CN209330528U - Electronic device - Google Patents
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- Publication number
- CN209330528U CN209330528U CN201821708177.7U CN201821708177U CN209330528U CN 209330528 U CN209330528 U CN 209330528U CN 201821708177 U CN201821708177 U CN 201821708177U CN 209330528 U CN209330528 U CN 209330528U
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- CN
- China
- Prior art keywords
- insulating radiation
- radiation plate
- electronic device
- electronic component
- card slot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of electronic devices, comprising: connecting plate (1)；Electronic component (2) is connected on the connecting plate (1), and has radiating part (21) on the surface thereof；And insulating radiation plate (3), the insulating radiation plate (3) and the radiating part (21) of the electronic component (2) are bonded on it by conducting adhesive material.The equipment heat dispersion performance is good, then improves its working performance, and is able to extend its service life.
Description
Technical field
The utility model relates to a kind of appliance field more particularly to a kind of electronic devices.
Background technique
Its electronic component can generate heat to electronic device during the work time, and in the prior art, electronic device construction is not
Rationally, heat dissipation effect is poor, with the accumulation of heat, will affect the service performance of electronic device, while can also shorten it and make
Use the service life.
Summary of the invention
The utility model aims to solve the problem that one of the above-mentioned problems of the prior art, provides a kind of electronic device, this sets
Standby structurally reasonable, perfect heat-dissipating, then improves its working performance, and be able to extend its service life.
To achieve the goals above, the utility model provides a kind of electronic device, comprising: connecting plate；Electronic component connects
It is connected on the connecting plate, and there is radiating part on the surface thereof；And insulating radiation plate, the insulating radiation plate and the electricity
The radiating part of subcomponent is bonded on it by conducting adhesive material.
In the technical scheme, electronic component is attached by using insulating radiation plate, facilitates electronic component
Heat dissipation, reduces the temperature of electronic device.Improve its working performance；By using conducting adhesive material can be improved electronic component with
Speed is connected in heat between insulating radiation plate, then further increases the heat dissipation of electronic component；And setting insulating radiation plate can
To improve the service life of electronic device.
In addition, electronic device according to the present utility model, can also have following technical characteristic:
Further, the insulating radiation plate is ceramic wafer, and which is provided with connection card slot, the radiating part and the company
Card slot is connect to match.
Further, the insulating radiation plate is resin plate, and which is provided with connection card slot, the radiating part and the company
Card slot is connect to match.
Preferably, the upper end edge of the insulating radiation plate is equipped with maintaining part.
Preferably, the maintaining part extends to the electronic component side, and its lower ora terminalis is suitable for supporting only in the electronics member
On part.
Preferably, the insulating radiation plate also on be additionally provided with heat radiating fin.
Further, the heat radiating fin is located at the end face being away from each other with the connection card slot.
Preferably, the heat radiating fin is multiple, along the short transverse arranged for interval of the insulating radiation plate.
Further, the insulating radiation plate is equipped with ventilation hole.
Electronic device according to the present utility model, additional technical feature also has the following technical effect that be protected by setting
The portion of holding can play the role of limit to electronic component, improve its reliability；Its radiating surface is capable of increasing by the way that heat radiating fin is arranged
Product is to further increase the heat sinking function of insulating radiation plate.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of electronic device；
Fig. 2 is the structural schematic diagram of insulating radiation plate in Fig. 1；
Fig. 3 is the structural schematic diagram of electronic component in Fig. 1；
Fig. 4 is the structural schematic diagram of the insulating radiation plate with maintaining part.
Fig. 5 is the structural schematic diagram of the insulating radiation plate with heat radiating fin.
In figure: connecting plate 1；Electronic component 2；Radiating part 21；Insulating radiation plate 3；Connect card slot 31；Maintaining part 32；It is horizontal
Portion 321；Lower edge portion 322；Heat radiating fin 33；Converter 4.
Specific embodiment
1 to Fig. 5 the utility model is described in further detail with reference to the accompanying drawing.
A kind of electronic device according to the present utility model, as shown in fig. 1~fig. 5, comprising: connecting plate 1,2 and of electronic component
Insulating radiation plate 3.
Connecting plate 1；Brace foundation of the connecting plate 1 as electronic device can be used for supporting connecting electronic component 2, for example,
Diode, converter 4 etc..
Electronic component 2 is connected on the connecting plate 1, and has radiating part 21 on the surface thereof；And
The radiating part 21 of insulating radiation plate 3, the insulating radiation plate 3 and the electronic component 2 passes through conducting adhesive material
Bonding is on it；Specifically, multiple electronic components 2 are intervally installed on connecting plate 1, and insulating radiation plate 3 can increase electricity
The heat dissipation area of subcomponent 2, radiating part 21 is connected with insulating radiation plate 3 can dissipate the heat transfer of electronic component 2 to insulation
Hot plate 3, then distributed the heat of electronic component 2 by insulating radiation plate 3, it should be pointed out that conducting adhesive material can be with
For the adhesive glue containing alloy tin or alloy indium etc., heat between electronic component 2 and insulating radiation plate 3 can be improved in this way and be connected
Speed.
It is understood that electronic component 2 is attached by using insulating radiation plate 3, facilitate electronic component 2
Heat dissipation, reduces the temperature of electronic device.Improve its working performance；Electronic component 2 can be improved by using conducting adhesive material
Speed is connected in heat between insulating radiation plate 3, then further increases the heat dissipation of electronic component 2；And setting insulating radiation
The service life of electronic device can be improved in plate 3.
