CN209544338U - A kind of encapsulating carrier plate and packaging body - Google Patents
A kind of encapsulating carrier plate and packaging body Download PDFInfo
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- CN209544338U CN209544338U CN201920594781.XU CN201920594781U CN209544338U CN 209544338 U CN209544338 U CN 209544338U CN 201920594781 U CN201920594781 U CN 201920594781U CN 209544338 U CN209544338 U CN 209544338U
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- metal electrode
- packaging body
- carrying tablet
- carrier plate
- chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
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Abstract
A kind of encapsulating carrier plate, for carry include chip packaging body；Including carrying tablet and the medium thinner than carrying tablet；For at least one side of the carrying tablet, part of it region belongs to areas of dielectric accompanying by the medium, rest part region then includes at least first area and second area, and: the first area belongs to is connected with region accompanying by the first metal electrode of the chip thereon, second area then belongs to is connected with second area accompanying by the second metal electrode of false piece thereon, the thickness of the vacation piece and the consistency of thickness of the chip；There is interval between the first area and second area；The vacation piece selects weldability metallic conductor；The carrying tablet can be removed relative to the packaging body and be recycled and reused for the encapsulating carrier plate.The disclosure realize it is a kind of it is simpler, utmostly avoid routing, more environmentally friendly, more inexpensive encapsulating carrier plate.Also disclose a kind of packaging body.
Description
Technical field
The disclosure belongs to electronic field, is specifically related to a kind of encapsulating carrier plate and packaging body.
Background technique
IC industry is the basic and advanced sector of informationized society, wherein the encapsulation of various integrated circuits
And test is the important ring in entire industrial chain.With regard to encapsulation technology, the encapsulating carrier plate of mainstream mostly uses HDI technology road
Line, core is the formation of micropore conducting and fine rule road, however the equipment of the technology path and technical threshold are high, and investment is big,
Dedicated support plate substrate need to be matched, and dimensional thickness is by material specification restriction.
How to design a kind of simpler, more environmentally friendly, more inexpensive encapsulating carrier plate and its process matched therewith, be encapsulation industry urgently
The technical issues of must solving.
Utility model content
In view of the deficiencies of the prior art, the disclosure discloses a kind of encapsulating carrier plate, it is characterised in that:
The encapsulating carrier plate be used for carry include chip packaging body；
The encapsulating carrier plate includes: carrying tablet and the medium thinner than carrying tablet；
The medium includes following any: release film, transition coating or other can form weak knot with packaging body or carrying tablet
The medium of resultant force；
For at least one side of the carrying tablet, part of it region belongs to areas of dielectric accompanying by the medium,
Remaining part subregion then includes at least first area and second area, and: the first area belongs to is connected with the chip thereon
The first metal electrode accompanying by region, second area, which then belongs to, to be connected with thereon accompanying by the second metal electrode of false piece
Second area, the thickness of the vacation piece and the consistency of thickness of the chip；Between existing between the first area and second area
Every；The vacation piece selects weldability metallic conductor；
The carrying tablet can be removed relative to the packaging body and be recycled and reused for the encapsulating carrier plate.
The disclosure further discloses a kind of packaging body, comprising:
Packaging body bottom surface, packaging body top surface, the first metal electrode in packaging body, the second metal electrode in packaging body,
Chip in packaging body, the false piece in packaging body, wherein
There is interval between first metal electrode and the second metal electrode；And relative to the packaging body top surface, institute
State the first metal electrode, the second metal electrode close to the packaging body bottom surface side；
The upper surface of first metal electrode is connected with the chip, and the upper surface of second metal electrode is connected with
The vacation piece；And relative to first metal electrode, the second metal electrode, chip and false piece in the packaging body closer to
The top surface of the packaging body；The consistency of thickness of first metal electrode and the second metal electrode, and the thickness of the false piece with
The consistency of thickness of the chip；
First metal electrode, chip, with: there is the relationship that electrically conducts in false piece, second metal electrode；
Relative to the upper surface of first metal electrode, the upper surface of the second metal electrode, first metal electrode
Lower surface, the second metal electrode lower surface closer to the bottom surface of the packaging body；
At the position in the package bottom resin face of first metal electrode, corresponding first metal electrode
Outer diameter differs within 20um with the outer diameter of the lower surface of first metal electrode；
At the position in the package bottom resin face of second metal electrode, corresponding second metal electrode
Outer diameter differs within 20um with the outer diameter of the lower surface of second metal electrode.
Through the above technical solutions, the disclosure realizes a kind of novel encapsulated support plate and packaging body, structure is simple, has
Strippable feature and be conducive to utmostly avoid routing, and can be improved production efficiency, reduce cost, is more environmentally-friendly.
Detailed description of the invention
Fig. 1-1 is the structural schematic diagram of an embodiment of the present disclosure；
Fig. 1-2 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 1-3 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 2 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 3 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 4-1 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 4-2 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 4-3 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 5-1 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 5-2 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 5-3 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 6-1 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 6-2 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 6-3 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 7-1 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 7-2 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 8-1 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 8-2 is the structural schematic diagram of another embodiment of the disclosure；
Fig. 9 is the structural schematic diagram of another embodiment of the disclosure；
Figure 10-1 to Figure 10-9 is the schematic diagram of another embodiment of the disclosure.
