CN209419997U - A kind of heat resistance metallized film - Google Patents
A kind of heat resistance metallized film Download PDFInfo
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- CN209419997U CN209419997U CN201821951587.4U CN201821951587U CN209419997U CN 209419997 U CN209419997 U CN 209419997U CN 201821951587 U CN201821951587 U CN 201821951587U CN 209419997 U CN209419997 U CN 209419997U
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- layer
- heat resistance
- conductive adhesive
- metallized film
- black polyimide
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Abstract
The utility model proposes a kind of heat resistance metallized films, it is related to metallized film technical field, including metal layer, black polyimide layer, conductive adhesive layer, high-temperaure coating and release layer, the metal layer is between the black polyimide layer and the conductive adhesive layer, the black polyimide layer surface is covered with the high-temperaure coating, and the surface of the conductive adhesive layer is covered with the release layer.The utility model has good electrical characteristic, strong antijamming capability, adhesive strength high, and the intensity of polyimides is high, can satisfy the demand of industry processing, has good processability, the high-temperaure coating of setting has good heat-resisting ability, while having certain electric conductivity.
Description
Technical field
The utility model relates to metallized film technical field, especially a kind of heat resistance metallized film.
Background technique
Under the market demand that electronics and communication products tend to multi-functional complication, the construction of circuit board needs more frivolous short
It is small but high due to requiring heat dissipation performance, then need to be arranged one layer of high-temperature-resistant layer, general high-temperature-resistant layer is polyurethane, is formed
Convex thickened area will affect the intensity of winding although improving heat-resisting quantity, and machinability is poor.
Utility model content
In order to solve the above technical problems, the utility model provides a kind of heat resistance metallized film.
The utility model specifically adopts the following technical scheme that realization:
A kind of heat resistance metallized film, including metal layer, black polyimide layer, conductive adhesive layer, high-temperaure coating and
Release layer, the metal layer is between the black polyimide layer and the conductive adhesive layer, the black polyimide layer
Surface is covered with the high-temperaure coating, and the surface of the conductive adhesive layer is covered with the release layer.
Preferably, the black polyimide layer hardness is 3H-5H and roughness is 0.2 μm~0.3 μm, and described black
Color polyimide layer is the Kapton uniaxially or biaxially extended.
Preferably, the roughness of the black polyimide layer is 0.25 μm.
Preferably, the black polyimide layer is with a thickness of 10 μm~4 μm, the metal layer with a thickness of 0.1 μm~8
μm, the conductive adhesive layer with a thickness of 5 μm~10 μm.
Preferably, the material of the metal layer is copper, silver, nickel, gold, aluminium or zinc, or comprising any in above-mentioned metal
More than one metal alloy.
Heat resistance metallized film provided by the utility model, the beneficial effect is that: have electrical characteristic good, anti-interference
Ability is strong, adhesive strength is high, and the intensity of polyimides is high, can satisfy the demand of industry processing, has good processability,
The high-temperaure coating of setting has good heat-resisting ability, while having certain electric conductivity.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the utility model heat resistance metallized film.
Specific embodiment
To further illustrate each embodiment, the utility model is provided with attached drawing.These attached drawings are in the utility model discloses
A part of appearance mainly to illustrate embodiment, and can cooperate the associated description of specification former come the running for explaining embodiment
Reason.Cooperation refers to these contents, and those of ordinary skill in the art will be understood that other possible embodiments and sheet are practical new
The advantages of type.Component in figure is not necessarily to scale, and similar component symbol is conventionally used to indicate similar component.
Now in conjunction with the drawings and specific embodiments, the present invention will be further described.
As shown in Figure 1, a kind of heat resistance metallized film provided in this embodiment, including metal layer 1, black polyamide
Layer 2 and conductive adhesive layer 3, metal layer 1 is between black polyimide layer 2 and conductive adhesive layer 3,2 surface of black polyimide layer
It is covered with high-temperaure coating 4, the surface of conductive adhesive layer 3 is also covered with release layer 5.Wherein,
2 hardness of black polyimide layer is 3H-5H and roughness is 0.2 μm~0.3 μm, and best roughness is 0.25 μm.
Black polyimide layer 2 is the Kapton of stand-alone product uniaxially or biaxially extended, with a thickness of 10 μm~4 μm,
Metal layer 1 with a thickness of 0.1 μm~8 μm, conductive adhesive layer 3 with a thickness of 5 μm~10 μm, the material of metal layer 1 be copper, silver, nickel,
Gold, aluminium or zinc, or include metal alloy more than any one in above-mentioned metal.
High-temperaure coating 4 is phosphate lead powder coating.Release layer 5 is release film, with a thickness of 30 μm~50 μm, is selected from PET
Fluorine moulds release film, PET release film containing silicone oil, PET matt release film or PE release film.Or release layer 5 is release paper, with a thickness of 40
μm~150 μm, it is selected from PE leaching membrane paper.
The metallized film of the present embodiment has good electrical characteristic, strong antijamming capability, adhesive strength height, and polyamides is sub-
The intensity of amine is high, can satisfy the demand of industry processing, has good processability, and the high-temperaure coating of setting has good
Heat-resisting ability, while there is certain electric conductivity.
Although specifically showing and describing the utility model in conjunction with preferred embodiment, those skilled in the art is answered
This is understood, in the spirit and scope for not departing from the utility model defined by the appended claims, in form and details
On the utility model can be made a variety of changes, be the protection scope of the utility model.
Claims (5)
1. a kind of heat resistance metallized film, which is characterized in that including metal layer, black polyimide layer, conductive adhesive layer, resistance to height
Warm coating and release layer, for the metal layer between the black polyimide layer and the conductive adhesive layer, the black is poly-
Imide layer surface is covered with the high-temperaure coating, and the surface of the conductive adhesive layer is covered with the release layer.
2. a kind of heat resistance metallized film according to claim 1, it is characterised in that: the black polyimide layer is hard
Degree is 3H-5H and roughness is 0.2 μm~0.3 μm, and the black polyimide layer is the polyamides Asia uniaxially or biaxially extended
Amine film.
3. a kind of heat resistance metallized film according to claim 2, it is characterised in that: the black polyimide layer
Roughness is 0.25 μm.
4. a kind of heat resistance metallized film according to claim 1 to 3, it is characterised in that: the black polyamides is sub-
Amine layer thichness is 10 μm~4 μm, the metal layer with a thickness of 0.1 μm~8 μm, the conductive adhesive layer with a thickness of 5 μm~10 μ
m。
5. a kind of heat resistance metallized film according to claim 1, it is characterised in that: the material of the metal layer is
Copper, silver, nickel, gold, aluminium or zinc, or include metal alloy more than any one in above-mentioned metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821951587.4U CN209419997U (en) | 2018-11-24 | 2018-11-24 | A kind of heat resistance metallized film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821951587.4U CN209419997U (en) | 2018-11-24 | 2018-11-24 | A kind of heat resistance metallized film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209419997U true CN209419997U (en) | 2019-09-20 |
Family
ID=67935316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821951587.4U Active CN209419997U (en) | 2018-11-24 | 2018-11-24 | A kind of heat resistance metallized film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209419997U (en) |
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2018
- 2018-11-24 CN CN201821951587.4U patent/CN209419997U/en active Active
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