In one embodiment of the utility model, the insulating radiation plate 3 is ceramic wafer, and which is provided with connection card slot
31, the radiating part 21 is matched with the connection card slot 31, that is to say, that connection card slot 31 and electronic component on ceramic wafer
2 21 shape of radiating part is consistent, is conducive to the height cooperation between electronic component 2 and ceramic wafer in this way, improves installation accuracy；
More specifically, it connects card slot 31 and radiating part 21 is T font structure.
In another embodiment of the utility model, the insulating radiation plate 3 is resin plate, and which is provided with connection card
Slot 31, the radiating part 21 are matched with the connection card slot 31, that is to say, that connection card slot 31 and electronics member on resin plate
21 shape of radiating part of part 2 is consistent, is conducive to the height cooperation between electronic component 2 and ceramic wafer in this way, improves installation essence
Degree；More specifically, it connects card slot 31 and radiating part 21 is T font structure.
As shown in figure 4, the upper end edge of the insulating radiation plate 3 is equipped with maintaining part 32.Specifically, the maintaining part 32 is to institute
The extension of 2 side of electronic component is stated, and its lower ora terminalis is suitable for supporting only on the electronic component 2；More specifically, maintaining part 32 includes
Horizontal part 321 and molding in conjunction and the lower edge portion 322 extended downwardly, the 321 insulating radiation plate of horizontal part 3 are horizontal even
It connects, lower edge portion 322 can support only on the upper end of electronic component 2, can play limit to electronic component 2 by the way that maintaining part 32 is arranged
The effect of position, improves its reliability；
As shown in figure 5, the insulating radiation plate 3 also on be additionally provided with heat radiating fin 33, further, the heat radiating fin 33 is located at
With the end face that is away from each other of connection card slot 31, the heat radiating fin 33 be it is multiple, along the height side of the insulating radiation plate 3
To arranged for interval, its heat dissipation area is capable of increasing to further increase the heat dissipation of insulating radiation plate 3 by the way that heat radiating fin 33 is arranged
Function.
Further, the insulating radiation plate 3 is equipped with ventilation hole, can be further improved insulation by the way that ventilation hole is arranged
The heat dissipation effect of heat sink 3.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are in the scope of the utility model
Inside it can make changes, modifications, alterations, and variations to the above described embodiments.
Claims (9)
1. a kind of electronic device characterized by comprising
Connecting plate (1)；
Electronic component (2) is connected on the connecting plate (1), and has radiating part (21) on the surface thereof；And
Insulating radiation plate (3), the insulating radiation plate (3) and the radiating part (21) of the electronic component (2) pass through conducting adhesive
Material bonds on it.
2. electronic device according to claim 1, which is characterized in that the insulating radiation plate (3) is ceramic wafer, and thereon
Equipped with connection card slot (31), the radiating part (21) matches with the connection card slot (31).
3. electronic device according to claim 1, which is characterized in that the insulating radiation plate (3) is resin plate, and thereon
Equipped with connection card slot (31), the radiating part (21) matches with the connection card slot (31).
4. electronic device according to claim 1, which is characterized in that the upper end edge of the insulating radiation plate (3), which is equipped with, to be protected
Hold portion (32).
5. electronic device according to claim 4, which is characterized in that maintaining part (32) the Xiang Suoshu electronic component (2)
Side extends, and its lower ora terminalis is suitable for supporting only on the electronic component (2).
6. electronic device according to claim 3, which is characterized in that the insulating radiation plate (3) also on be additionally provided with heat dissipation
Fin (33).
7. electronic device according to claim 6, which is characterized in that the heat radiating fin (33) is located at and the connection card slot
(31) end face being away from each other.
8. electronic device according to claim 7, which is characterized in that the heat radiating fin (33) be it is multiple, along described
The short transverse arranged for interval of insulating radiation plate (3).
9. electronic device according to claim 1, which is characterized in that the insulating radiation plate (3) is equipped with ventilation hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821708177.7U CN209330528U (en) | 2018-10-19 | 2018-10-19 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821708177.7U CN209330528U (en) | 2018-10-19 | 2018-10-19 | Electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209330528U true CN209330528U (en) | 2019-08-30 |
Family
ID=67706664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821708177.7U Active CN209330528U (en) | 2018-10-19 | 2018-10-19 | Electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209330528U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109152309A (en) * | 2018-10-19 | 2019-01-04 | 徐州携创智能科技有限公司 | A kind of electronic device |
-
2018
- 2018-10-19 CN CN201821708177.7U patent/CN209330528U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109152309A (en) * | 2018-10-19 | 2019-01-04 | 徐州携创智能科技有限公司 | A kind of electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211215 Address after: No. 201, 283, north section of Shixin Road, Kengtou village, Nancun Town, Panyu District, Guangzhou, Guangdong 510000 Patentee after: GUANGZHOU XIECHUANG CULTURE MEDIA TECHNOLOGY CO.,LTD. Address before: 221000 standard workshop No.10, high tech Industrial Park, Fengxian Economic Development Zone, Xuzhou City, Jiangsu Province Patentee before: XUZHOU XIECHUANG INTELLIGENT TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |