201018933 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種ic測試機台，尤指一種適用於可換 用不同探針卡之1C測試機台。 【先前技術】 ❷ 10 15201018933 VI. Description of the Invention: [Technical Field] The present invention relates to an ic test machine, and more particularly to a 1C test machine suitable for use with different probe cards. [Prior Art] ❷ 10 15
圖1係習知1C測試機台之立體圖，如圖i所示之測試機 台疋具有256個輸入/輸出個通道（channel)、及16組DPS的測 試機台，機台上之測試載板9、探針座91、及探針卡92均是 根據上述規格而設計。 由於目前電子產品日新月異、功能整合度愈來愈高， 其所涉及的訊號種類日趨複雜。為因應產業需求以提高測 試產能，測試機台的測試能力亦要提高，因此其規格從原 先之256個輸入/輸出個通道、及16組〇1>3提昇至512個輸入/ 輸出個通道、及32組DPS。 為此，測絲商除了重新構入具有512個輸人/輸出個 通道、及32組DPS規格之新機台夕卜，亦可由原2%個輸入/ 輪出個通道、及触DPS之舊機台從事硬體、或軟體的修改 若僅為新規格而購入或是改裝機台需要花費可觀之成 本，若能於改裝後兼顧新、舊機台 嫵二改此孙π 又功月巨’則能使改裝之 機σ發揮其最大的功效。 以改善前述一 因此亟待一種能相容新舊機台之界面 種機台使用於單一規格測試的缺點。 3 201018933 【發明内容】 本發明係關於一種可換用不同探針卡之ic測試機台， 包括一基座、一測試頭（tester)、一第一探針卡（pr〇be 5 card)、及一第二探針卡。 基座其上設有一承載台（stage)，承載台凹設有—容置 槽（card holder)，容置槽内凸伸至少二定位梢。測試頭 (tester)可分離式地設置於基座之承載台上方，測試頭下方 ® 組设有一測試載板（l〇ad board)、及一探針座（p〇g〇 10 tower)’探針座組設於測試載板上並對應於基座之容置槽， 探針座設有複數個内環探針、及複數個外環探針，複數個 内環探針、及複數個外環探針並分別與測試載板電性連接。 第一探針卡（probe card)其包括複數個環形接點、及 至少二定位孔。第二探針卡其大於第一探針卡第二探針 15卡包括複數個内環接點、複數個外環接點、及至少二定位 通孔。 〇 其中，基座之容置槽是選擇式地容置有第一探針卡， 第一探針卡之至少二定位孔並對應穿套在基座之至少二定 位梢上予以定位。第一探針卡之複數個環形接點並分別相 20應對合至測試頭之複數個内環探針而電性連接。 基座之容置槽或可選擇式地容置有第二探針卡，第二 探針卡之至少二定位通孔並對應穿套在基座之至少二定位 予以&位。第—糾卡之複數個内環接點並分別相應 “至測試頭之複數個内環探針而電性連接第二探針卡 201018933 之複數個外環接點並分別相應對合至測試頭之複數個外環 探針而電性連接。 綜合上述，於基座上之容置槽内可選擇式放入不同尺 1的探針卡，其是以共用之三根定位梢予以定位；不同的 5探針卡卻有相同且相對應之複數個内環接點，並可與測試 頭上的探針座所設之複數個内環探針分別相應對合而電性 連接，此外，較大之探針卡外圍的複數個外環接點亦分別 相應對合至探針座之複數個外環探針而電性連接。 β 目此，—部IC測試機台可換用兩種不同尺寸之探針卡 1〇進行測試，不需拆換測試載板、及修改測試機台内部軟體， 即能達到快速置換不同探針卡的目的，可降低產品跨機測 試時所需之成本，並能提升測試機台之競爭力。 此外1C測試機台可包括有一旋轉臂，旋轉臂一端固設 於基座上、另一端組設於測試頭上，測試頭是透過旋轉臂 15 旋轉以趨近或遠離基座之承載台。 測試頭之測試載板可包括複數個内圈接點、及複數個 β 外圈接點，複數個内圈接點可分別對應電性連接至探針座 之複數個内環探針，複數個外圈接點分別對應電性連接至 探針座之複數個外環探針。其中，探針座 如構組設於測試載板上。 紅轉接，'、。 轉接結構可包括一内鎖固環、及一外鎖固環，内鎖固 環可包括二内導柱、及二外導柱，外鎖固環可包括二斜導 槽，外鎖固環藉由螺絲固於測試載板上，探針座之底部之 %周包括二斜環槽’内鎖固環内側之二内導柱滑設於探針 5 201018933 座之二斜環槽内，内鎖固環外側之二外導柱滑設於外鎖固 環之二斜導槽内。 此外’測試頭可包括-驗證卡（U)ek dng)以對應蓋合 於探針座，驗證卡包括至少二定位插梢，至少二定位插梢 5可選擇式地對應插設於第一探針卡之至少二定位孔内、或 選擇式對應地插設於第二探針卡之至少二定位通孔内。 【實施方式】 請參閱圖2、及圖3,圖2係本發明一較佳實施例測試頭 相對於基座位置之狀態圖。圖3係本發明一較佳實施例之測 試頭與基座之立體圖。其中，圖3中所示之測試頭與基座之 相對位置是圖2中所標示位置B之狀態圖。如圖所示，本實 施例是一種可換用不同探針卡之扣測試機台，包括一基座 1、一測試頭2、一第一探針卡23、及一第二探針卡24。 15 如圖3所示，基座1其上設有一承載台11，承載台 凹6又有一谷置槽Π1，容置槽内凸伸三定位梢112。 1 如圖2、及圖3所示，ic測試機台包括有一旋轉臂3 ,旋 轉臂3 —端固設於基座丨上、另一端組設於測試頭2上，測試 頭2是透過旋轉臂3旋轉以趨近或遠離基座1之承載台u。 2〇 當測試頭2於圖2之位置B時，測試頭2可分離式地設置 於基座1之承載台n上方，測試頭2下方組設有一測試載板 21、及—探針座22，其中，測試頭2之測試載板21是為一電 路板’探針座22組設於測試載板21上並對應於基座1之容置 槽11 1，板針座22設有複數個内環探針221、及複數個外環 201018933 採針222 ’内裱探針221、及外環探針222分別與測試載板u 電性連接。 第一探針卡23其包括複數個環形接點231、及三個定位 5 10 15 ❿ 20 孔232,其中，第一探針卡23之外徑尺寸小於基座1之容置 槽111之外徑尺寸。 、第二探針卡24大於第一探針卡23，第二探針卡24包括 複數個内環接點241、複數個外環接點242、及三定位通孔 24^，其中，第二探針卡24之内環接點241其内徑、及外徑 /、第探針卡23之環形接點23 1其内徑、及外徑均相等，第 —探針卡24之外徑尺寸略小於基座丨之容置槽i丨丨之外徑尺 寸因此，當第二探針卡24置入於基座丨之該容置槽ln時， 剛好容置於容置槽1U内。 基座1之谷置槽111是選擇式地容置有第一探針卡， 第—探針卡23之三定位孔232並對應穿套在定位於基座}之 三定位梢112上予以定位。 第一探針卡23之複數個環形接點231並分別相應對合 至測試頭2之内環探針221而電性連接，進而將測試載板21 所輪出之訊號傳輸至第一探針卡23之環形接點231上。 基座1之容置槽111或可選擇式地容置有第二探針卡 24 '第二探針卡24之三定位通孔243並對應穿套在基座 三定位梢112上予以定位。 第二探針卡24之複數個内環接點241並分別相應對合 至測試頭2之内環探針221而電性連接，第二探針卡24之複 數個外環接點242並分別相應對合至測試頭2之複數個外環 7 201018933 探針222而電性連接，進而將測試載板21所輸出之訊號傳輸 至第一探針卡24之内環接點241、及外環接點242。 其中’探針座22的複數根探針225是為一具軸向彈力之 彈簧探針，其可因應探針座22與第一探針卡23、或第二探 5 針卡24間之接觸深度而自行調整每一探針225之高度。 請參閱圖2、及圖4係本發明一較佳實施例測試頭之立 體圖。其中，圖4中所示之測試頭位置是於圖2中所標示之 位置A之狀態圖。 # 如圖4所示，測試頭2亦包括一驗證卡25以對應蓋合於 10 探針座22，驗證卡25包括三定位插梢25 1，其中，定位插梢 251是選擇式地對應插設於第一探針卡23之三定位孔232 内、或選擇式地對應插設於第二探針卡24之三定位通孔243 内。 請參閱圖4、及圖5,圖5係本發明一較佳實施例測試頭 15 之分解圖。如圖所示，探針座22是透過一轉接結構21〇組設 於測試載板21上。