CN209487489U - A kind of novel surface attachment diode - Google Patents
A kind of novel surface attachment diode Download PDFInfo
- Publication number
- CN209487489U CN209487489U CN201920707669.2U CN201920707669U CN209487489U CN 209487489 U CN209487489 U CN 209487489U CN 201920707669 U CN201920707669 U CN 201920707669U CN 209487489 U CN209487489 U CN 209487489U
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- Prior art keywords
- conducting wire
- diode
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- product
- crystal grain
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Photovoltaic Devices (AREA)
Abstract
The utility model discloses a kind of novel surfaces to mount diode, including ontology, pin in ontology two sides, the end intrinsic diode crystal particle P and diode crystal particle N-terminal, the end crystal grain P connects one end of the first conducting wire, crystal grain N-terminal connects one end of the second conducting wire, first conducting wire and the second conducting wire are that section is round, size and specification are identical, it is external that the other end of first conducting wire and the second conducting wire extends to this, and it is changed into two identical plane pins by way of extruding, two pin clubfoots are at sea-gull foot shape.Two pin clubfoots are symmetrically arranged amongst ontology both sides at sea-gull foot shape, are highly lower than ontology lower end, and product is facilitated to carry out surface mount operation in client；Product creepage distance and electric clearance can be increased considerably, the insulating capacity of product is improved, promotes safety and stability that product is applied at high-voltage rectifying end；Reduce product Material Cost.
Description
Technical field
The utility model relates to a kind of surface mount diodes, belong to technical field of electronic components.
Background technique
Diode is one of most common electronic component, and maximum characteristic is exactly unilateal conduction, that is, electric current is only
It can be flowed through from a direction of diode；Diode can be applied to rectification circuit, detecting circuit, voltage regulator circuit, voltage and inhibit
Circuit and various modulation circuits.Surface mount diode, which refers to, to be not necessarily to printing twist drill plug-in opening, directly by surface-assembled member
Device pastes the product being soldered on printing board surface specified position, has the characteristics that packing density is high, small in size, light-weight, is easy to
The advantages that realizing automation, improving production efficiency, reduce cost, save material, the energy, equipment, manpower, time.
Existing surface mount diode product as shown in Figure 1, its ontology 1 be generally molding for epoxy resin glue plastic packaging and
At the leading foot of upper frame 4 and lower frame 5 is in the two sides of ontology 1, and internal structure is as shown in Fig. 2, the end diode crystal particle P 2 is logical
Frame 4 in solder (tin cream or solder etc.) connection is crossed, and is connected to the surface of ontology 1 by its pin, diode crystal particle N-terminal 3 is logical
Solder (tin cream or solder etc.) connection lower frame 5 is crossed, and is connected to the surface of ontology 1 by its pin, to complete diode crystalline substance
Grain P end 2 and N-terminal 3 it is external, facilitate subsequent use.Be attached to below ontology since its packaging pin curves inwardly, two pins it
Between distance it is very close, generally in 2.5mm or so, lead to high-voltage rectifying product, especially 1500V or more high-voltage rectifying product, climb
Electrical distance and electric clearance are inadequate, generally require 4mm or more, and the insulating materials easily caused around conductor is electrically polarized, and cause
Electrification phenomenon is presented in insulating materials, influences the stabilization of people life property safety and electric property；It uses upper and lower foot prop simultaneously
It is packaged, production cost is higher, reduces the competitiveness of product.
Summary of the invention
There is provided a kind of novel surfaces to mount diode for the utility model technical issues that need to address, to increase product
Creepage distance and electric clearance promote product in the safety and stable application in high-voltage rectifying market, change simultaneously interiors of products knot
Structure reduces product cost, promotes the competitiveness of product.
In order to solve the above technical problems, technical solution adopted in the utility model is as follows:
A kind of novel surface attachment diode, including ontology, the pin in ontology two sides, intrinsic diode crystal particle P
End and diode crystal particle N-terminal, the end crystal grain P connect one end of the first conducting wire, and crystal grain N-terminal connects one end of the second conducting wire, and first leads
Line and the second conducting wire are that section is circle, and size and specification are identical, and the other end of the first conducting wire and the second conducting wire extends to
This is external, and is changed into two identical plane pins by way of extruding, and two pin clubfoots are at sea-gull foot shape
Shape.
First conducting wire and the second conducting wire are fine copper conducting wire.
The big ailhead of conducting wire and the small ailhead of conducting wire are provided on first conducting wire and the second conducting wire, the big ailhead of conducting wire and crystal grain connect
It connects, the size of the big ailhead of conducting wire is generally higher than crystallite dimension.
A kind of above-mentioned novel surface mounts diode, and the conducting wire is fine copper conducting wire.
Due to using above technical scheme, technological progress acquired by the utility model is as follows.
Two pin clubfoots are symmetrically arranged amongst ontology both sides at sea-gull foot shape, and height is slightly below ontology lower end, convenient
Product carries out surface mount operation in client；Product creepage distance and electric clearance can be increased considerably, to improve product
Insulating capacity, promote the product safety and stability applied at high-voltage rectifying end；Product Material Cost can be reduced, and then is dropped
Low 15% or more product cost.
Detailed description of the invention
Fig. 1 is the schematic diagram that conventional surface mounts diode；
Fig. 2 is the schematic diagram of internal structure that conventional surface mounts diode；
Fig. 3 is the schematic diagram of the utility model surface mount diode.
Fig. 4 is the schematic diagram of internal structure of the surface mount diode of the utility model；
Wherein: 1. ontologies, 2. ends crystal grain P, 3. crystal grain N-terminals, frame on 4., 5. lower frames, 6. pins (sea-gull foot), 7. lead
Line, the big ailhead of 8. conducting wires, the small ailhead of 9 conducting wires, 10. conducting wires.
Specific embodiment
Below in conjunction with specific embodiment, the present invention will be further described in detail.
A kind of novel surface mounts diode, including ontology 1, the pin 6 in ontology two sides, and the diode in ontology 1 is brilliant
The end grain P 2 and diode crystal particle N-terminal 3, the end crystal grain P 2 connect one end of the first conducting wire 7, and crystal grain N-terminal 3 connects the one of the second conducting wire 10
End, the first conducting wire 7 and the second conducting wire 10 are that section is circle, and size and specification are identical, the first conducting wire 7 and the second conducting wire 10
The other end extend to outside ontology 1, and be changed into two identical plane pins 6 by way of extruding, this two are drawn
6 clubfoot of foot is at sea-gull foot shape.
First conducting wire 7 and the second conducting wire 10 are fine copper conducting wire.
The big ailhead 8 of conducting wire and the small ailhead 9 of conducting wire, big 8 He of ailhead of conducting wire are provided on first conducting wire 7 and the second conducting wire 10
Crystal grain connection, the size of the big ailhead 8 of conducting wire are generally higher than crystallite dimension.The big ailhead 8 of conducting wire and crystal grain (are generally welded by solder
Piece) mode connects, and the big ailhead 8 of conducting wire plays the role of auxiliary welding and protection crystal grain can buffer in addition if any external stress
Reduce stress, to protect the function of crystal grain unaffected；The small ailhead 9 of conducting wire is inside ontology 1, can be with if any external stress
Buffering reduces stress in advance, to protect the function of crystal grain unaffected.
In the utility model, the end crystal grain P 2 is welded by the first conducting wire 7, and crystal grain N-terminal 3 is carried out by the second conducting wire 10
Welding, the first conducting wire 7 and the second conducting wire 10 are cylindrical shape, and size and specification are identical, and easy to process, cost is relatively low,
Compare two foot props that conventional surface attachment diode uses, hence it is evident that there is cost advantage, therefore product can be greatly lowered
15% or more cost promotes product competitiveness；There are the big ailhead 8 of conducting wire and the small ailhead of conducting wire on another first conducting wire 7 and the second conducting wire 10
9, auxiliary welding can also be played and protection crystal grain, buffering reduce stress, promote product quality level.
In addition, ontology both sides are symmetrically arranged amongst, so that the novel surface since two 6 clubfoots of pin are at sea-gull foot shape
The creepage distance and electric clearance for mounting diode product reach 6mm or so, and the insulating capacity of product is greatly improved, thus
Promote safety and stability that product is applied in high-voltage rectifying.
Claims (3)
1. a kind of novel surface mounts diode, including ontology (1), the pin (6) in ontology two sides, two poles in ontology (1)
The end pipe crystal grain P (2) and diode crystal particle N-terminal (3), it is characterised in that: the end the crystal grain P (2) connects the one of the first conducting wire (7)
End, crystal grain N-terminal (3) connect the one end of the second conducting wire (10), and the first conducting wire (7) and the second conducting wire (10) are that section is round, ruler
Very little and specification is identical, and the other end of the first conducting wire (7) and the second conducting wire (10) extends to ontology (1) outside, and passes through extruding
Mode be changed into two identical plane pins (6), two pin (6) clubfoots are at sea-gull foot shape.
2. novel surface according to claim 1 mounts diode, it is characterised in that: first conducting wire (7) and second
Conducting wire (10) is fine copper conducting wire.
3. novel surface according to claim 1 mounts diode, it is characterised in that: first conducting wire (7) and second
The big ailhead of conducting wire (8) and the small ailhead of conducting wire (9) are provided on conducting wire (10), the big ailhead of conducting wire (8) is connected with crystal grain, and conducting wire is big
The size of ailhead (8) is generally higher than crystallite dimension.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920707669.2U CN209487489U (en) | 2019-05-17 | 2019-05-17 | A kind of novel surface attachment diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920707669.2U CN209487489U (en) | 2019-05-17 | 2019-05-17 | A kind of novel surface attachment diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209487489U true CN209487489U (en) | 2019-10-11 |
Family
ID=68135866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920707669.2U Active CN209487489U (en) | 2019-05-17 | 2019-05-17 | A kind of novel surface attachment diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209487489U (en) |
-
2019
- 2019-05-17 CN CN201920707669.2U patent/CN209487489U/en active Active
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