CN209562896U - The high-power inner-layer thick copper of resistance to electric current circuit board - Google Patents
The high-power inner-layer thick copper of resistance to electric current circuit board Download PDFInfo
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- CN209562896U CN209562896U CN201821651567.5U CN201821651567U CN209562896U CN 209562896 U CN209562896 U CN 209562896U CN 201821651567 U CN201821651567 U CN 201821651567U CN 209562896 U CN209562896 U CN 209562896U
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- electric current
- resistance
- circuit board
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Abstract
The utility model discloses a kind of high-power inner-layer thick copper of resistance to electric current circuit boards, it includes substrate etc., diffusing slot, diversion column, conductive through hole, power interface, radiating copper sheet are all fixed on substrate, multiple diversion columns are all located at below multiple diffusing slots, conductive through hole is located at the side of multiple diffusing slots, multiple power interfaces are all located at the other side of conductive through hole, and multiple radiating copper sheets are all located at the upper surface of diffusing slot, and wherein substrate includes external base etc..The utility model further improves the flintiness of the high-power inner-layer thick copper of resistance to electric current circuit board by a variety of levels, the high-power inner-layer thick copper of resistance to electric current circuit board is allowed to be not easy to be damaged by outside by upper base copper and lower base copper, the flexibility of substrate is improved by tinbase layer, the high-power inner-layer thick copper of resistance to electric current circuit board will not be damaged because of bending and easily, the high-power inner-layer thick copper of resistance to electric current circuit board can be stored for a long time, not need often to replace.
Description
Technical field
The utility model relates to a kind of circuit boards, more particularly to a kind of high-power inner-layer thick copper of resistance to electric current circuit board.
Background technique
The high-power inner-layer thick copper of resistance to electric current circuit board is the circuit more stable one is the electric current flowing made of thick copper
Plate, existing circuit board current flows above it to be not sufficiently stable, not enough quickly, is easier the electric currents accident such as short circuit occur,
And circuit board itself is also not hard enough is easier to damage, and more sliding circuit board is needed often, also without good flexibility, nothing
Method is bent.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of high-power inner-layer thick copper of resistance to electric current circuit boards, lead to
The flintiness that a variety of levels further improve the high-power inner-layer thick copper of resistance to electric current circuit board is crossed, upper base copper and lower copper are passed through
Base allows the high-power inner-layer thick copper of resistance to electric current circuit board to be not easy to be damaged by outside, can store for a long time, does not need often
Replacement.
The utility model is that above-mentioned technical problem is solved by following technical proposals: a kind of high-power internal layer of resistance to electric current
Heavy copper circuit board, which is characterized in that it includes substrate, diffusing slot, diversion column, conductive through hole, power interface, radiating copper sheet, is dissipated
Chute, diversion column, conductive through hole, power interface, radiating copper sheet are all fixed on substrate, and multiple diversion columns are all located at multiple diffusings
Below slot, conductive through hole is located at the side of multiple diffusing slots, and multiple power interfaces are all located at the other side of conductive through hole, multiple
Radiating copper sheet is all located at the upper surface of diffusing slot, in which: substrate includes external base, middle part adhesive layer, lower protective layer, and middle part is viscous
It closes layer to be located at below external base, lower protective layer is located at below the adhesive layer of middle part；External base includes upper base copper, tin
Base, lower base copper, graphite linings, tinbase layer are located at below upper base copper, and lower base copper is located at below tinbase layer, graphite linings
Below lower base copper；Lower protective layer includes sealant, insulating layer, bamboo-carbon layer, refractory layer, and insulating layer is located at sealant
Below, bamboo-carbon layer is located at below insulating layer, and refractory layer is located at below bamboo-carbon layer.
Preferably, the middle part adhesive layer is equipped with resin glue.
Preferably, the substrate is equipped with bolt hole.
Preferably, the substrate is equipped with six side nuts.
Preferably, the side of the diversion column is equipped with fan socket.
The positive effect of the utility model is: the utility model further improves big function by a variety of levels
The flintiness of the rate inner-layer thick copper of resistance to electric current circuit board makes the high-power inner-layer thick copper of resistance to electric current electric by upper base copper and lower base copper
Road plate is not easy to be damaged by outside, and the flexibility of substrate is improved by tinbase layer, allows the high-power inner-layer thick copper of resistance to electric current circuit
Plate will not be damaged because of bending and easily, and the high-power inner-layer thick copper of resistance to electric current circuit board can be stored for a long time, do not need through
Often replacement, flowing of the electric current on the high-power inner-layer thick copper of resistance to electric current circuit board become more stable, are safer, it is not easy to go out
Existing electric current accident, is able to bear more powerful work.
Detailed description of the invention
Fig. 1 is the overall construction drawing of the utility model.
Fig. 2 is the structure chart of the substrate of the utility model.
Specific embodiment
The utility model preferred embodiment is provided, with reference to the accompanying drawing the technical solution of the utility model is described in detail.
As shown in Figure 1 to Figure 2, the high-power inner-layer thick copper of the resistance to electric current circuit board of the utility model include substrate 1, diffusing slot 2,
Diversion column 3, conductive through hole 4, power interface 5, radiating copper sheet 6, diffusing slot 2, conductive through hole 4, power interface 5, dissipate diversion column 3
Hot copper sheet 6 is all fixed, and multiple diversion columns 3 are all located at below multiple diffusing slots 2 on substrate 1, and conductive through hole 4 is located at multiple dissipate
The side of chute 2, multiple power interfaces 5 are all located at the other side of conductive through hole 4, and multiple radiating copper sheets 6 are all located at diffusing slot 2
Above, in which: substrate 1 includes external base 7, middle part adhesive layer 8, lower protective layer 9, and middle part adhesive layer 8 is located at external base 7
Below, lower protective layer 9 is located at below middle part adhesive layer 8；External base 7 includes upper base copper 10, tinbase layer 11, lower copper
Base 12, graphite linings 13, tinbase layer 11 are located at below upper base copper 10, and lower base copper 12 is located at below tinbase layer 11, stone
Layer of ink 13 is located at below lower base copper 12；Upper base copper 10, tinbase layer 11, lower base copper 12, can be between each layer of graphite linings
It is bonded together by glue.
Lower protective layer 9 includes sealant 14, insulating layer 15, bamboo-carbon layer 16, refractory layer 17, and insulating layer 15 is located at sealant
Below 14, bamboo-carbon layer 16 is located at below insulating layer 15, and refractory layer 17 is located at below bamboo-carbon layer 16.Sealant 14, insulation
Layer 15, bamboo-carbon layer 16 can be bonded together between each layer of refractory layer 17 by glue.
Middle part adhesive layer 8 is equipped with resin glue 20, bonds external base and lower protective layer is stronger.
Substrate 1 is equipped with bolt hole 18, and the high-power inner-layer thick copper of the resistance to electric current circuit board of installation is more convenient, facilitates positioning.
Substrate 1 is equipped with six side nuts 19, and the fixed high-power inner-layer thick copper of resistance to electric current circuit board is stronger.
The side of diversion column 3 is equipped with fan socket 21, and installation fan further increases the high-power inner-layer thick copper of resistance to electric current electricity
The effect of road plate.
The working principle of the utility model is as follows: diffusing slot, diversion column, conductive through hole, power interface, radiating copper sheet are all solid
It is scheduled on substrate, diffusing slot becomes more quick by flowing of the electric current on substrate, diffusion around becomes to be more easier, and leads
Fluidization tower can further improve the stability that electric current flows on substrate, and conductive through hole can allow the high-power inner-layer thick of resistance to electric current
Copper circuit board facilitates conduction, and flowing of the electric current on the high-power inner-layer thick copper of resistance to electric current circuit board becomes more stable, more pacifies
Entirely, it is not easy to electric current accident occur, be able to bear more powerful work.Power interface can be the high-power inner-layer thick of resistance to electric current
Copper circuit board powers on, and radiating copper sheet allows substrate to possess good heat dissipation effect, allows the high-power inner-layer thick copper of resistance to electric current circuit
Plate can work for a long time.Substrate includes external base, middle part adhesive layer, lower protective layer, and middle part adhesive layer is by naturally setting
Rouge glue is made, and natural resin glue possesses good bonding effect, bonds external base and lower protective layer is stronger；External base
Layer includes upper base copper, tinbase layer, lower base copper, graphite linings, and it is all by sheet copper that upper base copper and lower base copper, which are identical,
It is made, sheet copper possesses better hardness, can be improved the flintiness of substrate, and substrate is not allowed to be damaged easily by outside.Tin
Base is made of metallic tin, and metallic tin possesses good flexibility, is bonded in allow between base copper and lower base copper and mentions
Substrate will not be easily damaged because of bending for the flexibility of high substrate, and graphite linings are made of lime ink, lime mill possess compared with
For good diversion effect, electric current flows more stable on substrate, it is not easy to electric current accident occurs；Lower protective layer includes close
Sealing, insulating layer, bamboo-carbon layer, refractory layer, sealant are made of natural rubber, and natural rubber possesses good sealing effect, energy
Substrate is enough allowed to be not easy by rain penetration, electric current flows on substrate to be also not easy to overflow outward, and insulating layer is by glass fibre system
At glass fibre possesses the point effect of resistance well, and electric current flows on substrate can become more stable, is safer, high-power
The inner-layer thick copper of resistance to electric current circuit board is able to bear more electric currents, is able to use bigger power, it is not easy to there is short circuit accident,
Bamboo-carbon layer is made of moso bamboo, and moso bamboo is not easy by the smell pollution in air, and being applied in external base can allow substrate to place
There will not be silica flour to be made by the smell pollution in air, refractory layer in air, substrate can be allowed by being applied in external base
Possess more good heat-resisting effect, the high-power inner-layer thick copper of resistance to electric current circuit board can work for a long time, in this way by more
Kind level further improves the flintiness of the high-power inner-layer thick copper of resistance to electric current circuit board, passes through upper base copper and lower base copper
It allows the high-power inner-layer thick copper of resistance to electric current circuit board to be not easy to be damaged by outside, the flexibility of substrate is improved by tinbase layer, is allowed
The high-power inner-layer thick copper of resistance to electric current circuit board will not be damaged because of bending and easily, the high-power inner-layer thick copper of resistance to electric current circuit board energy
Enough prolonged storages, do not need often to replace, flowing of the electric current on the high-power inner-layer thick copper of resistance to electric current circuit board becomes more
Add and stablize, is safer, it is not easy to electric current accident occur, be able to bear more powerful work.
Particular embodiments described above, the technical issues of to the solution of the utility model, technical scheme and beneficial effects
It has been further described, it should be understood that the foregoing is merely specific embodiment of the utility model, not
For limiting the utility model, within the spirit and principle of the utility model, any modification for being made, changes equivalent replacement
Into etc., it should be included within the scope of protection of this utility model.
Claims (5)
1. a kind of high-power inner-layer thick copper of resistance to electric current circuit board, which is characterized in that it includes substrate, diffusing slot, diversion column, conduction
Through-hole, power interface, radiating copper sheet, diffusing slot, diversion column, conductive through hole, power interface, radiating copper sheet are all fixed on substrate
On, multiple diversion columns are all located at below multiple diffusing slots, and conductive through hole is located at the side of multiple diffusing slots, multiple power interfaces
Be all located at the other side of conductive through hole, multiple radiating copper sheets are all located at the upper surface of diffusing slot, in which: substrate include external base,
Middle part adhesive layer, lower protective layer, middle part adhesive layer are located at below external base, and lower protective layer is located at middle part adhesive layer
Below；External base includes upper base copper, tinbase layer, lower base copper, graphite linings, and tinbase layer is located at below upper base copper, under
Base copper is located at below tinbase layer, and graphite linings are located at below lower base copper；Lower protective layer include sealant, insulating layer,
Bamboo-carbon layer, refractory layer, insulating layer are located at below sealant, and bamboo-carbon layer is located at below insulating layer, and refractory layer is located at bamboo-carbon layer
Below.
2. the high-power inner-layer thick copper of resistance to electric current circuit board as described in claim 1, which is characterized in that on the middle part adhesive layer
Equipped with resin glue.
3. the high-power inner-layer thick copper of resistance to electric current circuit board as described in claim 1, which is characterized in that the substrate is equipped with spiral shell
Keyhole.
4. the high-power inner-layer thick copper of resistance to electric current circuit board as described in claim 1, which is characterized in that the substrate is equipped with six
Side nut.
5. the high-power inner-layer thick copper of resistance to electric current circuit board as described in claim 1, which is characterized in that the side of the diversion column
Equipped with fan socket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821651567.5U CN209562896U (en) | 2018-10-12 | 2018-10-12 | The high-power inner-layer thick copper of resistance to electric current circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821651567.5U CN209562896U (en) | 2018-10-12 | 2018-10-12 | The high-power inner-layer thick copper of resistance to electric current circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209562896U true CN209562896U (en) | 2019-10-29 |
Family
ID=68297969
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821651567.5U Active CN209562896U (en) | 2018-10-12 | 2018-10-12 | The high-power inner-layer thick copper of resistance to electric current circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209562896U (en) |
-
2018
- 2018-10-12 CN CN201821651567.5U patent/CN209562896U/en active Active
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