CN208179273U - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
- Publication number
- CN208179273U CN208179273U CN201820597813.7U CN201820597813U CN208179273U CN 208179273 U CN208179273 U CN 208179273U CN 201820597813 U CN201820597813 U CN 201820597813U CN 208179273 U CN208179273 U CN 208179273U
- Authority
- CN
- China
- Prior art keywords
- substrate
- grinding
- board treatment
- transfer band
- treatment according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
- B24B7/242—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass
- B24B7/245—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass for plate glass discontinuous
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
- B65G2201/02—Articles
- B65G2201/0214—Articles of special size, shape or weigh
- B65G2201/022—Flat
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model relates to a kind of substrate board treatments, and the substrate board treatment for carrying out the grinding technics of substrate includes: substrate placement section, are placed with substrate；Retainer is configured to surround the surrounding periphery of substrate；Grinding unit grinds the upper surface of substrate with being contacted with the state of the upper surface of retainer, it is possible thereby to obtain following advantageous effects: the grinding uniformity of substrate is improved, so that the generation in non-ground region minimizes.
Description
Technical field
The utility model relates to a kind of substrate board treatments, more specifically, are related to a kind of substrate board treatment, can be with
The grinding efficiency of large-area substrates is improved, and improves grinding stability and the grinding uniformity.
Background technique
Recently, surging to the interest of information display, and want to get higher using the requirement for the information medium that can be carried, with
This simultaneously, emphasis carry out for replace existing display device Braun tube (Cathode Ray Tube；CRT: cathode-ray tube)
Light weight thin panel display device (Flat Panel Display:FPD: flat-panel monitor) research and commercialization.
In the panel display apparatus field, up to the present, although light and few power consumption liquid crystal display device
(Liquid Crystal Display Device；It LCD) is display device of greatest concern, but liquid crystal display device is not
Light-emitting component but light receiving element, and brightness, contrast (contrast ratio) and in terms of exist lack
Point, therefore actively exploitation of the expansion for the new display device that can overcome the disadvantage.Wherein, recently, organic light emission
Display (OLED:Organic Light Emitting Display) is one of the display of new generation just to attract attention.
In general, display device use intensity and the outstanding glass substrate of permeability, but recently, display device is tended to micro-
Small (slim) changes and high pixel (high-pixel), it is therefore necessary to prepare corresponding glass substrate.
For example, ELA (Eximer Laser Annealing: quasi-molecule laser annealing) technique is one in OLED technique
Kind, by laser scanning to amorphous silicon (a-Si) and crystallize as polysilicon (poly-Si), in the ELA technique, polysilicon crystal
While can surface generate protrusion, the protrusion can generate non-uniform phenomenon (mura-effects), so glass substrate must
The ground processing of palpus, it is raised to remove.
For this purpose, a variety of researchs for effective grinding base plate surface are being carried out recently, but it is still unsatisfactory, because
This requires the exploitation to this.
Utility model content
The purpose of this utility model is to provide a kind of substrate board treatments, can simplify the treatment process of substrate, and
And shorten the processing time.
In particular, the purpose of this utility model is that, shorten and loads and unload when large-area substrates the required time, and
Productivity and yield can be improved.
In addition, the purpose of this utility model is that, it continuous supplying substrate and can handle.
In addition, the purpose of this utility model is that, it can simplify equipment, and manufacturing expense can be reduced.
In addition, the purpose of this utility model is that, grinding stability and the grinding uniformity can be improved.
According to the preferred embodiment of the utility model for realizing described the utility model aim, configured in substrate periphery
There is a retainer, grinding unit is to be contacted with the state grinding base plate of retainer, thus, it is possible to make grinding unit in substrate edges
The phenomenon that position is rebounded minimizes, and improves the grinding efficiency of substrate, and grinding stability and the grinding uniformity can be improved.
As described above, following advantageous effects can be obtained according to the utility model: improving the grinding efficiency of substrate, improve
Grinding stability and the grinding uniformity.
In particular, following advantageous effects can be obtained according to the utility model: can to grind in the edge of substrate
The phenomenon that unit rebounds from substrate minimizes, and more effectively grinds to the edge of substrate.
In addition, following advantageous effects can be obtained according to the utility model: can to generate not at substrate edges position
The phenomenon that ground non-ground region (dead zone), minimizes, and increases productivity and yield.
In addition, following advantageous effects can be obtained according to the utility model: simplifying the treatment process of substrate, shortening processing
Time.
In addition, can obtain following advantageous effects according to the utility model: continuous supplying substrate is simultaneously handled.
In addition, following advantageous effects can be obtained according to the utility model: it can simplify equipment, reduce manufacturing expense, and
And improve space utilization degree.
Detailed description of the invention
Fig. 1 is the plan view for showing the composition of substrate board treatment according to the present utility model,
Fig. 2 is the perspective view for illustrating the means of abrasion of substrate board treatment according to the present utility model,
Fig. 3 is the side view for the means of abrasion for illustrating the substrate board treatment of the utility model,
Fig. 4 is the plan view for illustrating the retainer of substrate board treatment according to the present utility model,
Fig. 5 to Fig. 7 is the figure for the loading technique for illustrating the substrate of substrate board treatment according to the present utility model,
Fig. 8 is the figure for illustrating the fixed cell of substrate board treatment according to the present utility model,
Fig. 9 be for illustrate substrate board treatment according to the present utility model by grinding unit carry out grinding technics
Figure,
Figure 10 is the plane for the abrasion path for illustrating the grinding unit of substrate board treatment according to the present utility model
Figure,
Figure 11 is the another of the abrasion path for illustrating the grinding unit of substrate board treatment according to the present utility model
The plan view of a example,
Figure 12 is another embodiment for illustrating the substrate placement section of substrate board treatment according to the present utility model
Figure,
Figure 13 is the figure for illustrating the lift unit of substrate board treatment according to the present utility model,
Figure 14 and Figure 15 is the figure for the unloading process for illustrating the substrate of substrate board treatment according to the present utility model.
