CN208289664U - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
- Publication number
- CN208289664U CN208289664U CN201721858388.4U CN201721858388U CN208289664U CN 208289664 U CN208289664 U CN 208289664U CN 201721858388 U CN201721858388 U CN 201721858388U CN 208289664 U CN208289664 U CN 208289664U
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- Prior art keywords
- substrate
- conveyer belt
- board treatment
- treatment according
- grinding
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model relates to substrate board treatments, and the substrate board treatment for carrying out substrate grinding process includes: loading part, are used to load substrate；Grind section comprising conveyer belt, substrate support, grinding unit, the conveyer belt can be along given route circulation rotatings, for placing the substrate transmitted by loading part, the substrate support is configured at the inside of conveyer belt, the bottom surface of supporting substrate, the upper surface of the grinding unit grinding base plate；Uninstalling portion is discharged in the substrate that grind section completes grinding.The advantageous effects that the utility model can obtain simplified processing substrate process, shorten the processing time.
Description
Technical field
The utility model relates to substrate board treatments, more specifically, are related to a kind of place that can simplify large-area substrates
Science and engineering sequence, the substrate board treatment for shortening the processing time.
Background technique
Recently, surging with being concerned about information display device, to utilizing the requirement of the information medium that can be carried also just
It is improving, while just carrying out in emphasis to cathode-ray tube (the Cathode Ray Tube for substituting original display device；CRT)
Light and thin type panel display apparatus (Flat Panel Display；FPD research and commercialization).
In this panel display apparatus field, light and handy so far and liquid crystal display device (the Liquid Crystal of little power consumption
Display Device；LCD) be the display device to attract most attention, but liquid crystal display device is not light-emitting component but light is first
Part, brightness, contrast (contrast ratio) and in terms of there are disadvantages, therefore it is active carry out to can gram
Take the exploitation of the new display device of this disadvantage.Wherein, as one of the display device of new generation to attract attention recently, have
Machine luminous display unit (OLED:Organic Light Emitting Display).
In general, use intensity and the outstanding glass substrate of permeability in display device, recently, display device tends to be tight
Gathering and high pixel (high-pixel) are changed, thus should can prepare glass substrate with this corresponding.
As an example, it as one of OLED process, crystallizes to amorphous silicon (a-Si) irradiation laser and to form polycrystalline
In ELA (Eximer Laser Annealing, Excimer-Laser Crystallization) process of silicon (poly-Si), polycrystalline is formed in crystallization
While silicon, protrusion can occur for surface, and unbalanced phenomena (mura-effects), therefore, glass base may occur for this protrusion
Plate should be ground, raised to remove.
For this purpose, having carried out being intended to the multiplicity research of high-efficient grinding substrate surface recently, but also far from enough, it is desirable that this into
Row exploitation.
Utility model content
Technical problem to be solved
The utility model aim is to provide a kind of processing substrate that can simplify processing substrate process, shorten the processing time
Device.
Especially the utility model aim is that it is possible to shorten the time needed when loading and the unloading of large-area substrates,
Improve productivity and yield.
In addition, the utility model aim is that it is possible to without interruption, processing substrate.
In addition, the utility model aim is that it is possible to simplify equipment, manufacturing expense can be saved.
In addition, the utility model aim is that it is possible to improve grinding stability and grinds uniformity.
Technical solution
According to the preferred embodiment in the utility model for being intended to reach described the utility model aim, substrate loading and unload
Other pickup process is excluded when load, using the conveyer belt of circulation rotating, handles substrate in a manner of online (Inline), so as to
Enough simplify processing substrate process, shortens the processing time.
One embodiment of the utility model provides a kind of substrate board treatment, for carrying out substrate grinding process, comprising: dress
Load portion loads substrate；Grind section comprising conveyer belt, substrate support, grinding unit, conveyer belt can be along given routes
Circulation rotating, the substrate for being transmitted in outer surface mount by loading part, substrate support are configured at the inside of conveyer belt, across
The bottom surface of conveyer belt supporting substrate, the upper surface of grinding unit grinding base plate；Uninstalling portion is discharged in grind section and completes grinding
Substrate.
Preferably, conveyer belt is along the path circulation rotating determined by roller unit, by means of the circulation rotating of conveyer belt
Transmit substrate.
Preferably, roller unit includes: the first roller；Second roller is separatedly configured with the first roller, and conveyer belt is along by first
The path circulation rotating that roller and the second roller determine.
Preferably, above be provided as can be selectively to close to each other or separate for any one in the first roller and the second roller
Direction moves linearly.
Preferably, substrate support configures opposite to each other with substrate bottom surface, supports the inner surface of conveyer belt.
Preferably, substrate support is adjacent to the internal surface configurations of conveyer belt.
Preferably, the inner surface of substrate support and conveyer belt separates configuration, in contactless state support conveyer belt
Surface.
Preferably, substrate support sprays fluid to the inner surface of conveyer belt, supports biography by means of the jet power of fluid
Send the inner surface of band.
Preferably, the first surface for being improved the coefficient of friction to substrate and inhibiting sliding is formed in the outer surface of conveyer belt
Layer.
Preferably, first surface layer is formed by engineering plastics.
Preferably, it is formed in the inner surface of conveyer belt and is improved the coefficient of friction to substrate support and inhibits the of sliding
Two superficial layers.
Preferably, second surface layer is formed by engineering plastics.
Preferably, loading part transmits substrate in height identical with conveyer belt, multiple loadings including collaboration transmission substrate
Transfer roller.
Preferably, uninstalling portion transmits substrate in height identical with conveyer belt, multiple unloadings including collaboration transmission substrate
Transfer roller.
Preferably, grinding unit includes grinding pad, and grinding pad is formed with the size for being less than substrate, to contact the state of substrate
Rotation and movement.
Preferably, including guard ring, the outer surface of conveyer belt is provided in a manner of the surrounding periphery for surrounding substrate.
Preferably, be formed through substrate receiving portion in guard ring, substrate substrate receiving portion placed inside in conveyer belt
Outer surface.
Preferably, including lift unit, it is selectively spaced from the inner surface of conveyer belt from substrate support.
Preferably, lift unit is after the grinding to substrate, during conveyer belt circulation rotating, make conveyer belt from
Substrate support separates.
Preferably, lift unit includes: carrying roller, is in rolling contact the inner surface of conveyer belt；Lifting unit selects carrying roller
Go up and down to property.
Preferably, including fixed cell is fixed and is transmitted if substrate is transmitted to abrasion site by means of conveyer belt
Band.
Preferably, fixed cell includes pressing element, and pressing element configures opposite to each other with carrying roller, selectively to conveyer belt
Outer surface pressurization.
Preferably, pressing element continuously pressurizes to conveyer belt outer surface along conveyor width direction.
Preferably, multiple grinding units are equipped with.
A kind of substrate board treatment of another embodiment of the utility model, for carrying out substrate grinding process, comprising: transmission
Band, along given route circulation rotating, in outer surface mount substrate；Substrate support is configured at the inside of conveyer belt,
The lower part of substrate is adjacent to the inner surface of support conveyer belt；Grinding unit, the upper surface of grinding base plate；Lift unit makes to pass
The inner surface of band is sent to be selectively spaced from from substrate support.
Preferably, if completing the grinding to substrate, lift unit makes conveyer belt during conveyer belt circulation rotating
It is separated from substrate support.
Preferably, lift unit includes: carrying roller, is in rolling contact the inner surface of conveyer belt；Lifting unit selects carrying roller
Go up and down to property.
Preferably, including fixed cell is fixed and is transmitted if substrate is transmitted to abrasion site by means of conveyer belt
Band.
Preferably, fixed cell includes pressing element, and pressing element configures opposite to each other with carrying roller, selectively to conveyer belt
Outer surface pressurization.
Preferably, pressing element continuously pressurizes to conveyer belt outer surface along conveyor width direction.
Preferably, for conveyer belt along the path circulation rotating determined by roller unit, roller unit includes the first roller and the first roller
The second roller separatedly configured.
Preferably, it is formed with first surface layer in the outer surface of conveyer belt, is formed with the second table in the inner surface of conveyer belt
Surface layer.
Preferably, any one in first surface layer and second surface layer is above is formed by engineering plastics.
Preferably, grinding unit includes grinding pad, and grinding pad is formed with the size for being less than substrate, to contact the state of substrate
Rotation and movement.
Preferably, including guard ring, the outer surface of conveyer belt is provided in a manner of the surrounding periphery for surrounding substrate.
Preferably, be formed through substrate receiving portion in guard ring, substrate substrate receiving portion placed inside in conveyer belt
Outer surface.
Preferably, it during carrying out mechanical polishing to substrate, together for being applied to the slurry of chemical formula grinding, and carries out
Chemical-mechanical polishing process.
The another embodiment of the utility model provides a kind of substrate board treatment, for carrying out substrate grinding process, comprising:
Conveyer belt is moved along given route, in outer surface mount substrate；Substrate support is configured at the inside of conveyer belt,
The lower part of substrate is adjacent to support conveyer belt inner surface；First pressing element is configured at substrate along the direction of transfer of substrate
Rear, selectively pressurize to the outer surface of conveyer belt；Second pressing element is configured at along the direction of transfer of substrate
The front of substrate selectively pressurizes to the outer surface of conveyer belt；Pressurized control portion is supported according to conveyer belt relative to substrate
The levelness in portion and control the first pressing element and the second pressing element.
Preferably, including measurement portion of the measurement conveyer belt relative to the levelness of substrate support, pressurized control portion according to
The signal of measurement portion measurement keeps any one in the first pressing element and the second pressing element above mobile, so as to conveyer belt phase
Horizontal is reached for the levelness of substrate support.
Preferably, including the first lift unit, it is configured opposite to each other with the first pressing element, selects the inner surface of conveyer belt
It is separated from substrate support to selecting property, the first lift unit corresponds to the movement of the first pressing element and selectively goes up and down.
Preferably, including the second lift unit, it is configured opposite to each other with the second pressing element, selects the inner surface of conveyer belt
It is separated from substrate support to selecting property, the second lift unit corresponds to the movement of the first pressing element and selectively goes up and down.
The another embodiment of the utility model provides a kind of substrate board treatment, for carrying out substrate grinding process, comprising:
Conveyer belt is moved along given route, in outer surface mount substrate；Substrate support is configured at the inside of conveyer belt,
The lower part of substrate is adjacent to the inner surface of support conveyer belt；First pressing element is configured at substrate along the direction of transfer of substrate
Rear pressurize if substrate is transmitted to abrasion site by means of conveyer belt to the outer surface of conveyer belt；Second pressurization structure
Part is configured at the front of substrate along the direction of transfer of substrate, if substrate is transmitted to abrasion site, to conveyer belt
Outer surface pressurization；Grinding unit grinds base in the state that the first pressing element and the second pressing element pressurize to conveyer belt
The upper surface of plate.
Preferably, including the first lift unit, it is configured opposite to each other with the first pressing element, supports the interior table of conveyer belt
Face.
Preferably, including the second lift unit, it is configured opposite to each other with the second pressing element, supports the interior table of conveyer belt
Face.
The another embodiment of the utility model provides a kind of substrate board treatment, for carrying out substrate grinding process, comprising:
Grind section comprising conveyer belt, substrate support, grinding unit, conveyer belt can be movably equipped with along given route, in appearance
Substrate is placed in face, and substrate support is configured at the inside of conveyer belt, across the bottom surface of conveyer belt supporting substrate, grinding unit grinding
The upper surface of substrate；Uninstalling portion, unloading are separated as conveyer belt is mobile to the direction separated from substrate bottom surface from conveyer belt
Substrate.
Preferably, conveyer belt transmits substrate along given route circulation rotating.
Preferably, conveyer belt is wound from a direction to other direction, transmits substrate.
Preferably, including guard ring, the appearance of conveyer belt is projectedly provided in a manner of the surrounding periphery for surrounding substrate
Face.
Preferably, be formed through substrate receiving portion in guard ring, substrate substrate receiving portion placed inside in conveyer belt
Outer surface.
Preferably, guard ring is formed to have thinner than substrate or identical thickness.
Utility model effect
In conclusion can obtain simplified processing substrate process according to the utility model, shorten the advantageous effect for handling the time
Fruit.
In particular according to the utility model, other pickup process is excluded when substrate loads and unloads, energy can be obtained
Enough shorten the advantageous effects of the time needed when substrate loading and unloading.
In addition, the advantageous effects for improving productivity and yield can be obtained according to the utility model.
In addition, the advantageous effects of processing substrate without interruption can be obtained according to the utility model.
In addition, can obtain can simplify equipment, save manufacturing expense according to the utility model, space utilization is improved
Advantageous effects.
In addition, the advantageous effects for improving grinding stability and grinding uniformity can be obtained according to the utility model.
Detailed description of the invention
Fig. 1 is the top view for illustrating the composition of substrate board treatment of the utility model.
Fig. 2 is the perspective view for the grind section for illustrating the substrate board treatment of the utility model.
Fig. 3 is the side view for the grind section for illustrating the substrate board treatment of the utility model.
Fig. 4 to fig. 6 is the figure of the substrate loading process for illustrating the substrate board treatment of the utility model.
Fig. 7 is the figure for the fixed cell for illustrating the substrate board treatment of the utility model.
Fig. 8 is the figure for the guard ring for illustrating the substrate board treatment of the utility model.
Fig. 9 is the top view for the abrasion path for the grinding unit for illustrating the substrate board treatment of the utility model.
Figure 10 is another example of the abrasion path for the grinding unit for illustrating the substrate board treatment of the utility model
Top view.
Figure 11 is the figure of another embodiment of the substrate support for illustrating the substrate board treatment of the utility model.
Figure 12 is the figure for the lift unit for illustrating the substrate board treatment of the utility model.
Figure 13 and Figure 14 is the figure of the substrate unloading process for illustrating the substrate board treatment of the utility model.
Figure 15 is the figure of another embodiment of the grind section for illustrating the substrate board treatment of the utility model.
Figure 16 is the figure for illustrating the substrate board treatment of another embodiment of the utility model.
Appended drawing reference
10: substrate board treatment 100: loading part
110: loading transfer roller 120: loading control unit
200: grind section 210: conveyer belt
212: the 212a: the first roller of roller unit
212b: the second roller 214: guard ring
214a: substrate receiving portion 220,220': substrate support
230: grinding unit 232: grinding pad
240: lift unit 242: carrying roller
244: lifting unit 250: fixed cell
252: pressing element 300: uninstalling portion
310: unloading transfer roller 320: Unloading Control portion
Specific embodiment
With reference to the accompanying drawings, the preferred embodiment of the utility model is described in detail, but the utility model is not by embodiment
It limits or limits.As reference, in the present note, identical symbol censures substantially the same element, under this rule,
The content recorded in other figures can be quoted to be illustrated, be judged as that practitioner is self-evident or content repeatedly can save
Slightly.
Referring to figs. 1 to Figure 15, the substrate board treatment 10 of the utility model includes: loading part 100, loads substrate W；It grinds
Mill portion 200 comprising conveyer belt 210, substrate support 220, grinding unit 230, the conveyer belt 210 can be along given route
It is equipped with to circulation rotating, in the substrate W of outer surface mount loading part 100 transmission, the substrate support 220 is configured at conveyer belt
210 inside, across conveyer belt 210, the bottom surface of supporting substrate W, the upper surface of the 230 grinding base plate W of grinding unit；Unloading
Portion 300 is discharged in the substrate W that grind section 200 completes grinding.
This is the treatment process in order to simplify substrate W, shortens the processing time.
That is, needing to utilize other pick device (example to make the substrate for being supplied to loading part be loaded into grind section in the past
Such as, substrate absorption device), be placed in grind section after loading part picks up substrate, then by substrate, thus load that substrate needs when
Between for several seconds~tens of seconds or so, there are problems that handling the time increases.Further, in the past in order to make complete grind substrate
It is unloaded to uninstalling portion, is needed using other pick device (for example, substrate absorption device), after grind section picks up substrate, then
The time that substrate is placed in uninstalling portion, thus unloads carried base board needs is or so several seconds~tens of seconds, there is the increase of processing time
The problem of.
But the utility model utilizes the directly quilt of conveyer belt 210 of circulation rotating in the substrate W for being supplied to loading part 100
In the state of transmission, the grinding process to substrate W is executed, substrate W is made to be transferred directly to uninstalling portion 300 on conveyer belt 210, from
And the treatment process of simplified substrate W can be obtained, shorten the advantageous effects of processing time.
In addition, the utility model excludes other pickup process in loading and the unloading of substrate W, circulation rotating is utilized
Conveyer belt 210 handles substrate W in a manner of online (Inline), it is hereby achieved that shortening the substrate W loading time, simplifying unloading
Process, the advantageous effects for shortening the time that substrate W is loaded and unloading needs.
Further, in the present invention, it does not need to be equipped with when substrate W is loaded and unloaded and be picked up needed for pickup substrate W
Device is taken, thus can simplify equipment and equipment, the advantageous effects for improving space utilization can be obtained.
Loading part 100 is used to the substrate W of processing to be ground being loaded into grind section 200.
Loading part 100 can be formed with various structure that substrate W can be loaded into grind section 200, and the utility model is simultaneously
The non-structure by loading part 100 is limited or is limited.
As an example, loading part 100 is provided as transmitting substrate W in height identical with conveyer belt 210, including by both
It is spaced the multiple loading transfer rollers 110 separatedly configured calmly, is supplied to multiple substrate W for loading 110 top of transfer roller with dressing
The rotation of transfer roller 110 is carried, and is cooperateed with and transmits by multiple loading transfer rollers 110.According to circumstances, loading part also may include by
In the tape loop for loading transfer roller and circulation rotating.
Wherein, so-called loading part 100 transmits substrate W in height identical with conveyer belt 210, is defined as loading part 100
It is configured at the height for allowing substrate W bending deformation and transmits substrate W.For example, state (the transmission base protruded in substrate from loading part
Plate is so that it exceeds the state for being configured at the loading transfer roller of most gabarit) under, it is contemplated that the protrusion part of substrate causes because of self weight
Bending deformation, loading part can be configured at the height (for example, within 10 ㎜) of slightly above conveyer belt.But, if it is possible to press down
The bending deformation of substrate processed, what the height and substrate W that substrate W is transmitted in loading part 100 were placed and transmitted in conveyer belt 210
Height can be same to each other.
Moreover, the substrate W of loading part 100 is supplied to before being supplied to loading part 100, by means of alignment unit (on figure
It is not shown), posture and position can be allow to be arranged as set posture and position.
As reference, as substrate W used in the utility model, the length that a side can be used is greater than four sides of 1m
Shape substrate W.As an example, it as the substrate W processed for executing chemical-mechanical polishing process, can be used with 1500
6th generation glass substrate W of 1850 ㎜ size of ㎜ *.According to circumstances, the 7th generation and eighth generation glass substrate are also used as being located
Manage substrate W.Different from this, the substrate (for example, second generation glass substrate) that side edge lengths are less than 1m also can be used.
Grind section 200 is used for the surface of grinding base plate W, including conveyer belt 210 and substrate support 220, grinding unit
230, the conveyer belt 210 can be equipped with along given route circulation rotating, in outer surface mount substrate W, the substrate support
Portion 220 is configured at the inside of conveyer belt 210, the bottom surface of supporting substrate W, the upper surface of the 230 grinding base plate W of grinding unit.
As reference, in the present invention, so-called 200 grinding base plate W of grind section, be defined as grind section 200 by
In the mechanical polishing process or chemical-mechanical polishing (CMP) process to substrate W and grinding base plate W.As an example, exist
During grind section 200 carries out the mechanical polishing to substrate W, while the slurry for being applied to chemical formula grinding, carry out chemical machine
Tool formula grinding process.
The adjacent loading part 100 of conveyer belt 210 configures, and is configured to carry out circulation rotation in a manner of Infinite Cyclic along given route
Turn.The substrate W of conveyer belt 210 is transmitted in the state of being placed in 210 outer surface of conveyer belt from loading part 100, with transmission
With 210 circulation rotating and transmitted.
More specifically, it can be revolved from the substrate W that loading part 100 is transmitted to conveyer belt 210 with the circulation of conveyer belt 210
Then to be placed in the state of 210 outer surface of conveyer belt, it is transmitted to abrasion site PZ (upper position of substrate support).Separately
Outside, the substrate W for completing grinding can be transmitted to 300 side of uninstalling portion from abrasion site PZ with the circulation rotating of conveyer belt 210.
The circulation rotating of conveyer belt 210 can be carried out in a manner of various according to desired condition and design specification.As
One example, conveyer belt 210 carries out circulation rotating along the path determined by roller unit 212, by means of the circulation of conveyer belt 210
Rotation, the substrate W for being placed in conveyer belt 210 are transmitted along linear travel paths.
The movement routine (for example, circulating path) of conveyer belt 210 can according to desired condition and design specification multiplicity
Ground change.As an example, roller unit 212 includes the first roller 212a and the second roller 212b, the second roller 212b from first
Roller 212a horizontally separates configuration, and conveyer belt 210 is followed in a manner of Infinite Cyclic by means of the first roller 212a and the second roller 212b
Ring rotation.
It is configured at this point, any one in the first roller 212a and the second roller 212b is above by means of common drive motor
(single motor or multiple motors) and rotate.According to circumstances, can have other deflector rolls between the first roller and the second roller (on figure
It is not shown), but the utility model is not limited or is limited by the number and configuration structure of deflector roll.Moreover, deflector roll may include
At least any one is constituted in driven roller (driving roller) and carrying roller (idleroller).
As reference, the outer surface of so-called conveyer belt 210, it is meant that it is exposed to the outer surface in 210 outside of conveyer belt,
Place substrate W in 210 outer surface of conveyer belt.Moreover, the inner surface of so-called conveyer belt 210, it is meant that with the first roller 212a and second
The inner surface of the conveyer belt 210 of roller 212b contact.
It is configured to selectively in addition, any one in the first roller 212a and the second roller 212b is above to close to each other
Or the direction linear movement separated.As an example, the first roller 212a is configured to be fixed, and the second roller 212b is constituted
To move linearly towards the direction for approaching or separating with the first roller 212a.As described above, according to manufacturing tolerance and assembling tolerance etc.,
By means of keeping the second roller 212b close relative to the first roller 212a or separating, the tension of adjustable conveyer belt 210.
Wherein, the so-called tension for adjusting conveyer belt 210, is defined as being tensioned or loosening conveyer belt 210 and adjust tension.Root
According to situation, it can also be equipped with other dance roller, mobile dance roller adjusts the tension of conveyer belt.However, it is preferred to move
More than any one in dynamic first roller and the second roller, so as to improve structure and space utilization.
In addition, being formed with first surface layer 210b, the first surface layer in the outer surface of conveyer belt 210 referring to Fig. 8
210b improves the coefficient of friction to substrate W, inhibits sliding.
As described above, being placed in by means of forming first surface layer 210b in the outer surface of conveyer belt 210 by substrate W
In the state of 210 outer surface of conveyer belt, movement (constraint sliding) of the substrate W relative to conveyer belt 210 can be constrained, can obtain
Stably keep the advantageous effects of the allocation position of substrate W.
First surface layer 210b can with substrate W have adhesiveness various material formed, the utility model not by
The material of first surface layer 210b is limited or is limited.As an example, first surface layer 210b (is rubbed with retractility and viscosity
Wipe power) outstanding engineering plastics are formed.It according to circumstances, can also be such as anti-to have with the other materials with antiskid function
The polyurethane of sliding function forms first surface layer.
Further, by means of forming the first surface layer 210b with retractility in the outer surface of conveyer belt 210, even if
Foreign matter is flowed between substrate W and conveyer belt 210, it is corresponding to the thickness of foreign matter, in the part where foreign matter, first surface layer
210b can also be depressed, it is thus possible to which eliminating the substrate W height tolerance as caused by foreign matter, (privileged site of substrate is due to foreign matter
Part protrusion), the advantageous effect of grinding uniformity reduced minimum caused by protruding the privileged site of substrate W locally can be obtained
Fruit.
At this point, it is preferred that first surface layer 210b is formed in whole outer surfaces of conveyer belt 210.
In addition, the inner surface in conveyer belt 210 could be formed with second surface layer 210c, the second surface layer 210c is mentioned
Height inhibits sliding to the coefficient of friction of substrate support 220.
As described above, by means of forming second surface layer 210c in 210 inner surface of conveyer belt, in the interior table of conveyer belt 210
In the state of face contact substrate support 220, movement (constraint cunning of the conveyer belt 210 relative to substrate support 220 can be constrained
It is dynamic), the advantageous effects for stably keeping the allocation position of conveyer belt 210 can be obtained.
Second surface layer 210c can be formed with the outstanding various material of the frictional force to substrate support 220, this is practical
It is novel not to be limited or limited by the material of second surface layer 210c.As an example, second surface layer 210c is to base
The frictional force of plate support portion 220 is outstanding, can easily be formed from the isolated engineering plastics of substrate support 220.According to circumstances,
Can also with the other materials with antiskid function, such as with antiskid function polyurethane formed second surface layer.
Preferably, conveyer belt 210 includes the enhancement layer being configured between first surface layer 210b and second surface layer 210c
210a。
That is, conveyer belt 210 only can also be constituted with first surface layer 210b and second surface layer 210c.But it if passes
It send band 210 only to be constituted with first surface layer 210b and second surface layer 210c, then during carrying out grinding process, may excessively send out
The problem of giving birth to the sagging of conveyer belt 210, declining accordingly, there exist grinding uniformity.Therefore, the utility model is by means of in the first table
The enhancement layer 210a with high-durability and intensity is formed between surface layer 210b and second surface layer 210c, can obtain makes to grind
The movement of conveyer belt 210 in process and the advantageous effects of minimizing deformation.
Enhancement layer can be formed with various material with high-durability and intensity.Preferably, enhancement layer is with engineering plastics
It is formed.At this point, enhancement layer needs and the circulation rotating together of conveyer belt 210, thus the thickness being required to can ensure circulation rotating
Degree is formed.As an example, the enhancement layer of engineering plastics material can be formed with 0.1~2 ㎜ thickness.According to circumstances, may be used
To form enhancement layer with steel (SUS) or non-woven fabrics material.
Substrate support 220 is configured at the inside of conveyer belt 210, is provided as across the bottom of 210 supporting substrate W of conveyer belt
Face.
More specifically, substrate support 220 is configured at the inside of conveyer belt 210 in the mode opposite with the bottom surface substrate W,
Support the inner surface of conveyer belt 210.
Substrate support 220 is configured to support conveyer belt in a manner of various according to desired condition and design specification
As an example as substrate support 220, Shi Zhipan can be used, substrate support 220 is adjacent to biography in 210 inner surface
It send band 210 internal surface configurations, supports the inner surface of conveyer belt 210.
As described above, can prevent by means of making substrate support 220 support the inner surface of conveyer belt 210 because substrate W's
Conveyer belt 210 is sagging caused by self weight and grinding unit 230 pressurize to substrate W.
Substrate support 220 is set forth below to be illustrated with the example that substantially four side plate shapes are formed.According to circumstances, substrate
Support portion 220 can be formed with other different shapes and structure, it is also possible by means 2 or more substrate supports 220 and prop up
Support the inner face of conveyer belt 210.
On the other hand, it in the utility model embodiment for preceding addressing diagram, lists and is configured to make substrate support 220
It is illustrated with the example of way of contact support 210 inner surface of conveyer belt, but according to circumstances, is also configured to support substrate
Portion 220' supports the inner surface of conveyer belt 210 in a non contact fashion.
The inner surface of referring to Fig.1 1, substrate support 220' and conveyer belt 210 separates configuration, with contactless state support biography
Send the inner surface of band 210.
Substrate support 220' can be configured to non-contact side according to desired condition and design specification in a manner of various
The inner surface of formula support conveyer belt 210.As an example, substrate support 220' is configured to the inner surface to conveyer belt 210
Fluid is sprayed, the inner surface of conveyer belt 210 is supported by means of the jet power JF of fluid.
At this point, substrate support 220' can spray gas (for example, air) and liquid to the inner surface of conveyer belt 210
In (for example, pure water) at least any one, the type of fluid can diversely be changed according to desired condition and design specification.
As described above, can obtain makes because of frictional resistance by means of with the inner surface of contactless state support conveyer belt 210
The advantageous effects for the treatment of effeciency reduced minimum caused by (factor for interfering conveyer belt mobile (rotation)).
According to circumstances, substrate support be also configured to using magnetic force (for example, repulsion, repulsive force) or
Buoyancy caused by ultrasonic activation supports the inner surface of conveyer belt 210 in a non contact fashion.
Grinding unit 230 is provided as to contact the surface of the state grinding base plate W of substrate W surface.
As an example, grinding unit 230 includes grinding pad 232, and the grinding pad 232 is with the size less than substrate W
It is formed, to contact state rotation and the movement of substrate W.
More specifically, it is installed on 232 carrier of grinding pad (being not shown on figure), to contact the state rotation of substrate W surface
And linearly grind the surface of (planarization) substrate W.
232 carrier of grinding pad can be form various structure of 232 rotation of grinding pad, and the utility model is not by grinding
The structure of mill 232 carriers of pad is limited or is limited.As an example, 232 carrier of grinding pad can be constituted with a main body, or
It is bonded by multiple main bodys, is configured to connect and rotate with drive shaft (being not shown on figure).In addition, in 232 carrier of grinding pad
Has the pressurization part for grinding pad 232 to be stressed on to substrate W surface (for example, the sky to pressurize with air pressure to grinding pad 232
Atmospheric pressure pressurization part).
Grinding pad 232 is to be suitble to the material for carrying out mechanical polishing to substrate W to be formed.For example, grinding pad 232 can use
Polyurethane, polyureas (polyurea), polyester, polyethers, epoxy resin, polyamide, polycarbonate, polyethylene, polypropylene, fluorine polymerization
Object, ethene polymers, acrylate copolymer, methylpropanoic acid alkene polymer, silicone, latex, nitrile rubber, isoprene rubber, poly- fourth
Various copolymer of rubber and styrene, butadiene and acrylonitrile and formed, the material and characteristic of grinding pad 232 can bases
It is required that condition and design specification and diversely change.
Preferably as grinding pad 232, the circular abrasive pad 232 with the size less than substrate W is used.That is, can also be with
Using having the grinding pad 232 of the size greater than substrate W to carry out grinding base plate W, but if using the size having greater than substrate W
Grinding pad 232 needs very big rotating equipment and space, accordingly, there exist space efficiencies then in order to make 232 rotation of grinding pad
And the problem of design freedom decline, stability decline.It is highly preferred that grinding pad can be formed to have and substrate lateral length
Or the corresponding diameter of longitudinal length, or it is formed to have 1/2 diameter less than substrate lateral length or longitudinal length.
Substantially, the length of substrate W at least a side has the size greater than 1m, therefore, makes with the ruler greater than substrate W
Very little grinding pad (for example, having the grinding pad greater than the diameter of 1m) rotation inherently there is a problem of highly difficult.In addition, if
Using non-circular grinding pad (for example, quadrangle grinding pad), then the surface of the substrate W ground by means of the grinding pad of rotation without
Method is ground into uniform thickness on the whole.But the utility model makes the circular abrasive pad 232 with the size less than substrate W
From grinding base plate W surface is transferred, so as to make grinding pad while greatly not reducing space efficiency and design freedom
232 from grinding base plate W is transferred, and can obtain the advantageous effects of the uniform amount of grinding for keeping grinding pad 232 on the whole.
At this point, the abrasion path of grinding unit 230 can diversely be changed according to desired condition and design specification.
As an example, referring to Fig. 9, grinding pad 232 is configured to along relative to inclined first oblique line in the one side substrate W
Path L1, zigzag movement is repeated to the opposite direction inclined second oblique line path L2 of the first oblique line path L1 and grinds
The surface of substrate W.
Wherein, so-called first oblique line path L1, it is meant that the path for example relative to the bottom edge substrate W inclination first retainer θ.
In addition, so-called second oblique line path L2, it is meant that with the first oblique line path L1 across towards the first oblique line path L1 phase negative side
To the path of inclination first retainer.
In addition, in the present invention, so-called grinding pad 232 is anti-along the first oblique line path L1 and the second oblique line path L2
It carries out that zigzag is mobile again, is defined as grinding pad 232 with during the state of contact substrate W surface is mobile, 232 phase of grinding pad
The movement routine of substrate W is not interrupted and is converted to other directions (being the second oblique line path from the first oblique line path integration).
In other words, grinding pad 232 forms continuously coupled wave along the first oblique line path L1 and the second oblique line path L2 continuous moving
The motion track of form.
More specifically, the first oblique line path L1 and the second oblique line path L2 are constituted line pair on the basis of one side of substrate W
Claim, grinding pad 232 is repeated zigzag and moves along the first oblique line path L1 and the second oblique line path L2, the table of grinding base plate W
Face.At this point, to be constituted line on the basis of the one side substrate W symmetrical by so-called first oblique line path L1 and the second oblique line path L2, it is defined
For when making the first oblique line path L1 and the second oblique line path L2 is symmetrical centered on one side of substrate W 11, the first oblique line path
L1 and the second oblique line path L2 are completely overlapped, substrate W on one side constituted with the first oblique line path L1 angle, substrate W while
The angle constituted with the second oblique line path L2 is same to each other.
Preferably, grinding pad 232 is to move back and forth interval with the length for being less than or equal to 232 diameter of grinding pad, along the
One oblique line path L1 and the second oblique line path L2, moves back and forth relative to substrate W.In the following, illustrate grinding pad 232 with grind
The mill pad corresponding length of 232 diameters is to move back and forth interval P, along the first oblique line path L1 and the second oblique line path L2, relatively
In the example that substrate W is regularly moved back and forth.
At this point, grinding unit 230 is configured to works (being not shown on figure) and line by means of door frame (Gantry)
Property it is mobile, the utility model is not to be limited or limited by the type and structure of the works for keeping grinding unit mobile.As one
A example, door frame may include that substrate is clipped in the middle to and is configured at the two sides of substrate and is carried out along the direction of transfer of substrate straight
The first mobile support shaft of line, the second support shaft and the connecting shaft for connecting the first support shaft and the second support shaft, grinding unit
It can be installed in connecting shaft.
As described above, make grinding pad 232 relative to substrate W, it is anti-along the first oblique line path L1 and the second oblique line path L2
The surface of the mobile simultaneously simultaneous grinding substrate W of zigzag is carried out again, and grinding pad 232 is to be less than or equal to 232 diameter of grinding pad
Length is to move back and forth interval P, advance movement is carried out relative to substrate W, so as to not have in all surface regions of substrate W
There are the grinding missed areas of grinding pad 232, rule, equably grinding base plate W entirety surface.
Wherein, so-called grinding pad 232 carries out advance movement relative to substrate W, and it is oblique along first to be defined as grinding pad 232
Thread path L1 and the second oblique line path L2, while mobile relative to substrate W towards in front of substrate W (for example, using Fig. 9 as base
Standard, from substrate bottom edge towards top) linear movement.In other words, it is with the right angled triangle being made of bottom edge, bevel edge, opposite side
Example, the bottom edge of right angled triangle are defined as the bottom edge of substrate W, and the bevel edge of right angled triangle can be defined as the first oblique line road
Diameter L1 or the second oblique line path L2, the opposite side of right angled triangle can be defined as grinding pad 232 and move relative to the advance of substrate W
Dynamic distance.
In other words, so that being to move back and forth interval, grinding pad 232 to be less than or equal to the length of 232 diameter of grinding pad
Zigzag mobile (moving along the first oblique line path and the second oblique line path) and grinding base plate W is repeated relative to substrate W,
So as to prevent grinding pad 232 from grinding missed areas occurs in all surface regions of substrate W, thus can obtain equably
The thickness deviation of control base board W equably adjusts the thickness distribution of substrate W relative to two-dimentional plate face, improves having for grinding quality
Sharp effect.
As another example, referring to Fig.1 0, grinding pad 232 can also be along the first straight line path of mono- edge direction of substrate W
The table of the mobile simultaneously grinding base plate W of zigzag is repeated in the second straight line path L2' of L1', first straight line path L1' opposite direction
Face.
Wherein, so-called first straight line path L1', it is meant that for example from the bottom edge substrate W one end towards the road of another extreme direction
Diameter.In addition, so-called second straight line path L2', it is meant that towards the path with first straight line path L1' opposite direction.
On the other hand, in the utility model embodiment for preceding addressing diagram, although enumerating grind section 200 by means of to connect
The example that the grinding pad 232 of the state rotation and movement of touching substrate W carrys out grinding base plate W is illustrated, but according to circumstances, grinding
Portion also can use the lapping tape of circulation rotating in a manner of Infinite Cyclic and carry out grinding base plate.
As reference, in the utility model embodiment for preceding addressing diagram, only ground by one although enumerating grind section
The example that unit is constituted is illustrated, but according to circumstances, grind section may include 2 or more grinding units.Referring to Fig.1 5,
Grind section 200 may include 2 or more grinding units 230,230'.At this point, multiple grinding units 230,230' may be constructed
It is mobile towards path same to each other or mutual opposite direction path to have grinding pad 232,232' respectively, grinding base plate W's
Surface.
In addition, substrate board treatment may include the modified adjuster in the outer surface (surface of contact substrate) to grinding pad
(being not shown on figure).
As an example, adjuster can be configured at the lateral area of substrate, with predetermined pressure to grinding pad
Surface (bottom surface) is pressurizeed and is fine cut, and is modified in such a way that surface is exposed by the micropore for forming grinding pad surface.
In other words, the outer surface of adjuster fine cutting and grinding pad so that grinding pad outer surface play splendid attire by grinding agent and
A large amount of foaming micropores of the effect of the slurry of chemical substance mixing are not blocked, to make to fill in the foaming stomata of grinding pad
Slurry be smoothly supplied to substrate.Preferably, adjuster is revolvably equipped with, the outer surface (bottom surface) of rotating contact grinding pad.
In addition, grind section 200 includes being provided to the shield of 210 outer surface of conveyer belt in a manner of surrounding substrate W surrounding periphery
Circle 214.
In grinding process, when the grinding pad 232 of grinding unit 230 enters substrate W inside region from substrate W lateral area
When, guard ring 214 minimizes grinding pad 232 (bounce) the phenomenon that the edge of substrate W is sprung back, and makes grinding pad 232
The non-ground region (dead zone) (not being ground the region of pad grinding) of the edge substrate W caused by rebound phenomenon is minimum
Change.
More specifically, it is formed through substrate receiving portion 214a corresponding with the W-shaped state of substrate in guard ring 214, substrate W exists
The placed inside of substrate receiving portion 214a is in the outer surface of conveyer belt 210.
In the state that substrate W is contained in substrate receiving portion 214a, the apparent height of guard ring 214 has and the edge substrate W
The similar height of apparent height.As described above, making the edge of substrate W and the substrate W with the adjoining of the edge substrate W
Lateral area (214 region of guard ring) has mutually similar height, thus, in grinding process, in grinding pad 232 from substrate W
Lateral area it is mobile to the inside region of substrate W, or from the inside region of substrate W it is mobile to the lateral area of substrate W during,
232 rebound phenomenon of grinding pad caused by the height tolerance between substrate W inside region and lateral area can be made to minimize, can be obtained
It must make the advantageous effects that non-ground region minimizes as caused by rebound phenomenon.
Preferably, guard ring 214 is formed to have the thickness (T1 >=T2) of thinner or equal to substrate W.As described above, having thin
In or equal to substrate W thickness T2 form guard ring 214, it is hereby achieved that mobile from substrate W lateral area in grinding pad 232
To the advantageous effects for during substrate W inside region, preventing rebound phenomenon caused by grinding pad 232 is collided with guard ring 214.
Moreover, being equipped with multiple guard rings 214 in the outer surface of conveyer belt 210 along the loop direction of conveyer belt 210.As above
Described, by means of forming multiple guard rings 214 in 210 outer surface of conveyer belt, having can continuously be located in a manner of online (Inline)
The advantages of managing mutually different substrate W.
In addition, substrate board treatment 10 includes fixed cell 250, if be placed in the circulation rotating of conveyer belt 210
The substrate W of conveyer belt 210 is sent to abrasion site PZ, then the fixed conveyer belt 210 of the fixed cell 250.
This is substrate W shaking caused by order to during grinding to substrate W, inhibit the shaking of conveyer belt 210 and movement,
Improve the grinding uniformity of substrate W.
That is, substrate W is ground in the state of being placed in conveyer belt 210, thus if conveyer belt 210 shakes,
The substrate W for being then placed in conveyer belt 210 shakes together, therefore during grinding to substrate W, should be able to constrain conveyer belt
210 shaking.
Fixed cell 250 can be formed with the various structure for being capable of fixing conveyer belt 210.As an example, fixed cell
250 can be provided to the top of conveyer belt 210 up and down, add including what the outer surface selectively to conveyer belt 210 was pressurizeed
Press component 252.
Preferably, pressing element 252 is configured to the width direction along conveyer belt 210 continuously to the outer of conveyer belt 210
Surface-pressure.As described above, along the width direction of conveyer belt 210,210 outer surface of conveyer belt by continuous pressure, so as to
Obtain the advantageous effects that more effectively constraint conveyer belt 210 shakes.
As an example, pressing element 252 is to separate conveyer belt 210 from substrate support 220, and in conveyer belt
The carrying roller 242 for the lift unit 240 that inside is equipped with configures opposite to each other.As described above, configuring pressing element opposite to each other with carrying roller 242
252, and it is pressurized conveyer belt 210 between pressing element 252 and carrying roller 242, it is hereby achieved that preventing due to the structure that pressurizes
The advantageous effects that part 252 causes conveyer belt 210 sagging the pressurization of conveyer belt 210.According to circumstances, pressing element can also be matched
It is placed in the top of substrate support, or is configured to support the conveyer belt of pressurized component pressurization using other different supporting members
Inner surface.
On the other hand, substrate board treatment 10 includes loading control unit 120, is ground substrate W to be transmitted to from loading part 100
In the loading transmission process in mill portion 200, loading transmission speed and transmission that control unit 120 makes loading part 100 transmit substrate W are loaded
Band transmission speed with 210 transmission substrate W is synchronous.
More specifically, if one end of substrate W is configured at placement starting position SP predetermined on conveyer belt 210,
Then loading control unit 120 keeps loading transmission speed synchronous with transmission speed.
Wherein, placement starting position SP predetermined on so-called conveyer belt 210, being defined as substrate W can be by means of passing
The position sent the circulation rotating of band 210 and start transmission assigns and bonding between conveyer belt 210 and substrate W in placement starting position SP
Property.As an example, placing starting position SP can be set in the base opposite with the front end substrate W transmitted from loading part 100
Plate receiving portion 214a is on one side (or while adjacent substrate receiving portion position).
As reference, if perceiving substrate receiving portion by means of the common awareness apparatus of such as sensor or video camera
Starting position SP is placed in being located on one side for 214a, then conveyer belt 210 stops rotating, and is kept for being located on one side for substrate receiving portion 214a
Place the state of starting position SP.
Then, in the state that conveyer belt 210 stops rotating, match if being perceived the front end substrate W by means of awareness apparatus
It is placed in and places starting position SP, then loading control unit 120 makes conveyer belt 210 rotate (synchronous rotary), and loading part 100 is made to transmit base
Loading transmission speed and conveyer belt 210 transmission the substrate W's of plate W becomes speed same to each other with transmission speed, to make base
Plate W is transmitted to abrasion site PZ.
Moreover, uninstalling portion 300 is for unloading the substrate W for completing milled processed from grind section 200.
Uninstalling portion 300 can be formed with the various structure that can unload carried base board W from grind section 200, the utility model not by
The structure of uninstalling portion 300 is limited or is limited.
As an example, uninstalling portion 300 transmits substrate W in height identical with conveyer belt 210, and including pressing set
Every the multiple unloading transfer rollers 310 separatedly configured, the substrate W on multiple unloading 310 tops of transfer roller is supplied to as unloading passes
It send the rotation of roller 310 and is cooperateed with and transmit by multiple unloading transfer rollers 310.According to circumstances, uninstalling portion also may include being unloaded biography
Send the tape loop of roller circulation rotating.
Wherein, so-called uninstalling portion 300 transmits substrate W in height identical with conveyer belt 210, is defined as uninstalling portion 300
It is configured at the height for allowing substrate W bending deformation and transmits substrate W.For example, state (the substrate one protruded in substrate from conveyer belt
The state being partially transferred on the outside of conveyer belt) under, it is contemplated that substrate protrudes bending deformation caused by the self weight of part, and loading part can
To be configured at the height more slightly lower than conveyer belt (for example, within 10 ㎜).But, if it is possible to inhibit the bending deformation of substrate, base
The height that the height that plate W is transmitted in uninstalling portion 300 is placed and transmitted in conveyer belt 210 with substrate W can be same to each other.
In addition, substrate board treatment 10 includes Unloading Control portion 320, substrate W is being transmitted to uninstalling portion from grind section 200
In 300 unloading transmission process, Unloading Control portion 320 makes the band transmission speed and uninstalling portion 300 of the transmission of conveyer belt 210 substrate W
The unloading transmission speed for transmitting substrate W is synchronous.
As an example, if one end of perception substrate W, Unloading Control portion 320 transmits base according to conveyer belt 210
The identical speed of band transmission speed of plate W, keeps unloading transmission speed synchronous.According to circumstances, can also with the one end substrate W perceive with
It is no unrelated, make to unload transfer roller rotation, so that it is synchronous with unloading transmission speed with transmission speed, in this state, make to transmit
Band rotation, is unloaded to uninstalling portion for substrate.
In addition, substrate board treatment 10 includes lift unit 240, the lift unit 240 makes the inner surface of conveyer belt 210
It is selectively spaced from from substrate support 220.
This is to be used in and more successfully follow the substrate W for the completing grinding conveyer belt 210 for being transmitted to uninstalling portion 300
Ring rotation.
That is, being formed in the inner surface of conveyer belt 210 for improving conveyer belt 210 to the frictional force of substrate support 220
Second surface layer 210c, therefore, conveyer belt 210 inner surface contact substrate support 220 in the state of, it is difficult to successfully
Carousel 210.
During grinding to substrate W, lift unit 240 keeps 210 inner surface of conveyer belt (second surface layer 210c)
The state for contacting substrate support 220 during 210 circulation rotating of conveyer belt, makes the interior of conveyer belt 210 after completing grinding
Surface is separated from substrate support 220.
Lift unit 240 can be more be selectively spaced from 210 inner surface of conveyer belt from substrate support 220
Spline structure is formed.As an example, lift unit 240 includes the carrying roller 242 for being in rolling contact 210 inner surface of conveyer belt, makes to hold in the palm
The lifting unit 244 that roller 242 is selectively gone up and down.
Carrying roller 242 rotates in the state of contacting 210 inner surface of conveyer belt with the rotation of conveyer belt 210.
Lifting unit 244 can be formed with various structure that carrying roller 242 can be made selectively to go up and down, and the utility model is not
It is limited or is limited by the structure and type of lifting unit 244.As an example, it as lifting unit 244, can be used common
Solenoid, cylinder etc..
On the other hand, Figure 16 is the figure for illustrating the substrate board treatment of another embodiment of the utility model.Moreover, right
In identical as aforementioned composition and be equivalent to identical part, assign it is same or equivalent in identical appended drawing reference, omit to its
It is described in detail.
Referring to Fig.1 6, the substrate board treatment of another embodiment of the utility model includes: conveyer belt 210, along set
Path is mobile (for example, circulation rotating), in outer surface mount substrate W；Substrate support 220 is configured at the interior of conveyer belt 210
Portion is adjacent to the inner surface of support conveyer belt 210 in the lower part of substrate W；First pressing element 252, along the sender of substrate W
To, be configured at the rear of substrate W, selectively to 210 outer surface of conveyer belt pressurize；Second pressing element 252', along base
The direction of transfer of plate W is configured at the front of substrate W, selectively pressurizes to the outer surface of conveyer belt 210；Pressurized control portion
260, the levelness according to conveyer belt 210 relative to substrate support 220, the first pressing element of control 252 and second pressurizes
Component 252'.
This is the levelness in order to horizontally adjust conveyer belt 210 relative to substrate support 220.
That is, the grinding to substrate W is carried out in the state that substrate W is placed in conveyer belt 210, therefore, if conveyer belt 210
It is tilted relative to 220 levelness of substrate support (level), is then difficult to apply pressure uniform on the whole to substrate W, there are bases
The problem of grinding uniformity decline of plate W.Therefore, the utility model utilizes the first pressing element 252 and the second pressing element
252' horizontally adjusts levelness of the conveyer belt 210 relative to substrate support 220, it is hereby achieved that improving grinding for substrate W
It grinds uniformity and grinds the advantageous effects of accuracy.
More specifically, the first pressing element 252 along substrate W direction of transfer, be configured at substrate W rear (as
One example is configured at the right side of substrate support on the basis of Figure 16), it is provided as selectively rising on 210 top of conveyer belt
Drop pressurizes to 210 outer surface of conveyer belt.Preferably, the first pressing element 252 is configured to connect along 210 width direction of conveyer belt
Continuously pressurize to 210 outer surface of conveyer belt.
Second pressing element 252' is configured in front of substrate W along the direction of transfer of substrate W (as an example, to scheme
On the basis of 16, it is configured on the left of substrate support), it is provided as selectively going up and down on 210 top of conveyer belt, to conveyer belt 210
Outer surface pressurization.Preferably, the second pressing element 252' is configured to along 210 width direction of conveyer belt continuously to conveyer belt
The pressurization of 210 outer surfaces.
Preferably, substrate board treatment includes measurement portion 270, and the measurement portion 270 measures conveyer belt 210 relative to substrate
The levelness of support portion 220, the signal that pressurized control portion 260 is measured according to measurement portion 270, mobile first pressing element, 252 He
More than any one in second pressing element 252', so that conveyer belt 210 reaches water relative to the levelness of substrate support 220
It is flat.
As measurement portion 270, the common measuring device of such as common sensor or video camera can be used, this is practical
It is novel not to be limited or limited by the type and measurement method of measurement portion 270.
As described above, pressurized control portion 260 can make 252 He of the first pressing element according to the signal that measurement portion 270 measures
Any one in second pressing element 252' is above to be gone up and down, and levelness of the conveyer belt 210 relative to substrate support 220 is adjusted.
As an example, if being measured as the levelness at the position of adjacent first pressing element 252 of conveyer belt 210 (relative to substrate
The levelness of support portion) be higher than the levelness that conveyer belt 210 abuts the position of the second pressing element 252', then make the first pressurization structure
The falling head of part 252 increases than the second pressing element 252', so as to horizontally adjust conveyer belt 210 relative to substrate branch
The levelness of support part 220.
At this point, 210 inner surface of conveyer belt to be pressurizeed by the first pressing element 252 and the second pressing element 252', Ke Yigen
It is supported in a manner of various according to desired condition and design specification.
As an example, including the first lift unit 240, first lift unit 240 and the first pressing element 252
It configures opposite to each other, is selectively spaced from the inner surface of conveyer belt 210 from substrate support 220.First lift unit 240 and
The movement of one pressing element 252 is accordingly selectively gone up and down.That is, the first lift unit 240 and the first pressing element 252 go up and down height
Degree is accordingly gone up and down, and supports the inner surface of conveyer belt 210.
First lift unit 240 can be be selectively spaced from 210 inner surface of conveyer belt from substrate support 220
Various structure is formed.As an example, the first lift unit 240 includes the carrying roller for being in rolling contact 210 inner surface of conveyer belt
242, the lifting unit 244 for going up and down carrying roller 242 selectively.
Carrying roller 242 rotates in the state of contacting 210 inner surface of conveyer belt with the rotation of conveyer belt 210.
Lifting unit 244 can be formed with various structure that carrying roller 242 can be made selectively to go up and down, the utility model not by
The structure and type of lifting unit 244 are limited or are limited.As an example, as lifting unit 244, common spiral shell can be used
Spool, cylinder etc..
As the structure similar with the first lift unit 240, including the second lift unit 240', second lift unit
240' is configured opposite to each other with the second pressing element 252', make 210 inner surface of conveyer belt from substrate support 220 selectively every
It opens.The movement of second lift unit 240' and the second pressing element 252' is accordingly selectively gone up and down.That is, the second lift unit
The adjustable height of 240' and the second pressing element 252' are accordingly gone up and down, and support 210 inner surface of conveyer belt.
Second lift unit 240' can be be selectively spaced from 210 inner surface of conveyer belt from substrate support 220
Various structure formed.As an example, the second lift unit 240' includes the carrying roller for being in rolling contact 210 inner surface of conveyer belt
(referring to Fig.1 the 242 of 6), the lifting unit for going up and down carrying roller selectively (referring to Fig.1 the 244 of 6).
According to circumstances, the first lift unit 240 and the second lift unit 240' can also be excluded, is configured to support in substrate
The upper surface (for example, upper surface of guard ring) in portion 220, the first pressing element 252 and the second pressing element 252' are to conveyer belt 210
Outer surface pressurization passed in 210 outer surface of conveyer belt by the first pressing element 252 and the second pressing element 252' pressure dwell
The inner surface (by the conveyer belt inner surface that each pressing element is pressurizeed) of band 210 is sent to be supported in substrate support 220.
Referring again to Figure 16, the substrate board treatment of another embodiment of the utility model includes: conveyer belt 210, along
Given route is mobile (for example, circulation rotating), in outer surface mount substrate W；Substrate support 220 is configured at conveyer belt 210
Inside, the lower part of substrate W be adjacent to support 210 inner surface of conveyer belt；First pressing element 252, along the transmission of substrate W
Direction is configured at the rear the substrate W, if substrate W is transmitted to abrasion site by conveyer belt 210, to 210 appearance of conveyer belt
Face pressurization；Second pressing element 252' is configured in front of substrate W, along the direction of transfer of substrate W if substrate W is transmitted
To abrasion site, then pressurize to 210 outer surface of conveyer belt；Grinding unit 230, in the first pressing element 252 and the second pressurization
In the state that component 252' pressurizes to conveyer belt 210, the upper surface of grinding base plate W.
This is to inhibit the movement of conveyer belt 210, stably keep transmission during carrying out grinding process to substrate W
With 210 configuration status.
Especially the utility model is fixed along substrate W biography with the first pressing element 252 and the second pressing element 252' pressurization
The 210 front position of conveyer belt and rear position at the adjacent both ends substrate W in direction are sent, it is hereby achieved that conveyer belt 210 is inhibited to move
It moves and inhibits that the advantageous effects of gauffer occur at 210 position of conveyer belt at the adjacent both ends substrate W.
More specifically, the first pressing element 252 is configured at the rear substrate W (as one along the direction of transfer of substrate W
Example is configured at the right side of substrate support on the basis of Figure 16), it is provided as selectively rising on the top of conveyer belt 210
Drop pressurizes to the outer surface of conveyer belt 210.Preferably, the first pressing element 252 is configured to the width side along conveyer belt 210
It pressurizes to the outer surface continuously to conveyer belt 210.
Second pressing element 252' is configured in front of substrate W along substrate W direction of transfer (as an example, with Figure 16
On the basis of, be configured on the left of substrate support), be provided as selectively going up and down on 210 top of conveyer belt, to conveyer belt 210 outside
Surface-pressure.Preferably, the second pressing element 252' is configured to along 210 width direction of conveyer belt continuously to conveyer belt 210
Outer surface pressurization.
At this point, 210 inner surface of conveyer belt to be pressurizeed by the first pressing element 252 and the second pressing element 252', Ke Yigen
It is supported in a manner of various according to desired condition and design specification.
As an example, including the first lift unit 240, it is configured opposite to each other with the first pressing element 252, support passes
Send the inner surface of band 210.
First lift unit 240 can be can support various structure of 210 inner surface of conveyer belt to be formed.Show as one
Example, the first lift unit 240 include the carrying roller 242 for being in rolling contact 210 inner surface of conveyer belt, go up and down carrying roller 242 selectively
Lifting unit 244.
In addition, including the second lift unit 240', configured opposite to each other with the second pressing element 252', supports conveyer belt
210 inner surface.
Second lift unit 240' can be can support various structure of 210 inner surface of conveyer belt to be formed.Show as one
Example, the second lift unit 240' include the carrying roller 242 for being in rolling contact 210 inner surface of conveyer belt, go up and down carrying roller 242 selectively
Lifting unit 244.
According to circumstances, the first lift unit 240 and the second lift unit 240' can also be excluded, is configured to support in substrate
The upper surface (for example, upper surface of guard ring) in portion 220, the first pressing element 252 and the second pressing element 252' are to conveyer belt 210
Outer surface pressurization passed in 210 outer surface of conveyer belt by the first pressing element 252 and the second pressing element 252' pressure dwell
The inner surface (by 210 inner surface of conveyer belt that each pressing element is pressurizeed) of band 210 is sent to be supported in substrate support 220.
In addition, referring to Fig.1 and Figure 13, the substrate board treatment of another embodiment of the utility model include: grind section 200,
It includes conveyer belt 210, substrate support 220, grinding unit, and the conveyer belt 210 can be movably equipped with along given route,
In outer surface mount substrate W, the substrate support 220 is configured at the inside of conveyer belt 210, across 210 support groups of conveyer belt
The bottom surface plate W, the upper surface of the grinding unit grinding base plate W；Uninstalling portion 300, unloading is as conveyer belt 210 is to from substrate W
Direction that bottom surface separates is mobile and the substrate W isolated from conveyer belt 210.
During this is the substrate W in order to complete grinding in unloading, exclude using other pick device (for example, base
Plate W adsorbent equipment) process that substrate W is put into uninstalling portion again after substrate W is picked up, shorten the discharge time of substrate W.
Especially the utility model shape that substrate W is transmitted to set section or more in the conveyer belt 210 for transmitting substrate W
Under state, it is mobile to the direction separated from the bottom surface substrate W to make conveyer belt 210, it is hereby achieved that just without other pickup process
From the advantageous effects of the separating base plate W naturally of conveyer belt 210.
As reference, in the present invention, so-called conveyer belt 120 has the meaning for the carrier for transmitting substrate W.Such as
It is upper described, although conveyer belt has the meaning of carrier, for convenient and referred to as conveyer belt below.
As an example, referring to Fig.1 3, conveyer belt 210 is configured to along given route circulation rotating and transmits substrate W.
Along rotating path starting the position moved in conveyer belt 210, (conveyer belt 210 starts along the curved path of the second roller outer surface
Mobile position), substrate W is separated as conveyer belt 210 is mobile to the direction separated from the bottom surface substrate W from conveyer belt 210.
As another example, conveyer belt is configured to substrate W is wound and transmitted from a direction to other direction (does not show in figure
Out).
Wherein, so-called conveyer belt is wound from a direction to other direction, is defined as conveyer belt with common cassette tape
Reel-to-reel (reel to reel) winding method (being wound in the mode for being wound in volume Two after the first volume round about again),
Motion track along open loop form is moved (winding).
Substrate is in the position that the movement routine of conveyer belt is turned (for example, as shown in figure 13, conveyer belt is along roller outer surface
Curved path starts mobile position), it is separated as conveyer belt is mobile to the direction separated from substrate bottom surface from conveyer belt.
Moreover, unloading the substrate W isolated from conveyer belt 120 in uninstalling portion 300.
Uninstalling portion 300 can be formed with the various structure that can unload carried base board W from grind section 200, the utility model not by
The structure of uninstalling portion 300 is limited or is limited.
As an example, uninstalling portion 300 transmits substrate W in height identical with conveyer belt 210, and including pressing set
Every the multiple unloading transfer rollers 310 separatedly configured, the substrate W on multiple unloading 310 tops of transfer roller is supplied to as unloading passes
The rotation of roller 310 is sent, and is cooperateed with and transmits by multiple unloading transfer rollers 310.According to circumstances, uninstalling portion also may include being unloaded biography
Send the tape loop of roller circulation rotating.
Wherein, so-called uninstalling portion 300 transmits substrate W in height identical with conveyer belt 210, is defined as uninstalling portion 300
It is configured at the height for allowing substrate W bending deformation and transmits substrate W.For example, the state protruded from conveyer belt in substrate (substrate
A part is transmitted to the state on the outside of conveyer belt) under, it is contemplated that the bending deformation of substrate, loading part, which can be configured at, compares conveyer belt
Slightly lower height (for example, within 10 ㎜).But, if it is possible to inhibit substrate bending deformation, then substrate W is in uninstalling portion 300
The height that the height of transmission is placed and transmitted in conveyer belt 210 with substrate W can be same to each other.
In addition, even if substrate with conveyer belt 210 it is mobile to the direction that is separated from the bottom surface substrate W and from conveyer belt 210
In isolated structure, in the outer surface of conveyer belt 210, the shield protruded in a manner of surrounding substrate W surrounding periphery can also be equipped with
Circle 214 (referring to Fig. 2 and Fig. 8).
In grinding process, when the grinding pad 232 of grinding unit 230 enters substrate W inside region from substrate W lateral area
When, guard ring 214 minimizes grinding pad 232 (bounce) the phenomenon that the edge of substrate W is sprung back, and makes grinding pad 232
The non-ground region (dead zone) (not carrying out the region of grinding pad grinding) of the edge substrate W caused by rebound phenomenon is most
Smallization.
More specifically, substrate receiving portion 214a, substrate W corresponding with the W-shaped state of substrate are formed through on guard ring 214
Substrate receiving portion 214a placed inside in the outer surface of conveyer belt 210.
In the state that substrate W is contained in substrate receiving portion 214a, the apparent height of guard ring 214 has and the edge substrate W
The similar height of apparent height.As described above, making outside the edge and the substrate W adjacent with the edge substrate W of substrate W
Side region (214 region of guard ring) has mutual similar height, thus, in grinding process, in grinding pad 232 from substrate W's
Lateral area is mobile to the inside region of substrate W, or from the inside region of substrate W it is mobile to the lateral area of substrate W during, can
So that 232 rebound phenomenon of grinding pad caused by height tolerance between substrate W inside region and lateral area minimizes, can obtain
Make the advantageous effects that non-ground region minimizes caused by rebound phenomenon.
Preferably, guard ring 214 is formed to have the thickness (T1 >=T2) of thinner or equal to substrate W.As described above, guard ring
214 are formed to have the thickness T2 of thinner or equal to substrate W, it is hereby achieved that moving in grinding pad 232 from substrate W lateral area
During moving substrate W inside region, prevents grinding pad 232 and guard ring 214 collides the advantageous effects of caused rebound phenomenon.
Be illustrated above by reference to the preferred embodiment of the utility model, but as long as be the technical staff in the field just
It will be appreciated that in the range of the thought of the utility model recorded without departing from patent claims and field, it can be diversely
Revision and change the utility model.
Claims (50)
1. a kind of substrate board treatment, for carrying out substrate grinding process characterized by comprising
Loading part is used to load substrate；
Grind section comprising conveyer belt, substrate support, grinding unit, the conveyer belt can along given route circulation rotating,
The substrate for being transmitted in outer surface mount by the loading part, the substrate support are configured at the interior of the conveyer belt
Portion, the bottom surface of the substrate is supported across the conveyer belt, and the grinding unit grinds the upper surface of the substrate；
Uninstalling portion is discharged in the substrate that the grind section completes grinding.
2. substrate board treatment according to claim 1, which is characterized in that
The conveyer belt is along the path circulation rotating determined by roller unit, by means of the circulation rotating of the conveyer belt
Transmit the substrate.
3. substrate board treatment according to claim 2, which is characterized in that the roller unit includes:
First roller；
Second roller is separatedly configured with first roller,
The conveyer belt is along the path circulation rotating determined by first roller and second roller.
4. substrate board treatment according to claim 3, which is characterized in that
More than any one in first roller and second roller being provided as can be selectively to side that is close to each other or separating
To moving linearly.
5. substrate board treatment according to claim 1, which is characterized in that
The substrate support configures opposite to each other with the substrate bottom surface, is used to support the inner surface of the conveyer belt.
6. substrate board treatment according to claim 5, which is characterized in that
The substrate support is adjacent to the internal surface configurations of the conveyer belt.
7. substrate board treatment according to claim 5, which is characterized in that
The inner surface of the substrate support and the conveyer belt separates configuration, is supported in the conveyer belt with contactless state
Surface.
8. substrate board treatment according to claim 7, which is characterized in that
The substrate support sprays fluid to the inner surface of the conveyer belt, supports institute by means of the jet power of the fluid
State the inner surface of conveyer belt.
9. substrate board treatment according to claim 1, which is characterized in that
The first surface layer for being improved the coefficient of friction to the substrate and inhibiting sliding is formed in the outer surface of the conveyer belt.
10. substrate board treatment according to claim 9, which is characterized in that
The first surface layer is formed by engineering plastics.
11. substrate board treatment according to claim 1, which is characterized in that
The coefficient of friction to the substrate support is improved in the inner surface formation of the conveyer belt and inhibits the second of sliding
Superficial layer.
12. substrate board treatment according to claim 11, which is characterized in that
The second surface layer is formed by engineering plastics.
13. substrate board treatment according to claim 1, which is characterized in that
The loading part transmits the substrate in height identical with the conveyer belt, transmits the multiple of the substrate including collaboration
Load transfer roller.
14. substrate board treatment according to claim 1, which is characterized in that
The uninstalling portion transmits the substrate in height identical with the conveyer belt, transmits the multiple of the substrate including collaboration
Unload transfer roller.
15. substrate board treatment according to claim 1, which is characterized in that
The grinding unit includes grinding pad, and the grinding pad is formed with the size for being less than the substrate, to contact the substrate
State rotation and movement.
16. according to claim 1 to substrate board treatment described in any one of 15, which is characterized in that including guard ring, with
The mode for surrounding the surrounding periphery of the substrate is provided to the outer surface of the conveyer belt.
17. substrate board treatment according to claim 16, which is characterized in that
Be formed through substrate receiving portion in the guard ring, the substrate the substrate receiving portion placed inside in the biography
Send the outer surface of band.
18. according to claim 1 to substrate board treatment described in any one of 15, which is characterized in that
Including lift unit, it is selectively spaced from the inner surface of the conveyer belt from the substrate support.
19. substrate board treatment according to claim 18, which is characterized in that
The lift unit is after the grinding to the substrate, during the conveyer belt circulation rotating, makes the biography
Band is sent to separate from the substrate support.
20. substrate board treatment according to claim 18, which is characterized in that
The lift unit includes:
Carrying roller is in rolling contact the inner surface of the conveyer belt；
Lifting unit goes up and down the carrying roller selectively.
21. substrate board treatment according to claim 20, which is characterized in that
Including fixed cell, if the substrate is transmitted to abrasion site by means of the conveyer belt, the transmission is fixed
Band.
22. substrate board treatment according to claim 21, which is characterized in that
The fixed cell includes pressing element, and the pressing element configures opposite to each other with the carrying roller, selectively to described
It pressurizes the outer surface of conveyer belt.
23. substrate board treatment according to claim 22, which is characterized in that
The pressing element continuously pressurizes to the conveyer belt outer surface along the conveyor width direction.
24. according to claim 1 to substrate board treatment described in any one of 15, which is characterized in that be equipped with multiple described
Grinding unit.
25. a kind of substrate board treatment, for carrying out substrate grinding process characterized by comprising
Conveyer belt, along given route circulation rotating, in outer surface mount substrate；
Substrate support is configured at the inside of the conveyer belt, in the lower part of the substrate, is adjacent to the support conveyer belt
Inner surface；
Grinding unit grinds the upper surface of the substrate；
Lift unit is selectively spaced from the inner surface of the conveyer belt from the substrate support.
26. substrate board treatment according to claim 25, which is characterized in that
If completing the grinding to the substrate, the lift unit makes described during the conveyer belt circulation rotating
Conveyer belt is separated from the substrate support.
27. substrate board treatment according to claim 25, which is characterized in that
The lift unit includes:
Carrying roller is in rolling contact the inner surface of the conveyer belt；
Lifting unit goes up and down the carrying roller selectively.
28. substrate board treatment according to claim 27, which is characterized in that
Including fixed cell, if the substrate is transmitted to abrasion site by means of the conveyer belt, the transmission is fixed
Band.
29. substrate board treatment according to claim 28, which is characterized in that
The fixed cell includes pressing element, and the pressing element configures opposite to each other with the carrying roller, selectively to described
The pressurization of conveyer belt outer surface.
30. substrate board treatment according to claim 29, which is characterized in that
The pressing element continuously pressurizes to the conveyer belt outer surface along the conveyor width direction.
31. substrate board treatment according to claim 25, which is characterized in that
The conveyer belt along the path circulation rotating determined by roller unit, the roller unit include the first roller and with institute
State the second roller that the first roller separatedly configures.
32. substrate board treatment according to claim 25, which is characterized in that
It is formed with first surface layer in the outer surface of the conveyer belt, is formed with second surface in the inner surface of the conveyer belt
Layer.
33. substrate board treatment according to claim 32, which is characterized in that
Any one in the first surface layer and the second surface layer is above to be formed by engineering plastics.
34. substrate board treatment according to claim 25, which is characterized in that
The grinding unit includes grinding pad, and the grinding pad is formed with the size for being less than the substrate, to contact the substrate
State rotation and movement.
35. the substrate board treatment according to any one of claim 25 to 34, which is characterized in that
Including guard ring, the outer surface of the conveyer belt is provided in a manner of the surrounding periphery for surrounding the substrate.
36. substrate board treatment according to claim 35, which is characterized in that
Be formed through substrate receiving portion in the guard ring, the substrate the substrate receiving portion placed inside in the biography
Send the outer surface of band.
37. the substrate board treatment according to any one of claim 25 to 34, which is characterized in that
During carrying out mechanical polishing to the substrate, together for being applied to the slurry of chemical formula grinding, and chemical machine is carried out
Tool formula grinding process.
38. a kind of substrate board treatment, for carrying out substrate grinding process characterized by comprising
Conveyer belt is moved along given route, in outer surface mount substrate；
Substrate support is configured at the inside of the conveyer belt, in the lower part of the substrate, is adjacent in the support conveyer belt
Surface；
First pressing element is configured at the rear of the substrate, selectively to described along the direction of transfer of the substrate
It pressurizes the outer surface of conveyer belt；
Second pressing element is configured at the front of the substrate, selectively to described along the direction of transfer of the substrate
It pressurizes the outer surface of conveyer belt；
Pressurized control portion controls first pressurization according to the conveyer belt relative to the levelness of the substrate support
Component and second pressing element.
39. the substrate board treatment according to claim 38, which is characterized in that
Measurement portion including measuring levelness of the conveyer belt relative to the substrate support,
The signal that the pressurized control portion is measured according to the measurement portion makes first pressing element and the second pressurization structure
Any one in part is above mobile, so that the conveyer belt reaches horizontal relative to the levelness of the substrate support.
40. the substrate board treatment according to claim 38, which is characterized in that
It including the first lift unit, is configured opposite to each other with first pressing element, selects the inner surface of the conveyer belt
Separated from the substrate support to property,
First lift unit corresponds to the movement of first pressing element and selectively goes up and down.
41. the substrate board treatment according to claim 38, which is characterized in that
It including the second lift unit, is configured opposite to each other with second pressing element, selects the inner surface of the conveyer belt
Separated from the substrate support to property,
Second lift unit corresponds to the movement of first pressing element and selectively goes up and down.
42. a kind of substrate board treatment, for carrying out substrate grinding process characterized by comprising
Conveyer belt is moved along given route, in outer surface mount substrate；
Substrate support is configured at the inside of the conveyer belt, is adjacent to the support conveyer belt in the lower part of the substrate
Inner surface；
First pressing element is configured at the rear of the substrate along the direction of transfer of the substrate, if the substrate is borrowed
Help the conveyer belt and be transmitted to abrasion site, then pressurizes to the outer surface of the conveyer belt；
Second pressing element is configured at the front of the substrate along the direction of transfer of the substrate, if the substrate passes
It is sent to the abrasion site, then is pressurizeed to the outer surface of the conveyer belt；
Grinding unit, in the state that first pressing element and second pressing element pressurize to the conveyer belt,
Grind the upper surface of the substrate.
43. substrate board treatment according to claim 42, which is characterized in that
Including the first lift unit, is configured opposite to each other with first pressing element, support the inner surface of the conveyer belt.
44. substrate board treatment according to claim 42, which is characterized in that
Including the second lift unit, is configured opposite to each other with second pressing element, support the inner surface of the conveyer belt.
45. a kind of substrate board treatment, for carrying out substrate grinding process characterized by comprising
Grind section comprising conveyer belt, substrate support, grinding unit, the conveyer belt can movably match along given route
Standby, in outer surface mount substrate, the substrate support is configured at the inside of the conveyer belt, supports institute across the conveyer belt
The bottom surface of substrate is stated, the grinding unit grinds the upper surface of the substrate；
Uninstalling portion unloads and divides to from the direction that the substrate bottom surface separates movement from the conveyer belt with the conveyer belt
From the substrate.
46. substrate board treatment according to claim 45, which is characterized in that
The conveyer belt transmits the substrate along given route circulation rotating.
47. substrate board treatment according to claim 45, which is characterized in that
The conveyer belt is wound from a direction to other direction, transmits the substrate.
48. substrate board treatment according to claim 45, which is characterized in that
Including guard ring, the outer surface of the conveyer belt is projectedly provided in a manner of the surrounding periphery for surrounding the substrate.
49. substrate board treatment according to claim 48, which is characterized in that
Be formed through substrate receiving portion in the guard ring, the substrate the substrate receiving portion placed inside in the biography
Send the outer surface of band.
50. substrate board treatment according to claim 48, which is characterized in that
The guard ring is formed to have thinner than the substrate or identical thickness.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0155213 | 2017-11-21 | ||
| KR1020170155213A KR102532246B1 (en) | 2017-11-21 | 2017-11-21 | Substrate procesing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208289664U true CN208289664U (en) | 2018-12-28 |
Family
ID=64696895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721858388.4U Active CN208289664U (en) | 2017-11-21 | 2017-12-27 | Substrate board treatment |
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| Country | Link |
|---|---|
| KR (1) | KR102532246B1 (en) |
| CN (1) | CN208289664U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115647982A (en) * | 2022-12-26 | 2023-01-31 | 沙河市赛孚玻璃制品有限公司 | Furniture glass production is with dysmorphism edging machine |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1268130A1 (en) * | 2000-03-31 | 2003-01-02 | Lam Research | Fixed abrasive linear polishing belt and system using the same |
| JP2005271111A (en) * | 2004-03-23 | 2005-10-06 | Ebara Corp | Substrate polishing device and substrate polishing method |
| KR100796447B1 (en) * | 2006-07-10 | 2008-01-22 | 주식회사 엔씨비네트웍스 | Grinding device for display panel |
| KR101004435B1 (en) * | 2008-11-28 | 2010-12-28 | 세메스 주식회사 | Substrate polishing apparatus and method of polishing substrate using the same |
-
2017
- 2017-11-21 KR KR1020170155213A patent/KR102532246B1/en active IP Right Grant
- 2017-12-27 CN CN201721858388.4U patent/CN208289664U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115647982A (en) * | 2022-12-26 | 2023-01-31 | 沙河市赛孚玻璃制品有限公司 | Furniture glass production is with dysmorphism edging machine |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102532246B1 (en) | 2023-05-15 |
| KR20190057826A (en) | 2019-05-29 |
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