. The test head is provided with a test carrier and a probe holder. The probe holder is disposed on the test carrier and corresponds to The accommodating groove of the pedestal, the probe holder is provided with a plurality of inner ring probes, and a plurality of outer ring probes, the plurality of inner ring probes, and the plurality of outer ring probes respectively Testing the carrier electrical connection; a first probe card comprising a plurality of annular contacts and at least two positioning holes; and a second probe card larger than the first probe card, the second probe The card includes a plurality of inner ring contacts, a plurality of outer ring contacts, and at least two positioning through holes; wherein the receiving groove of the base is selectively accommodating the first probe card, the first The at least two positioning holes of the probe card are correspondingly positioned on the at least two positioning ends of the base, and the first probe card is positioned a plurality of annular contacts are electrically connected to the plurality of inner ring probes respectively connected to the test head; the receiving slot of the base or the second probe card is optionally accommodated The at least two positioning through holes of the second probe card are correspondingly positioned on the at least two positioning ends of the base, and the plurality of inner ring contacts of the second probe card are respectively correspondingly aligned Electrically connecting to the plurality of inner loop probes of the test head, and the plurality of outer loop contacts of the second probe card are respectively correspondingly coupled to the plurality of outer loop probes of the test head Sexual connection. The IC test machine of claim 1, further comprising a rotating arm, one end of the rotating arm being fixed on the base and the other end being disposed on the test head, the test head is transmitted through the rotation The arm rotates to approach or away from the deck of the base. The IC test machine of claim 1, wherein the test carrier of the test head comprises a plurality of inner ring contacts and a plurality of outer ring contacts, wherein the plurality of inner ring contacts respectively correspond to The plurality of inner ring probes are electrically connected to the probe holder, and the plurality of outer ring contacts respectively correspond to the plurality of outer ring probes electrically connected to the probe holder. The IC test machine of claim 1, wherein the probe holder is disposed on the test carrier through an adapter structure. The IC testing machine of claim 4, wherein the adapter structure comprises an inner locking ring and an outer locking ring, the inner locking ring comprises at least two inner guiding columns, and at least two The outer locking ring includes at least two oblique guiding grooves, the outer locking ring is fixed on the test carrier, and the circumference of the probe base includes at least two oblique ring grooves, and the inner side of the inner locking ring The at least two inner guide columns are slidably disposed in the at least two oblique ring grooves of the probe base, and the at least two outer guide columns on the outer side of the inner locking ring are slidably disposed on the at least two oblique guides of the outer locking ring Inside the slot. The IC test machine of claim 1, wherein the test head further comprises a verification card correspondingly to the probe base, the verification card comprising at least two positioning pins, the at least two positioning pins The tip is selectively inserted into the at least two positioning holes of the first probe card, or selectively inserted into the at least two positioning through holes of the second probe card.