CN209406886U - A kind of IC chip test, printing, sorting unit - Google Patents

A kind of IC chip test, printing, sorting unit Download PDF

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Publication number
CN209406886U
CN209406886U CN201821966255.3U CN201821966255U CN209406886U CN 209406886 U CN209406886 U CN 209406886U CN 201821966255 U CN201821966255 U CN 201821966255U CN 209406886 U CN209406886 U CN 209406886U
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China
Prior art keywords
chip
guided mode
test
sorting
overturning
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Application number
CN201821966255.3U
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Chinese (zh)
Inventor
芦俊
潘小华
周芸
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Wuxi Wekay Technology Co ltd
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Jiangsu Vocational College of Information Technology
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Abstract

The utility model discloses a kind of IC chip test, printing, sorting units, including sorting test platform and turret system, the turret system is set to the central part of sorting test platform, including turntable and fixed station, around fixed station, circumferentially direction is successively arranged automatical feeding system, angle detecting system, correction for direction system, test macro, print system, Mark detection system, positioning system, 3D detection system, braid system, discharge system and flash system on the sorting test platform.The present apparatus can complete full-automatic carrying, power test, printing, braid and the sorting of IC chip, and the apparatus structure is simple, and manufacturing cost is low, and testing efficiency is high.

Description

A kind of IC chip test, printing, sorting unit
Technical field
The utility model relates to IC chip test technical fields, and in particular to a kind of IC chip test, Printing, sorting unit.
Background technique
Testing, sorting technology is always the hot technology in the field IC, it is that IC test encapsulation field is indispensable together Process.And the testing, sorting technology of new packaging form integrated circuit even more wherein walks the key technology in Environment Science.Entirely certainly The tower test macro of turn is mainly used for the testing, sorting of the new packaging forms circuit such as QFN, CSP, SOIC, screening installation tool There are automatic charging, transmission, the accurately functions such as rotation and positioning, the image detection of appearance, braid and automatic blanking.It is existing it is complete from The tower test system structure of turn is complicated, and testing efficiency is low.
Present applicant proposes a kind of IC chip test sorting unit (number of patent application 201811186829.X), full-automatic carrying, power test, braid and the sorting of IC chip, the device knot can be completed Structure is simple, and manufacturing cost is low, and testing efficiency is high.But the device is not provided with print system, in practical applications, has client to need Number is printed on circuit chip or alphabetic flag, the device cannot achieve this function.
Utility model content
The utility model provides a kind of IC chip test, printing, sorting unit, can complete IC chip Full-automatic carrying test, printing and sorting.
For this purpose, the technical solution adopted in the utility model is:
A kind of IC chip test, printing, sorting unit, including sorting test platform and turret system, described turn Tower System is set to the central part of sorting test platform, including turntable and fixed station, surrounds fixed station on the sorting test platform Circumferentially direction be successively arranged automatical feeding system, angle detecting system, correction for direction system, test macro, print system, Mark detection system, positioning system, 3D detection system, braid system, discharge system and flash system, in circle on the fixed station Circumferential direction is evenly distributed with several independent press mechanisms, the independent press mechanism respectively with automatical feeding system, angle detecting System, correction for direction system, test macro, print system, Mark detection system, positioning system, 3D detection system, braid system System, discharge system and flash system correspond;The turntable is set to the top of fixed station, is turned by the driving of directly-drive servo main motor Dynamic, turntable is equipped with and the independent one-to-one vacuum WAND of press mechanism;Directly-drive servo main motor drives every turn of turntable A dynamic lattice, turntable drive independent press mechanism to turn to the top of another system above a system, independently descend press Structure drives vacuum WAND to push absorption chip.
For IC chip after automatical feeding system vibration discharging, the vacuum WAND above automatical feeding system will Chip takes out, and directly-drive servo main motor rotates a lattice, and vacuum WAND absorption chip is moved to above angle detecting system, under independence Chip is pressed to detection camera picture taking interval by press mechanism, completes chip angle detecting.After the completion of detection, directly-drive servo main motor A lattice are rotated, chip approach axis corrects system and chip is rotated to specified angle;After the completion of correction for direction, the main electricity of directly-drive servo Machine rotates a lattice, and chip enters test macro and completes chip electric performance test;After the completion of test, directly-drive servo main motor rotation one Lattice, chip enter print system and complete chip surface character