CN209256645U - Substrate board treatment - Google Patents

Abstract

The utility model relates to substrate board treatment, which is used to carry out the grinding process of substrate comprising: grinding pad, the upper surface for grinding base plate；Grinding head has the diaphragm contacted with grinding pad upper surface, is moved relative to substrate, so as to improve grinding stability and grinding accuracy.

Description

Substrate board treatment

Technical field

The utility model relates to substrate board treatments, more specifically, it is stable to be related to a kind of grinding that can be improved substrate Property and grinding the uniformity substrate board treatment.

Background technique

Recently, surging with being concerned about information display device, it be using the requirement of information medium that can be carried also It improves, while just carrying out in emphasis to cathode-ray tube (the Cathode Ray Tube for substituting original display device；CRT) light Thin panel display device (Flat Panel Display；FPD research and commercialization).

In this panel display apparatus field, light and handy so far and liquid crystal display device (the Liquid Crystal of little power consumption Display Device；LCD) be the display device to attract most attention, but liquid crystal display device is not light-emitting component but light is first Part, brightness, contrast (contrast ratio) and in terms of there are disadvantages, therefore carrying out to can overcome The active exploitation of the new display device of this disadvantage.Wherein, as one of the display device of new generation to attract tremendous attention recently, have Machine luminous display unit (OLED:Organic Light Emitting Display).

In general, use intensity and the outstanding glass substrate of permeability in display device, recently, display device is directed toward tight Gathering and high pixel (high-pixel), thus should can prepare glass substrate with this corresponding.

As an example, as one of OLED process, polysilicon is being crystallized into amorphous silicon (a-Si) irradiation laser (poly-Si) in ELA (Eximer Laser Annealing, Excimer-Laser Crystallization) process, in the same of polysilicon crystal When, protrusion can occur for surface, and unbalanced phenomena (mura-effects) may occur for this protrusion, and therefore, glass substrate should be able to Enough it is ground, it is raised to remove.

For this purpose, having carried out being intended to the multiplicity research of high-efficient grinding substrate surface recently, but also far from enough, it is desirable that this into Row exploitation.

Utility model content

Technical problem

The utility model aim be to provide a kind for the treatment of effeciency that can be improved substrate and improve grinding stability and Grind the substrate board treatment of the uniformity.

Especially be being capable of according to the surface curvature of substrate and equably grinding base plate for the utility model aim.

In addition, the utility model aim is that the configuration status of grinding pad can be stably kept in grinding process.

In addition, the utility model aim is easily replace grinding pad and can simplify the replacement work of grinding pad Sequence.

In addition, the utility model aim is to can be improved productivity and yield.

Solve the scheme of technical problem

The utility model for being intended to reach described the utility model aim provides a kind of substrate board treatment, at the substrate Managing device includes: grinding pad, the upper surface for grinding base plate；Grinding head has the diaphragm contacted with grinding pad upper surface, phase Substrate is moved.

Wherein, on the top of the diaphragm, it is formed with the single pressure chamber that connection is one,

The first pressure for being applied to the substrate from the central portion of the grinding pad is greater than from the edge part of the grinding pad It is applied to the second pressure of the substrate.

Wherein, in the bottom plate central portion of the diaphragm, apply and the grinding pad is stressed on described the first of the substrate Pressure；In the bottom edge portion of the diaphragm, apply the second pressure that the grinding pad is stressed on to the substrate.

Wherein, the mode around bottom plate central portion of the bottom edge portion of the diaphragm to surround the diaphragm is formed.

Wherein, the bottom edge portion of the diaphragm is formed as the bottom plate central portion that thickness is thicker than the diaphragm.

Wherein, the bottom edge portion of the diaphragm gradually thickens from inside to outside with the radial direction along the diaphragm Thickness.

Wherein, the bottom surface of the bottom plate central portion of the bottom surface and diaphragm in the bottom edge portion of the diaphragm constitutes same plane.

Wherein, the bottom plate central portion of the diaphragm is contacted with the grinding pad, and the bottom edge portion of the diaphragm is from described Grinding pad separates.

Wherein, the mode around bottom plate central portion of the bottom edge portion of the diaphragm to surround the diaphragm is formed.

Wherein, the bottom edge portion of the diaphragm is formed as plane.

Wherein, the bottom edge portion of the diaphragm is formed as curved surface.

Wherein, the shape that the bottom edge portion of the diaphragm is gradually increased from inside to outside with the radial direction along the diaphragm Shape is separated from the grinding pad.

Wherein, the bottom plate central portion of the diaphragm is contacted with the grinding pad, the bottom plate side including being configured at the diaphragm Intermediate member between edge and the upper surface of the grinding pad.

Wherein, apply first pressure that the grinding pad is stressed on to the substrate from the bottom plate central portion of the diaphragm Power；Apply the second pressure that the grinding pad is stressed on to the substrate from the intermediate member.

Wherein, the mode around bottom plate central portion of the intermediate member to surround the diaphragm is formed.

Wherein, the intermediate member has the thickness gradually to thicken from inside to outside along the radial direction of the diaphragm.

Wherein, the bottom edge portion of the diaphragm and the upper surface of the intermediate member form face contact.

Wherein, the grinding head includes: body part, in bottom surface equipped with the diaphragm；Grinding pad snap ring, with the ontology Portion's connection, is configured at around the diaphragm；Snap ring extension extends from the grinding pad snap ring, is configured at the diaphragm Between bottom edge portion and the upper surface of the grinding pad；Retainer ring pressure chamber is formed in the top of the snap ring extension；Institute The bottom plate central portion of diaphragm is stated in the inside of the snap ring extension, is contacted with the grinding pad.

Wherein, in the bottom plate central portion of the diaphragm, apply and the grinding pad is stressed on described the first of the substrate Pressure；In the snap ring extension, apply the second pressure that the grinding pad is stressed on to the substrate.

Wherein, the mode around bottom plate central portion of the snap ring extension to surround the diaphragm is formed.

Wherein, the snap ring extension has the thickness gradually to thicken from inside to outside along the radial direction of the diaphragm.

Wherein, the diaphragm includes: the first diaphragm, is contacted with the grinding pad；Second diaphragm is located at first diaphragm Upside.

Wherein, the second diaphragm stacking is configured at the upper surface in the bottom edge portion of first diaphragm.

Wherein, second diaphragm is formed with ring-type, to surround around the bottom plate central portion of first diaphragm.

Wherein, second diaphragm has the thickness gradually to thicken from inside to outside along the radial direction of first diaphragm Degree.

Wherein, be formed with inclined surface in the upper surface of second diaphragm, the inclined surface have along described first every The height that the radial direction of film gradually rises from inside to outside.

Wherein, the inclined surface is formed as curved surface.

Wherein, the inclined surface is formed as plane.

Wherein, including constraint protrusion, the constraint protrusion protrusion are formed in the upper surface of first diaphragm, determine described in Allocation position of second diaphragm relative to first diaphragm.

Wherein, first diaphragm include: the first bottom plate central portion contacted in grinding process with the grinding pad, with And the first bottom edge portion formed in the mode surrounded around the first bottom plate central portion；Second diaphragm includes being located at Second bottom plate central portion of the upside of the first bottom plate central portion and side to surround around the second bottom plate central portion Formula forms and is located at the second bottom edge portion of the upside in first bottom edge portion.

Wherein, second bottom edge portion is formed as thickness and is thicker than the second bottom plate central portion.

Wherein, it is formed with inclined surface in the upper surface in second bottom edge portion, the inclined surface is along described second The radial direction of diaphragm gradually rises from inside to outside.

Wherein, it is applied to the circular shape that there is the pressure curve of the grinding pad inflection point to be located at the grinding pad center.

Wherein, it is applied to the triangle shape that there is the pressure curve of the grinding pad inflection point to be located at the grinding pad center Shape.

Wherein, in the central portion of the grinding pad, the first pressure is applied with uniform range.

Wherein, it on the top of the diaphragm, is formed with by multiple pressure chamber of independent Ground Split, from the grinding pad The first pressure that central portion is applied to the substrate is greater than the second pressure that the substrate is applied to from the edge part of the grinding pad Power.

Wherein, the bottom surface of the diaphragm of grinding pad pressurization is divided into along the radial direction of the diaphragm more A pressurised zone, the multiple pressure chamber individually apply mutually different pressure to the multiple pressurised zone.

Wherein, the diaphragm includes the first pressurised zone and the mode shape to surround around first pressurised zone At and be configured at the second pressurised zone of fringe region of the grinding pad and formed and on the top of second pressurised zone Oriented second pressurised zone applies the second pressure chamber of the second pressure, on the top of first pressurised zone, Form the first pressure chamber that oriented first pressurised zone is applied more than the first pressure of the second pressure.

Wherein, first pressurised zone is concentric with the second pressurised zone configuration.

Wherein, first pressurised zone includes divided multiple first segmentations of radial direction along the diaphragm Area, the first pressure chamber include independently applying stressed multiple first segmentations pressure chamber to first cut section.

Wherein, in the multiple first cut section, along the radial direction of the diaphragm, be applied from center outward by Decrescence small pressure.

Wherein, in the multiple first cut section, it is applied evenly pressure.

Wherein, second pressurised zone includes divided multiple second segmentations of radial direction along the diaphragm Area, the second pressure chamber include independently applying stressed multiple second segmentations pressure chamber to second cut section.

Wherein, it in the multiple second cut section, along the radial direction of the diaphragm, is applied and gradually subtracts from inside to outside Small pressure.

Wherein, the diaphragm includes: bottom plate, is contacted with the grinding pad；Next door extends shape in the upper surface of the bottom plate At forming the multiple pressure chamber.

Wherein, the diaphragm includes: the first diaphragm, is contacted with the grinding pad；Second diaphragm is located at first diaphragm Upside.

Wherein, first diaphragm includes: the first bottom plate, is contacted with the grinding pad；First side plate, at first bottom The perimeter of plate is extended to form to top.

Wherein, second diaphragm includes: the second bottom plate, positioned at the upside of first bottom plate；Next door, described second The upper surface of bottom plate extends to form, and forms the multiple pressure chamber.

Wherein, second diaphragm further includes the second side plate, perimeter of second side plate in second bottom plate It is extended to form to top, positioned at the inner surface of first side plate.

Wherein, including constraint protrusion, the constraint protrusion protrusion are formed in the upper surface of first bottom plate, determine described in Allocation position of second diaphragm relative to first diaphragm.

The effect of utility model

In conclusion the treatment effeciency of substrate can be improved according to the utility model, and improves grinding stability and grind Grind the uniformity.

In particular according to the utility model, grinding pad can be made to be adjacent to substrate according to the surface curvature of substrate, and Even ground grinding base plate.

In addition, can stably keep the configuration status of grinding pad in grinding process according to the utility model, make to grind The sliding of pad and break-off minimize.

In addition, can easily replace grinding pad according to the utility model, the replacement process of grinding pad can simplify, and And the time needed for shortening replacement.

In addition, productivity and yield can be improved according to the utility model.

Detailed description of the invention

Fig. 1 is the perspective view for illustrating the substrate board treatment of the utility model first embodiment.

Fig. 2 is the side view for illustrating the substrate board treatment of the utility model first embodiment.

Fig. 3 is the enlarged drawing of the part Fig. 1 " A ".

Fig. 4 is the sectional view for the grinding unit for illustrating the substrate board treatment of the utility model first embodiment.

Fig. 5 is diaphragm for illustrating the substrate board treatment of the utility model first embodiment due to substrate surface bending The figure of the state of deformation.

Fig. 6 is another implementation of the substrate placement section for illustrating the substrate board treatment of the utility model first embodiment The figure of example.

Fig. 7 and Fig. 8 is the figure for the diaphragm for illustrating the substrate board treatment of the utility model first embodiment.

Fig. 9 is for illustrating being applied to and grind by means of diaphragm for the substrate board treatment of the utility model first embodiment Grind the figure of the pressure of pad.

Substrate board treatment of the Figure 10 as the utility model first embodiment is for illustrating to be applied by means of diaphragm To another exemplary figure of the pressure of grinding pad.

Substrate board treatment of the Figure 11 as the utility model first embodiment is for illustrating to be applied by means of diaphragm To the another exemplary figure of the pressure of grinding pad.

Substrate board treatment of the Figure 12 as the utility model first embodiment is another embodiment for illustrating diaphragm Figure.

Figure 13 is to be applied to the figure of the pressure of grinding pad for illustrating the diaphragm by means of Figure 12.

Substrate board treatment of the Figure 14 as the utility model first embodiment is the figure for illustrating intermediate member.

Substrate board treatment of the Figure 15 as the utility model first embodiment is the figure for illustrating snap ring extension.

Substrate board treatment of the Figure 16 as the utility model first embodiment, be for illustrate to be formed dual structure every First diaphragm of film and the figure of the second diaphragm.

Substrate board treatment of the Figure 17 as the utility model first embodiment, be for illustrate to be formed dual structure every First diaphragm of film and the figure of the second diaphragm.

Substrate board treatment of the Figure 18 as the utility model first embodiment, be for illustrate to be formed dual structure every First diaphragm of film and the figure of the second diaphragm.

Substrate board treatment of the Figure 19 and Figure 20 as the utility model second embodiment is the figure for illustrating diaphragm.

Substrate board treatment of the Figure 21 as the utility model second embodiment is for illustrating to be applied by means of diaphragm To the figure of the pressure of grinding pad.

Substrate board treatment of the Figure 22 as the utility model second embodiment is for illustrating to be applied by means of diaphragm To another exemplary figure of the pressure of grinding pad.

Substrate board treatment of the Figure 23 as the utility model second embodiment is for illustrating to be applied by means of diaphragm To the another exemplary figure of the pressure of grinding pad.

Substrate board treatment of the Figure 24 and Figure 25 as the utility model second embodiment is for illustrating the another of diaphragm The figure of embodiment.

Appended drawing reference:

10: substrate board treatment 20: gantry unit

100: substrate placement section 110: substrate support

120: surface cushion 120': transfer band

130: snap ring 130a: substrate receiving portion

200: grinding unit 210: grinding head

212: body part 214: diaphragm

214': bottom edge portion 214 ": bottom plate central portion

216: grinding pad snap ring 216a: snap ring extension

217: fixing groove 219: intermediate member

220: grinding pad

Specific embodiment

The preferred embodiment of the utility model is described in detail referring to attached drawing in bottom surface, but not the utility model by embodiment It limits or limits.As reference, in the present note, identical label censures substantially the same element, under this rule, The content recorded in different figures can be quoted to be illustrated, be judged as that practitioner is self-evident or duplicate content can save Slightly.

Referring to figs. 1 to Figure 18, the substrate board treatment 10 of the utility model first embodiment includes: grinding pad 220, with base The upper surface of plate W contacts；Grinding head 210 has the diaphragm 214 contacted with 220 upper surface of grinding pad, carries out relative to substrate W It is mobile.

Even if this is the also equably surface of grinding base plate in order to bend in substrate surface.

That is, grinding pad is difficult to be adjacent to substrate surface, and there are grinding for substrate if such as curved deformation occurs in substrate Grind the low problem of the uniformity.Especially if smile-shaped occurs in substrate, (the two side ends edge of substrate is than substrate Central portion position is to the raised shape in top) bending, then grinding pad is difficult to integrally be adjacent to the surface of substrate, and there are substrates Grind the low problem of the uniformity.

But the utility model makes the bottom plate 1214a of diaphragm 1214 and the surface curvature of grinding pad 1220 and substrate W Accordingly deform (bending) together makes grinding pad 1220 integrally be adjacent to the surface of substrate by means of this, so as to improve base The grinding stability and the grinding uniformity of plate W.

In addition, during carrying out the grinding process to substrate, if the configuration status of the grinding pad of grinding base plate can not It keeps set, then there is a problem of that the grinding uniformity of substrate and grinding stability are low.Especially will have less than base The grinding pad of the size of plate stresses on the mobile grinding pad of state of substrate in the mode ground to substrate, and existing will grind The pressure that pad stresses on substrate is bigger, the grinding pad problem bigger relative to the sliding phenomenon of grinding head, if grinding pad is opposite In grinding head sliding (disengaging) be greater than it is set more than, then exist because grinding head directly contacts substrate cause substrate damage or Damaged problem.

But the utility model is constrained in grinding head 210 by means of making grinding pad 220 be ground pad constriction 230, it can To stably keep configuration status of the grinding pad 220 relative to grinding head 210, thus can prevent caused by being slid because of grinding pad Grinding stability and grinding uniformity decline, and prevent substrate damage.

Importantly, side surface and grinding head 210 of the utility model by means of constraint grinding pad 220, it can be effective The horizontal direction that grinding pad 220 is limited relative to grinding head 210 is mobile.

Further, the utility model is by means of selectively keeping or releasing between grinding head 210 and grinding pad 220 Bonding state, can simplify the replacement process of grinding pad 220, and shortens grinding pad 220 and replace the required time.

That is, the grinding pad 220 of grinding base plate needs periodically be replaced according to set using the time.But it grinds Pad 220 is replaced the required time and is more increased, and the treatment effeciency and productivity of substrate are lower, thus needs that grinding pad can be shortened Time needed for 220 replacements.But be configured to grinding pad in the past and be fixed on grinding head by means of adhesive, thus will grinding Time needed for pad installs subsequent grinding pad additional in grinding head again after grinding head separation increases, and there are treatment effeciency and productivities Low problem.

Especially previous grinding pad is attached to grinding head by means of adhesive, thus exists to replace grinding pad, needs Subsequent grinding pad is set to be re-attached to grind using adhesive after grinding head pressure separation by the grinding pad for using up the service life The problem of complicated procedures of forming of bistrique, the replacement of simultaneous grinding pad need the plenty of time, there is a problem of that the treatment effeciency of substrate is low. Further, in order to make with the grinding pad of adhesive attachment from grinding head separate, need to grinding pad force apply external force and from Grinding head removes grinding pad, and the process is not only very troublesome, but also there are problems that needing a large amount of activity durations.

In addition, in grinding head, if in foreign substances such as the attachment surface residual adhesives adhered to for grinding pad, it is subsequent to grind Mill pad is difficult to be attached to the attachment surface of grinding head with parallel state, and (grinding pad is to cover for the state adhered in grinding pad entanglement The state that the mode of lid foreign substances is adhered to) under, if carrying out the grinding to substrate, there are the grinding uniformity of substrate and grindings The low problem of stability.

But the utility model make grinding pad 220 by without using adhesive it is non-adhering in a manner of be incorporated into grinding unit 200, by means of this, the feelings of the foreign substances such as the attachment surface residual adhesive adhered in grinding unit 200 for grinding pad 220 can be made Condition, which is realized, to be minimized, and the grinding pad of subsequent grinding pad 220'(replacement can be made) grinding (it is single to be parallel to set posture always The state of member) it is attached to grinding unit 200, thus the grinding uniformity and grinding stability can be improved.

Grinding head 210 and grinding pad 220 are equipped with to constitute grinding unit 200, to the base for being placed in substrate placement section 100 Plate W is ground.

Substrate placement section 100 is configured between loading station (being not shown on figure) and unloading part (being not shown on figure), is supplied The substrate W that loading station should be arrived is transplanted on substrate placement section 100, after grinding in the state of being placed in substrate placement section 100, leads to Unloading part is crossed to be unloaded.

More specifically, loading station is with being ready for use on the substrate W of milled processed is loaded into means of abrasion.

Loading station can be formed with various structure that substrate W can be loaded into means of abrasion, not the utility model It is limited or is limited by the structure of loading station.

As an example, loading station includes that multiple loading transfer rollers for separatedly configuring of predetermined space are arranged (on figure It is not shown), multiple substrate W for loading transfer roller top are supplied to the rotation for loading transfer roller and by multiple loading transfer rollers It transfers with cooperating.According to circumstances, loading station also may include the tape loop by means of loading transfer roller and circulation rotating It constitutes.

Moreover, being supplied to the substrate W of loading station before being supplied to loading station, (on figure not by means of alignment unit Show), posture and position can be arranged as set posture and position.

As reference, as substrate W used in the utility model, the length that a side can be used is greater than four sides of 1m Shape substrate.As an example, it as the substrate processed for executing chemical-mechanical polishing process, can be used with 1500 6th generation glass substrate of 1850 ㎜ size of ㎜ *.According to circumstances, the 7th generation and eighth generation glass substrate are also used as processed Substrate.Different from this, the substrate (for example, second generation glass substrate) that side edge lengths are less than 1m also can be used.

Substrate placement section 100 and grinding unit 200 are equipped with loading station (being not shown on figure) and unload part (on figure Be not shown) between constitute means of abrasion.

Substrate placement section 100 can with can place substrate W various structure be equipped with, the structure of substrate placement section 100 and Shape can diversely be changed according to desired condition and design pattern.

As an example, referring to FIG. 1 and FIG. 2, substrate placement section 100 includes substrate support 110 and surface cushion 120, The surface cushion 120 is provided to 110 upper surface of substrate support, improves the coefficient of friction to substrate W, inhibits sliding；Substrate W It is placed in pad upper surface.

As reference, in the present invention, so-called grinding base plate W is defined as by means of the mechanical lapping to substrate W Process or chemical-mechanical polishing (CMP) process and grinding base plate W.As an example, it carries out in means of abrasion to substrate W's During mechanical lapping, together for the slurry applied to chemical grinding, chemical-mechanical polishing (CMP) process is carried out.At this point, slurry It can supply from the inside region (for example, central portion of grinding pad) of grinding pad 220, or be supplied from the lateral area of grinding pad 220 It answers.

Substrate support 110 is equipped in a manner of the bottom surface supporting substrate W.

Substrate support 110 can be configured to the supporting substrate W in a manner of various according to desired condition and design pattern.

Bottom surface is enumerated substrate support 110 and is illustrated with the example that substantially four side plate shapes are formed.According to circumstances, substrate Support portion can be formed with other different shapes and structure, also can use 2 above substrate support portions, supporting substrate bottom surface.

Moreover, granite flat disk can be used as substrate support 110.According to circumstances, substrate support can be with Metal material or porous material are formed, and not the utility model is limited or limited by the material of substrate support.

Grinding unit 200 is equipped with the state for being able to contact substrate W surface, the surface of grinding base plate W.

More specifically, grinding unit 200 includes: grinding head 210, is moved relative to substrate；Grinding pad 220, Its lower part for being provided to grinding head 210, grinding base plate upper surface；Grinding pad constriction 230 is constrained relative to grinding head 210 Grinding pad 220.

Grinding head 210 can be can form the various structure pressurizeed while 220 rotation of grinding pad, not The utility model is limited or is limited by the structure of grinding head 210.

As an example, grinding head 210 includes: body part 212；Diaphragm 214 is provided to 212 bottom surface of body part, will Grinding pad 220 stresses on substrate；Grinding pad snap ring 216 is connect with body part 212, is installed additional for grinding pad 220.

Body part 212 can be made of a main body, or be bonded by multiple main bodys, be configured to drive shaft (on figure It is not shown) connection rotation.In addition, having the pressurization part for grinding pad 220 to be stressed on to substrate W surface in grinding head 210 (for example, the air pressure pressurization part pressurizeed with air pressure to grinding pad).

Diaphragm 214 is installed in the bottom surface of body part 212, is equipped with to transmit the pressure that grinding pad 220 is stressed on to substrate W.

Preferably, elasticity, flexible material (example of the diaphragm 214 can accordingly be deformed with the surface curvature of substrate W Such as, polyurethane) it is formed.

This is to improve the grinding uniformity of substrate to improve grinding pad 220 to the degree of being adjacent to of substrate W.

That is, grinding pad is difficult to be adjacent to substrate surface, and there are grinding for substrate if such as curved deformation occurs in substrate Grind the low problem of the uniformity.It sticks up than the central portion position of substrate to top the two side ends edge that substrate can especially occur The bending of smile-shaped diaphragm bottom is contacted in a manner of face contact if diaphragm is formed with the rigid material of firm (rigid) The grinding pad bottom surface in face (bottom plate) is difficult to the surface according to curved substrate always with the surface of flat form contact substrate Bending, makes grinding pad be adjacent to substrate, there are the amount of grinding of the edge of substrate and the amount of grinding at central portion position to deviate The problem of.

But the utility model is by means of forming diaphragm 214, diaphragm 214 and the curved shape of substrate W with flexible material State accordingly deforms (bending), and grinding pad 220 can be made to be adjacent to the surface of substrate W, thus the grinding that substrate can be improved is stablized Property and grinding the uniformity.

As an example, referring to Fig. 5, smile-shaped shape is protruded downwards than edge with central portion in the upper surface substrate W In the case where, diaphragm 1214 can accordingly be deformed into smile-shaped with the surface curvature of substrate W, so that being pressurizeed by diaphragm 1214 Also grinding base plate W in the state of being deformed into smile-shaped of grinding pad 1220.According to circumstances, according to being deformed into wafer shape The surface curvature of substrate, diaphragm can also be so that the state that grinding pad is deformed into wafer shape be ground.

Diaphragm 1214 may be constructed, according to desired condition and design pattern, to apply in a manner of various to grinding pad and press Power.As an example, it is formed with single pressure chamber on the top of diaphragm 1214, adjusts the pressure of pressure chamber, by means of This, the pressure that adjustable grinding pad 1220 pressurizes to substrate W.According to circumstances, closed sky can also be formed on diaphragm top Gas chamber, so that adjusting the pressure that grinding pad pressurizes to substrate by means of the power that pressurizing device pressurizes to air chamber.

Grinding pad snap ring 216 is connect with body part 212, installs grinding pad 220 additional with being ready for use on.

Grinding pad snap ring 216 can be according to desired condition and design pattern, with the combinative various position of grinding pad 220 And shape is equipped with.

As an example, grinding pad snap ring 216 along diaphragm 214 periphery, in the outside of diaphragm 214, with ring-type At being connect with the side surface of body part 212.According to circumstances, grinding pad snap ring can also be made along 214 periphery of diaphragm and partly It is formed, or is configured to connect with 212 upper surface of body part.

Grinding pad constriction 230 is equipped with relative to grinding head 210, constrains grinding pad 220.More specifically, grinding pad Constriction 230 is equipped with to obtain horizontal direction movement of the limitation grinding pad relative to grinding head.

This is the configuration stability in order to improve grinding pad 220, improves the grinding stability and the grinding uniformity of substrate W.

That is, during carrying out the grinding process to substrate, if the configuration status of the grinding pad of grinding base plate can not be protected It holds set, then there is a problem of that the grinding uniformity of substrate and grinding stability are low.Especially will have less than substrate The grinding pad of size stress on the mobile grinding pad of state of substrate in the mode ground to substrate, exist grinding pad The pressure for stressing on substrate is bigger, the grinding pad problem bigger relative to the sliding phenomenon of grinding head, if grinding pad relative to The sliding (disengaging) of grinding head is greater than more than set, then existing leads to substrate damage or breakage because grinding head directly contacts substrate The problem of.

But the utility model is constrained in grinding head 210 by means of making grinding pad 220 be ground pad constriction 230, it can To stably keep configuration status of the grinding pad 220 relative to grinding head 210, thus can prevent caused by being slid because of grinding pad Grinding stability and grinding uniformity decline, and prevent substrate damage.

Importantly, side surface and grinding head 210 of the utility model by means of constraint grinding pad 220, it can be effective The horizontal direction that grinding pad 220 is limited relative to grinding head 210 is mobile.

Grinding pad constriction 230 can be tied with the multiplicity that can constrain grinding pad 220 relative to grinding pad snap ring 216 It is configured to.

As an example, referring to figs. 1 to Fig. 3, grinding pad constriction 230 includes confining part 231, the confining part The side surface of 231 constraint grinding pads 220 and grinding head 210, limitation grinding pad 220 are moved relative to the horizontal direction of grinding head 210 It is dynamic.

More specifically, confining part 231 is equipped with to obtain the side surface of constraint grinding pad 220 and the side of grinding pad snap ring 216 Surface.

At this point, confining part 231 can be can constrain the side surface of grinding pad 220 and the side table of grinding pad snap ring 216 Various structure in face is formed.As an example, confining part 231 can be along the periphery of grinding pad snap ring 216, with ring-type At.

As described above, forming confining part 231 with ring-type, confining part 231 is to surround the side of the entire periphery of grinding pad 220 Formula configuration, by means of this, grinding pad 220 can be limited all along moving for 220 radial direction of grinding pad, thus can be more stable Ground limits movement of the grinding pad 220 relative to grinding head 210.

Further, inside the confining part 231 formed with ring-type, inserted with grinding pad snap ring 216 and grinding pad 220, the inner surface of the outer surface of the outer surface of grinding pad 220 and grinding pad snap ring 216 contiguity constraint component 231 together, So that grinding pad 220 and grinding pad snap ring 216 mutually constrain, by means of this, can exclude using for keeping confining part 231 solid Due to the other fixing component of the side surface of the side surface or grinding pad snap ring 216 of grinding pad 220, confining part can simplify 231 installation process, and shorten and install the time additional.

According to circumstances, multiple confining parts can also be separatedly equipped with along grinding pad snap ring periphery (for example, by 120 degree It is spaced 3 confining parts of configuration) so that constraining sliding of the grinding pad relative to grinding head by means of multiple confining parts.

Grinding pad 220 is installed in the grinding pad snap ring 216 of grinding head 210, in the state rotation to contact substrate W surface The surface of linear grinding (planarization) substrate W simultaneously.

Grinding pad 220 is to be suitble to form the material of the mechanical polishing of substrate W.For example, grinding pad 220 can use Polyurethane, polyureas (polyurea), polyester, polyethers, epoxy resin, polyamide, polycarbonate, polyethylene, polypropylene, fluorine polymerization Object, ethene polymers, acrylic acid and methylpropanoic acid alkene polymer, silicon, latex, nitrile rubber, isoprene rubber, butadiene rubber And styrene, butadiene and acrylonitrile various copolymer and formed, the material and characteristic of grinding pad 220 can be according to requiring Condition and design specification and diversely change.

Preferably as grinding pad 220, the circular abrasive pad 220 with the size less than substrate W is used.That is, can also be with Using having the grinding pad greater than substrate W size to carry out grinding base plate, but if using the grinding pad having greater than size of substrate, that , in order to make grinding pad rotation, very big rotating equipment and space are needed, accordingly, there exist space efficiency and design freedoms Lowly, the low problem of stability, thus it is preferable to use the grinding pads 220 that size is less than substrate W.It is highly preferred that grinding pad 220 It can be formed to have diameter corresponding with substrate W lateral length or longitudinal length, or be formed to have laterally long less than substrate W The diameter of degree or longitudinal length 1/2.

Substantially, the length of substrate W at least a side has the size greater than 1m, therefore, makes with big greater than substrate W Small grinding pad (for example, having the grinding pad greater than the diameter of 1m) rotation inherently there is a problem of highly difficult.In addition, if Using non-circular grinding pad (for example, quadrangle grinding pad), then the surface of the substrate W ground by means of the grinding pad of rotation without Method is ground into uniform thickness on the whole.But the utility model makes the circular abrasive pad 220 with the size less than substrate W Rotation and grinding base plate W surface, by means of this, can while significantly not reducing space efficiency and design freedom, Make 220 rotation of grinding pad and grinding base plate W, can equably keep the amount of grinding of grinding pad 220 on the whole.

Grinding unit 200 is configured to be moved by means of door frame (Gantry) unit 20 along X-direction and Y axis direction.

More specifically, gantry unit 20 includes: the first main body 22, is moved linearly along the x axis；Second main body 24, It is installed in the first main body 22, moves linearly along the Y direction to intersect vertically with X-direction；Grinding unit 200 is installed in Two main bodys 24, grinding base plate W while being moved along X-direction and Y direction.

First main body 22 can be formed with "U" shaped shape, be configured to be moved along the guide rail 22a configured along the x axis It is dynamic.The permanent magnet of the pole N and the pole S is alternately arranged on guide rail 22a, the first main body 22 can be can lead according to being applied to first The current control of the coil of body 22 and realize that the linear motor principle of precise position control is driven.

At this point, the abrasion path of grinding unit 200 can diversely be changed according to desired condition and design specification.

As an example, grinding pad 220 be configured to along relative to substrate W on one side and inclined first oblique line path, The surface of the mobile simultaneously grinding base plate W of zigzag is repeated to the opposite direction inclined second oblique line path in the first oblique line path.

Wherein, so-called first oblique line path, such as mean the path being tilted by a predetermined angle relative to the bottom edge substrate W. In addition, so-called second oblique line path, it is meant that incline across towards the first oblique line path opposite direction with the first oblique line path The path of oblique predetermined angular.

As reference, in the embodiments of the present invention for preceding addressing diagram, although enumerating means of abrasion only by one The example that grinding unit 200 is constituted is illustrated, but according to circumstances, means of abrasion may include 2 or more grinding units.Example Such as, means of abrasion may include 2 or more grinding units.At this point, the grinding pad of multiple grinding units can be by each grinding pad Constriction is constrained in grinding head.

On the other hand, uninstalling portion distribution, which is ready for use on, is unloaded at means of abrasion for the substrate W for completing milled processed.

Unloading part can be formed in various structure that means of abrasion unloads carried base board W, not the utility model by The structure of unloading part is limited or is limited.

As an example, uninstalling portion point includes multiple unloading transfer rollers for separatedly configuring of setting predetermined space (on figure It is not shown), the substrate W on multiple unloading transfer roller tops is supplied to the rotation of unloading transfer roller, by multiple unloading transfer rollers It transfers with cooperating.According to circumstances, unloading part also may include the tape loop of circulation rotating by means of unloading transfer roller It constitutes.

On the other hand, substrate board treatment of the Fig. 6 as the utility model first embodiment is for illustrating that substrate is placed The figure of another embodiment in portion.Moreover, for identical and be equivalent to identical part as aforementioned compositions, imparting it is same or equivalent in Identical appended drawing reference omits detailed description thereof.

Referring to Fig. 6, another embodiment according to the present utility model, substrate board treatment includes: transfer band 120', edge The path that determines it is mobile, in outer surface mount substrate W；Substrate support 110 is configured at the inside of transfer band 120', will Between transfer band 120' is placed in, the bottom surface of supporting substrate W；Grinding unit 200 is moved, grinding base plate relative to substrate W The upper surface W.

Transfer band 120' can be configured in a manner of various according to desired condition and design pattern along set road Diameter is mobile.As an example, transfer band 120' is configured to carry out circulation rotating along set path.

The circulation rotating of transfer band 120' can be carried out in a manner of various according to desired condition and design pattern.As One example, transfer band 120' are revolved along the path circulation rotating determined by roller unit 150 by means of the circulation of transfer band 120' Turn, the substrate W for being placed in transfer band 120' is transferred along linear travel paths.

The movement routine (for example, circulating path) of transfer band 120' can according to desired condition and design pattern multiplicity Ground change.As an example, roller unit 150 horizontally separates the second roller of configuration including the first roller 152, from the first roller 152 154, transfer band the 120' circulation rotating by means of the first roller 152 and the second roller 154 and in a manner of Infinite Cyclic.

As reference, the outer surface of so-called transfer band 120', it is meant that the outer surface being exposed on the outside of transfer band 120', Substrate W is laid in the outer surface of transfer band 120'.Moreover, the inner surface of so-called transfer band 120', it is meant that supply the first roller 152 With the inner surface of the transfer band 120' of the second roller 154 contact.

In the past, it in order to make the substrate for being supplied to loading station be loaded into means of abrasion, needs to utilize other pickup device (for example, substrate absorption device) is placed in means of abrasion after loading station picks up substrate, then by substrate, thus loads substrate The time needed is or so several seconds~tens of seconds, there are problems that handling the time increases.Further, in the past in order to will complete to grind The substrate of mill is unloaded to unloading part, needs to pick up using other pickup device (for example, substrate absorption device) in means of abrasion After playing substrate, then or so time time-consuming several seconds~tens of seconds that substrate is put down in unloading part, thus unloads carried base board needs, it deposits The problem of handling time increase.

But the utility model makes in the transfer that the substrate W for being supplied to loading station is transplanted directly on to circulation rotating In the state of band 120', the grinding process to substrate W is carried out, substrate W is transplanted directly on unloading part from transfer band 120', By means of this, substrate W treatment process can simplify, and shorten the processing time.

In addition, the utility model to exclude in loading and the unloading of substrate W it is other pick up process, utilize circulation rotation The transfer band 120' turned, handles substrate W in a manner of in line (Inline), by means of this, can simplify substrate W and loads and unload work Sequence, and shorten the time that substrate W is loaded and unloading needs.

Further, in the present invention, it when not needing to be equipped with substrate W loading and unloading, picks up and is picked up needed for substrate W Lifting device, thus can simplify equipment and equipment, and space utilization can be improved.

As another example of transfer band, transfer band is also configured to batch and transfer from a direction to other direction Substrate W.(not shown)

Wherein, so-called transfer band is batched from a direction to other direction, is defined as transfer band with common cassette tape Reel-to-reel (reel to reel) batch mode (batching the mode batched round about again after the first volume in volume Two), It is moved and (is batched) along the open cricoid motion track that follows.

On the other hand, referring to Fig.1 6 to Figure 25, first embodiment according to the present utility model, on the top of diaphragm 214, It is formed with the single pressure chamber C that connection is one, the first pressure P2 for being applied to substrate W from the central portion of grinding pad 220 is big In the second pressure P1 for being applied to substrate W from the edge part of grinding pad 220.

This is to improve the grinding uniformity of substrate W to adjust amount of grinding by the region of grinding pad 220.

That is, in the mode that grinding pad carries out rotation relative to fixed substrate and is ground, due in grinding pad The difference of linear velocity (v=rw) between centre portion and the edge part of grinding pad, amount of grinding will appear unevenly.

The especially linear velocity of grinding pad edge part, greater than the linear velocity of grinding pad central portion, thus grinding pad edge part Caused amount of grinding can be greater than amount of grinding caused by grinding pad central portion, therefore the grinding homogeneity deviation of substrate can occur.

But the utility model is greater than from the first pressure P2 that the central portion of grinding pad 220 is applied to substrate W from grinding The edge part of pad 220 is applied to the second pressure P1 of substrate W, can central portion by grinding pad 220 and edge part by means of this And amount of grinding is adjusted different from each other, therefore, the thickness deviation of substrate W is removed, equably adjusts the thickness of substrate W on the whole The grinding quality of substrate W can be improved in curve.

Under conditions of the top of diaphragm 214 is formed with single pressure chamber C, it is applied to from the central portion of grinding pad 220 The first pressure P2 of substrate W, the second pressure P1 that substrate W is applied to from the edge part of grinding pad 220, can be according to desired item Part and design pattern and by multiplicity in a manner of adjust.

It as an example, include bottom plate central portion by the diaphragm 214 that grinding pad 220 stresses on substrate W referring to Fig. 7 214 " and bottom edge portion 214', and in the bottom plate central portion 214 of diaphragm 214 ", apply and grinding pad 220 is stressed on into substrate First pressure P2 applies the second pressure P1 that grinding pad 220 is stressed on to substrate in the bottom edge portion 214' of diaphragm 214.

Preferably, the bottom edge portion 214' of diaphragm 214 is with continuous cyclic annular formation, to surround the bottom plate of diaphragm 214 Central portion 214 " around.

As described above, by the bottom edge portion 214' from diaphragm 214 to the edge part Z1 and central portion of grinding pad 220 Z2 apply be less than 214 bottom plate central portion 214 of diaphragm " pressure, the linear velocity in 220 edge part of grinding pad, which is relatively higher than, is grinding The linear velocity of 220 central portions is padded, therefore, amount of grinding deviation can be made to realize and minimized.

At this point, by means of the thickness T1 of the bottom edge portion 214' that forms diaphragm 214 different from each other and the bottom of diaphragm 214 Plate central portion 214 " thickness T2, first pressure caused by the bottom edge portion 214' of diaphragm 214 can be adjusted different from each other " the caused second pressure P1 of bottom plate central portion 214 of P2 and diaphragm 214.

More specifically, to be thicker than the bottom plate central portion 214 of diaphragm 214 " thickness form the bottom edge portion of diaphragm 214 214', by means of this, the bottom plate central portion 214 of diaphragm 214 " first pressure P2 be formed larger than the bottom edge of diaphragm 214 The second pressure P1 of portion 214'.

Preferably, the bottom edge portion 214' of diaphragm 214 be formed to have along diaphragm 214 radial direction from inside to outside The thickness gradually to thicken.

As described above, forming the bottom plate of diaphragm 214 to be thinner than the thickness of the bottom edge portion 214' thickness T1 of diaphragm 214 Central portion 214 " thickness T2, form the bottom edge portion 214' of diaphragm 214 with gradually thickeing, by means of this, even if to diaphragm 214 bottom plate central portion 214 " applies identical pressure (single pressure with the upper surface of the bottom edge portion 214' of diaphragm 214 Pressure caused by chamber) P, for " central portion of the grinding pad 220 contacted can apply with 214 bottom plate central portion 214 of diaphragm Grinding pad (is stressed on base by the pressure relatively bigger than 220 edge part of grinding pad contacted with 214 bottom edge portion 214' of diaphragm The pressure of plate).

That is, being applied perpendicular to the bottom plate central portion 214 of diaphragm 214, " the pressure P of upper surface can be passed directly referring to Fig. 8 (P2) is passed to the central portion of grinding pad 220.On the contrary, be applied to the bottom edge portion upper surface 214' (inclined surface) of diaphragm 214 Pressure P includes vertically to be transmitted vertically into component P (y) to grinding pad 220 at component P (y) and horizontal component power P (x), thus For the edge part of grinding pad 220, apply the pressure (P1=P (y)) more relatively smaller than central portion.

At this point, the bottom surface of the bottom edge portion 214' of diaphragm 214 and bottom plate central portion 214 " bottom surface constitute same plane. Wherein, the bottom edge portion 214' of so-called diaphragm 214 and diaphragm 214 bottom plate central portion 214 " bottom surface constitute same plane, Be defined as bottom surface and the bottom plate central portion 214 of diaphragm 214 of the bottom edge portion 214' of diaphragm 214 " bottom surface flatly configure In identical height.

It is highly preferred that being applied to the pressure curve of grinding pad 220 by means of diaphragm 214 referring to Fig. 9, being located at inflection point Circular shape (semi-spherical shape) formation at 1220 center of grinding pad.In other words, grinding pad is applied to by means of diaphragm 214 220 pressure curve is formed with (P1) circular shape that central portion (center) high (P2), edge part (edge) are low.

As described above, making the pressure for being applied to grinding pad 220, high in the central portion of grinding pad, Xiang Bianyuan increasingly subtracts It is small, by means of this, amount of grinding deviation caused by the linear velocity deviation along 220 radial direction of grinding pad can be made to further realize It minimizes.

According to circumstances, as shown in Figure 10, the pressure curve of grinding pad 220 is applied to by means of diaphragm 214, it can also be with Triangle (for example, isosceles triangle) shape that inflection point is located at 220 center of grinding pad is formed, from 220 central portion of grinding pad (center) to edge part (edge), the pressure for being applied to grinding pad 1220 is increasingly in linear reduction.

Differently, as shown in figure 11, the pressure curve of grinding pad 220 is applied to by means of diaphragm 214, it can also be in Centre portion (center) uniformly (P2) is formed, at edge part (edge), along diaphragm 214 radial direction from inside to outside gradually The shape for reducing (P1) is formed.

Wherein, the so-called pressure curve for being applied to grinding pad 220 central portion (center) uniformly, be defined as first pressure P2 is applied to the central portion of grinding pad 220 with uniform range.Different from this, it is also possible to apply in the edge part of grinding pad The pressure of homogeneity range, or apply pressure by stages in a manner of constituting stairstepping.

As another example, 2 and Figure 13 referring to Fig.1, can also change the shape of diaphragm 214, by the region of grinding pad 220 And differently adjust pressure.

More specifically, the bottom edge portion 214' of diaphragm 214 is arranged to the bottom plate central portion 214 higher than diaphragm 214 " (H1 > H2), by means of this, if pressure is applied to pressure chamber C, the bottom plate central portion 214 of diaphragm 214 " contact grinding pad The bottom edge portion 214' of 220 upper surface, diaphragm 214 is separated from the upper surface of grinding pad 220.

Preferably, the bottom edge portion 214' of diaphragm 214 is with continuous cyclic annular formation, to surround the bottom plate of diaphragm 214 Central portion 214 " around.

At this point, the bottom edge portion 214' of diaphragm 214 can be formed as plane, or be formed as curved surface.As an example, The shape that the bottom edge portion 214' of diaphragm 214 is gradually increased from inside to outside with the radial direction along diaphragm 214, from grinding pad 220 separate to be formed.It is highly preferred that the bottom plate central portion 214 of diaphragm 214 ", the bottom edge portion 214' of diaphragm 214 be formed as structure The semi-spherical shape that direction is protruded to the lower part on integral.

As described above, making the bottom plate central portion 214 in diaphragm 214 " in the state of contact 220 upper surface of grinding pad, every The bottom edge portion 214' of film 214 is separated from grinding pad 220, by means of this, even if to the bottom plate central portion 214 of diaphragm 214 " and The upper surface of the bottom edge portion 214' of diaphragm 214 applies identical pressure (pressure caused by single pressure chamber), also only has The bottom plate central portion 214 of diaphragm 214 " can contact grinding pad 220, the bottom edge portion 214' of diaphragm 214 is with from grinding pad 220 The shape of tilting separatedly configures, thus in contact 214 bottom plate central portion 214 of diaphragm " grinding pad 220 central portion, can be with Apply first pressure P2 and does not apply pressure in the edge part of grinding pad 220.

Moreover, the first pressure P2 because caused by contacting diaphragm 214, is that medium passes to substrate W with grinding pad 220, because This, even if the bottom plate central portion 214 of actual membrane 214 " peripheral part does not contact grinding pad 220, as shown in FIG. 12 and 13, every The bottom plate central portion 214 of film 214 " to the power of 220 central portion of grinding pad pressurization, also passes to the central portion periphery of grinding pad 220 Position also forms the circumferential pressure P2' to substrate W pressurization in the central portion peripheral part of grinding pad 220.At this point, in grinding pad The circumferential pressure P2' that 220 central portion peripheral part is formed, composition gradually subtract from inside to outside along the radial direction of diaphragm 214 Small shape.

Alternatively, it is also possible to make the circumferential pressure P2' formed using the central portion peripheral part in grinding pad 220, to grinding The edge part pressurization of pad 220 is ground, the size and range of circumferential pressure P2' can pass through the bottom edge portion of adjusting diaphragm 214 Gap (y of Figure 12) between the curvature or grinding pad edge bottom surface and substrate of 214' and change.

Similarly, in the bottom edge portion 214' of diaphragm 214 from the structure that grinding pad 220 separates, as shown in figure 8, borrowing Help diaphragm 214 and be applied to the pressure curve of grinding pad 220, preferably with central portion (center) height (P2), edge part (edge) low (P1) sine wave shape (semi-spherical shape) formation.

As another example, referring to Fig.1 4, the bottom plate central portion 214 of diaphragm 214 " contact grinding pad 220, in diaphragm 214 The bottom surface of bottom edge portion 214' and the upper surface of grinding pad 220 between configure intermediate member 219, can also be with by means of this Pressure is differently adjusted by the region of grinding pad 220.

More specifically, " the contact grinding pad 220, in the bottom edge of diaphragm 214 of bottom plate central portion 214 of diaphragm 214 The bottom surface of portion 214' and the upper surface (the edge part upper surface of grinding pad) of grinding pad 220, are configured with intermediate member 219.

In the bottom plate central portion 214 of diaphragm 214 ", apply the first pressure P2 that grinding pad 220 is stressed on to substrate, is matching It is placed in the intermediate member 219 of the bottom edge portion lower part 214' of diaphragm 214, applies and grinding pad 220 is stressed on the second of substrate Pressure P1.

Preferably, intermediate member 219 is with continuous cyclic annular formation, " the week to surround the bottom plate central portion 214 of diaphragm 214 It encloses.

As described above, applying to grinding pad 220 " smaller than the bottom plate central portion 214 of diaphragm 214 in intermediate member 219 Pressure can make the linear velocity due to the edge part of grinding pad 220 than the linear velocity phase of 220 central portion of grinding pad by means of this Amount of grinding deviation caused by higher is realized and is minimized.

It is highly preferred that intermediate member 219 is formed to have and gradually thickens from inside to outside along the radial direction of diaphragm 214 Thickness.It is highly preferred that the bottom surface of the bottom edge portion 214' of diaphragm 214 is formed as contacting intermediate member 219 in a manner of face contact Upper surface.

At this point, intermediate member 219 can be configured at having for shape between diaphragm 214 and grinding pad 220 to be able to maintain Material (for example, the polyurethane or silicon etc.) formation of rigidity, not the utility model is limited or is limited by the material of intermediate member 219 It is fixed.

As described above, being formed by means of being configured between the bottom surface of bottom edge portion 214' and the upper surface of grinding pad 220 For the intermediate member 219 with the thickness gradually to thicken, " the bottom with diaphragm 214 even if in the bottom plate central portion 214 of diaphragm 214 The upper surface of edges of boards edge 214' applies identical pressure (pressure caused by single pressure chamber) P, is being applied to intermediate member Include in the pressure of 219 upper surface (inclined surface) is vertical in component P (y) and horizontal component power P (x), only vertically at Component P (y) passes to grinding pad 220, therefore, contact 214 bottom plate central portion 214 of diaphragm " 220 central portion of grinding pad, can To apply larger pressure (P2), in 220 edge part of grinding pad that intermediate member 219 contacts, smaller pressure (P1) can be applied. (referring to Fig. 8)

As another example, referring to Fig.1 5, snap ring extension 216a can also be formed on grinding pad snap ring 216, every Between the bottom surface of bottom edge portion 214' and the upper surface of grinding pad 220 of film 214, snap ring extension 216a is configured, by grinding The region of pad 220 and differently adjust pressure.

More specifically, grinding head 210 includes: body part 212, has diaphragm 214 in bottom surface；Grinding pad snap ring 216, with Body part 212 connects, and is configured at around diaphragm 214；Snap ring extension 216a, from grinding pad snap ring 216 extend, be configured at every Between the bottom surface of bottom edge portion 214' and the upper surface of grinding pad 220 of film 214；Retainer ring pressure chamber RC, is formed in snap ring The top of extension 216a；The bottom plate central portion 214 of diaphragm 214 is " in the interior contact grinding pad 220 of snap ring extension 216a.

In the bottom plate central portion 214 of diaphragm 214 ", apply the first pressure (P2) that grinding pad 220 is stressed on to substrate, It is configured at the snap ring extension 216a of the bottom edge portion lower part 214' of diaphragm 214, applies and grinding pad 220 is stressed on into substrate Second pressure P1.

Preferably, snap ring extension 216a is with continuous cyclic annular formation, to surround the bottom plate central portion 214 of diaphragm 214 " Around.

Moreover, snap ring extension 216a is configured to selectively rise by the pressure for being applied to retainer ring pressure chamber RC Drop, is configured to when pressure is applied to pressure chamber C, pressure is also applied to retainer ring pressure chamber RC together.Therefore, in diaphragm While 214 expansion (pressure is applied to pressure chamber), if pressure is applied to retainer ring pressure chamber RC, snap ring extension 216a can decline.

It is highly preferred that snap ring extension 216a has the thickness gradually to thicken from inside to outside along the radial direction of diaphragm 214 Degree.

As described above, being configured between the bottom surface of bottom edge portion 214' and the upper surface of grinding pad 220 and being formed as having Have the snap ring extension 216a of the thickness gradually to thicken, by means of this, even if in the bottom plate central portion 214 of diaphragm 214 " and every The bottom edge portion upper surface 214' of film 214 applies identical pressure (pressure caused by single pressure chamber) P, is being applied to card The pressure of the upper surface (inclined surface) of ring extension 216a includes vertical in component P (y) and horizontal component power P (x), only Have and pass to grinding pad 220 at component P (y) vertically, thus in contact 214 bottom plate central portion 214 of diaphragm " grinding pad 220 Central portion can apply biggish pressure (P2), in 220 edge part of grinding pad of snap ring extension 216a contact, can apply Lesser pressure (P1).(referring to Fig. 8)

As another example, referring to Fig.1 6 to Figure 18, it is also possible by means diaphragm 214 is formed with dual structure, by grinding The region of pad 220 and differently adjust pressure.

More specifically, diaphragm 214 includes: the first diaphragm 214a, is contacted with grinding pad；Second diaphragm 214b, stacking Positioned at the upside of the bottom edge portion 214a' of the first diaphragm 214a.

As described above, making the second diaphragm 214b configuration in the bottom edge for the first diaphragm 214a for being exposed to pressure chamber C The portion upper surface 214a', by means of this, the first pressure P2 of the bottom plate central portion 214a " of the first diaphragm 214a is formed as than first The second pressure P1 of the bottom edge portion 214a' of diaphragm 214a is big.

Preferably, the second diaphragm 214b is with continuous cyclic annular formation, to surround the bottom plate central portion of the first diaphragm 214a Around 214a ".

First diaphragm 214a and the second diaphragm 214b can be formed with same or similar material, not the utility model by The material of first diaphragm 214a and the second diaphragm 214b are limited or are limited.

Differently, the first diaphragm 214a and the second diaphragm 214b can be formed with mutually different material.Show as one Example, the first diaphragm 214a and the second diaphragm 214b with different rigid material to form.Wherein, rigidly refer to stretching side To more than certain one in, the rigidity of bending direction, compression direction.Preferably, the second diaphragm 214b is to have than the first diaphragm 214a is relatively lower, and rigid material is formed.For example, more than certain one can benefit in the first diaphragm 214a and the second diaphragm 214b With the textile (fabric textile) of Fiber Materials, the textile (metalic textile) of metal material, rubber, silicon, At least certain one is formed in polyurethane.According to circumstances, it is also possible to form the second diaphragm 214b using the material of inductility.

As described above, by means of making the second diaphragm 214b that there is the rigidity lower than the first diaphragm 214a, referring to Fig.1 6, In the state that the bottom plate central portion of upper surface and the first diaphragm 214a to the second diaphragm 214b applies pressure, the second diaphragm 214b Deformation extent follow the bottom deformation of the first diaphragm 214a, the fine sky between the first diaphragm 214a and grinding pad 220 In complementary space, deformed by means of the protrusion of the bottom plate central portion 214a " of the first diaphragm 214a, it is right downwards with bigger pressure Grinding pad 220 pressurizes, meanwhile, in the inclined surface of the second diaphragm 214b, horizontal direction is only eliminated into the vertical direction of component The power of ingredient is pressurizeed, the pressure that 220 central portion Z2 of grinding pad is acted on can than 220 edge Z1 of grinding pad carry out The pressure of effect is larger acted on.

It is highly preferred that the second diaphragm 214b gradually thickend from inside to outside with the radial direction along the first diaphragm 214a Thickness.At this point, being formed with the radial direction along the first diaphragm 214a from inside to outside in the upper surface of the second diaphragm 214b The inclined surface 214c of the height gradually risen.

As an example, the inclined surface 214c of referring to Fig.1 6, the second diaphragm 214b are to have along the first diaphragm 214a The curved surface of height that gradually rises from inside to outside of radial direction formed.

As another example, the inclined surface 214c of referring to Fig.1 7, the second diaphragm 214b can also with have along first every The plane for the height that the radial direction of film 214a gradually rises from inside to outside is formed.

As described above, the upper surface of the bottom edge portion 214a' in the first diaphragm 214a, it is equipped with gradually thickeing Second diaphragm 214b of thickness, by means of this, even if to the bottom plate central portion 214a " and the second diaphragm 214b of the first diaphragm 214a Inclined surface 214c apply identical pressure (pressure caused by single pressure chamber) P, in contacting the first diaphragm 214a bottom plate 220 central portion of grinding pad of centre portion 214a " can also apply grinding for the bottom edge portion 214a' contact than the first diaphragm 214a The relatively bigger pressure in 220 edge parts of mill pad (grinding pad is stressed on to the pressure of substrate).

That is, 6 and Figure 17 referring to Fig.1, in the pressure that the upper surface bottom plate central portion 214a " of the first diaphragm 214a vertically applies P can directly transmit (P2) to the central portion of grinding pad 220.On the contrary, being applied to the pressure of the inclined surface 214c of the second diaphragm 214b Power P includes and transmitting vertically to grinding pad 220 into component P (y) vertically at component P (y) and horizontal component power P (x), because This applies the pressure (P1=P (y)) more relatively smaller than central portion in the edge part of grinding pad 220.

In addition, being formed with constraint protrusion 214d, the constraint protrusion 214d phase in the upper surface of the first diaphragm 214a protrusion For the first diaphragm 214a, determines the position of the second diaphragm 214b and constrained, to fix position.As an example, Constraining protrusion 214d can be formed with ring-type, can be constrained in a manner of being inserted in the second diaphragm 214b inner peripheral surface.As above It is described, constraint protrusion 214d is formed in the upper surface of the first diaphragm 214a, so that the second diaphragm 214b of constraint can by means of this To stably keep configuration status of the second diaphragm 214b relative to the first diaphragm 214a, pressure can be steadily transmitted to grinding pad Power.Differently, it is also possible by means form the second diaphragm adhering in the first diaphragm upper surface or dual injection, integral production the One diaphragm and the second diaphragm.

In addition, enumerating the second diaphragm in the embodiments of the present invention for preceding addressing diagram and being formed with ring-type, is arranged to Only the example of bottom edge portion upper surface of the first diaphragm of covering is illustrated, but according to another embodiment of the utility model, Second diaphragm can also all cover the first diaphragm upper surface, be formed on the whole with 2 foldings.

More specifically, referring to Fig.1 8, diaphragm 214 includes the first diaphragm 214a and the second diaphragm 214b, described first every Film 214a includes in the first bottom plate central portion 214a " contacted to 220 pressure dwell of grinding pad and to surround first The first bottom edge portion 214a' that mode around bottom plate central portion 214a " is formed, the second diaphragm 214b include configuration In the first bottom plate central portion 214a " the second bottom plate central portion 214b of upper surface " and to surround the second bottom plate central portion Mode around 214b " forms and is configured at the second bottom edge portion 214b' of the first bottom edge portion upper surface 214a'.

Preferably, the second bottom edge portion 214b' is formed to have the thickness thicker than the second bottom plate central portion 214b ". It is highly preferred that the second bottom edge portion 214b' be formed to have along the second diaphragm 214b radial direction from inside to outside gradually The thickness to thicken is formed in the upper surface of the second bottom edge portion 214b' with the radial direction along the second diaphragm 214b And the inclined surface 214c of the height gradually risen from inside to outside.Wherein, the inclined surface 214c of the second bottom edge portion 214b' can To have the plane of the height gradually risen from inside to outside along the radial direction of the second diaphragm 214b or curved surface to be formed.

In addition, the first diaphragm 214a and the second diaphragm 214b can be formed with mutually different material.As an example, First diaphragm 214a and the second diaphragm 214b can be improved pressure and act on center to be formed with different rigid material The effect in portion.Preferably, the second diaphragm 214b is to have rigid material relatively lower than the first diaphragm 214a to be formed.For example, The textile (fabric textile) of certain one Fiber Materials utilized above in first diaphragm 214a and the second diaphragm 214b, The textile (metalic textile) of metal material, rubber, silicon, at least certain one is formed in polyurethane, and can choose The rigidity of second diaphragm 214b is than the first diaphragm 214a rigid phase to lower material.It according to circumstances, can also be with identical or class As material formed the first diaphragm 214a and the second diaphragm 214b.

As described above, by means of making the second diaphragm 214b that there is rigidity lower than the first diaphragm 214a, referring to Fig.1 8, Pressure is applied in the state of the second upper surface diaphragm 214b, induces the deformation extent ratio so that the bottom plate of the second diaphragm 214b First diaphragm 214a bottom deformation is bigger, and the bottom plate central portion of the second diaphragm 214b is adjacent to the first diaphragm 214a bottom plate central portion While, act on larger pressure downwards, meanwhile, the bottom edge portion for becoming the first diaphragm 214a is adjacent to grinding pad 220 or subtle tilting state (x of Figure 17).

For example, appropriate big in the pressure for being applied to the second diaphragm 214b, between the first diaphragm 214a and grinding pad between Gap be arranged it is sufficiently big in the case where, the edge part of the first diaphragm 214a becomes relative to grinding pad 220 shape of subtle tilting State (x of Figure 17), and pressure can not be made to be acted on downwards, by means of the bottom plate central portion 214a " of the first diaphragm 214a The pressure that 220 central portion of grinding pad is released, grinding pad is pushed out, consequently only that smaller pressure acts on the side of grinding pad 220 Edge.As a result, in the grinding process of substrate, the linear velocity in the Rotation of central portion and edge part that can compensate grinding pad 220 is inclined Amount of grinding difference caused by poor per unit time equably adjusts the amount of grinding to substrate entirety surface, improves grinding quality.

On the other hand, do not have greatly or between the first diaphragm 214a and grinding pad very much in the pressure for being applied to the second diaphragm 214b Have in the very small situation in gap or gap, the edge part of the first diaphragm 214a is also adjacent to grinding pad 220 (referring to Fig.1 8), together When, the bottom surface of the second diaphragm 214b also becomes the state for being adjacent to the first upper surface diaphragm 214a.Wherein, in the first diaphragm 214a Upper surface be equipped with and be formed with the second diaphragm 214b, second bottom edge portion 214b' of the second bottom edge portion 214b' With the thickness gradually to thicken than the second bottom plate central portion 214b ", therefore, even if in the second bottom plate central portion 214b " and second The inclined surface 214c of bottom edge portion 214b' applies identical pressure (pressure caused by single pressure chamber) P, in contact first 220 central portion of grinding pad of bottom plate central portion 214a " can apply the grinding pad than the second bottom edge portion 214b' contact The relatively bigger pressure in 220 edge parts (grinding pad is stressed on the pressure of substrate by P2).That is, referring to Fig.1 8, in the second bottom plate Centre portion 214b " the pressure P that vertically applies of upper surface by the first bottom plate central portion 214a ", can directly transmit (P2) and arrive The central portion of grinding pad 220.The pressure P for being applied to the inclined surface 214c of the second bottom edge portion 214b' includes vertically at component P (y) with horizontal component power P (x), grinding pad only is transmitted to by the first bottom edge portion 214a' at component P (y) vertically 220, in the edge part of grinding pad 220, apply the pressure (P1=P (y)) more relatively smaller than central portion.

As previously mentioned, the utility model to apply smaller pressure in the edge part of diaphragm 214, in 214 central portion of diaphragm Apply larger pressure, by means of this, can be adjusted different from each other by the region (edge part is relative to central portion) of grinding pad 220 Amount of grinding is saved, thus amount of grinding deviation caused by the linear velocity difference in each region of grinding pad 220 can be made to realize and minimized, is improved The grinding uniformity of substrate W.

In addition, apply in the mode of uniform pressure on the whole to diaphragm, the problem is that, grinding pad is in each region It unevenly wears, the replacement cycle, (for example, carrying out grinding base plate using 4 grinding pads) was short, it is difficult to make the equal of grinding pad 220 Even grinding section (can use a grinding pad and equably grind region) increases.But the utility model is by means of making It obtains and applies different pressure by 214 region of diaphragm, the uneven wear phenomenon of grinding pad 220 can be made to realize and minimized, extended Replacement cycle (for example, carrying out grinding base plate using 3 grinding pads) can be such that the uniform grinding section of grinding pad 220 increases, and Improve substrate W treatment effeciency.

Bottom surface illustrates the substrate board treatment of the utility model second embodiment.Moreover, for aforementioned composition it is identical and It is equivalent to identical part, is assigned same or equivalent in identical appended drawing reference, omission detailed description thereof.

Referring to Fig.1 9 to Figure 25, the diaphragm 1214 of the substrate board treatment of the utility model second embodiment includes: bottom plate 1214a is contacted with grinding pad 1220；Next door 1214b extends to form in the upper surface of bottom plate 1214a, forms multiple pressure chamber C1-1,C1-2,C2-1,C2-2,C2-3.(referring to Fig.1 9)

In multiple pressure chamber C1-1, C1-2, C2-1, C2-2, C2-3, the pressure for measuring pressure respectively can be provided Sensor (is not shown) on figure.The pressure of each pressure chamber C1-1, C1-2, C2-1, C2-2, C2-3 can be controlled according to pressure The control in portion's (being not shown on figure) and individually adjust, adjustable each pressure chamber C1-1, C1-2, C2-1, C2-2, C2-3's Pressure individually (for example, different from each other) is adjusted the pressure pressurizeed to substrate by 1220 region of grinding pad.

More specifically, 1214 bottom surface of diaphragm pressurizeed to grinding pad 1220, is divided into multiple pressurised zone Z1-1, Z1- 2、Z2-1、Z2-2、Z2-3。

Wherein, so-called pressurised zone Z1-1, Z1-2, Z2-1, Z2-2, Z2-3 are defined as being divided and being connect by next door 1214b The bottom plate 1214a base surface area for touching 1220 upper surface of grinding pad, in each pressurised zone Z1-1, Z1-2, Z2-1, Z2-2, Z2-3, Individually apply mutually different pressure.

The number and size of pressure span can diversely be changed according to desired condition and design pattern.As one Example, the bottom plate 1214a for forming 1214 bottom surface of diaphragm may include 5 pressurised zones Z1-1, Z1-2, Z2-1, Z2-2, Z2-3. According to circumstances, it also may include 4 or less or 6 or more pressurised zones and constitute diaphragm.

Next door 1214b may be constructed to divide pressurised zone according to desired condition and design pattern with varied shapes. Preferably, next door 1214b is formed with ring-type, along the radial direction of diaphragm 1214 divide multiple pressurised zone Z1-1, Z1-2, Z2-1, Z2-2, Z2-3, multiple pressurised zones are formed with ring-type.According to circumstances, be also configured to make multiple pressurised zones along The circumferencial direction of diaphragm divides, or divides by lattice shape or other different shapes.

Therefore, can by means of from pressure regulating part (being not shown on figure) to each pressure chamber C1-1, C1-2, C2-1, The air pressure of C2-2, C2-3 supply, is arranged the pressure divergence along 1214 radial direction of diaphragm, applies to grinding pad 1220 and presses Power.By the radial direction along diaphragm 1214, apply pressure different from each other to grinding pad 1220, so as to remove edge The thickness deviation of 1010 radial direction of substrate.For example, in the state for obtaining the thickness distribution relative to the whole plate face of substrate 1010 Under, the thickness measure for substrate obtains biggish region, compared with the thickness measure of substrate obtains smaller region, is applied to pressure The pressure of power chamber adjusts bigger, and substrate thickness can be accurately adjusted to desired distribution shape on the whole.

If referring again to Figure 19 to Figure 23, second embodiment according to the present utility model, in the top shape of diaphragm 1214 At having by multiple pressure chamber C1-1, C1-2, C2-1, C2-2, C2-3 of independent Ground Split, and from the central portion of grinding pad 1220 The first pressure for being applied to substrate W is greater than the second pressure that substrate W is applied to from 1220 edge part of grinding pad.

This is to improve the grinding uniformity of substrate W to adjust amount of grinding by the region of grinding pad 1220.

That is, in grinding pad relative in fixed substrate rotation and the mode ground, due to the central portion of grinding pad Linear velocity (v=rw) difference between grinding pad edge part, it may appear that amount of grinding is uneven.

Especially because the linear velocity of grinding pad edge part is greater than the linear velocity of grinding pad central portion, therefore, grinding pad side The amount of grinding of edge will appear to be greater than the amount of grinding of grinding pad central portion, therefore, it may occur that the grinding homogeneity deviation of substrate.

But the utility model is greater than by being applied to the first pressure of substrate W from 1220 central portion of grinding pad from grinding The second pressure that 1220 edge parts are applied to substrate W is padded, it can be different by the central portion and edge part of grinding pad 1220 Ground adjusts amount of grinding, thus can eliminate the thickness deviation of substrate W, equably adjusts the thickness curve of substrate W on the whole, can be with Improve the grinding quality of substrate W.

More specifically, 1214 bottom surface of diaphragm (bottom plate) pressurizeed to grinding pad 1220, including multiple pressurised zone Z1, Z2, multiple pressurised zone Z1, Z2 pressurize to grinding pad 1220 with mutually different pressure.

Preferably, pressurised zone Z1, Z2 of diaphragm 1214 are divided along 1214 radial direction of diaphragm (for example, being divided into It is cyclic annular).As an example, diaphragm 1214 include be configured at 1220 central portion region of grinding pad the first pressurised zone Z2, with And it is formed in the mode surrounded around the first pressurised zone Z2 and is configured at the second pressurised zone of 1220 fringe region of grinding pad Z1。

Wherein, the first pressurised zone Z2 of so-called diaphragm 1214 is defined as that the pressurization of 1220 central portion of a grinding pad will be used for Higher first pressure P2 ", P2', P needed for substrate are applied to the region of 1220 central portion of grinding pad.In addition, so-called diaphragm 1214 the second pressurised zone Z1 is defined as that 1220 edge part of grinding pad will be used to stress on lower second needed for substrate Pressure P1', P1 is applied to the region of 1220 edge part of grinding pad.

Preferably, the first pressurised zone Z2 and the second pressurised zone Z1 are mutually concentrically configured.

In addition, the first pressurised zone Z2 can be sub-divided into multiple first cut section Z2-1, Z2-2, Z2-3.Wherein, so-called First cut section Z2-1, Z2-2, Z2-3 is defined as the multiple areas that can individually control for being split to form the first pressurised zone Z2 (zone)。

More specifically, the first pressurised zone Z2 may include along the radial direction of diaphragm 1214 divided multiple One cut section Z2-1, Z2-2, Z2-3, the pressure of each first cut section Z2-1, Z2-2, Z2-3 individually control.As one Example, the first pressurised zone Z2 may include 3 first cut sections Z2-1, Z2-2, Z2-3.According to circumstances, it is also possible to first Pressurised zone include 4 or more or 2 the first cut sections below, not the utility model by the first cut section number and Interval limits or limits (along the width of radial direction).

Similarly, the second pressurised zone Z1 can be sub-divided into multiple second cut section Z1-1, Z1-2.Wherein, so-called Two cut section Z1-1, Z1-2 are defined as the multiple areas that can individually control for being split to form the second pressurised zone Z1.

More specifically, the second pressurised zone Z1 may include along the radial direction of diaphragm 1214 divided multiple Two cut section Z1-1, Z1-2, the pressure of each second cut section Z1-1, Z1-2 are individually controlled.As an example, Two pressurised zone Z1 may include 2 second cut sections Z1-1, Z1-2.According to circumstances, being also possible to the second pressurised zone includes 3 or more the second cut sections, not the utility model is by the number of the second cut section and interval (along the width of radial direction) It limits or limits.

As described above, the first pressurised zone Z2 is subdivided into multiple first cut section Z2-1, Z2-2, Z2-3, second is added Intermediate pressure section Z1 is subdivided into multiple second cut section Z1-1, Z1-2, by means of this, can further segment and fine adjustment first adds The pressure distribution of intermediate pressure section Z2 and the pressure of the second pressurised zone Z1 are distributed.

In the second pressurised zone Z1, the pressure less than the first pressurised zone Z2 is applied to grinding pad 1220.This is to make Because amount of grinding is inclined caused by the linear velocity of 1220 edge part of grinding pad is more relatively higher than the linear velocity of 1220 central portion of grinding pad Difference, which is realized, to be minimized.

9 and Figure 20 referring to Fig.1 forms oriented second pressurised zone Z1 and applies second on the top of the second pressurised zone Z1 The second pressure cavity C 1 of pressure forms oriented first pressurised zone Z2 and applies described in ratio on the top of the first pressurised zone Z2 The first pressure chamber C2 of the big first pressure P2 " of second pressure P1', P1, P2', P.

More specifically, second pressure cavity C 1 includes that pressure is applied independently to multiple second cut section Z1-1, Z1-2 Multiple second segmentation pressure chamber C1-1, C1-2 of P1', P1, first pressure chamber C2 includes to multiple first cut section Z2- 1, multiple first segmentation pressure chamber C2-1, C2-2, C2-3 of pressure P2 ", P2', P are applied independently in Z2-2, Z2-3.

The pressure curve of grinding pad is applied to by means of diaphragm 1214, can according to desired condition and design pattern and Diversely change.

Preferably, apply the radius along diaphragm 1214 in multiple first cut section Z2-1, Z2-2, Z2-3 referring to Figure 21 The pressure (P2 " > P2' > P) that direction is gradually reduced outward from center, in multiple second cut section Z1-1, Z1-2, apply along The pressure (P1' > P1) that the radial direction of diaphragm 1214 is gradually reduced from inside to outside.

It is highly preferred that being applied to the pressure curve of grinding pad 1220 by means of diaphragm 1214, grinding pad is located at inflection point Circular shape (semi-spherical shape) formation at 1220 centers.In other words, grinding pad 1220 is applied to by means of diaphragm 1214 Pressure curve, with the circular shape shape of central portion (center) high (P2 ", P2', P2), edge part (edge) low (P1', P1) At.

As reference, it is applied to the pressure curve of grinding pad 1220 by means of diaphragm 1214, can be shown as by each point It cuts area Z2-1, Z2-2, Z2-3, Z1-1, Z1-2 and constitutes stairstepping by stages, but can also be to each cut section Z2-1, Z2- 2, the pressure of Z2-3, Z1-1, Z1-2 are averaged or are segmented, and embody the pressure curve of circular shape.

As described above, making the pressure for being applied to grinding pad 1220 high in grinding pad central portion, Xiang Bianyuan gradually becomes smaller, borrows Help this, amount of grinding deviation caused by the linear velocity deviation of 1220 radial direction of grinding pad can be made to be further minimized.

According to circumstances, as shown in figure 22, it is bent to be also possible to the pressure for being applied to grinding pad 1220 by means of diaphragm 1214 Line is formed with triangle (for example, isosceles triangle) shape that inflection point is located at 1220 center of grinding pad, from 1220 center of grinding pad To edge part (edge), the pressure for being applied to grinding pad 1220 is increasingly in linear reduction in portion (center).

Similarly, it is applied to the pressure curve of grinding pad 1220 by means of diaphragm 1214, can be shown as by each segmentation Area Z2-1, Z2-2, Z2-3, Z1-1, Z1-2 and constitute stairstepping by stages, but can to each cut section Z2-1, Z2-2, The pressure of Z2-3, Z1-1, Z1-2 are averaged or are segmented, and linear triangular shaped pressure curve is embodied.

Differently, as shown in figure 23, it is also possible to be applied to the pressure curve of grinding pad 1220 by means of diaphragm 1214 It uniformly (P2) is formed in central portion (center), at edge part (edge) with the radial direction along diaphragm 1214 and from introversion The shape for being gradually reduced (P1', P1) outside is formed.

Wherein, the so-called pressure curve for being applied to grinding pad 1220 central portion (center) uniformly, be defined as being formed Multiple first cut section Z2-1, Z2-2, Z2-3 of first pressurised zone Z2, apply the pressure of homogeneity range.It differently, can also be with It is to apply the pressure of homogeneity range in second cut section Z1-1, Z1-2, or apply pressure in a manner of being constituted stairstepping stage by stage Power.

On the other hand, it is also possible to referring to Figure 24 and Figure 25 according to the utility model second embodiment with dual structure shape At diaphragm 1214.

More specifically, diaphragm 1214 includes the first diaphragm 1214a of contact grinding pad 1220, is located at the first diaphragm Second diaphragm 1214b of the upside of 1214a.

It as an example, include the first bottom plate for contacting grinding pad 1220 referring to Figure 24, the first diaphragm 1214a 1214a', the first side plate 1214a " extended to form in the first bottom plate 1214a' perimeter to top.Moreover, the second diaphragm 1214b includes prolonging positioned at the second bottom plate 1214b' of the upside of the first bottom plate 1214a', in the upper surface of the second bottom plate 1214b' Stretch the next door 1214b " to form and be formed multiple pressure chamber.

In addition, being formed with constraint protrusion 1214c, the constraint protrusion 1214c in the upper surface of the first diaphragm 1214a protrusion Relative to the first diaphragm 1214a, determines the position of the second diaphragm 1214b and constrained, to fix position.Show as one Example, constraint protrusion 1214c can be formed with ring-type, and the second bottom plate 1214b' can be to be inserted in constraint protrusion 1214c inner peripheral surface Mode it is restrained.As described above, constraint protrusion 1214c is formed in the upper surface of the first diaphragm 1214a, so that the second diaphragm 1214b is restrained, by means of this, can stably keep configuration shape of the second diaphragm 1214b relative to the first diaphragm 1214a State, and pressure can be steadily transmitted to grinding pad 1220.Differently, it is also possible to the second diaphragm being pasted on the first diaphragm Upper surface, or formed by means of dual injection, the first diaphragm of integral production and the second diaphragm.

At this point, the first diaphragm 1214a and the second diaphragm 1214b can be formed with same or similar material, not this reality It is limited or is limited with the novel material by the first diaphragm 1214a and the second diaphragm 1214b.

Differently, the first diaphragm 1214a and the second diaphragm 1214b can be formed with mutually different material.As one Example, the first diaphragm 1214a and the second diaphragm 1214b with different rigid material to form.Wherein, so-called rigidity, It is defined as including in the rigidity of draw direction, bending direction, compression direction more than certain one.Preferably, the second diaphragm 1214b with It is formed with rigid material more relatively low than the first diaphragm 1214a.

For example, more than certain one can use the textile of Fiber Materials in the first diaphragm 1214a and the second diaphragm 1214b The textile (metalic textile) of (fabric textile), metal material, rubber, silicon, at least certain one in polyurethane It is formed.According to circumstances, it is also possible to form the second diaphragm using the material of inductility.

As another example, referring to Figure 25, including contacting the first bottom plate 1214a' of grinding pad 1220, in the first bottom plate The first side plate 1214a " that 1214a' perimeter is extended to form to top, and the second diaphragm 1214b includes being located at the first bottom plate Second bottom plate 1214b' of the upside of 1214a', it is extended to form in the upper surface of the second bottom plate 1214b' and forms multiple pressure In the next door 1214b ", extended to form in the second bottom plate 1214b' perimeter to top and be located at the first side plate 1214a " of chamber The second side plate 1214b " ' on surface.

The inner surface of second side plate 1214b " ' be adjacent to the first side plate 1214a " is equipped with, and by means of this, can be stably kept Configuration status of the second diaphragm 1214b relative to the first diaphragm 1214a.