轉接結構210包括一内鎖固環213、及一 ❹ 外鎖固環214’内鎖固環213包括二内導柱215、及二外導柱 216,外鎖固環214包括二斜導槽217，外鎖固環214藉由螺 絲（圖未示）固設於測試載板21上，探針座22底部之環周包括 2〇 二斜環槽226，内鎖固環213内側之二内導柱215滑設於探針 座22^—斜環槽226内，内鎖固環213外側之二外導柱216滑 s5:於外鎖固環214之二導槽217内，再以螺絲鎖固測試載板 21及外鎖固環214，因此，探針座22得以固設於測試載板21 201018933 此外’測試頭2之測試載板21包括複數個内圈接點 2U、及複數個外圈接點212,測試頭2之複數個内圈接點211 分別對應電性連接至探針座22之複數個内環探針22卜測試 頭2之複數個外圈接點212分別對應電性連接至探針座22之 5 複數個外環探針222,以使測試載板21所輸出之訊號能分別 對應傳輸至探針座22的内環探針221、及外環探針222上。 請同時參閱圖2、圖4、及圖6，圖6係圖2其局部D之剖 視圖。其中’當測試頭2置於圖2中所標示之位置A之狀態 ® 時’待測晶片模組（圖未示）可置於圖4中驗證卡25上，以利 10 進行測試頭2的工程驗證測試，以確認測試頭2之測試功能 是否正確運作。 如圖6所示，當工程驗證完成後’再將驗證卡25自測試 頭2拆下’並將第一探針卡23、或是第二探針卡24擇一置於 基座1之容置槽1U内’最後將測試頭2轉置位置c(示於圖2 15 中）’以探針座22與第一探針卡23電性連接，以利進行晶圓 針測（wafer sort)，即一般所謂的 Cp(chip pr〇cess)測試。 ❹ 綜合上述，請看圖3、及圖6,於基座1上之容置槽Π1 内可選擇式放入不同尺寸的探針卡23,24，其是以共用之三 根定位梢112予以定位；不同的探針卡23,24卻有相同且相對 20應之複數個環形接點231、或内環接點241，並可與測試頭2 上的探針座22所設之複數個内環探針221分別相應對合而 電性連接，此外，較大之探針卡24外圍的複數個外環接點 242亦分別相應對合至探針座22之複數個外環探針而電 性連接。 201018933 因此，一部ic測試機台可換用兩種不同尺寸之探針卡 進行測試。不需修改拆換任何測試載板21、及修改測試機 台内部軟體，即能達到快速置換不同探針卡的目的，可降 低產品跨機測試時所需之成本，並能提升測試機台之 5 力。 上述實施例僅係為了方便說明而舉例而已，本發明所 主張之權利範圍自應以申請專利範圍所述為準，而非僅限 於上述實施例。 【圖式簡單說明】 圖1係習知測試機台之立體圖。 圖2係本發明一較佳實施例測試頭相對於基座位置之狀態 圖。 圖3係本發明一較佳實施例之測試頭與基座之立體圖。 15 圖4係本發明一較佳實施例測試頭之立體圖。 圖5係本發明一較佳實施例測試頭之分解圖。 .圖6係圖2其局部D之剖視圖。 【主要元件符號說明】 基座1 定位梢112 内圈接點211 外鎖固環214 斜導槽217 承載台11 測試頭2 外圈接點212 内導柱215 探針座22 容置槽111 測試載板21 内鎖固環213 外導柱216 内環探針221 201018933Figure 1 is a perspective view of a conventional 1C test machine. The test machine shown in Figure i has 256 input/output channels and 16 DPS test machines. The test board on the machine. 9. The probe holder 91 and the probe card 92 are all designed according to the above specifications. Due to the rapid changes in electronic products and the increasing degree of functional integration, the types of signals involved are becoming more and more complex. In order to improve the test capacity in response to industrial demand, the testing capability of the test machine has also been improved. Therefore, its specifications have been upgraded from the original 256 input/output channels and 16 groups of &1>3 to 512 input/output channels. And 32 sets of DPS. To this end, in addition to re-constructing a new machine with 512 input/output channels and 32 DPS specifications, the wire supplier can also use the original 2% input/round to exit the channel and touch the DPS. If the machine is engaged in hardware or software modification, it will cost a considerable amount of money to purchase or modify the machine if it is only for new specifications. If it can be modified, both new and old machines will be changed. It can make the modified machine σ play its maximum effect. In order to improve the foregoing one, it is necessary to treat the interface of a new and old machine to be used in a single specification test. 3 201018933 SUMMARY OF THE INVENTION The present invention relates to an ic test machine that can be replaced with different probe cards, including a base, a tester, and a first probe card (pr〇be 5 card). And a second probe card. The base is provided with a stage, and the carrying platform is recessed with a card holder, and the receiving groove protrudes at least two positioning tips. The tester is detachably disposed above the carrier of the pedestal, and a test carrier (l〇ad board) and a probe holder (p〇g〇10 tower) are placed under the test head. The needle holder is disposed on the test carrier and corresponds to the accommodating groove of the pedestal. The probe holder is provided with a plurality of inner ring probes, a plurality of outer ring probes, a plurality of inner ring probes, and a plurality of outer The loop probes are electrically connected to the test carrier, respectively. The first probe card includes a plurality of annular contacts and at least two positioning holes. The second probe card is larger than the first probe card. The second probe 15 card includes a plurality of inner loop contacts, a plurality of outer loop contacts, and at least two positioning through holes. The accommodating slot of the pedestal is selectively accommodating the first probe card, and at least two locating holes of the first probe card are correspondingly positioned on the at least two positioning ends of the pedestal. The plurality of annular contacts of the first probe card are respectively electrically connected to the plurality of inner ring probes that are coupled to the test head. The accommodating slot of the pedestal or the second probe card is selectively received, and at least two positioning through holes of the second probe card are correspondingly positioned at the second position of the pedestal. The plurality of inner loop contacts of the first correcting card are respectively corresponding to the plurality of inner loop probes of the test head and electrically connected to the plurality of outer loop contacts of the second probe card 201018933 and respectively correspondingly connected to the test head The plurality of outer ring probes are electrically connected. In the above, the probe cards of different sizes 1 are selectively placed in the receiving slots on the base, which are positioned by the three common positioning tips; different 5 probe cards have the same and corresponding multiple inner ring contacts, and can be correspondingly connected and electrically connected with the plurality of inner ring probes provided on the probe base on the test head, in addition, the larger one The plurality of outer ring contacts on the periphery of the probe card are respectively electrically connected to the plurality of outer ring probes of the probe base. β. Therefore, the IC test machine can be replaced with two different sizes. The probe card is tested, and the test board is not required to be replaced, and the internal software of the test machine is modified, so that the purpose of quickly replacing different probe cards can be achieved, and the cost required for cross-machine testing of the product can be reduced, and Improve the competitiveness of the test machine. In addition, the 1C test machine can include a rotating arm, one end of the rotating arm is fixed on the base, and the other end is set on the test head, and the test head is rotated by the rotating arm 15 to approach or away from the carrying platform of the base. The test carrier of the test head may include plural The inner ring contact and the plurality of β outer ring contacts, the plurality of inner ring contacts respectively corresponding to the plurality of inner ring probes electrically connected to the probe base, and the plurality of outer ring contacts respectively corresponding to the electrical connection a plurality of outer ring probes to the probe base, wherein the probe holders are configured on the test carrier. Red transfer, ',. The transfer structure may include an inner locking ring and an outer locking The inner locking ring may include two inner guiding columns and two outer guiding columns, and the outer locking ring may include two oblique guiding grooves, and the outer locking ring is fixed on the test carrier by screws, and the bottom of the probe base The % inner circumference includes the two inner guide pillars on the inner side of the inner locking ring. The inner inner guide column is slidably disposed in the second oblique ring groove of the probe 5 201018933. The outer outer guide column on the outer side of the inner locking ring is slidably disposed on the outer locking ring. In the second oblique guide groove. In addition, the 'test head may include a verification card (U) ek dng) to cover the probe base correspondingly, and the verification card includes At least two positioning pins, at least two positioning pins 5 are selectively inserted into at least two positioning holes of the first probe card, or at least two positioning pins correspondingly inserted into the second probe card [Embodiment] Please refer to FIG. 2 and FIG. 3, FIG. 2 is a state diagram of the position of the test head relative to the base according to a preferred embodiment of the present invention. FIG. 3 is a test head according to a preferred embodiment of the present invention. A perspective view of the base and the base, wherein the relative position of the test head and the base shown in FIG. 3 is a state diagram of the position B indicated in FIG. 2. As shown, the present embodiment is a different probe that can be exchanged. The buckle test machine includes a base 1, a test head 2, a first probe card 23, and a second probe card 24. 15 As shown in FIG. 3, the base 1 is provided with a load thereon. The stage 11 has a valley recess 6 and a trough 1 in the receiving slot. 1 As shown in FIG. 2 and FIG. 3, the ic test machine includes a rotating arm 3, the rotating arm 3 is fixed on the base cymbal, the other end is set on the test head 2, and the test head 2 is rotated. The arm 3 rotates to approach or away from the carrier u of the base 1. 2 When the test head 2 is at the position B of FIG. 2, the test head 2 is detachably disposed above the carrier n of the susceptor 1, and a test carrier 21 and a probe holder 22 are disposed below the test head 2. The test carrier 21 of the test head 2 is a circuit board 'probe base 22 disposed on the test carrier 21 and corresponding to the receiving slot 11 of the base 1, and the board pin 22 is provided with a plurality of The inner ring probe 221 and the plurality of outer rings 201018933 are respectively electrically connected to the test carrier u. The first probe card 23 includes a plurality of annular contacts 231 and three positioning 5 10 15 ❿ 20 holes 232, wherein the outer diameter of the first probe card 23 is smaller than the receiving slot 111 of the base 1 Diameter size. The second probe card 24 is larger than the first probe card 23, and the second probe card 24 includes a plurality of inner ring contacts 241, a plurality of outer ring contacts 242, and three positioning through holes 24^, wherein the second The inner ring and the outer diameter of the inner ring contact 241 of the probe card 24, the inner diameter and the outer diameter of the annular contact 23 1 of the probe card 23 are equal, and the outer diameter of the first probe card 24 The outer diameter of the accommodating groove 丨丨 is slightly smaller than that of the accommodating groove 丨丨 of the susceptor. Therefore, when the second probe card 24 is placed in the accommodating groove ln of the susceptor, it is just accommodated in the accommodating groove 1U. The valley slot 111 of the base 1 is selectively accommodating the first probe card, and the three positioning holes 232 of the first probe card 23 are correspondingly positioned on the three positioning pins 112 positioned on the base. . The plurality of annular contacts 231 of the first probe card 23 are respectively electrically connected to the inner ring probes 221 of the test head 2, and the signals of the test carrier 21 are transmitted to the first probe. The ring 23 of the card 23 is on the joint 231. The accommodating groove 111 of the pedestal 1 or the locating socket 243 of the second probe card 24' the second probe card 24 is selectively received and correspondingly positioned on the pedestal three positioning tips 112. The plurality of inner ring contacts 241 of the second probe card 24 are respectively electrically connected to the inner ring probes 221 of the test head 2, and the plurality of outer ring contacts 242 of the second probe card 24 are respectively Correspondingly, the plurality of outer rings 7 201018933 probes 222 of the test head 2 are electrically connected, and the signals outputted by the test carrier 21 are transmitted to the inner ring contacts 241 of the first probe card 24 and the outer ring. Contact 242. The plurality of probes 225 of the probe holder 22 are spring-loaded spring probes that are in contact with the first probe card 23 or the second probe 5 card 24 of the probe holder 22. The height of each probe 225 is adjusted by itself. 2 and 4 are perspective views of a test head according to a preferred embodiment of the present invention. The test head position shown in Fig. 4 is a state diagram of the position A indicated in Fig. 2. As shown in FIG. 4, the test head 2 also includes a verification card 25 for correspondingly covering the 10 probe holder 22, and the verification card 25 includes three positioning insertion pins 25 1, wherein the positioning insertion pins 251 are selectively inserted correspondingly. It is disposed in the three positioning holes 232 of the first probe card 23 or selectively inserted into the three positioning through holes 243 of the second probe card 24. Please refer to FIG. 4 and FIG. 5. FIG. 5 is an exploded view of the test head 15 according to a preferred embodiment of the present invention. As shown, the probe holder 22 is assembled to the test carrier 21 via an adapter structure 21''. The adapter structure 210 includes an inner locking ring 213, and an outer locking ring 214'. The inner locking ring 213 includes two inner guiding columns 215 and two outer guiding columns 216. The outer locking ring 214 includes two oblique guiding slots. 217, the outer locking ring 214 is fixed on the test carrier 21 by screws (not shown), and the circumference of the bottom of the probe base 22 includes two second oblique ring grooves 226, and the inner side of the inner locking ring 213 The guide post 215 is slidably disposed in the probe housing 22^-the oblique ring groove 226, and the two outer guide posts 216 on the outer side of the inner locking ring 213 slide s5: in the two guiding slots 217 of the outer locking ring 214, and then locked by screws The test carrier 21 and the outer locking ring 214 are fixed, so that the probe holder 22 is fixed to the test carrier 21 201018933. Further, the test carrier 21 of the test head 2 includes a plurality of inner ring contacts 2U, and a plurality of outer The loop contact 212, the plurality of inner loop contacts 211 of the test head 2 respectively correspond to the plurality of inner loop probes 22 electrically connected to the probe holder 22, and the plurality of outer loop contacts 212 of the test head 2 respectively correspond to the electrical properties 5 outer ring probes 222 connected to the probe holder 22, so that the signals outputted by the test carrier 21 can be respectively transmitted to the