Specific embodiment
Hereinafter, the preferred embodiment of the utility model is described in detail, but the utility model is not referring to attached drawing
It is limited by example or limits.As reference, in the present note, identical label actually means that identical element, and
And under the rule, it can quote and be recorded in the contents of other accompanying drawings to illustrate, and omit and be judged as to art technology
Apparent or content repeatedly for personnel.
Fig. 1 is the plan view for showing the composition of substrate board treatment according to the present utility model, and Fig. 2 is for illustrating basis
The perspective view of the means of abrasion of the substrate board treatment of the utility model, Fig. 3 are the processing substrates for illustrating the utility model
The side view of the means of abrasion of device, Fig. 4 are for illustrating the flat of the retainer of substrate board treatment according to the present utility model
Face figure, in addition, Fig. 5 to Fig. 7 is the figure for the loading technique for illustrating the substrate of substrate board treatment according to the present utility model,
Fig. 8 is the figure for illustrating the fixed cell of substrate board treatment according to the present utility model.Meanwhile Fig. 9 is for illustrating root
According to the figure for carrying out grinding technics by grinding unit of the substrate board treatment of the utility model, Figure 10 is for illustrating according to this
The plan view of the abrasion path of the grinding unit of the substrate board treatment of utility model, Figure 11 are practical new according to this for illustrating
The plan view of another example of the abrasion path of the grinding unit of the substrate board treatment of type.In addition, Figure 12 is for illustrating
The figure of another embodiment of the substrate placement section of substrate board treatment according to the present utility model, Figure 13 are for illustrating basis
The figure of the lift unit of the substrate board treatment of the utility model, Figure 14 and Figure 15 are for illustrating base according to the present utility model
The figure of the unloading process of the substrate of plate processing unit.
Referring to figs. 1 to Figure 15, substrate board treatment 10 according to the present utility model includes: substrate placement section 201, is placed
There is substrate；Retainer 214 is configured to surround the surrounding periphery of substrate W；Grinding unit 230, to be contacted with retainer 214
The upper surface of state the upper surface of substrate W is ground.
It is intended that improving the grinding efficiency of substrate W, and improve grinding stability and the grinding uniformity.
In other words, in the state that substrate is placed in substrate placement section, substrate is configured to from the substrate for being placed with substrate
The placed side of placement section is protruded, and in the boundary (base of the inside region of substrate (the upper surface of substrate) and the lateral area of substrate
The edge of plate) generate segment difference.There is problems in that during being ground by grinding unit to substrate, if grinding is single
Member passes through the edge of substrate, then generates the phenomenon that grinding unit rebounds from substrate due to the segment difference in substrate edges.
In particular, if substrate lateral area, grinding unit configuration is in the height lower than the upper surface of substrate, then to substrate
Inside region enter, then grinding unit is because in the segment difference of substrate edges (between the upper surface of the bottom surface of grinding unit and substrate
Difference in height) and substrate is collided, and generate the phenomenon that rebounding from substrate.As described above, if the fringe region in substrate generates
The rebound phenomena of grinding unit, then can not ensure has in the grinding uniformity of the fringe region of substrate in severe cases
The fringe region of substrate leads to the problem of non-ground region (dead zone) (region without grinding pad grinding).For example, just like
Lower problem: from the edge of substrate to the inside of substrate, it is equivalent to the substrate in the region 10mm or so (forming figuratum region)
Fringe region can not be ground unit grinding.
But for the utility model, there is the height similar with substrate W in the perimeter setting of substrate W
Retainer 214, it is possible thereby to obtain following advantageous effects: in grinding technics, lateral area of the grinding unit 230 from substrate W
It is mobile to the inside region of substrate W or mobile from the inside region of substrate W to the lateral area of substrate W, in the process
In, the rebound of grinding unit 230 caused by the height tolerance between inside region and lateral area as substrate W can be made to show
As minimizing, and the non-ground region generated by rebound phenomena is minimized.
Substrate placement section 201 is configured between loading station 100 and unloading part 300, and is supplied to loading station 100
Substrate W be shifted into substrate placement section 201, it is polished in the state of being placed in substrate placement section 201, pass through uninstalling portion
300 are divided to be unloaded.
More specifically, loading station 100 in order to will the substrate W of ground processing be loaded into means of abrasion 200 and set
It sets.
Loading station 100 can be formed by the various structures that substrate W can be loaded into means of abrasion 200, and this reality
It is not limited or restriction by the structure of loading station 100 with novel.
For example, loading station 100 is set as transferring substrate W in height identical with transfer band 210, including to be separated by rule
Surely the form being spaced separates multiple loadings transfer roller 110 of configuration, and when loading the transfer rotation of roller 110, by multiple
It loads transfer roller 110 and co-operatively transfers the substrate W for being supplied to multiple tops for loading transfer roller 110.According to difference
The case where, loading station also can include tape loop, and tape loop carries out circulation rotating by loading transfer roller.
It is defined as, is loading here, so-called loading station 100 and transfer band 210 transfer substrate W in identical height
Height that 100 substrate W of part is transferred and the height for being placed and transferring in 210 substrate W of transfer band are same to each other.
Meanwhile for the substrate W for being supplied to loading station 100, before supplying to loading station 100, posture and position
Set posture as defined in being arranged as by alignment unit (not shown) and position.
As reference, for used substrate W in the present invention, the length that a side can be used is greater than 1m
Quadrilateral substrate W.Chemical machine is executed for example, the 6th generation glass substrate W with 1500mm*1850mm size can be used as
The substrate W processed of tool grinding technics.According to different situations, the 7th generation and eighth generation glass substrate can also act as processed
Substrate W.Different from this, the length for being also able to use a side is less than the substrate (for example, second generation glass substrate) of 1m.
Substrate placement section 201, retainer 210, grinding unit 230 are arranged between loading station 100 and unloading part 300
To constitute means of abrasion 200.
Substrate placement section 201 can be set to place the various structures of substrate, and the structure of substrate placement section 201
And form can be changed to according to required condition and design specification it is a variety of.
For example, referring to Fig. 1 to Fig. 9, substrate placement section 201 includes: transfer band 210, is configured to along defined
Path circulation rotating, and substrate W is mounted in outer surface；Substrate support 220 is configured at the inside of transfer band 210, and
And the bottom surface of supporting substrate W.
As reference, in the present invention, so-called means of abrasion 200 carries out grinding to substrate W and is defined as, grind section
200 mechanical milling tech or chemical mechanical grinding (CMP) technique by being directed to substrate W is divided to grind substrate W.For example,
During means of abrasion 200 carries out the mechanical lapping for substrate W, while the lapping liquid for being used for chemical grinding is supplied, and carry out
Chemical mechanical grinding (CMP) technique.
Transfer band 210 is configured to adjoining with loading station 100, and is configured to along defined path with Infinite Cyclic
Mode carries out circulation rotating.For being transferred to the substrate W of transfer band 210 from loading station 100, it is being placed in transfer band 210
Outer surface in the state of, transferred with the circulation rotating of transfer band 210.
More specifically, when 210 circulation rotating of transfer band, the substrate W of transfer band 210 is transferred to from loading station 100
Abrasion site PZ (upper position of substrate support) can be transferred to be placed in the state of the outer surface of transfer band 210.This
Outside, when 210 circulation rotating of transfer band, the substrate W of grinding can be completed from abrasion site PZ to the transfer of unloading 300 side of part.
It can carry out the circulation rotating of transfer band 210 in many ways according to required condition and design specification.For example,
Transfer band 210 carries out circulation rotating along defined path by roller unit 212, passes through the circulation rotating of transfer band 210, edge
Linear travel paths transfer the substrate W for being placed in transfer band 210.
The movement routine (for example, circulating path) of transfer band 210 can be changed according to required condition and design specification
It is a variety of.For example, roller unit 212 includes: the first roller 212a；Second tin roller 212b is configured to and the first roller 212a
It horizontally separates, transfer band 210 carries out circulation rotating by the first roller 212a and second tin roller 212b in a manner of Infinite Cyclic.
As reference, the outer surface of transfer band 210 refers to the outer surface for being exposed to 210 outside of transfer band, and substrate W
It is placed in the outer surface of transfer band 210.Also, the inner surface of transfer band 210 refers to the first roller 212a and second tin roller 212b
The inner surface of the transfer band 210 contacted.
In addition, the above property of can choose of any one in the first roller 212a and second tin roller 212b be configured to mutual
Direction that is close and separating moves linearly.For example, the position of the first roller 212a be it is fixed, second tin roller 212b can be with
It is configured to move linearly to close to the first roller 212a and with the direction being spaced the first roller 212a.As described above, root
According to manufacturing tolerance and assembling tolerance etc., second tin roller 212b is spaced close to the first roller 212a and with the first roller 212a, by
The tension of this adjustable transfer band 210.
Here, the so-called tension for adjusting transfer band 210 is defined as, is adjusted and opened by tensing or loosening transfer band 210
Power.According to different situations, it can be also provided with other tension adjustment roller, adjusted by making tension adjustment roller mobile
Save the tension of transfer band.It is, however, preferable that make any one in the first roller and second tin roller above mobile, so as to
Improve structure and space utilization degree.
In addition, being formed with first surface layer 210b in the outer surface of transfer band 210, first surface layer 210b is logical referring to Fig. 9
Coefficient of friction of the raising for substrate W is crossed to inhibit to slide.
As described above, first surface layer 210b is formed in the outer surface of transfer band 210, it is possible thereby to obtain following advantageous
Effect: in the state that substrate W is placed in the outer surface of transfer band 210, (constraint sliding) can be constrained relative to transfer band 210
Substrate W it is mobile, and stably keep the allocation position of substrate W.
First surface layer 210b can be by with substrate W there is the multiple material of zygosity to be formed, and the utility model is simultaneously
The non-material by first surface layer 210b is limited or restriction.For example, first surface layer 210b is by retractility and tackness (friction
Power) outstanding engineering plastics, any one in polyurethane be formed above.
Moreover, the first surface layer 210b with retractility is formed in the outer surface of transfer band 210, it is possible thereby to obtain
Following advantageous effects:, can also be in the part where foreign matter by first even if foreign matter flows between substrate W and transfer band 210
Superficial layer 210b depresses the thickness degree of foreign matter, it is possible to eliminate the height tolerance (substrate of the substrate W as caused by foreign matter
Privileged site locally protruded because of foreign matter), and to grind caused by locally being protruded by the privileged site of substrate W equal
Evenness reduced minimum.
In addition, the inner surface in transfer band 210 could be formed with second surface layer 210c, second surface layer 210c is by mentioning
Height inhibits to slide relative to the coefficient of friction of substrate support 220.
As described above, the inner surface in transfer band 210 is formed with second surface layer 210c, it is possible thereby to obtain following advantageous
Effect: in the state that the inner surface of transfer band 210 is contacted with substrate support 220, can be constrained (constraint sliding) relative to
The movement of the transfer band 210 of substrate support 220, and stably keep the allocation position of transfer band 210.
Second surface layer 210c can be formed by the outstanding multiple material of the frictional force relative to substrate support 220, and
And the utility model is not limited or restriction by the material of second surface layer 210c.For example, second surface layer 210c is by opposite
Frictional force in substrate support 220 is outstanding and may be easy to appoint from the isolated engineering plastics of substrate support 220, polyurethane
Anticipating, more than one are formed.
Preferably, transfer band 210 includes enhancement layer 210a, and enhancement layer 210a is configured at first surface layer 210b and the second table
Between surface layer 210c.
In other words, transfer band 210 also can only include first surface layer 210b and second surface layer 210c.But if
Transfer band 210 only includes first surface layer 210b and second surface layer 210c, then can generate during carrying out grinding technics
210 sagging of transfer band is excessive, has the problem of reduction grinding uniformity accordingly.In this, in the utility model, in first surface layer
The enhancement layer 210a with high-durability and intensity is formed between 210b and second surface layer 210c, it is possible thereby to which obtain has as follows
Sharp effect: so that the movement and minimizing deformation of the transfer band 210 in grinding technics.