Specific embodiment
It is hereafter the more specific detail of disclosure preferred embodiment shown in attached drawing 1-1 to attached drawing 10-9, passes through this
A little explanations, the feature and advantage of the disclosure will be evident.
Referring to Fig. 1-1, in one embodiment, there is disclosed a kind of encapsulating carrier plates:
The encapsulating carrier plate be used for carry include chip packaging body；
The encapsulating carrier plate includes: carrying tablet and the medium thinner than carrying tablet；
The medium includes following any: release film, transition coating or other can form weak knot with packaging body or carrying tablet
The medium of resultant force；
For at least one side of the carrying tablet, part of it region belongs to areas of dielectric accompanying by the medium,
Remaining part subregion then includes at least first area and second area, and: the first area belongs to is connected with the chip thereon
The first metal electrode accompanying by region, second area, which then belongs to, to be connected with thereon accompanying by the second metal electrode of false piece
Second area, the thickness of the vacation piece and the consistency of thickness of the chip；Between existing between the first area and second area
Every；The vacation piece selects weldability metallic conductor；
The carrying tablet can be removed relative to the packaging body and be recycled and reused for the encapsulating carrier plate.
For the medium comprising following any: release film, transition coating or other can be with packaging body or carrying
The medium of piece formation weak binding power.Wherein, Fig. 1-2, Fig. 1-3 respectively illustrate the different situations of the medium.
For the technical solution of above-described embodiment, since the medium is thinner than carrying tablet, attachment of medium, metal electrode
Attachment, when the medium includes following any: release film, transition coating or other can be formed with packaging body or carrying tablet it is weak
When the medium of binding force, so that having strippable design feature between carrying tablet and packaging body, this is further such that above-mentioned envelope
Loading plate has that structure is simple, improves packaging efficiency, reduces cost, more environmentally-friendly technical effect.Further, due to holding
Slide glass can be repeated for encapsulating carrier plate, and this can enable carrying tablets is utilized repeatedly until physically or electrically the indexs such as gas performance are not or not it
Meet encapsulation again to require, so the overall cost of the technical solution is substantially reduced.
It is understood that one side is thinner than carrying tablet for the medium, on the other hand, and packaging body or hold
Weak binding power is needed to form between slide glass, is removed with being conducive to carrying tablet relative to packaging body, specific example is as follows:
(1) when carrying tablet is removed relative to packaging body, if medium, which belongs to, to form weak binding power with packaging body
That, then, medium will be the situation of above-mentioned release film with the separated state of packaging body, such as medium with carrying tablet: from
Type film class medium in conjunction with carrying tablet and solidifies in liquid, and the release film after solidification is pasted with other materials (such as packaging body) again
Binding force when conjunction belongs to the scope of weak binding power, and in comparison, release film and carrying tablet after solidification but have stronger knot
With joint efforts, therefore, after carrying tablet is removed with respect to packaging body, release film can still be under the jurisdiction of carrying tablet, release film and carrying tablet
It can still be attached together.Release film may include various types of release film.
(2) when carrying tablet is removed relative to packaging body, if medium, which belongs to, to form weak binding power with carrying tablet
That, then, medium will be the situation of above-mentioned transition coating with the separated state of carrying tablet, such as medium with packaging body:
Therefore the scope that the characteristics of due to plating process itself, carrying tablet and transition binding force of cladding material belong to weak binding power works as carrying tablet
After opposite packaging body removing, transition coating can still be under the jurisdiction of packaging body, and transition coating can be still attached to packaging body
Together, transition coating then with the separated state of carrying tablet.Transition coating can then pass through the shapes such as gold-plated, silver-plated, nickel plating, copper facing
At, it is preferred that transition coating selects copper facing to be formed.
(3) naturally, when the medium is thinner than carrying tablet, and the medium belong to other can be with packaging body or carrying tablet
When forming the medium of weak binding power, then, medium at this time is equally beneficial for carrying tablet and removes or remove relative to packaging body
Medium can be still attached together with packaging body after medium still can be attached together or remove with carrying tablet afterwards.
It is understood that carrying tablet is that bottom, areas of dielectric and the first, second region are respectively positioned in the one side of carrying tablet, it is theoretical
From, it may be used to carry packaging body above areas of dielectric and the first, second region.When carrying tablet is relative to the envelope
When filling body removing, carrying tablet shown in described Fig. 1-1 to Fig. 1-3 can be a side of actively removing, and the packaging body can also
To be a side of actively removing.Packaging body then includes the different packing forms of various integrated circuits.As for areas of dielectric, first,
Second area is then the formation in order to be conducive to electrode corresponding region and non-electrode corresponding region in potting process.
For above-described embodiment, prior feature is then: for the encapsulating carrier plate, when it is used for institute
It states when including the packaging body of chip, even if only one chip on first metal electrode, at this time since the encapsulation carries
Plate can be used for the situation of chip and false piece almost same thickness, this means that: in packaging technology, beating without single chip
Line, the encapsulating carrier plate can be in response to the balances of single chip and false piece.