inner ring probe 221 and the outer ring probe 222 of the probe holder 22. on. Please refer to FIG. 2, FIG. 4, and FIG. 6, and FIG. 6 is a cross-sectional view of a portion D of FIG. Wherein 'When the test head 2 is placed in the state of the position A indicated in FIG. 2', the wafer module to be tested (not shown) can be placed on the verification card 25 in FIG. 4 to facilitate the test head 2 Engineering verification test to confirm that the test function of test head 2 is working correctly. As shown in FIG. 6, when the verification of the project is completed, 'the verification card 25 is removed from the test head 2' and the first probe card 23 or the second probe card 24 is placed on the base 1 In the slot 1U, the final test head 2 is rotated to the position c (shown in FIG. 2 15). The probe base 22 is electrically connected to the first probe card 23 to facilitate wafer sorting. That is, the so-called Cp (chip pr〇cess) test. ❹ In summary, please refer to FIG. 3 and FIG. 6 , in which the probe cards 23 , 24 of different sizes are selectively placed in the receiving slot 1 on the base 1 , which are positioned by the three common positioning tips 112 . The different probe cards 23, 24 have the same plurality of annular contacts 231, or inner ring contacts 241, and may be combined with the plurality of inner rings of the probe holder 22 on the test head 2. The probes 221 are respectively electrically connected to each other. In addition, the plurality of outer loop contacts 242 on the periphery of the larger probe card 24 are respectively corresponding to the plurality of outer loop probes of the probe holder 22 and electrically connected. connection. 201018933 Therefore, an ic test machine can be replaced with two different size probe cards for testing. No need to modify any test carrier board 21 and modify the internal software of the test machine, it can achieve the purpose of quickly replacing different probe cards, which can reduce the cost of cross-machine testing of products and improve the test machine. 5 force. The above-described embodiments are merely examples for the convenience of the description, and the scope of the claims is intended to be limited by the scope of the claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a conventional test machine. Figure 2 is a diagram showing the state of the test head relative to the base of a preferred embodiment of the present invention. 3 is a perspective view of a test head and a base in accordance with a preferred embodiment of the present invention. 15 is a perspective view of a test head in accordance with a preferred embodiment of the present invention. Figure 5 is an exploded view of a test head in accordance with a preferred embodiment of the present invention. Figure 6 is a cross-sectional view of a portion D of Figure 2. [Main component symbol description] Base 1 Locating tip 112 Inner ring contact 211 External locking ring 214 Oblique guide groove 217 Carrier table 11 Test head 2 Outer ring contact 212 Inner guide post 215 Probe holder 22 Socket groove 111 Test Carrier 21 inner locking ring 213 outer guide post 216 inner ring probe 221 201018933
外環探針222 第一探針卡23 第二探針卡24 定位通孔243 位置AOuter Ring Probe 222 First Probe Card 23 Second Probe Card 24 Positioning Through Hole 243 Position A
轉接結構210 探針225 環形接點231 内環接點241 驗證卡25 位置B 斜環槽226 定位孔232 外環接點242 定位插梢25 1 位置CTransfer structure 210 Probe 225 Ring contact 231 Inner ring contact 241 Verification card 25 Position B Oblique ring groove 226 Positioning hole 232 Outer ring contact 242 Positioning pin 25 1 Position C