Enhancement layer can be formed by the multiple material with durability and intensity.Preferably, enhancement layer is by engineering plastics shape
At.At this point, enhancement layer should carry out together circulation rotating with transfer band 210, so should be formed as ensureing the thickness of circulation rotating
Degree.For example, the enhancement layer of engineering plastic materials can be formed as the thickness of 0.1~2mm.According to different situations, can also use
Steel (SUS) or nonwoven cloth material form strong layer.
Substrate support 220 is configured at the inside of transfer band 210, and is set as in the state of across transfer band 210
The bottom surface of supporting substrate W.
More specifically, substrate support 220 is configured at transfer band 210 in the form facing with the bottom surface of substrate W
Inside, and support the inner surface of transfer band 210.
Substrate support 220 can be configured to support transfer in many ways according to required condition and design specification
With 210 inner surface.For example, rock plate can be used, and substrate support 220 is configured to as substrate support 220
It is tightly attached to the inner surface of transfer band 210, the inner surface of transfer band 210 is supported.
As described above, substrate support 220 is supported 210 inner surface of transfer band, thus it can be prevented that by substrate W certainly
Transfer band 210 is sagging caused by body weight and grinding unit 230 pressurize to substrate W.
Hereinafter, being illustrated so that substrate support 220 is generally formed into rectangular plate as an example.According to different situations, base
Plate support portion 220 can be formed as other different shapes and structure, and can also pass through more than two substrate supports 220
To support the inner face of transfer band 210.
In addition, being constituted in above mentioned and shown the embodiments of the present invention with substrate support 220
It is illustrated for inner surface to support transfer band 210 by the way of contact, but according to different situations, substrate branch
Support part can also be configured to support the inner surface of transfer band in a non contact fashion.
For example, substrate support is configured to be spaced with the inner surface of transfer band, and can be propped up with contactless state
Support the inner surface of transfer band.
Substrate support can be configured to use cordless in many ways according to required condition and design specification
To support transfer band inner surface.For example, substrate support is configured to, fluid is sprayed to the inner surface of transfer band, by by fluid
The jet power of generation supports the inner surface of transfer band.
At this point, substrate support can be sprayed to the inner surface of transfer band 210 gas (for example, air) and liquid (for example,
Pure water) in any one, and numerous variations can be carried out to the type of fluid according to required condition and design specification.
As described above, with the inner surface of contactless state support transfer band, it is possible thereby to obtain following advantageous effects: so that
The treatment effeciency reduced minimum as caused by frictional resistance (factor for interfering transfer band mobile (rotation)).
According to different situations, substrate support can also be configured to, using magnetic force (for example, repulsion；repulsive
Force the suspending power that) or by ultrasonic activation generates supports the inner surface of transfer band in a non contact fashion.
Grinding unit 230 is set as to be contacted with the state of substrate W surface to the surface of substrate W and grind.
For example, grinding unit 230 includes grinding pad 232, grinding pad 232 is formed as less than the size of substrate W, and to connect
It touches mobile while the state rotation of substrate W.
More specifically, it is installed on 232 carrier (not shown) of grinding pad, and to be contacted with the state of substrate W surface certainly
(planarization) is linearly ground to the surface of substrate W while turning.
232 carrier of grinding pad can be formed to the various structures so that 232 rotation of grinding pad, and the utility model is not
It is limited or restriction by the structure of 232 carrier of grinding pad.For example, 232 carrier of grinding pad is configured to a main body, Huo Zheneng
It is enough to be constituted in the form that multiple main bodys combine, and be configured to be connected and rotate with drive shaft (not shown).In addition, grinding
Mill 232 carriers of pad are provided with pressurization part (for example, pressurizeing using air pressure to the air pressure that grinding pad 232 pressurizes
Portion), pressurization part is used to grinding pad 232 stressing on substrate W surface.
Grinding pad 232 is formed by the material for being suitable for carrying out substrate W mechanical lapping.For example, grinding pad 232 can use
Polyurethane, polyureas (polyurea), polyester, polyethers, epoxy resin, polyamide, polycarbonate, polyethylene, polypropylene, fluorine polymerization
Object, polyvinyl, acrylic acid and methacrylic (methacrylic) polymer, silicone resin, latex, nitrite elastomer,
A variety of copolymers of isoprene rubber, butadiene rubber and styrene, butadiene and acrylonitrile are formed, and can be according to institute
It is required that condition and design specification numerous variations are carried out to the material and characteristic of grinding pad 232.
Preferably, the circular abrasive pad 232 by size less than substrate W is used as grinding pad 232.In other words, can also make
Grinding pad 232 with size greater than substrate W is come grinding base plate W, still, if being greater than the grinding pad 232 of substrate W using size,
In order to enable grinding pad 232 transfers to need very big rotating equipment and space certainly, therefore there is reduction space efficiency and design
Freedom degree and the problem of reduce stability.
Actually problem is, because the length of at least a side of substrate W has the size greater than 1m, so that greatly
Small grinding pad (for example, the grinding pad with the diameter greater than 1m) rotation greater than substrate W is very difficult in itself.This
Outside, it if using non-circular grinding pad (for example, quadrangle grinding pad), will can not be ground on the whole by the grinding pad of rotation
The surface grinding of substrate W is uniform thickness.But in the utility model, by making size be less than the circular abrasive of substrate W
Pad 232 is from transferring to grind the surface of substrate W, it is possible thereby to obtain following advantageous effects: even if sky is not greatly reduced
Between efficiency and design freedom, also can by make grinding pad 232 from then substrate W is ground, and on the whole
Equably keep the amount of grinding carried out by grinding pad 232.
At this point it is possible to carry out a variety of changes according to the abrasion path of required condition and design specification to grinding unit 230
More.
For example, referring to Figure 10, grinding pad 232 is configured to, along to one side of substrate W inclined first oblique line path L1 and
Movement in a zigzag is repeated to the opposite direction inclined second oblique line path L2 of the first oblique line path L1, while to substrate W
Surface ground.
Here, the first oblique line path L1 refers to, such as the path of the bottom edge inclination predetermined angular θ relative to substrate W.This
Outside, the second oblique line path L2 refers to, in the form that intersects with the first oblique line path L1 towards the opposite of the first oblique line path L1
The path of direction inclination predetermined angular.
In addition, in the present invention, so-called grinding pad 232 is along the first oblique line path L1 and the second oblique line path L2
Movement in a zigzag is repeated to be defined as, during grinding pad 232 carries out mobile to be contacted with the state of substrate W surface,
232 movement routine of grinding pad relative to substrate W will not be interrupted, but turn to other directions (from the first oblique line route turning
Second oblique line path).In other words, grinding pad 232 is along the first oblique line path L1 and the second oblique line path L2 continuous moving, and
And form the motion track of continuously coupled wave feature.
More specifically, the first oblique line path L1 and the second oblique line path L2 is symmetrical in line on the basis of one side of substrate W,
Grinding pad 232 is repeated along the first oblique line path L1 and the second oblique line path L2 and moves and to the surface of substrate W in a zigzag
It is ground.At this point, the first oblique line path L1 and the second oblique line path L2 are symmetrically referred on the basis of one side of substrate W in line,
When making the first oblique line path L1 and the second oblique line path L2 symmetrical centered on one side of substrate W 11, the first oblique line path L1
It is completely overlapped with the second oblique line path L2, and it is defined as one side and the first oblique line path L1 angle formed and the base of substrate W
One side of plate W is identical as the angle that the second oblique line path L2 is formed.
Preferably, it is to move back and forth pitch (pitch) with the length for being less than or being equal to the diameter of grinding pad 232, grinds
Mill pad 232 is moved back and forth along the first oblique line path L1 and the second oblique line path L2 relative to substrate W.Hereinafter, with suitable
It is to move back and forth pitch P in the length of 232 diameter of grinding pad, grinding pad 232 is along the first oblique line path L1 and the second oblique line road
Diameter L2 is regularly moved back and forth relative to substrate W, is illustrated as example.
As discussed previously with respect to substrate W, grinding pad 232 along the first oblique line path L1 and the second oblique line path L2 repeatedly
It carries out zigzagged while the surface of substrate W is ground, and to be less than or be equal to the diameter of grinding pad 232
Length is to move back and forth pitch P, and grinding pad 232 carries out advance movement relative to substrate W, it is possible thereby to obtain following advantageous effect
Fruit: regular and equably in the state that the region that ground pad 232 is ground is not omitted in the whole surface region of substrate W
The whole surface of substrate W is ground.
It is defined as here, so-called grinding pad 232 carries out advance movement relative to substrate W, grinding pad 232 is oblique along first
Towards the front of substrate W (for example, using Figure 10 as base while thread path L1 and the second oblique line path L2 is mobile relative to substrate W
Standard, from the bottom edge of substrate towards top) carry out straight movement.In other words, the right angle three to be formed by bottom edge, bevel edge, opposite side
For angular, the bottom edge of right angled triangle can be defined as to the bottom edge of substrate W, the bevel edge of right angled triangle is defined as first
Oblique line path L1 or the second oblique line path L2, and the opposite side of right angled triangle can be defined relative to the grinding of substrate W
The advance moving distance of pad 232.
It in other words, is to move back and forth pitch, grinding pad 232 with the length for being less than or being equal to the diameter of grinding pad 232
To substrate while mobile in a zigzag (moving along the first oblique line path and the second oblique line path) is repeated relative to substrate W
It is ground, thus it can be prevented that and generate the region omitting grinding pad 232 and grinding in the whole surface region of substrate W, so can
To obtain following advantageous effects: the equably thickness deviation of control base board W equably adjusts substrate W's relative to two-dimentional plate face
Thickness distribution, to improve grinding quality.
For another example, referring to Fig.1 1, grinding pad 232 also can be along first straight line path L1 ' and second straight line path L2 ' repeatedly
It carries out zigzagged while the surface of substrate W is ground, first straight line path L1 ' is one side side along substrate W
To path, second straight line path L2 ' is the path of the opposite direction of first straight line path L1 '.
Here, first straight line path L1 ' refers to, such as along from bottom edge one end of substrate W towards the direction of the other end
Path.In addition, second straight line path L2 ' refers to towards the path with first straight line path L1 ' opposite direction.
In addition, in above mentioned and shown the embodiments of the present invention, with means of abrasion 200 by grinding
Mill pad 232 comes for grinding base plate W to be illustrated, shifting while state rotation of the grinding pad 232 to be contacted with substrate W
It is dynamic, but according to different situations, means of abrasion can also be ground substrate using lapping tape, and lapping tape is with Infinite Cyclic
Mode carries out circulation rotating.
In addition, retainer 214 is set as to surround the surrounding of substrate W in the outer surface of transfer band 210 referring to Fig. 4 and Fig. 9
The form of the form protrusion on periphery.
Retainer 214 is arranged for following purpose: in grinding technics, the grinding pad 232 of grinding unit 230 from
When the lateral area of substrate W enters to the inside region of substrate W, so that grinding pad 232 shows what the edge of substrate W was rebounded
As (phenomenon of rebounding) minimizes, and make caused by the rebound phenomena by grinding pad 232 in the edge substrate W non-grinds
Region (dead zone) (region without grinding pad grinding) is ground to minimize.
More specifically, substrate corresponding with the form of substrate W receiving portion 214a is formed through in retainer 214,
The inside of substrate receiving portion 214a, substrate W are placed in the outer surface of transfer band 210.
In the state that substrate W is contained in substrate receiving portion 214a, the apparent height of retainer 214 has and the side substrate W
The similar height of the apparent height of edge.As described above, making the edge of substrate W and adjacent with the edge of substrate W
The lateral area (retainer region) of close substrate W has mutually similar height, it is possible thereby to obtain following advantageous effects:
It is mobile from the lateral area of substrate W to the inside region of substrate W in grinding pad 232 in grinding technics, or out of substrate W
During side region is moved to the lateral area of substrate W, it can make between inside region and lateral area by substrate W
The rebound phenomena of grinding pad 232 caused by height tolerance minimizes, and makes the non-ground region as caused by rebound phenomena
It minimizes.