That is, being not necessarily to do routing process compared with traditional handicraft, or even in encapsulation process using above-mentioned encapsulating carrier plate
In be not necessarily to multiple potting resin and figure transfer process, this obviously enables to packaging technology simpler, more efficient, in addition
The carrying tablet can also be reused, it means that the encapsulating carrier plate facilitate further such that packaging technology it is more environmentally friendly and
Cost is lower.
In another embodiment, the height of each metal electrode, medium thickness can be according to the requirement specifically encapsulated
And it is designed.In addition, the height of each metal electrode can be slightly above/be slightly below the thickness of medium according to different designs,
It can also be apparently higher than/be lower than the thickness of medium, can also be flushed.
In another embodiment, the first, second metal electrode may include a variety of electrode forms.
In another embodiment, if it is electric using the one side that the first, second metal electrode is contacted with carrying tablet as metal
The bottom surface of pole, then for metal electrode, the another side of the metal electrode opposite with metal electrode bottom surface, i.e. metal electrode
Surface further surface treatment can be then needed according to encapsulation, such as: gold-plated, silver-plated, tin plating, roughening, at anti-oxidation, passivation
Reason, protective mulch etc..It is furthermore preferred that the surface of metal electrode can carry out the operation such as die bond, bonding wire, welding and plastic packaging.This
After a little surface treatments are implemented, as described in foregoing first embodiment, wherein the chip is connected on the first metal electrode, wherein
The false piece is connected on second metal electrode.
In another embodiment,
First, second metal electrode is by carrying out plating realization on the carrying tablet.
Although above-described embodiment forms electrode by the way of plating, not indicating that can only be by the way of plating, this
Depending on whether there is other modes that can form electrode, such as growth electrode or spraying electricity on carrying tablet in technology development process
Pole.
It is understood that there are a kind of situations: when using release film as medium, if release film covers carrying tablet in advance
All areas expose carrying tablet then the release film for needing plating area can be removed first, plating forms gold on carrying tablet
Belong to electrode.Naturally, although the thickness of dielectric layer is but to meet the insulating properties of plating depending on the thickness of required coating
Energy；Assuming that the coating that metal electrode needs is thicker, one layer of dry film or wet film class are covered again on release film then can choose
Can photosensitive material, exposure development mode, which is exposed, needs the region that is electroplated, then carries out on the region of the exposing on carrying tablet
Plating is to form metal electrode.Similar, there is also a kind of situations: when the use of transition coating being medium, if transition coating
The all areas of carrying tablet are covered in advance, then can be electroplated to form metal electrode in the following way: being first electroplated corresponding
Covered on the transition coating in region one layer of dry film class can photosensitive material, exposure development, then transition coating, dew are removed with etching mode
Then correspondence plating area on carrying tablet out carries out plating on carrying tablet to form metal electricity on the region of the exposing
Pole.
Referring to fig. 2, in another embodiment,
Insulating layer is attached in the areas of dielectric.It is understood that insulating layer is packaging technology common in encapsulation process
It is required, but and not all packaging technology require.Similar to above, the present embodiment is intended to emphasize: needing the scene of insulating layer
Under, after the carrying tablet is removed relative to the packaging body, the insulating layer is under the jurisdiction of the packaging body.
It is furthermore preferred that at least part of insulating layer is attached on the first and/or second metal electrode.Obviously, when having
When insulating layer, the encapsulating carrier plate can realize Multi-layer design, and more specific example is detailed in hereinafter.In view of above for other implementations
The description of example, it is to be understood that the aforementioned encapsulating carrier plate for having peel property can be used for the multilayer technology of packaging body by the disclosure,
And carrying tablet is still made to have the characteristic for facilitating removing.
In another embodiment,
After the carrying tablet is removed relative to the packaging body, first, second metal electrode is under the jurisdiction of the envelope
Fill body.
For the embodiment, it means that, encapsulating carrier plate described in the present embodiment is taken, after removing being made, gold
Belong to electrode be with packaging body still it is integrated, i.e., metal electrode still can connect, be under the jurisdiction of packaging body.This illustrates this just
Another of embodiment is subsidiary the utility model has the advantages that strippable carrying tablet can be improved packaging efficiency and reduce cost.
In another embodiment,
It include the first attachment at least one metal electrode in first, second metal electrode, when the carrying
After piece is removed relative to the packaging body, first attachment is under the jurisdiction of the packaging body.
It is understood that the first attachment on metal electrode can be in the packaging technology of integrated circuit, all are reasonable,
The various attachments such as the attachment on metal electrode, including glue, film, insulating layer, bonding wire, IC may.As previous embodiment,
The present embodiment is intended to emphasize: after carrying tablet removing, related attachment still can connect, be under the jurisdiction of packaging body.
In another embodiment, the carrying tablet is band-like.It is understood that the shape of carrying tablet can be any convenience
It is band-like to be conducive to pipelining for the shape of production.
Preferably, in another embodiment, the length of the carrying tablet is to for closed loop mode.It is understood that carrying tablet one
As be rectangle, transversely stretch, and carrying tablet has two sides of length and width, it is long to where referring to long side.When carrying tablet
It is long to for closed loop mode when, this is conducive to continual production, so that the efficiency of subsequent encapsulation be greatly improved.
In another embodiment,
The carrying tablet includes following any: the lower stainless steel of thermal expansion coefficient or thermal expansion coefficient and plastic packaging resin
Other matched metals.
It is understood that the present embodiment is to carry out type selecting to carrying tablet.For the embodiment, by thermal expansion coefficient come
The type selecting for carrying out carrying tablet, is to overcome and thermally expand possible negative effect in packaging technology.It should be noted that root
According to each embodiment is for disclosure base case and its rationale above, with the continuous development of science and technology, the disclosure is simultaneously
Nonmetallic materials are not excluded for as carrying tablet.
In another embodiment, after the carrying tablet is removed relative to the packaging body, the insulating layer is under the jurisdiction of
The packaging body.Such for the embodiment, the present embodiment is intended to emphasize: after carrying tablet removing, insulating layer still be can connect,
It is under the jurisdiction of packaging body.It means that the revealed encapsulating carrier plate of the disclosure can be used for: the encapsulation of the packaging body containing insulating layer
Technique.
It is furthermore preferred that including the second attachment on the insulating layer, when the carrying tablet is removed relative to the packaging body
Afterwards, second attachment is under the jurisdiction of the packaging body.It is understood that the second attachment on insulating layer can be integrated circuit
Packaging technology in, the various attachments such as all attachments, including glue, film, electrode, bonding wire, IC reasonable, on insulating layer can
Energy.As embodiment above, the present embodiment is intended to emphasize: after carrying tablet removing, related attachment still can connect, be subordinate to
In packaging body.
Referring to Fig. 3, in another embodiment, electrocondution slurry can be further adhered on insulating layer, to meet certain envelopes
Fill the needs of technique.
It is furthermore preferred that electrocondution slurry can be electrodepositable electrocondution slurry.
Referring to fig. 4-1, in another embodiment, in the packaging technology of not insulating layer, adhesion metal on carrying tablet
Electrode, release film, and adhere to glue successively on metal electrode, release film (corresponding areas of dielectric and second area) and in glue
On further adhere to substrate.
- 2, Fig. 4-3 referring to fig. 4, respectively illustrate, also attached on insulating layer in the packaging technology with insulating layer
In the case of electrocondution slurry and the preferred electrodepositable electrocondution slurry of electrocondution slurry: it is adhesion metal electrode on carrying tablet, release
Film, and adhere to insulating layer, electrodepositable conductive paste successively on metal electrode, release film (corresponding areas of dielectric and second area)
Material and further adheres to substrate at glue on glue.
It can be found that electrocondution slurry or electrodepositable electrocondution slurry not only cover insulation in the situation shown in Fig. 4-2, Fig. 4-3
Layer, and can be bridged between metal electrode and metal electrode.Might as well by metal electrode at shown in Fig. 4-2 three from
Left-to-right is respectively designated as the first metal electrode, the second metal electrode, third metal electrode, it is clear that electrocondution slurry is in the first gold medal
Belong to and being bridged between electrode and third metal electrode.
Just the two embodiments that the text of Fig. 4-2, Fig. 4-3 and its attached drawing is illustrated herein, it should be understood that insulation
Layer can be used for being electrically insulated isolation, and the electrocondution slurry on insulating layer is then realized due to the bridging between different metal electrodes
Across the electric connection at insulating layer both ends.At this point, encapsulating carrier plate is clearly advantageous to realize the encapsulation of Double-side line.
It in another embodiment, can be further on electrocondution slurry and metal electrode in order to meet certain encapsulation needs
Carry out graphic plating, i.e., the surface of the graphical electrocondution slurry and metal electrode.It is understood that the resulting metal of graphic plating
Layer can be according to encapsulation needs, and (i.e. the part that contacts with carrying tablet of metal electrode, it is electric to can be described as bottom with the bottom of metal electrode
Pole), or need to be electrically connected with the electrode that other needs are connected to according to encapsulation.Preferably, in a further embodiment, may be used also
Encapsulate needs with further view and carry out to the related surface after graphical: metal thickeies, is surface-treated, etches etc..
For above-described embodiment, further graphic plating can improve conductance property and the surface spy in bridging area
Property, it reduces resistivity, improve conducting surface, this is particularly important when especially kelvin effect is obvious under frequency applications environment.
In another embodiment,
It include third attachment on the release film, after the carrying tablet is removed relative to the packaging body, described the
Three attachments are under the jurisdiction of the packaging body.It is understood that the third attachment on release film can be the encapsulation work of integrated circuit
Attachment, including light-sensitive surface, dry film, insulating film, glue, electrode, bonding wire, IC of all in skill reasonably, on release film etc. is various
Attachment may.As embodiment above, the present embodiment is intended to emphasize: after carrying tablet removing, related attachment still can connect
It connects, be under the jurisdiction of packaging body.
It in another embodiment, can when on the release film including light-sensitive surface or the various types of films such as dry film or insulating film
To be further processed by exposure, development or laser burn to the above various types of films on release film, so that: one of carrying tablet
Subregion belongs to the areas of dielectric of the release film attachment, and at least another part region of the carrying tablet belongs to first, second
The region of metal electrode attachment.