print;After the completion of printing, directly-drive servo main motor rotates a lattice, core Piece enters Mark detection system and completes chip surface Mark detection;After the completion of Mark detection, directly-drive servo main motor rotates a lattice, Chip is moved to above positioning system, and positioning system is by chip positioning in the center of vacuum WAND;It is straight to drive after the completion of positioning Servo main motor rotates a lattice, and chip enters the pin Defect Detection that 3D detection system completes device;It is straight to drive after the completion of 3D detection Servo main motor rotates a lattice, when testing integrated circuit is non-defective unit, completes integrated circuit packaging into braid system, works as test When integrated circuit is defective products, directly-drive servo main motor rotates a lattice, and bad chip enters discharge system, completes ic core The collection in bulk of piece.
Further, the print system includes guided mode rack, overturning guided mode, cam link mechanism, servo motor and swashs Optical printer, the overturning guided mode may be reversed by cam link mechanism set on one end of guided mode rack, and servo motor is set to and leads The other end of mould rack, servo motor drive cam link mechanism movement, and connecting rod drives overturning guided mode overturning;Laser printer is set In the side of guided mode rack, laser head is corresponding with overturning guided mode.
Further, the overturning guided mode is equipped with vacuum warehouse, and the vacuum warehouse is connected with vacuum system, for adsorbing The chip being located on overturning guided mode.
The utility model has the beneficial effects that the present apparatus can complete the full-automatic carrying of IC chip, power test, Printing, braid and sorting, the apparatus structure is simple, and manufacturing cost is low, and testing efficiency is high.
Detailed description of the invention
Fig. 1 be the IC chip test of the utility model, printing, sorting unit embodiment 1 structural schematic diagram.
Fig. 2 is the IC chip test of the embodiments of the present invention 1, printing, sorting unit embodiment 1 The structural schematic diagram of turret system.
Fig. 3 is the IC chip test of the embodiments of the present invention 1, printing, sorting unit embodiment 1 Print system structural schematic diagram.
Specific embodiment
It is preferred below in conjunction with attached drawing and one kind to keep the purpose of this utility model, technical solution and advantage clearer Embodiment the technical solution of the utility model is clearly and completely described.
Embodiment 1
Refering to fig. 1 to Fig. 3, IC chip test, printing, sorting unit include testing, sorting platform, in platform The heart is equipped with turret system 12, and around turret system 12, circumferentially direction is successively arranged automatical feeding system 1, direction to the outer rim of platform Detection system 2, correction for direction system 3, first and second test macro 4, print system 5, Mark detection system 6, positioning system 7,3D detection system 8, braid system 9, discharge system 10 and flash system 11.
For testing, sorting platform by the aerial setting of the supporting leg for being located at four angles of mesa base, Platform center portion offers capstan head System installation through-hole.
Turret system 12 is mounted in the installation through-hole, including fixed station and turntable, and turntable is by directly-drive servo main motor 360 degree of rotations are done in 10.1 drivings in the horizontal plane.Directly-drive servo main motor 10.1 is fixedly mounted on testing, sorting by pedestal and puts down The central part of platform, output end extends straight up to be connect with turntable, and turntable is equipped with several vacuum WANDs 10.2.In this implementation In example, it is equipped with 11 vacuum WANDs altogether, vacuum WAND is circumferentially uniformly distributed along turntable, and distribution is examined with automatical feeding system 1, direction Examining system 2, correction for direction system 3, first and second test macro 4, print system 5, Mark detection system 6, positioning system 7, 3D detection system 8, braid system 9, discharge system 10 and flash system 11 correspond.Directly-drive servo main motor 10.1 is with turn Platform rotates in the horizontal plane, and one lattice of every rotation, vacuum WAND reaches another system from a system.Fixed station by bracket with Directly-drive servo main motor 10.1 is fixedly connected, and fixed station is equipped with several independent press mechanisms 10.3.In the present embodiment, it sets altogether Have 10 independent press mechanisms, respectively with automatical feeding system 1, angle detecting system 2, correction for direction system 3, first and second Test macro 4, print system 5, Mark detection system 6, positioning system 7,3D detection system 8, braid system 9 correspond.Very Hole capital after selling all securities 10.5 is set between turntable and fixed station, and vacuum warehouse is connected to vacuum WAND, provides vacuum force for vacuum WAND.Under Pressure servo motor 10.4 drives independent press mechanism to act, and independent press mechanism drives vacuum WAND 10.2 to push.Vacuum WAND 10.2 and independent press mechanism be equipped with reset spring.Independent press mechanism 10.3 is equipped with reset detection sensor, for examining It surveys and pushes the reset of servo motor 10.4.
Automatical feeding system 1 is the prior art, including piezoelectric ceramics ontology, vibrating disk and the track that directly shakes, and directly shake track Outlet is equipped with first position detection sensor, for whether in place to detect IC chip.