As described above, the utility model makes the pressure bigger than the pressure (second pressure) for being applied to 1214 edge part of diaphragm Power (first pressure) is applied to the central portion of diaphragm 1214, can (edge part is opposite by 1220 region of grinding pad by means of this In central portion) and amount of grinding is adjusted different from each other, thus can make caused by the linear velocity difference in each region of grinding pad 1220 Amount of grinding deviation, which is realized, to be minimized, and improves the grinding uniformity of substrate W.

In addition, apply in the mode of uniform pressure on the whole to diaphragm, the problem is that, grinding pad is in each region It unevenly wears, the replacement cycle, (for example, carrying out grinding base plate using 4 grinding pads) was short, it is difficult to make grinding pad 1220 Uniformly grinding section (can use a grinding pad and equably grind region) increases.But the utility model make by 1214 region of diaphragm applies different pressure, by means of this, the uneven wear phenomenon of grinding pad 1220 can be made to realize minimum Change, extends replacement cycle (for example, carrying out grinding base plate using 3 grinding pads), the uniform grinding section of grinding pad 1220 can be made Increase, improves substrate W treatment effeciency.

As described above, the preferred embodiment referring to the utility model is illustrated, but as long as being relevant art field Skilled practitioner is just it will be appreciated that thought and field in the utility model carried without departing from utility model claims secretary In range, the utility model diversely can be revised and changed.

Claims (50)

1. a kind of substrate board treatment, for carrying out the grinding process of substrate characterized by comprising

Grinding pad, the upper surface for grinding base plate；

Grinding head has the diaphragm contacted with the grinding pad upper surface, is moved relative to the substrate.

2. substrate board treatment according to claim 1, which is characterized in that

On the top of the diaphragm, it is formed with the single pressure chamber that connection is one,

The first pressure for being applied to the substrate from the central portion of the grinding pad, which is greater than from the edge part of the grinding pad, to be applied To the second pressure of the substrate.

3. substrate board treatment according to claim 2, which is characterized in that

In the bottom plate central portion of the diaphragm, apply the first pressure that the grinding pad is stressed on to the substrate；Institute The bottom edge portion of diaphragm is stated, the second pressure that the grinding pad is stressed on to the substrate is applied.

4. substrate board treatment according to claim 3, which is characterized in that

Mode around bottom plate central portion of the bottom edge portion of the diaphragm to surround the diaphragm is formed.

5. substrate board treatment according to claim 3, which is characterized in that

The bottom edge portion of the diaphragm is formed as the bottom plate central portion that thickness is thicker than the diaphragm.

6. substrate board treatment according to claim 5, which is characterized in that

The bottom edge portion of the diaphragm is formed to have the thickness gradually to thicken from inside to outside along the radial direction of the diaphragm Degree.

7. substrate board treatment according to claim 6, which is characterized in that

The bottom surface of the bottom plate central portion of the bottom surface and diaphragm in the bottom edge portion of the diaphragm constitutes same plane.

8. substrate board treatment according to claim 2, which is characterized in that

The bottom plate central portion of the diaphragm is contacted with the grinding pad,

The bottom edge portion of the diaphragm is separated from the grinding pad.

9. substrate board treatment according to claim 8, which is characterized in that

Mode around bottom plate central portion of the bottom edge portion of the diaphragm to surround the diaphragm is formed.

10. substrate board treatment according to claim 8, which is characterized in that

The bottom edge portion of the diaphragm is formed as plane.

11. substrate board treatment according to claim 8, which is characterized in that

The bottom edge portion of the diaphragm is formed as curved surface.

12. substrate board treatment according to claim 8, which is characterized in that

The shape that the bottom edge portion of the diaphragm is gradually increased from inside to outside with the radial direction along the diaphragm, from described Grinding pad separates.

13. substrate board treatment according to claim 2, which is characterized in that

The bottom plate central portion of the diaphragm is contacted with the grinding pad,

Including the intermediate member being configured between the bottom edge portion of the diaphragm and the upper surface of the grinding pad.

14. substrate board treatment according to claim 13, which is characterized in that

Apply the first pressure that the grinding pad is stressed on to the substrate from the bottom plate central portion of the diaphragm；From described Intermediate member applies the second pressure that the grinding pad is stressed on to the substrate.

15. substrate board treatment according to claim 14, which is characterized in that

Mode around bottom plate central portion of the intermediate member to surround the diaphragm is formed.

16. substrate board treatment according to claim 14, which is characterized in that

The intermediate member is formed to have the thickness gradually to thicken from inside to outside along the radial direction of the diaphragm.

17. substrate board treatment according to claim 14, which is characterized in that

The bottom edge portion of the diaphragm and the upper surface of the intermediate member form face contact.

18. substrate board treatment according to claim 2, which is characterized in that

The grinding head includes:

Body part, in bottom surface equipped with the diaphragm；

Grinding pad snap ring is connect with the body part, is configured at around the diaphragm；

Snap ring extension extends from the grinding pad snap ring, be configured at the diaphragm bottom edge portion and the grinding pad Between upper surface；

Retainer ring pressure chamber is formed in the top of the snap ring extension；

The bottom plate central portion of the diaphragm is contacted in the inside of the snap ring extension with the grinding pad.

19. substrate board treatment according to claim 18, which is characterized in that

In the bottom plate central portion of the diaphragm, apply the first pressure that the grinding pad is stressed on to the substrate；

In the snap ring extension, apply the second pressure that the grinding pad is stressed on to the substrate.

20. substrate board treatment according to claim 19, which is characterized in that

Mode around bottom plate central portion of the snap ring extension to surround the diaphragm is formed.

21. substrate board treatment according to claim 19, which is characterized in that

The snap ring extension has the thickness gradually to thicken from inside to outside along the radial direction of the diaphragm.

22. substrate board treatment according to claim 2, which is characterized in that the diaphragm includes:

First diaphragm is contacted with the grinding pad；

Second diaphragm, positioned at the upside of first diaphragm.

23. substrate board treatment according to claim 22, which is characterized in that

The second diaphragm stacking is configured at the upper surface in the bottom edge portion of first diaphragm.

24. substrate board treatment according to claim 23, which is characterized in that

Second diaphragm is formed with ring-type, to surround around the bottom plate central portion of first diaphragm.

25. substrate board treatment according to claim 23, which is characterized in that

Second diaphragm has the thickness gradually to thicken from inside to outside along the radial direction of first diaphragm.

26. substrate board treatment according to claim 25, which is characterized in that

It is formed with inclined surface in the upper surface of second diaphragm, the inclined surface has the radius side along first diaphragm To the height gradually risen from inside to outside.

27. substrate board treatment according to claim 26, which is characterized in that

The inclined surface is formed as curved surface.

28. substrate board treatment according to claim 26, which is characterized in that

The inclined surface is formed as plane.

29. substrate board treatment according to claim 23, which is characterized in that

Including constraint protrusion, the constraint protrusion protrusion is formed in the upper surface of first diaphragm, determines second diaphragm Allocation position relative to first diaphragm.

30. substrate board treatment according to claim 22, which is characterized in that

First diaphragm include: the first bottom plate central portion contacted in grinding process with the grinding pad and with surround The first bottom edge portion that mode around the first bottom plate central portion is formed；

Second diaphragm includes positioned at the second bottom plate central portion of the upside of the first bottom plate central portion and to surround State the second bottom edge portion that the mode around the second bottom plate central portion formed and be located at the upside in first bottom edge portion.

31. substrate board treatment according to claim 30, which is characterized in that

Second bottom edge portion is formed as thickness and is thicker than the second bottom plate central portion.

32. substrate board treatment according to claim 31, which is characterized in that

Be formed with inclined surface in the upper surface in second bottom edge portion, the inclined surface along second diaphragm radius Direction gradually rises from inside to outside.

33. the substrate board treatment according to any one of claim 2 to 32, which is characterized in that

It is applied to the circular shape that there is the pressure curve of the grinding pad inflection point to be located at the grinding pad center.

34. the substrate board treatment according to any one of claim 2 to 32, which is characterized in that

There is the pressure curve for being applied to the grinding pad inflection point to be located at the triangular shaped of the grinding pad center.

35. the substrate board treatment according to any one of claim 2 to 32, which is characterized in that

In the central portion of the grinding pad, the first pressure is applied with uniform range.

36. substrate board treatment according to claim 1, which is characterized in that

On the top of the diaphragm, it is formed with by multiple pressure chamber of independent Ground Split, is applied from the central portion of the grinding pad The first pressure for being added to the substrate is greater than the second pressure that the substrate is applied to from the edge part of the grinding pad.

37. substrate board treatment according to claim 36, which is characterized in that

Multiple pressor areas are divided into along the radial direction of the diaphragm to the bottom surface of the diaphragm of grinding pad pressurization Domain, the multiple pressure chamber individually apply mutually different pressure to the multiple pressurised zone.

38. the substrate board treatment according to claim 37, which is characterized in that

The diaphragm includes the first pressurised zone and is formed and be configured in the mode surrounded around first pressurised zone Second pressurised zone of the fringe region of the grinding pad, and

On the top of second pressurised zone, the second pressure that oriented second pressurised zone applies the second pressure is formed Power chamber,

On the top of first pressurised zone, the institute that oriented first pressurised zone is applied more than the second pressure is formed State the first pressure chamber of first pressure.

39. the substrate board treatment according to claim 38, which is characterized in that

First pressurised zone is concentric with the second pressurised zone configuration.

40. the substrate board treatment according to claim 38, which is characterized in that

First pressurised zone includes divided multiple first cut sections of radial direction along the diaphragm,

The first pressure chamber includes independently applying stressed multiple first segmentations pressure chamber to first cut section.

41. substrate board treatment according to claim 40, which is characterized in that

In the multiple first cut section, along the radial direction of the diaphragm, it is applied and is gradually reduced outward from center Pressure.

42. substrate board treatment according to claim 40, which is characterized in that

In the multiple first cut section, it is applied evenly pressure.

43. the substrate board treatment according to claim 38, which is characterized in that

Second pressurised zone includes divided multiple second cut sections of radial direction along the diaphragm,

The second pressure chamber includes independently applying stressed multiple second segmentations pressure chamber to second cut section.

44. substrate board treatment according to claim 43, which is characterized in that

In the multiple second cut section, along the radial direction of the diaphragm, it is applied the pressure being gradually reduced from inside to outside.

45. the substrate board treatment according to claim 37, which is characterized in that

The diaphragm includes:

Bottom plate is contacted with the grinding pad；

Next door extends to form in the upper surface of the bottom plate, forms the multiple pressure chamber.

46. the substrate board treatment according to claim 37, which is characterized in that

The diaphragm includes:

First diaphragm is contacted with the grinding pad；

Second diaphragm, positioned at the upside of first diaphragm.

47. substrate board treatment according to claim 46, which is characterized in that

First diaphragm includes:

First bottom plate is contacted with the grinding pad；

First side plate is extended to form in the perimeter of first bottom plate to top.

48. substrate board treatment according to claim 47, which is characterized in that

Second diaphragm includes:

Second bottom plate, positioned at the upside of first bottom plate；

Next door extends to form in the upper surface of second bottom plate, forms the multiple pressure chamber.

49. substrate board treatment according to claim 48, which is characterized in that

Second diaphragm further includes the second side plate, and second side plate extends in the perimeter of second bottom plate to top It is formed, positioned at the inner surface of first side plate.

50. substrate board treatment according to claim 48, which is characterized in that

Including constraint protrusion, the constraint protrusion protrusion is formed in the upper surface of first bottom plate, determines second diaphragm Allocation position relative to first diaphragm.