Further, in another embodiment, the above various types of films on the release film can further be located as follows
Reason:
Fade away light-sensitive surface, dry film or insulating film first；
Secondly, being covered with insulating coating on release film；
Again, metalized obtains the metal layer on release film on the insulating coating；
Again, so that the metal layer on the release film is connected to hearth electrode, wherein the hearth electrode refer to metal electrode with
The part of carrying tablet contact；
Again, the metal layer on the graphical release film, and the metal of the metal layer on the release film is thickeied, table
Surface treatment and etching；
Again, the packaging technologies such as die bond, bonding wire, welding and plastic packaging are carried out on the metal layer on the release film.
It is understood that above-described embodiment is the further disposition of the release film on encapsulating carrier plate described in the disclosure
Example.
In another embodiment, it is dry film (such as on release film that Fig. 5-1, which illustrates the third attachment on release film,
Paste dry film), it forms metal electrode figure and metal electrode belongs to the situation of conventional electrodes, and illustrate the feelings of 3 metal electrodes
Shape.It is understood that the thickness of dry film is associated with the thickness of metal electrode.
In another embodiment, Fig. 5-2 illustrates to make each metal electrode in graphics field, and in electroplating surface
The situation of solderability metal.
In another embodiment, Fig. 5-3 illustrates to make electrode is isolated to be formed to dispose the dry film of surrounding them
The situation of " T " shape.It is understood that the electrode of T-shaped is allowed to stronger convenient for insertion potting resin glue in subsequent process.
Above more schematic diagrames and embodiment are described in detail when medium is release film, and encapsulating carrier plate described in the disclosure is such as
What is used for this field related application scene.When wherein carrying tablet is removed, release film often follows carrying tablet.
Illustrate below by other embodiments and schematic diagram, when medium is transition coating, encapsulating carrier plate described in the disclosure
How related application scene in this field is used for.When wherein carrying tablet is removed, transition coating often follows packaging body.
In another embodiment, Fig. 6-1 illustrates that the attachment on transition coating is dry film and metal electrode belongs to often
The situation of electrode is advised, and illustrates the situation of 3 metal electrodes.
In another embodiment, Fig. 6-2 illustrates that the attachment on transition coating is resin and metal electrode belongs to often
The situation of electrode is advised, and illustrates the situation of 3 metal electrodes.It compares, in another embodiment, Fig. 6-3 is illustrated
The situation of special-shaped electrode, such as T shape electrode, and illustrate the situation of 3 metal electrodes.
In another embodiment, the situation after Fig. 7-1 carrying tablet removings illustrated in Fig. 6-3；Fig. 7-2 into one
Step illustrates the situation after the removal of transition coating in another embodiment.
In addition, can also first remove carrying tablet and its release film, also together for the related embodiment of release film described previously
Sample can first complete encapsulation and remove carrying tablet and its release film again.This is advantageous the division of labor of industry, it means that can be with
Offer packaging body, can also be directly to delivery to customer together with encapsulating carrier plate and envelope to client after removing carrying tablet by supply chain manufacturer
The product mix of dress body removes carrying tablet to client and by client.
For above-mentioned multiple embodiments, under existing process capability (being primarily referred to as line width line-spacing), even if two layers different
Attachment, if different interelectrode electric connection relationships can not still be realized, then it is contemplated that again plus layer attachment
Object is to realize different interelectrode electric connections.That is, theoretically, each attachment described previously can be two layers to N
Layer, wherein N is positive integer.In this way, the encapsulating carrier plate of the disclosure can be used for the LED encapsulating carrier plate of RGB, class BGA can be used for
IC package support plate etc..In addition, it is necessary to explanation, as previously mentioned, insulating layer can be used to implement Multi-layer design, if
It is reasonably designed, the bottom and top of insulating layer can design electrode layer, and each electrode layer can be realized by plating.
That is, insulating layer described in the disclosure, every kind of attachment can have multilayered structure, may be incorporated for realizing different electricity
The electric connection of interpolar.Similar, the attachment on each metal electrode also can have multilayered structure, further, metal
Electrode and insulating layer can overlap, be spaced and form multilayered structure, such as a layer insulating, have one layer of metal electrode above, gold
Belong to another layer insulating above electrode, or: one layer of metal electrode, a layer insulating above, the another layer gold of insulating layer
Belong to electrode etc..
It should be noted that for each embodiment described previously, when carrying tablet relative to metal electrode or insulating layer or
When attachment or certain specific packaging body are removed, can using with sticking transfer by the metal electrode or insulation
Layer or attachment or certain specific packaging body are transferred in the transfer and realize, exemplary, can be real in the following way
It is now bonded and shifts: (1) using the enough pressure sensitive adhesives of viscosity；(2) the enough UV visbreaking glue of viscosity is used, UV is irradiated after the completion of transfer
Light reduces the viscosity of UV glue；(3) bonding transfer is heated with hot melt adhesive, after the completion of transfer, when room temperature, hot melt adhesive is not glued；(4)
Switch through shifting with heat curing type melt viscosity, after the completion of transfer, heating cure hot melt adhesive.
Including all embodiments above, the disclosure can effectively control the thickness such as each electrode layer, thus compared to existing
Metal, especially frequency applications scene needed for thering is technology to greatly save plating.In addition, the carrying tablet of the disclosure do not need it is thicker
Layers of copper support, also save significantly on metal.More particularly, the encapsulating carrier plate of the disclosure enables to: single in packaging technology
Chips are not necessarily to routing, are not necessarily to do routing process compared with traditional handicraft, or even be not necessarily to multiple potting resin and figure in encapsulation process
Shape shifting process, this obviously enables to packaging technology simpler, more efficient, and the carrying tablet can also repeat to make in addition
With, it means that the encapsulating carrier plate facilitates further such that packaging technology is more environmentally friendly and cost is lower.
As shown in Fig. 8-1, in another embodiment, since the encapsulating carrier plate is adapted to chip and false piece is almost same
The situation of thickness, although on the first metal electrode being chip, the difference in height of the first, second surface of metal electrode passes through institute
False piece is stated to be balanced.So, the encapsulating carrier plate is in packaging technology, all chips and interelectrode on full wafer encapsulating carrier plate
Bonding pattern can use brazing mode, i.e. related metal electrode on chip hearth electrode and support plate passes through soldering connection, core
The connection between related metal electrode between piece table electrode and on chip list electrode and support plate by welding conductive sheet (such as: it is described
Conductive sheet selection weldering metallic conductor, as shown in 09 in Fig. 8-1) mode connects, and referring to Fig. 8-1, chip after welding can be through
Packaging body is formed by disposable potting resin technique (for example, by using plastic packaging resin glue 10), can clearly be understood from figure described
Encapsulating carrier plate and the packaging body, wherein can be coated with by plating mode on the first metal electrode and the second metal electrode can
Weldering property metal 05 (such as tin or silver etc.) further by solder 08 and can contain metallic conductor 09 as false piece 07 and chip 06
Weld together.As previously mentioned, the encapsulating carrier plate can be removed easily with the packaging body.
Can further it be welded together by solder 08 with containing metallic conductor 09 except through above-mentioned false piece 07 and chip 06
It realizes except electrical functionality, first area, second area can also realize electrical functionality such as under type, for example, two regions are logical
It crosses:
One layer of resin of plastic packaging, directly to piece false on the resin and the second metal electrode on chip position position
Resin carries out laser drill, plating metal and pattern transfer, electrically conducts.
In another embodiment, Fig. 8-2 packaging bodies illustrated after situation, removing shown in Fig. 8-1, further each
A metal electrode bottom plates the situation of solderable metal 11.
For the embodiment, after encapsulating carrier plate removing, further plated in each metal electrode bottom solderable
Metal is connect, this carries out welding assembly convenient for single packaging body.Meanwhile carrying tablet (the release film for the encapsulating carrier plate being lifted off of
Can be still attached to above) the encapsulation process of a new round can be carried out again, this makes entire encapsulating carrier plate in packaging technology
In can recycle be made and be recycled so that packaging technology is more environmentally friendly and cost is lower.
In another embodiment, Fig. 9 then illustrate the encapsulating carrier plate two sides can operation situation.That is,
Compared to one embodiment:
For the another side of the carrying tablet, part of it region similarly belongs to accompanying by the medium or second medium
Second medium region, rest part region then includes at least third region and the fourth region, and: the third region belongs to it
On be connected with region accompanying by the third metal electrode of the second chip, the fourth region then belongs to is connected with the second false piece thereon
The fourth region accompanying by 4th metal electrode, the thickness of the described second false piece and the consistency of thickness of second chip.
It is understood that entire packaging technology manufacture completely can two faces of the carrying tablet of the encapsulating carrier plate simultaneously
It realizes, so that production efficiency maximizes.In addition, when the technique that the encapsulating carrier plate is packaged simultaneously for two faces, also
Can be very good, which improves single side, encapsulates brought warpage issues.
It should be noted that the encapsulating carrier plate, can be in carrying tablet in packaging technology for above-mentioned all embodiments
Surface be coated with release film, then form the bottom of metal electrode figure, the place outside electrode pattern region still retains release film,
This is conducive to disposably peel away after convenient for encapsulation.As for chip, can be realized on the electrode by way of die bond；
False piece then can carrying out in advance with full slice system, then in encapsulation process, full wafer array is once welded all false pieces and is being welded
On foot, while it is consistent to be made into false piece with the thickness of chip.It is understood that the encapsulating carrier plate of the disclosure, it can be abundant
It is advantageously allowed in response to the production technology for introducing false piece to be conducive to the mode of the routing of substitution traditional handicraft, bonding lead
Entire encapsulation process is simpler, more efficient.
It can be seen that in another embodiment, the disclosure further discloses a kind of packaging body, comprising:
Packaging body bottom surface, packaging body top surface, the first metal electrode in packaging body, the second metal electrode in packaging body,
Chip in packaging body, the false piece in packaging body, wherein
There is interval between first metal electrode and the second metal electrode；And relative to the packaging body top surface, institute
State the first metal electrode, the second metal electrode close to the packaging body bottom surface side；
The upper surface of first metal electrode is connected with the chip, and the upper surface of second metal electrode is connected with
The vacation piece；And relative to first metal electrode, the second metal electrode, chip and false piece in the packaging body closer to
The top surface of the packaging body；The consistency of thickness of first metal electrode and the second metal electrode, and the thickness of the false piece with
The consistency of thickness of the chip；
First metal electrode, chip, with: there is the relationship that electrically conducts in false piece, second metal electrode；
Relative to the upper surface of first metal electrode, the upper surface of the second metal electrode, first metal electrode
Lower surface, the second metal electrode lower surface closer to the bottom surface of the packaging body；
At the position in the package bottom resin face of first metal electrode, corresponding first metal electrode
Outer diameter differs within 20um with the outer diameter of the lower surface of first metal electrode；In the encapsulation of second metal electrode
At the position in body bottom resin face, the outer diameter of corresponding second metal electrode, the lower surface with second metal electrode
Outer diameter differ within 20um.Situation is differed about outer diameter, is detailed in hereinafter.
More preferably, in another embodiment,
The relationship that electrically conducts, is realized by following either type:
(1) the weldering metallic conductor 09 is welded between the chip and the false piece, electrically conducted；
(2) one layer of resin of plastic packaging, directly in place to piece institute false on the resin and the second metal electrode on chip position
The resin set carries out laser drill, plating metal and pattern transfer, electrically conducts.
In conjunction with above, it is to be understood that the disclosure further discloses a kind of packaging technology, includes the following steps:
S100: the medium thinner than carrying tablet is set on carrying tablet；
S200: the first metal electrode is arranged in the first area on the carrying tablet for being equipped with the medium, and described first
The second metal electrode is arranged in the second area of the encapsulating carrier plate of beginning, wherein between existing between the first area and second area
Every；
S300: being arranged chip on the first metal electrode, and false piece is arranged on the second metal electrode, wherein the vacation piece
Select weldability metallic conductor, and the consistency of thickness of false piece and chip；
S400: on chip and false piece, electrically conducting for the two is carried out by welding metal conductor；
S500: to the carrying tablet and its medium, the first metal electrode and its chip, the second metal electrode and its false piece,
And the welding metal conductor, plastic packaging is carried out by plastic packaging resin glue, so that plastic packaging resin glue is higher by chip and false piece；
S600: removing the carrying tablet, exposes the lower surface of the first metal electrode and the second metal electrode, is encapsulated
Body, also,
After removing, relative to the upper surface of first metal electrode, the upper surface of the second metal electrode, first gold medal
Belong to the lower surface of electrode, the second metal electrode lower surface closer to the bottom surface of the packaging body；
At the position in the package bottom resin face of first metal electrode, corresponding first metal electrode
Outer diameter differs within 20um with the outer diameter of the lower surface of first metal electrode；In the encapsulation of second metal electrode
At the position in body bottom resin face, the outer diameter of corresponding second metal electrode, the lower surface with second metal electrode
Outer diameter differ within 20um.
It in another embodiment, can also be further respectively to the lower surface of the first metal electrode and the second metal electrode
It is surface-treated.
In addition, the disclosure further discloses a kind of packaging technology referring to Figure 10-1 to Figure 10-9, include the following steps:
S110: the medium thinner than carrying tablet is set on carrying tablet；
S210: the first metal electrode is arranged in the first area on the carrying tablet for being equipped with the medium, and described first
The second metal electrode is arranged in the second area of the encapsulating carrier plate of beginning, wherein between existing between the first area and second area
Every；
S310: being arranged chip on the first metal electrode, false piece is arranged on the second metal electrode, wherein false piece and core
The consistency of thickness of piece；
S410: to the carrying tablet and its medium, the first metal electrode and its chip, the second metal electrode and its false piece,
First time plastic packaging is carried out by the first plastic packaging resin glue, so that the first plastic packaging resin glue is higher by chip and false piece；
S510: the plastic packaging position on chip and false piece carries out laser drill, exposed chip upper surface, false piece respectively
Upper surface；
S610: between chip upper surface, false piece upper surface, along the surface of first time plastic packaging, a coat of metal is electroplated；
S710: on the coat of metal, along the surface of first time plastic packaging, further pass through the second plastic packaging resin glue
Carry out second of plastic packaging；
S810: removing the carrying tablet, exposes the lower surface of the first metal electrode and the second metal electrode, is encapsulated
Body, also,
After removing, relative to the upper surface of first metal electrode, the upper surface of the second metal electrode, first gold medal
Belong to the lower surface of electrode, the second metal electrode lower surface closer to the bottom surface of the packaging body；
At the position in the package bottom resin face of first metal electrode, corresponding first metal electrode
Outer diameter differs within 20um with the outer diameter of the lower surface of first metal electrode；In the encapsulation of second metal electrode
At the position in body bottom resin face, the outer diameter of corresponding second metal electrode, the lower surface with second metal electrode
Outer diameter differ within 20um.
It in another embodiment, can also be further respectively to the lower surface of the first metal electrode and the second metal electrode
It is surface-treated.