Angle detecting system 2 is the prior art, including positioning guided mode and detection camera, and detection camera is used to give positioning guided mode Upper chip is taken pictures.
Correction for direction system 3 is the prior art, including rotation guided mode, rotation guided mode are rotatably set to guided mode branch by shaft In frame, rotation guided mode is rotated at an angle by rotating electric machine driving.
Test macro 4 is the prior art, is set altogether in order to improve testing efficiency there are two test macro, is tested in the present embodiment System includes test bench and the tester connecting plate being arranged on test bench, passes through the external test instrumentation pair of tester connecting plate Chip carries out circuit electric performance test.
Print system 5 includes guided mode rack, overturning guided mode 5.1, cam link mechanism, servo motor 5.5 and laser printing Machine 5.7.Cam link mechanism includes connecting rod 5.3 and cam 5.6.Guided mode rack includes a horizontal base, one end of horizontal base Equipped with a vertically-mounted seat, the upper end of vertically-mounted seat is equipped with U-shaped groove.Servo motor 5.5 is vertically installed at water by bracket The other end of flat bed, motor output shaft and cam 5.6 are sequentially connected.Connecting rod 5.3 is L-shaped, by a long side and a short side It constitutes, connecting rod long side is horizontally disposed, and end is connect by first rotating shaft with driving cam 5.6, and the other end passes through the second shaft It is installed in rotation in U-shaped groove, reset spring 5.4 is equipped in U-shaped groove, the upper end of reset spring 5.4 is against length of connecting rod The downside on side, lower end automatically reset against the bottom surface of groove, reset spring 5.4 for connecting rod.The short side of connecting rod 5.3 is overturn Upwards, end is equipped with overturning guided mode 5.1, and the bottom of overturning guided mode 5.1 is equipped with vacuum warehouse 5.2, vacuum warehouse 5.2 and vacuum suction System connection, for adsorbing the chip being located on overturning guided mode 5.1.Servo motor 5.5 drives driving cam 5.6 to rotate, and passes Moving cam 5.6 drives connecting rod 5.3 around the second shaft in vertical rotation in surface by first rotating shaft, to drive overturning guided mode 5.1 Outwardly or inwardly overturn.Horizontal base is mounted on testing, sorting platform, and laser printer 5.7 is mounted on the one of guided mode rack Side, laser head direction overturning guided mode 5.1.
Mark detection system 6 is the prior art, including overturning guided mode and vision camera, and vision camera is turned over for giving to be located in Chip on transduction mould is taken pictures.
Positioning system 7 is the prior art, including positioning guided mode and the position-detection sensor being arranged on positioning guided mode.It is fixed Position guided mode is equipped with locating piece, and locating piece is used for chip positioning, and position-detection sensor is used for the position of detection chip.
3D detection system 8 is the prior art, including 3D detects camera, and 3D detection camera takes pictures for chip and completes 3D inspection Altimetric image processing.
Braid system 9, discharge system 10 and flash system 11 are the prior art, and braid system 9 is used for good to being detected as The chip of product carries out braid, and the chip of defective products enters the discharge of discharge system 10, and flash system 11 is used to work as discharge system failure When collect chip.
The working method of this system is:
Vacuum WAND of the IC chip after the vibration discharging of automatical feeding system 1, above automatical feeding system Chip is taken out, directly-drive servo main motor rotates a lattice, and vacuum WAND absorption chip is moved to 2 top of angle detecting system, solely It makes press mechanism driving vacuum WAND and chip is pressed into detection camera picture taking interval, complete chip angle detecting;Detection is completed Afterwards, directly-drive servo main motor rotates a lattice, and chip is rotated to specified angle by chip approach axis correction system 3;Correction for direction After the completion, directly-drive servo main motor rotates a lattice, and chip enters test macro 4 and completes chip electric performance test;After the completion of test, Directly-drive servo main motor 10.1 rotates a lattice, and chip enters print system 5 and completes chip surface character print;After the completion of printing, Directly-drive servo main motor 10.1 rotates a lattice, and chip enters Mark detection system 6 and completes chip surface Mark detection;Mark detection After the completion, directly-drive servo main motor rotates a lattice, and chip is moved to 7 top of positioning system, and positioning system is by chip positioning in true The center of suction pen;After the completion of positioning, directly-drive servo main motor rotates a lattice, and chip enters 3D detection system 8 and completes device The pin Defect Detection of part;After the completion of 3D detection, directly-drive servo main motor rotates a lattice, when testing integrated circuit is non-defective unit, Integrated circuit packaging is completed into braid system 9, when testing integrated circuit is defective products, directly-drive servo main motor rotation one Lattice, bad chip enter discharge system 10, complete the collection in bulk of IC chip.
Not doing the part illustrated in above instructions is the prior art, or has both been able to achieve by the prior art.

Claims (3)

1. a kind of IC chip test, printing, sorting unit, including sorting test platform and turret system, the capstan head System is set to the central part of sorting test platform, including turntable and fixed station, which is characterized in that encloses on the sorting test platform Around fixed station, circumferentially direction is successively arranged automatical feeding system, angle detecting system, correction for direction system, test macro, beats Print system, Mark detection system, positioning system, 3D detection system, braid system, discharge system and flash system, the fixation Circumferentially direction is evenly distributed with several independent press mechanisms on platform, the independent press mechanism respectively with automatical feeding system, Angle detecting system, correction for direction system, test macro, print system, Mark detection system, positioning system, 3D detection system, Braid system, discharge system and flash system correspond;The turntable is set to the top of fixed station, by directly-drive servo main motor Driving rotation, turntable are equipped with and the independent one-to-one vacuum WAND of press mechanism;The driving of directly-drive servo main motor turns Platform one lattice of every rotation, turntable drive independent press mechanism to turn to the top of another system above a system, independent Press mechanism drives vacuum WAND to push absorption chip.
2. IC chip test as described in claim 1, printing, sorting unit, which is characterized in that the print system Pass through cam including guided mode rack, overturning guided mode, cam link mechanism, servo motor and laser printer, the overturning guided mode Link mechanism may be reversed set on one end of guided mode rack, and servo motor is set to the other end of guided mode rack, and servo motor driving is convex Connecting rod mechanism movement is taken turns, connecting rod drives overturning guided mode overturning;Laser printer be set to guided mode rack side, laser head with turn over Mould of transduceing is corresponding.
3. IC chip test as claimed in claim 2, printing, sorting unit, which is characterized in that the overturning guided mode It is equipped with vacuum warehouse, the vacuum warehouse is connected with vacuum system, for adsorbing the chip being located on overturning guided mode.
CN201821966255.3U 2018-11-27 2018-11-27 A kind of IC chip test, printing, sorting unit Active CN209406886U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821966255.3U CN209406886U (en) 2018-11-27 2018-11-27 A kind of IC chip test, printing, sorting unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821966255.3U CN209406886U (en) 2018-11-27 2018-11-27 A kind of IC chip test, printing, sorting unit

Publications (1)

Publication Number Publication Date
CN209406886U true CN209406886U (en) 2019-09-20

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111359910A (en) * 2020-03-17 2020-07-03 苏州日月新半导体有限公司 Integrated circuit product testing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111359910A (en) * 2020-03-17 2020-07-03 苏州日月新半导体有限公司 Integrated circuit product testing method
CN111359910B (en) * 2020-03-17 2022-03-29 苏州日月新半导体有限公司 Integrated circuit product testing method

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GR01 Patent grant
GR01 Patent grant
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TR01 Transfer of patent right

Effective date of registration: 20231027

Address after: E09, No. 35 Yougu Industrial Park, Xibei Town, Xishan District, Wuxi City, Jiangsu Province, 214194

Patentee after: WUXI WEKAY TECHNOLOGY CO.,LTD.

Address before: 214153 No. 1 Qian Lotus Road, Huishan District, Jiangsu, Wuxi

Patentee before: JIANGSU VOCATIONAL College OF INFORMATION TECHNOLOGY