Preferably, the interval G being spaced is formed between the side of substrate receiving portion 214a and the side of substrate W.Such as
It is upper described, interval is formed between the side of substrate receiving portion 214a and the side of substrate W, thus substrate W can more smoothly
Ground is separated from substrate receiving portion 214a.
For example, the interval G between the side of substrate receiving portion 214a and the side of substrate W is formed as 0.1~5mm.As above
Described, the interval G between the side of substrate receiving portion 214a and the side of substrate W is formed as 0.1~5mm, thus in grinding
Minimize the rebound phenomena of grinding unit 230, after grinding base
Plate W can be separated successfully from substrate receiving portion 214a.
Meanwhile retainer 214 is set as the placed side from the substrate placement section 201 for being placed with substrate W (for example, transfer band
The upper surface of) protrusion, the grinding pad 232 of grinding unit 230 is configured to, to be contacted with the upper surface of retainer 214 and substrate W's simultaneously
States above is passed through the edge of substrate W and is ground to the upper surface of substrate W.
Preferably, the grinding technics that substrate W is carried out by the grinding pad 232 of grinding unit 230, in grinding for the substrate W
On the grinding starting position (SP of Fig. 4) that grinding process starts, a part of grinding pad 232 is configured to be contacted with retainer 214
States above, other a part of grinding pad 232 are configured to be contacted with the state of the upper surface of substrate W.
As described above, the grinding pad 232 of grinding unit 230 is contacted with substrate W's at the same time on grinding starting position SP
Above with start to grind in the state of the upper surface of retainer 214, it is possible thereby to obtain following advantageous effects: in grinding unit 230
Grinding pad 232 by substrate W edge when can more inhibit the phenomenon that grinding pad 232 from substrate W rebound.
In addition, retainer 214 is formed to have thickness (T1 >=T2) thinner than substrate W or identical with substrate W.Institute as above
It states, so that retainer 214 is formed to have thickness (T2) thinner than substrate W or identical with substrate W, it is possible thereby to obtain as follows
Advantageous effects: during grinding pad 232 is mobile to the inside region of substrate W from the lateral area of substrate W, prevent by
Rebound phenomena caused by the collision of grinding pad 232 and retainer 214.
Meanwhile the outer surface of transfer band 210 being provided with multiple retainers 214 along the loop direction of transfer band 210.Such as
It is upper described, multiple retainers 214 are formed in the outer surface of transfer band 210, thus having can be with straight column mode continuously to mutual
The advantages of different substrate W is handled.
Retainer 214 can be formed of a variety of materials according to required condition.But because grinding pad 232 contacts
In retainer 214, it is preferable that lesser such as polyethylene (PE), unsaturated polyester (UP) by being worn in grinding technics
(unsaturated polyester；) etc. UPE the material as forms retainer 214.
In addition, following composition has been illustrated: substrate placement section includes transfer band in the embodiments of the present invention,
Retainer is formed in the outer surface of transfer band, but according to different situations, as shown in figure 12, can also not have transfer band, only
201 ' of substrate placement section is constituted by substrate support (referring to the 220 of Fig. 9), retainer 214 can be formed in and only be supported by substrate
The upper surface of 201 ' of substrate placement section that portion is constituted.
In addition, substrate board treatment 10 includes fixed cell 250, if being placed in the substrate W of transfer band 210 with transfer band
210 circulation rotating and be transferred to abrasion site PZ, then fixed cell 250 makes transfer band 210 fixed.
It is intended that in carrying out the grinding for substrate W, to caused by the travelling and movement due to transfer band 210
The travelling of substrate W is inhibited, and improves the grinding uniformity of substrate W.
In other words, because being ground in the state that substrate W is placed in transfer band 210, if transfer band 210 is sent out
Raw travelling, then be placed in the substrate W of transfer band 210 while moving about, therefore in carrying out the grinding for substrate W, it is necessary to constrain
The travelling of transfer band 210.
Fixed cell 250 can be formed to the various structures of fixed transfer band 210.For example, fixed cell 250 is with energy
The form enough gone up and down is set to the top of transfer band 210, and selectively includes pressing member 252,252 pairs of pressing member shiftings
The outer surface of band 210 is sent to pressurize.
Preferably, pressing member 252 is configured to the width direction along transfer band 210 continuously to the appearance of transfer band 210
It pressurizes in face.As described above, the width direction along transfer band 210 continuously pressurizes to the outer surface of transfer band 210, from
And the advantageous effects for more certainly constraining the travelling of transfer band 210 can be obtained.
For example, pressing member 252 is configured to and is set in order to enable transfer band 210 is spaced with substrate support 220
Deflector roll (the idle roller) 242 of the lift unit 240 of the inside of transfer band is facing.As described above, by pressing member 252
It is configured to facing with deflector roll 242, pressurizes between pressing member 252 and deflector roll 242 to transfer band 210, it is possible thereby to
It obtains following advantageous effects: preventing the sagging of transfer band 210 caused by being pressurizeed by pressing member 252 to transfer band 210.
It according to different situations, can also be configured to, pressing member is configured to the top of substrate support, or is different using other
Support member support the inner surface of the transfer band of pressurized component pressurization.
In addition, substrate board treatment 10 includes loading control unit 120, transferred from loading station 100 to means of abrasion 200
In the loading transfer technique of substrate W, loads control unit 120 and loading station 100 is made to transfer the loading screen of substrate W and move
The band screen for sending band 210 to transfer substrate W is synchronous.
More specifically, if one end of substrate W is configured at predefined in the placement starting position SP of transfer band 210,
Loading control unit 120 makes loading screen synchronous with screen.
Here, so-called predefined is defined as in the placement starting position SP of transfer band 210, pass through transfer band 210
Circulation rotating can start to transfer the position of substrate W, assign between transfer band 210 and substrate W on placement starting position SP
Zygosity.For example, the front end for the substrate W that placement starting position SP may be set in and transfer from loading station 100 is facing
Substrate receiving portion 214a on one side (or while position for adjoininging with substrate receiving portion).