It is understood that above-mentioned technique directly results in: after removing, the lower surface of corresponding metal electrode does not need to carry out
Any etching still can easily be surface-treated its lower surface.This has the difference of essence with the prior art.Existing skill
It in art, before metal electrode lower surface is surface-treated, needs to be etched, but in order to avoid destroying lower surface, in etching
It must be retained, prevent from destroying metal electrode lower surface, therefore, the outer diameter of lower surface is commonly greater than metal electrode thickness
The outer diameter of the corresponding metal electrode in half position place.And the disclosure is quite different, does not on the one hand need to etch, and on the other hand, stripping
From rear, corresponding outer diameter is almost the same, and AA ' is almost the same with BB ' within 20um, such as in Figure 10-9 for difference, at most also
It is difference 20um.
The foregoing is merely the preferred embodiments of the disclosure, and not to limit the disclosure, those skilled in the art exists
Common variations and alternatives are carried out in disclosed technique aspects should all be included in the protection scope of the disclosure.
Claims (10)
1. a kind of encapsulating carrier plate, it is characterised in that:
The encapsulating carrier plate be used for carry include chip packaging body；
The encapsulating carrier plate includes: carrying tablet and the medium thinner than carrying tablet；
The medium includes following any: release film, transition coating or other can form weak binding power with packaging body or carrying tablet
Medium；
For at least one side of the carrying tablet, part of it region belongs to areas of dielectric accompanying by the medium, remaining part
Subregion then includes at least first area and second area, and: the first area belongs to is connected with the of the chip thereon
Region accompanying by one metal electrode, second area, which then belongs to, to be connected with thereon second accompanying by the second metal electrode of false piece
Region, the thickness of the vacation piece and the consistency of thickness of the chip；There is interval between the first area and second area；Institute
State false piece selection weldability metallic conductor；
The carrying tablet can be removed relative to the packaging body and be recycled and reused for the encapsulating carrier plate.
2. encapsulating carrier plate according to claim 1, in which:
It is attached with insulating layer in the areas of dielectric, after the carrying tablet is removed relative to the packaging body, the insulating layer
It is under the jurisdiction of the packaging body.
3. encapsulating carrier plate according to claim 1, in which:
First, second metal electrode is by carrying out plating realization on the carrying tablet.
4. encapsulating carrier plate according to claim 1, in which:
After the carrying tablet is removed relative to the packaging body, first, second metal electrode, chip, false piece are under the jurisdiction of
The packaging body.
5. encapsulating carrier plate according to claim 1, in which:
It include the first attachment on first metal electrode, it is described after the carrying tablet is removed relative to the packaging body
First attachment is under the jurisdiction of the packaging body.
6. encapsulating carrier plate according to claim 1, in which:
The carrying tablet has the characteristics that following any: sheet, band-like, long to for closed loop mode.
7. encapsulating carrier plate according to claim 1, in which:
The carrying tablet includes following any: the lower stainless steel of thermal expansion coefficient or thermal expansion coefficient are matched with plastic packaging resin
Other metals.
8. encapsulating carrier plate according to claim 2, in which:
It include the second attachment on the insulating layer, after the carrying tablet is removed relative to the packaging body, described second is attached
Object be under the jurisdiction of the packaging body.
9. the encapsulating carrier plate according to claim 5 or 8, in which:
The attachment has multilayered structure.
10. a kind of packaging body, comprising:
Packaging body bottom surface, packaging body top surface, the first metal electrode in packaging body, the second metal electrode in packaging body, encapsulation
Chip in body, the false piece in packaging body, wherein
There is interval between first metal electrode and the second metal electrode；And relative to the packaging body top surface, described
One metal electrode, the second metal electrode close to the packaging body bottom surface side；
The upper surface of first metal electrode is connected with the chip, and the upper surface of second metal electrode is connected with described
False piece；And relative to first metal electrode, the second metal electrode, chip and false piece in the packaging body are closer to described
The top surface of packaging body；The consistency of thickness of first metal electrode and the second metal electrode, and the thickness of the false piece with it is described
The consistency of thickness of chip；
First metal electrode, chip, with: there is the relationship that electrically conducts in false piece, second metal electrode；
Relative to the upper surface of first metal electrode, the upper surface of the second metal electrode, under first metal electrode
Surface, the second metal electrode lower surface closer to the bottom surface of the packaging body；
At the position in the package bottom resin face of first metal electrode, outside corresponding first metal electrode
Diameter differs within 20um with the outer diameter of the lower surface of first metal electrode；In the packaging body of second metal electrode
At the position in bottom resin face, the outer diameter of corresponding second metal electrode, with the lower surface of second metal electrode
Outer diameter differs within 20um.
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| CN201920594781.XU CN209544338U (en) | 2019-04-25 | 2019-04-25 | A kind of encapsulating carrier plate and packaging body |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111863633A (en) * | 2019-04-25 | 2020-10-30 | 深圳市环基实业有限公司 | Package carrier, package and process thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111863633A (en) * | 2019-04-25 | 2020-10-30 | 深圳市环基实业有限公司 | Package carrier, package and process thereof |
| CN111863633B (en) * | 2019-04-25 | 2022-01-25 | 深圳市鼎华芯泰科技有限公司 | Package carrier, package and process thereof |
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