As reference, if perceiving substrate receiving portion by the common sensing device as sensor or vision camera
214a's is located at placement starting position SP on one side, then transfer band 210 stops rotating, to keep one side of substrate receiving portion 214a
Positioned at the state of placement starting position SP.
Later, in the state that transfer band 210 stops rotating, if perceiving the front-end configuration of substrate W by sensing device
In placement starting position SP, then control unit 120 is loaded so that loading screen and becoming same to each other with screen
The form of speed makes transfer band 210 rotate (synchronous rotary), and substrate W is transferred to abrasion site PZ, loads screen
The speed that substrate W is transferred for loading station 100 is the speed that transfer band 210 transfers substrate W with screen.
Also, it unloads part 300 to be arranged to unload the substrate W of completion milled processed from means of abrasion 200.
Unloading part 300 can be formed to unload the various structures of carried base board W, the utility model from means of abrasion 200
Not limited or restriction by the structure of unloading part 300.
For example, substrate W is transferred in unloading part 300 in height identical with transfer band 210, including to be separated by specified interval
Form separate configuration multiple unloadings transfer roller 310, when unloading transfer roller 310 rotate when, by multiple unloadings transfer rolling
Co-operatively transfer is supplied to the substrate W that the top of rollers 310 is transferred in multiple unloadings to cylinder 310.According to different situations, unloading
Part also can include tape loop, and tape loop carries out circulation rotating by unloading transfer roller.
It is defined as here, so-called unloading part 300 and transfer band 210 transfer substrate W in identical height, in uninstalling portion
Height that point 300 substrate W are transferred and the height for being placed and transferring in 210 substrate W of transfer band are same to each other.
In addition, substrate board treatment 10 includes Unloading Control portion 320, transferred from means of abrasion 200 to unloading part 300
In the unloading transfer technique of substrate W, Unloading Control portion 320 transfers band screen and the unloading part of substrate W to transfer band 210
The unloading screen of 300 transfer substrate W synchronizes.
For example, if Unloading Control portion 320 perceives one end of substrate W, to unload that screen is synchronous is and transfer
The identical speed of band screen with 210 transfer substrate W.According to different situations, nothing whether one end with perception substrate W
Close, also can by band screen and unloading screen it is identical in the form of make unloading transfer roller rotate in the state of,
So that transfer band rotates and substrate is offloaded to unloading part.
In addition, substrate board treatment 10 includes lift unit 240, lift unit 240 selectively makes transfer band 210
Inner surface is spaced with substrate support 220.
It is intended that more successfully realizing the circulation rotating of transfer band 210, transfer band 210 is used for so that completing to grind
The substrate W of mill is transferred to unloading part 300.
In other words, because the inner surface in transfer band 210 is formed with second surface layer 210c, in transfer band 210
Inner surface be contacted in the state of substrate support 220, be difficult smoothly realize transfer band 210 rotation, second surface layer
210C is used to improve the frictional force of the transfer band 210 relative to substrate support 220.
For lift unit 240, during carrying out the grinding for substrate W, the inner surface of transfer band 210 is kept
(second surface layer 210c) is contacted with the state of substrate support 220, after completing grinding, carries out circulation rotation in transfer band 210
During turning, so that the inner surface of transfer band 210 is spaced with substrate support 220.
Lift unit 240 can be formed to so that transfer band 210 inner surface selectively with substrate support 220
The various structures being spaced.For example, lift unit 240 includes: deflector roll 242, it is in rolling contact in the inner surface of transfer band 210；
Lifting unit 244 goes up and down deflector roll 242.
Deflector roll 242 rotates in the state of being contacted with the inner surface of transfer band 210 with the rotation of transfer band 210.
Lifting unit 244 can be formed to so that the various structures that deflector roll 242 is selectively gone up and down, the utility model is simultaneously
Non- structure and type by lifting unit 244 is limited or restriction.It is risen for example, general electrical solenoid, cylinder etc. can be used as
Drop portion 244.
As described above, the preferred embodiment referring to the utility model is illustrated, it is to be understood that, if affiliated
Those skilled in the art, then can the utility model documented by no disengaging claims thought and field
In range, so that the utility model carries out a variety of modifications and changes.
Label declaration
10: substrate board treatment 100: loading station
110: loading transfer roller 120: loading control unit
200: means of abrasion 210: transfer band
212: the 212a: the first roller of roller unit
212b: second tin roller 214: retainer
214a: substrate receiving portion 220,220 ': substrate support
230: grinding unit 232: grinding pad
240: lift unit 242: deflector roll
244: lifting unit 250: fixed cell
252: pressing member 300: unloading part
310: unloading transfer roller 320: Unloading Control portion
Claims (20)
1. a kind of substrate board treatment, the substrate board treatment as the grinding technics for carrying out substrate characterized by comprising
Substrate placement section, is placed with substrate；
Retainer is configured to surround the surrounding periphery of the substrate；
Grinding unit grinds the upper surface of described substrate with being contacted with the state of the upper surface of described retainer.
2. substrate board treatment according to claim 1, which is characterized in that
The retainer is set as protruding from the placed side for the substrate placement section for being placed with the substrate,
The grinding unit to be contacted with the state of the upper surface of the upper surface of described retainer and the substrate by the base simultaneously
Simultaneously the upper surface of described substrate is ground at the edge of plate.
3. substrate board treatment according to claim 1, which is characterized in that
The grinding technics that the substrate is carried out by the grinding unit starts in the grinding that the grinding technics of the substrate starts
On position, a part of the grinding unit is configured to be contacted with the state of the upper surface of described retainer, the grinding unit
Other a part are configured to be contacted with the state of the upper surface of described substrate.
4. substrate board treatment according to claim 1, which is characterized in that the substrate placement section includes:
Transfer band carries out circulation rotating along defined path, is mounted with the substrate in outer surface；
Substrate support is configured at the inside of the transfer band, and in the state of across the transfer band described in support
The bottom surface of substrate.
5. substrate board treatment according to claim 1, which is characterized in that
Substrate receiving portion is formed through in the retainer, and in the inside of the substrate receiving portion, the substrate is placed in described
Substrate placement section.
6. substrate board treatment according to claim 5, which is characterized in that
The interval being spaced is formed between the side of the substrate receiving portion and the side of the substrate.
7. substrate board treatment according to claim 6, which is characterized in that
The interval is 0.1~5mm.
8. substrate board treatment according to claim 1, which is characterized in that
The retainer is formed to have thickness thinner than the substrate or identical with the substrate.
9. substrate board treatment according to claim 4, which is characterized in that
Along the loop direction of the transfer band, the outer surface of the transfer band is provided with multiple retainers.
10. substrate board treatment according to claim 4, which is characterized in that
The transfer band carries out circulation rotating along the defined path by roller unit,
The substrate is transferred by the circulation rotating of the transfer band.
11. substrate board treatment according to claim 10, which is characterized in that the roller unit includes:
First roller；
Second tin roller is configured to be spaced with first roller,
The transfer band carries out circulation rotating along the defined path by first roller and the second tin roller.
12. substrate board treatment according to claim 4, which is characterized in that
The substrate support is configured to inner surface facing with the bottom surface of the substrate, and supporting the transfer band.
13. substrate board treatment according to claim 12, which is characterized in that
The substrate support is configured to be tightly attached to the inner surface of the transfer band.
14. substrate board treatment according to claim 10, which is characterized in that
The substrate support is configured to be spaced with the inner surface of the transfer band, and supports the shifting with contactless state
Send the inner surface of band.
15. substrate board treatment according to claim 4, which is characterized in that
It is formed with first surface layer in the outer surface of the transfer band, first surface layer is by improving rubbing relative to the substrate
Coefficient is wiped to inhibit to slide,
It is formed with second surface layer in the inner surface of the transfer band, second surface layer is supported by improving relative to the substrate
The coefficient of friction in portion inhibits to slide.
16. substrate board treatment according to claim 15, which is characterized in that
The first surface layer and the second surface layer are formed above by any one in engineering plastics, polyurethane.
17. substrate board treatment according to claim 4, which is characterized in that the grinding unit includes:
Grinding pad is formed as less than the size of the substrate, and shifting while to be contacted with the state rotation of the substrate
It is dynamic.
18. substrate board treatment according to claim 17, which is characterized in that
The grinding pad is repeated zigzagged while to the base along the first oblique line path and the second oblique line path
The surface of plate is ground, on one side inclination of the first oblique line path to the substrate, and the second oblique line path is to first oblique line
The opposite direction in path tilts.
19. substrate board treatment according to claim 17, which is characterized in that
The grinding pad is repeated zigzagged while to the base along first straight line path and second straight line path
The surface of plate is ground, and first straight line path is along the path of an edge direction of the substrate, and second straight line path is institute
State the path of the opposite direction in first straight line path.
20. according to claim 1 to substrate board treatment described in any one of 19, which is characterized in that
During carrying out the mechanical lapping for the substrate, while the lapping liquid for being used for chemical grinding is supplied, and carry out chemistry
Mechanical lapping (CMP) technique.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170151465A KR20190054650A (en) | 2017-11-14 | 2017-11-14 | Substrate procesing apparatus |
| KR10-2017-0151465 | 2017-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208179273U true CN208179273U (en) | 2018-12-04 |
Family
ID=64435004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820597813.7U Active CN208179273U (en) | 2017-11-14 | 2018-04-25 | Substrate board treatment |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20190054650A (en) |
| CN (1) | CN208179273U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112123197A (en) * | 2020-09-24 | 2020-12-25 | 郑州方铭高温陶瓷新材料有限公司 | Double-track sliding plate brick plane grinding machine |
| CN114734353A (en) * | 2022-04-08 | 2022-07-12 | 永臻科技股份有限公司 | Equipment and method for removing fluorine-containing layer of backboard |
-
2017
- 2017-11-14 KR KR1020170151465A patent/KR20190054650A/en not_active Application Discontinuation
-
2018
- 2018-04-25 CN CN201820597813.7U patent/CN208179273U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112123197A (en) * | 2020-09-24 | 2020-12-25 | 郑州方铭高温陶瓷新材料有限公司 | Double-track sliding plate brick plane grinding machine |
| CN112123197B (en) * | 2020-09-24 | 2024-03-22 | 郑州方铭高温陶瓷新材料有限公司 | Double-track slide plate brick plane grinding machine |
| CN114734353A (en) * | 2022-04-08 | 2022-07-12 | 永臻科技股份有限公司 | Equipment and method for removing fluorine-containing layer of backboard |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190054650A (en) | 2019-05-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208697130U (en) | Substrate board treatment | |
| CN208179273U (en) | Substrate board treatment | |
| KR102506047B1 (en) | Substrate procesing apparatus | |
| KR20190102945A (en) | Substrate processing apparatus | |
| KR20190120937A (en) | Substrate processing apparatus | |
| CN110091246A (en) | Substrate board treatment | |
| CN109786298A (en) | Substrate board treatment and transfer band for the substrate board treatment | |
| CN208289664U (en) | Substrate board treatment | |
| KR20190059357A (en) | Substrate procesing apparatus | |
| CN208729489U (en) | Substrate board treatment | |
| KR102461594B1 (en) | Substrate procesing apparatus and transfer belt using the same | |
| KR102583017B1 (en) | Substrate processing apparatus | |
| KR20200025487A (en) | Substrate processing apparatus | |
| KR102070070B1 (en) | Substrate procesing apparatus | |
| KR102589149B1 (en) | Substrate processing apparatus | |
| KR102506050B1 (en) | Substrate procesing apparatus | |
| KR102144846B1 (en) | Substrate processing apparatus and retainer using the same | |
| KR102564114B1 (en) | Substrate processing apparatus | |
| KR102597763B1 (en) | Substrate processing apparatus | |
| KR20190105996A (en) | Substrate processing apparatus | |
| KR102528074B1 (en) | Substrate procesing apparatus | |
| KR102528070B1 (en) | Substrate processing apparatus | |
| KR102507755B1 (en) | Substrate processing apparatus | |
| CN110340799A (en) | Substrate board treatment | |
| KR20190102347A (en) | Substrate processing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |