CN110091246A - Substrate board treatment - Google Patents

Abstract

The present invention relates to a kind of substrate board treatments, and the substrate board treatment for carrying out the grinding technics of substrate includes: substrate placement section, are used to place substrate；Grinding unit comprising grinding pad, and the upper surface of described substrate is ground, grinding pad is moved with the state for being contacted with the substrate；The temperature of the grinding pad is adjusted to defined temperature range before the grinding pad touches the substrate by temperature regulation section, it is possible thereby to obtain the advantageous effects for improving the grinding uniformity and grinding stability.

Description

Substrate board treatment

Technical field

The present invention relates to a kind of substrate board treatments, more specifically, are related to a kind of substrate board treatment, can be improved Grind the uniformity and grinding stability.

Background technique

Recently, surging to the interest of information display, and want to get higher using the requirement for the information medium that can be carried, with This simultaneously, emphasis carry out for replace existing display device Braun tube (Cathode Ray Tube；CRT: cathode-ray tube) Light weight thin panel display device (Flat Panel Display；FPD: flat-panel monitor) research and commercialization.

In the panel display apparatus field, up to the present, although light and few power consumption liquid crystal display device (Liquid Crystal Display Device；It LCD) is display device of greatest concern, but liquid crystal display device is not Light-emitting component but light receiving element, and brightness, contrast (contrast ratio) and in terms of exist lack Point, therefore actively exploitation of the expansion for the new display device that can overcome the disadvantage.Wherein, recently, organic light emission Display (OLED:Organic Light Emitting Display) is one of the display of new generation just to attract attention.

In general, display device use intensity and the outstanding glass substrate of permeability, but recently, display device is tended to surpass Thinning and high pixel (high-pixel), it is therefore desirable to prepare corresponding glass substrate.

For example, ELA (Eximer Laser Annealing: quasi-molecule laser annealing) technique is one in OLED technique Kind, laser scanning to amorphous silicon (a-Si) is crystallized as polysilicon (poly-Si), in the ELA technique, polysilicon knot Protrusion can be generated on surface while brilliant, the protrusion can generate non-uniform phenomenon (mura-effects), so glass substrate Necessary ground processing, it is raised to remove.

For this purpose, a variety of researchs for effective grinding base plate surface are being carried out recently, but it is still unsatisfactory, because This requires the exploitation to this.

Summary of the invention

The purpose of the present invention is to provide a kind of substrate board treatment, the grinding uniformity can be improved and grinding is stablized Property.

It is further an object that the grinding efficiency of substrate can be improved, and make the amount of grinding of substrate equal It is even.

It is further an object that the grinding quality of substrate can be improved, and productivity can be improved.

According to the preferred embodiment of the present invention for realizing described the object of the invention, so that grinding pad is preheated in advance In the state of substrate is ground, it is possible thereby to improve the grinding uniformity and grinding stability.

In addition, according to a further advantageous embodiment of the invention, according to the position of the grinding pad relative to substrate, so that grinding The movement speed for grinding unit is different, it is possible thereby to reduce the amount of grinding deviation of substrate abradant surface, and improves the grinding uniformity.

As described above, according to the present invention it is possible to obtain improving the advantageous effects of the grinding uniformity and grinding stability.

In particular, according to the present invention, so that grinding pad grinds substrate in the state of being preheated to predetermined temperature in advance, It is possible thereby to obtain following advantageous effects: reducing the amount of grinding deviation of substrate abradant surface, improve the grinding uniformity.

In addition, according to the present invention, according to the position of the grinding pad relative to substrate, being carried out to the movement speed of grinding unit Different adjusting, it is possible thereby to obtain following advantageous effects: can be according to the position of grinding pad, so that being carried out by grinding pad every Unit time amount of grinding is uniform, and reduces the amount of grinding deviation of substrate abradant surface, improves the grinding uniformity.

In addition, according to the present invention it is possible to obtain following advantageous effects: the flatness of the grinding pad relative to substrate is improved, Improve grinding stability.

In addition, according to the present invention it is possible to obtain following advantageous effects: improving the grinding efficiency of substrate, shorten milling time.

In addition, according to the present invention it is possible to obtain making the uniform advantageous effects of the amount of grinding of substrate.

In addition, according to the present invention it is possible to obtain following advantageous effects: the grinding quality of substrate can be improved, and improve Yield and productivity.

Detailed description of the invention

Fig. 1 is the perspective view for being illustrated to substrate board treatment according to a first embodiment of the present invention,

Fig. 2 is the side view for showing substrate board treatment according to a first embodiment of the present invention,

Fig. 3 is the plan view for being illustrated to substrate board treatment according to a first embodiment of the present invention,

Fig. 4 is the figure for being illustrated to the amount of grinding per unit time according to grinding pad temperature,

Fig. 5 and Fig. 6 is ground for each section of the substrate to substrate board treatment according to a first embodiment of the present invention The figure that mill amount is illustrated,

Fig. 7 is the figure being illustrated for the retainer to substrate board treatment according to a first embodiment of the present invention,

Fig. 8 is the abrasion path progress for the grinding unit to substrate board treatment according to a first embodiment of the present invention The plan view of explanation,

Fig. 9 is another embodiment for the grinding unit to substrate board treatment according to a first embodiment of the present invention The figure being illustrated,

Figure 10 is another embodiment for the preheating part to substrate board treatment according to a first embodiment of the present invention The figure being illustrated,

Figure 11 is another implementation again for the preheating part to substrate board treatment according to a first embodiment of the present invention The figure that example is illustrated,

Figure 12 to Figure 14 is for the another of the substrate placement section to substrate board treatment according to a first embodiment of the present invention The figure that one embodiment is illustrated,

Figure 15 is the figure for being illustrated to substrate board treatment according to a second embodiment of the present invention,

Figure 16 is the figure for being illustrated to the amount of grinding per unit time according to the movement speed of grinding pad,

Figure 17 and Figure 18 is the mobile speed for the grinding pad to substrate board treatment according to a second embodiment of the present invention The figure that the correlativity of degree and amount of grinding is illustrated.

Specific embodiment

Hereinafter, to a preferred embodiment of the present invention will be described in detail, but the present invention is not by embodiment referring to attached drawing Limitation or restriction.As reference, in the present note, identical label actually means that identical element, and described Under rule, it can quote and be recorded in the contents of other accompanying drawings to illustrate, and omit and be judged as a person skilled in the art Obviously content or repeatedly.

Referring to figs. 1 to Figure 11, substrate board treatment 10 according to the present invention includes: substrate placement section 210, is used to place Substrate W；Grinding unit 220 comprising grinding pad 222, and the upper surface of substrate W is ground, grinding pad 222 is to be contacted with The state of substrate W is moved；Temperature regulation section 400, before grinding pad 222 touches substrate W, by grinding pad 222 Temperature is adjusted to defined temperature range.

Its purpose is to improve the grinding uniformity of substrate W and grinding stability.

In other words, if changing to the temperature for the grinding pad that substrate is ground, by every list of grinding pad progress Position time amount of grinding also changes, so must make the temperature of grinding pad in grinding technics for equably grinding base plate Degree is uniformly maintained in defined temperature range.In other words, if the temperature of grinding pad within the specified temperature range, by grinding The amount of grinding per unit time that mill pad carries out is shown as defined amount of grinding range, in contrast, if the temperature of grinding pad is lower than Defined temperature range is then lower than defined amount of grinding range by the amount of grinding per unit time that grinding pad carries out, so grinding In grinding process, it is necessary to so that the temperature of grinding pad is maintained at uniform temperature range.

It, can be by by grinding pad and substrate during grinding pad carries out mobile to be contacted with the state of substrate surface Between friction generate fever and make the temperature of grinding pad be maintained at defined temperature range.But it is initial in grinding pad When being contacted with substrate, the temperature of grinding pad is formed as lower than defined temperature range, is initially contacted with so having in grinding pad The problem of region of substrate can be inevitably lower by the amount of grinding per unit time that grinding pad carries out has ask as follows accordingly Topic: the amount of grinding deviation of substrate abradant surface becomes larger, and reduces the grinding uniformity of substrate.

But for the present invention, so that the state that is preheated in advance before being contacted with substrate of grinding pad to substrate into Row grinding, it is possible thereby to obtain following advantageous effects: the amount of grinding deviation of substrate abradant surface can be controlled to obtain very little, and mentioned The height grinding uniformity and grinding stability.

Moreover, for the present invention, so as to base in the state of grinding pad temperature range as defined in being preheated in advance Plate is ground, it is possible thereby to obtain following advantageous effects: being improved the grinding efficiency of substrate W, is shortened milling time.

Substrate placement section 210 be configured at loading station (referring to Fig.1 the 100 of 3) and unloading part (referring to Fig.1 the 300 of 4) it Between, the substrate W for being supplied to loading station is transferred to substrate placement section 210, and in the state of being placed in substrate placement section 210 After being ground, it is unloaded by unloading part 300.

More specifically, setting loading station 100 is in order to which the substrate W that will be ground is loaded into means of abrasion (not shown).

Loading station 100 can be formed to for substrate W to be loaded into the various structures of means of abrasion, the present invention not by The limitation or restriction of the structure of loading station 100.

For example, loading station 100 includes the multiple loadings transfer roller for separating configuration in the form of being separated by specified interval 110, and when load transfer roller 110 rotate when, by multiple loading transfer roller 110 co-operatively transfer be supplied to it is multiple Load the substrate W on the top of transfer roller 110.According to different situations, loading station also can include tape loop, recycle band logical It crosses loading transfer roller and carries out circulation rotating.

Meanwhile for the substrate W for being supplied to loading station 100, before supplying to loading station 100, posture and position Set posture as defined in being arranged as by alignment unit (not shown) and position.

As reference, for substrate W as used in the present invention, the length that a side can be used is greater than the four of 1m Side shape substrate W.It is ground for example, the 6th generation glass substrate W with 1500mm*1850mm size can be used as and execute chemical machinery The substrate W processed of grinding process.According to different situations, the 7th generation and eighth generation glass substrate can also act as substrate processed W.Differently, the length for being also able to use a side is less than the substrate (for example, second generation glass substrate) of 1m.

Substrate placement section 210 and grinding unit 220 constitute means of abrasion between loading station 100 and unloading part 300.

Substrate placement section 210 can be set to place the various structures of substrate W, and the knot of substrate placement section 210 Structure and form can be changed to a variety of according to required condition and design specification.

For example, substrate placement section 210 includes substrate support 212 and surface cushion 214, surface cushion 214 is set to substrate branch The upper surface of support part 212 inhibits to slide by improving the coefficient of friction relative to substrate W, and substrate W is placed in surface cushion 214 Above.

As reference, in the present invention, it is so-called to substrate W carry out grinding be defined as, pass through be directed to substrate W mechanical grinding Grinding process or chemical mechanical grinding (CMP) technique grind substrate W.For example, carrying out in means of abrasion for substrate W's During mechanical lapping, while the lapping liquid for being used for chemical grinding is supplied, and carry out chemical mechanical grinding (CMP) technique.At this point, can To supply lapping liquid from the inside region of grinding pad 222, or lapping liquid can also be supplied from the lateral area of grinding pad 222.

Substrate support 212 in order to supporting substrate W bottom surface and be arranged.

Substrate support 212 may be constructed for according to required condition and design specification in many ways come supporting substrate The bottom surface of W.

Hereinafter, being illustrated so that substrate support 212 is generally formed into quadrangle plate as an example.According to different situations, Substrate support can be formed as other different shapes and structure, and can also be propped up using more than two substrate supports The bottom surface of support group plate.

Meanwhile as substrate support 212, rock plate can be used.According to different situations, substrate support can be with It is formed by metal material or porous material, the present invention is not limited or restriction by the material of substrate support.

The upper surface of substrate support 212 is provided with surface cushion 214, surface cushion 214 is by improving rubbing relative to substrate W Coefficient is wiped to inhibit to slide.

As described above, being provided with surface cushion 214 in the upper surface of substrate support 212, substrate W is placed in surface cushion 214 Outer surface, it is possible thereby to obtain following advantageous effects: in the state that substrate W is placed in substrate support 212, phase can be constrained Movement (constraint sliding) for the substrate W of substrate support 212, and stably keep the allocation position of substrate W.

Surface cushion 214 can be by with substrate W there is the multiple material of zygosity to be formed, and the present invention is not by surface cushion The limitation or restriction of 214 material.For example, surface cushion 214 can use retractility and the outstanding poly- ammonia of tackness (frictional force) Ester, engineering plastics, any one in silicon materials are formed above.According to different situations, surface cushion also can be by with anti-skidding function The other materials of energy is formed.

In addition, surface cushion 214 is formed to have higher compression ratio.Here, so-called surface cushion 214 be formed to have compared with High compression ratio can also be expressed as the elongation percentage with higher of surface cushion 214, and be defined as, and surface cushion 214 is by can be easy It is formed in the soft material of compression.

Preferably, surface cushion 214 is formed to have 20~50% compression ratio.As described above, surface cushion 214 is formed as having Have 20~50% compression ratio, it is possible thereby to obtain following advantageous effects: even if foreign matter flow in substrate W and surface cushion 214 it Between, surface cushion 214 can also easily be pressed to the thickness degree of foreign matter, it is possible to so that the height of the substrate W as caused by foreign matter It spends deviation (privileged site of substrate is locally protruded because of foreign matter) to minimize, and makes the privileged site part by substrate W Uniformity reduced minimum is ground caused by protrusion.

In addition, being configured to logical in above mentioned and shown the embodiment of the present invention with substrate support 212 It crosses the way of contact to come for supporting substrate W to be illustrated, but according to different situations, substrate support can also be configured to Come the bottom surface of supporting substrate in a non contact fashion.

For example, substrate support is configured to, fluid is sprayed to the bottom surface of substrate, passes through the jet power generated by fluid Come the bottom surface (or bottom surface of surface cushion) of supporting substrate.At this point, substrate support can spray gas (example to the bottom surface of substrate Such as, air) and liquid (for example, pure water) at least any one, and can be according to required condition and design specification Numerous variations are carried out to the type of fluid.

According to different situations, substrate support can also be configured to, using magnetic force (for example, repulsion；repulsive Force the suspending power) or by ultrasonic activation generated, carrys out the inner surface of supporting substrate in a non contact fashion.

Grinding unit 220 includes grinding pad 222, and is set as grinding the surface of substrate W, grinding pad 222 with The state for being contacted with substrate W surface is moved.

For example, grinding pad 222 is formed as less than the size of substrate W, and while to be contacted with the state rotation of substrate W It is mobile.

More specifically, grinding pad 222 is installed on 222 carrier (not shown) of grinding pad, and to be contacted with substrate W surface State rotation while (planarization) is linearly ground to the surface of substrate W.

Grinding pad carrier can be formed to the various structures so that 222 rotation of grinding pad, and the present invention is not ground Pad the limitation or restriction of the structure of carrier.For example, grinding pad carrier is configured to a main body, or can be with multiple main bodys The form combined is constituted, and is configured to be connected and rotate with drive shaft (not shown).In addition, being arranged in grinding pad carrier Have pressurization part (for example, the air pressure pressurization part pressurizeed using air pressure to grinding pad), pressurization part will be for that will grind Pad 222 stresses on the surface of substrate W.

Grinding pad 222 is formed by the material for being suitable for carrying out substrate W mechanical lapping.For example, grinding pad 222 can use Polyurethane, polyureas (polyurea), polyester, polyethers, epoxy resin, polyamide, polycarbonate, polyethylene, polypropylene, fluorine polymerization Object, polyvinyl, acrylic acid and methacrylic (methacrylic) polymer, silicon materials, latex, nitrite elastomer, A variety of copolymers of isoprene rubber, butadiene rubber and styrene, butadiene and acrylonitrile are formed, and can basis Required condition and design specification carries out numerous variations to the material and characteristic of grinding pad 222.

Preferably, the circular abrasive pad 222 by size less than substrate W is used as grinding pad 222.In other words, can also make Grinding pad 222 with size greater than substrate W is come grinding base plate W, still, if being greater than the grinding pad 222 of substrate W using size, In order to enable grinding pad 222 transfers to need very big rotating equipment and space certainly, therefore there is reduction space efficiency and design Freedom degree and the problem of reduce stability.It is further preferable that grinding pad is formed to have and the lateral length of substrate W or longitudinal direction The corresponding diameter of length, or the half of lateral length or longitudinal length less than substrate W can be formed to have Diameter.

Actually problem is, because the length of at least a side of substrate W has the size greater than 1m, so that greatly Small grinding pad (for example, grinding pad that diameter is greater than 1m) rotation greater than substrate W is very difficult in itself.In addition, if making It, then can not be on the whole by the substrate W's ground by the grinding pad of rotation with non-circular grinding pad (for example, quadrangle grinding pad) Surface grinding is uniform thickness.But in the present invention, by making size be less than 222 rotation of circular abrasive pad of substrate W And the surface of substrate W is ground, it is possible thereby to obtain following advantageous effects: space efficiency and design will not both be greatly reduced Freedom degree, also can by make grinding pad 222 from then substrate W is ground, and equably keep on the whole by The amount of grinding that grinding pad 222 carries out.

Grinding unit 220 is configured to move by gantry (gantry) unit 20 along X-direction and Y direction.

More specifically, gantry unit 20 includes: X-axis gantry 22, and (for example, X-direction) carries out along a first direction Linear movement；Y-axis gantry 24 is installed on X-axis gantry 22, along with the decussate second direction of first direction (for example, Y Axis direction) it moves linearly, and grinding unit 220 is installed on Y-axis gantry 24, moves along X-direction and Y direction Simultaneous grinding substrate W.

X-axis gantry 22 can be formed as "U" shaped shape, and be configured to move along guide rail 22a, and guide rail 22a is along The configuration of one direction.It is alternately arranged the permanent magnet of the pole N and the pole S in guide rail 22a, and can be by being applied to X-axis gantry 22 The current control of coil drives X-axis gantry 22 according to the principle for the linear motor that can accurately control position.

At this point it is possible to carry out a variety of changes according to the abrasion path of required condition and design specification to grinding unit 220 More.

For example, referring to Fig. 8, grinding pad 222 is configured to, along one side inclined first oblique line path relative to substrate W L1 and opposite direction inclined second oblique line path L2 to the first oblique line path L1 be repeated it is mobile in a zigzag, while to base It is ground on the surface of plate W.

Here, the first oblique line path L1 refers to, such as the path of the bottom edge inclination predetermined angular θ relative to substrate W.This Outside, the second oblique line path L2 refers to, in the form that intersects with the first oblique line path L1 towards the opposite of the first oblique line path L1 The path of direction inclination predetermined angular.

In addition, in the present invention, so-called grinding pad 222 along the first oblique line path L1 and the second oblique line path L2 repeatedly It carries out movement in a zigzag to be defined as, during grinding pad 222 carries out mobile to be contacted with the state of substrate W surface, relatively It is not interrupted in the movement routine of the grinding pad 222 of substrate W, but turns to other directions (from the first oblique line route turning the Two oblique line paths).In other words, grinding pad 222 is along the first oblique line path L1 and the second oblique line path L2 continuous moving, and Form the motion track of continuously coupled wave feature.

More specifically, the first oblique line path L1 and the second oblique line path L2 is symmetrical in line on the basis of one side of substrate W, Grinding pad 222 is repeated along the first oblique line path L1 and the second oblique line path L2 and moves and to the surface of substrate W in a zigzag It is ground.At this point, the first oblique line path L1 and the second oblique line path L2 are symmetrically referred on the basis of one side of substrate W in line, When making the first oblique line path L1 and the second oblique line path L2 symmetrical centered on one side of substrate W 11, the first oblique line path L1 It is completely overlapped with the second oblique line path L2, and it is defined as one side and the first oblique line path L1 angle formed and the base of substrate W One side of plate W is identical as the angle that the second oblique line path L2 is formed.

Preferably, it is to move back and forth pitch (pitch) with the length for being less than or being equal to the diameter of grinding pad 222, grinds Mill pad 222 is moved back and forth along the first oblique line path L1 and the second oblique line path L2 relative to substrate W.Hereinafter, to phase When the length in 222 diameter of grinding pad is to move back and forth pitch P, grinding pad 222 is along the first oblique line path L1 and the second oblique line Path L2 is regularly moved back and forth relative to substrate W and is illustrated.

At this point, grinding unit 220 is configured to carry out by the works (not shown) as gantry (Gantry) Linear movement, and the present invention is not the type by the works for making grinding unit 220 mobile and structure is limited or restriction. For example, gantry may include: the first support shaft and the second support shaft, the two of substrate W is configured in the state of across substrate W Side, and be configured to move linearly along the transfer direction of substrate W；And connecting shaft, to the first support shaft and Second support shaft is attached, and grinding unit 220 can be installed in connecting shaft.

As discussed previously with respect to substrate W, grinding pad 222 along the first oblique line path L1 and the second oblique line path L2 repeatedly It carries out zigzagged while the surface of substrate W is ground, and to be less than or be equal to the diameter of grinding pad 222 Length is to move back and forth pitch P, and grinding pad 222 carries out advance movement relative to substrate W, it is possible thereby to obtain following advantageous effect Fruit: regular and equably right in the state that the region of the grinding of grinding pad 222 is not omitted in the whole surface region of substrate W The whole surface of substrate W is ground.

It is defined as here, so-called grinding pad 222 carries out advance movement relative to substrate W, grinding pad 222 is oblique along first Towards the front of substrate W (for example, using Fig. 8 as base while thread path L1 and the second oblique line path L2 is mobile relative to substrate W Standard, from the bottom edge of substrate towards top) carry out straight movement.In other words, the right angle three to be made of bottom edge, bevel edge, opposite side For angular, the bottom edge of right angled triangle can be defined as to the bottom edge of substrate W, the bevel edge of right angled triangle is defined as first Oblique line path L1 or the second oblique line path L2, and the opposite side of right angled triangle can be defined relative to the grinding of substrate W The advance moving distance of pad 222.

It in other words, is to move back and forth pitch, grinding pad 222 with the length for being less than or being equal to the diameter of grinding pad 222 To substrate while mobile in a zigzag (moving along the first oblique line path and the second oblique line path) is repeated relative to substrate W W is ground, it is possible thereby to obtain following advantageous effects: can be prevented from generating in the whole surface region of substrate W and be omitted grinding The region that pad 222 is ground, so the equably thickness deviation of control base board W, equably adjusts substrate W's relative to two-dimentional plate face Thickness distribution, to improve grinding quality.

For another example, grinding pad also can be in the word being repeated along first straight line path (not shown) and second straight line path Shape grinds the surface of substrate W while mobile, and first straight line path is along the path of an edge direction of substrate W the Two straight line paths are the paths of the opposite direction in first straight line path.Here, first straight line path refers to, such as along from substrate Path of the bottom edge one end of W towards the direction of the other end.In addition, second straight line path refers to towards opposite with first straight line path The path in direction.

As reference, in above mentioned and shown the embodiment of the present invention, with means of abrasion only by one Grinding unit is illustrated for constituting, but referring to Fig. 9, means of abrasion can include more than two grinding units 220, 220 '.At this point, multiple grinding units 220,220 ' are respectively arranged with grinding pad 222,222 ', and it is configured to, towards phase The surface of substrate W is ground while with path or mobile opposite direction path.

In addition, substrate board treatment may include adjuster (not shown), adjuster (is contacted with the outer surface of grinding pad The surface of substrate) it is modified.

For example, adjuster can be configured at the lateral area of substrate W, and the plus-pressure by providing in advance is to grinding The surface (bottom surface) of pad is pressurizeed and carries out micro-cutting, so that the micropore modification that will be formed in grinding pad surface is exposing table Face.In other words, adjuster in order to prevent many foaming blockage of the micro orifice in the outer surface of grinding pad and to the outer surface of grinding pad Micro-cutting is carried out, to swimmingly will be filled with being supplied to substrate W in the lapping liquid of grinding pad foaming stomata, foaming micropore is played Hold the effect of the lapping liquid by grinding agent and chemical substance mixing.Preferably, adjuster is configured to rotate, and with rotation The mode turned is contacted with the outer surface (bottom surface) of grinding pad.

Referring to Fig. 7, means of abrasion includes retainer 130, and retainer 130 is set as to wrap up the perimeter of substrate W Form protrudes from the state of the outer surface of surface cushion 214.

Retainer 130 is arranged for following purpose: in grinding technics, the grinding pad 210 of grinding unit 220 from When the lateral area of substrate W enters to the inside region of substrate W, so that grinding pad 210 shows what the edge of substrate W was rebounded As (phenomenon of rebounding) minimizes, and make caused by the rebound phenomena by grinding pad 210 in the edge substrate W non-grinds Region (dead zone) (region without grinding pad grinding) is ground to minimize.

More specifically, substrate corresponding with the form of substrate W receiving portion 130a is formed through in retainer 130, The inside of substrate receiving portion 130a, substrate W are placed in the outer surface of surface cushion 214.

In the state that substrate W is contained in substrate receiving portion 130a, the apparent height of retainer 130 has and the side substrate W The similar height of the apparent height of edge.As described above, making the edge of substrate W and adjacent with the edge of substrate W The lateral area (retainer region) of close substrate W has mutually similar height, it is possible thereby to obtain following advantageous effects: It is mobile from the lateral area of substrate W to the inside region of substrate W in grinding pad 210 in grinding technics, or out of substrate W During side region is moved to the lateral area of substrate W, it can make between inside region and lateral area by substrate W The rebound phenomena of grinding pad 210 caused by height tolerance minimizes, and makes the non-ground region as caused by rebound phenomena It minimizes.

Meanwhile retainer 130 is set as protruding from the placed side for the substrate placement section 210 for being placed with substrate W, grinding unit 220 grinding pad 210 is configured to, to be contacted with the state of the upper surface of the upper surface of retainer 130 and substrate W simultaneously by substrate W Edge and the upper surface of substrate W is ground.

Preferably, start in the grinding that the grinding technics that the grinding pad 210 by grinding unit 220 carries out substrate W starts On position, a part of grinding pad 210 is configured to be contacted with the state of the upper surface of retainer 130, another part of grinding pad 210 It is configured to be contacted with the state of the upper surface of substrate W.

As described above, the grinding pad 210 of grinding unit 220 is contacted with the upper of substrate W at the same time on grinding starting position Start to grind in the state of the upper surface of face and retainer 130, it is possible thereby to obtain following advantageous effects: in grinding unit 220 Grinding pad 210 can more inhibit the phenomenon that grinding pad 210 rebounds from substrate W when passing through the edge of substrate W.

Preferably, retainer 130 is formed to have thickness (T1 >=T2) thinner than substrate W or identical with substrate W.As above It is described, so that retainer 130 is formed to have thickness (T2) thinner than substrate W or identical with substrate W, it is possible thereby to obtain such as Lower advantageous effects: during grinding pad 210 is mobile to the inside region of substrate W from the lateral area of substrate W, so that by grinding The rebound phenomena of grinding unit 220 minimizes caused by the collision of mill pad 210 and retainer 130.

Retainer 130 can be formed of a variety of materials according to required condition.But because grinding pad 232 contacts In retainer 130, it is preferable that lesser such as polyethylene (PE), unsaturated polyester (UP) by being worn in grinding technics (unsaturated polyester；) etc. UPE the material as forms retainer 130.

Temperature regulation section 400 is set as the temperature tune of grinding pad 222 before grinding pad 222 is contacted with substrate W in advance It saves to defined temperature range.

It is defined as here, the so-called temperature by grinding pad 222 is adjusted to defined temperature range, by grinding pad 222 Temperature is adjusted to the temperature model that defined amount of grinding range can be shown as by the amount of grinding per unit time that grinding pad 222 carries out It encloses.

As reference, referring to Fig. 4, if the temperature of grinding pad 222 is in cryogenic temperature range A1, by grinding pad 222 into Capable amount of grinding per unit time is shown as the form being gradually increased, if the temperature of grinding pad 222 increases to defined temperature model A2 (for example, 40 DEG C~80 DEG C) are enclosed, then are shown as being uniformly maintained in rule by the amount of grinding per unit time that grinding pad 222 carries out The form of fixed amount of grinding range.

As described above, if carrying out the grinding of substrate W in the state that the temperature of grinding pad 222 reaches predetermined temperature range, Then quickly removal is covered in the film of substrate W grinding layer under high temperature environment, thus promote mechanical lapping, at the same time, setting For be most suitable for lapping liquid chemical reaction temperature, to more shorten chemical milling time.

Based on this, temperature regulation section 400 is before grinding pad 222 is contacted with substrate W by the temperature tune of grinding pad 222 Save to defined temperature range A2, it is specified that temperature range A2 be shown as the amount of grinding per unit time carried out by grinding pad 222 The form of amount of grinding range as defined in equably remaining.

In other words, during grinding pad 222 carries out mobile to be contacted with the state of substrate W surface, by by grinding The fever grinding the friction between pad 222 and substrate W and generating, the temperature of grinding pad 222 can be kept to defined temperature model It encloses.But when grinding pad 222 is initially contacted with substrate W, the temperature of grinding pad 222 is formed as lower than defined temperature range, Amount of grinding per unit time that the region EZ of substrate W is carried out by grinding pad 222 is initially contacted with not in grinding pad 222 so having The problem of reducing avoidablely, has a problem in that the amount of grinding deviation delta RR of substrate W abradant surface becomes larger accordingly, and substrate W's grinds Grinding the uniformity reduces.

As a result, for the present invention, grinding pad 222 before being contacted with substrate W in the state preheated in advance (by temperature The state of temperature range as defined in being adjusted to) under substrate W is ground, it is possible thereby to obtain following advantageous effects: can will The amount of grinding deviation of substrate W abradant surface controls to obtain very little, and improves the grinding uniformity and grinding stability.

Preferably, the temperature of grinding pad 222 is adjusted to be higher than room temperature temperature by temperature regulation section 400.As described above, with will The temperature of grinding pad 222 is adjusted to start the grinding carried out by grinding pad 222 higher than the state of room temperature temperature, it is possible thereby to obtain Following advantageous effects: improving the grinding uniformity of substrate W, reduces the amount of grinding deviation of substrate W abradant surface.

Temperature regulation section 400 may be constructed for according to required condition and design specification in many ways to grinding pad 222 temperature is adjusted.

For example, temperature regulation section 400 is configured at the lateral area of substrate W, and including preheating part 410, preheating part 410 will Grinding pad 222 is preheated to defined temperature range.Hereinafter, being contacted with preheating part 410 with grinding pad 222 and being produced and by friction Raw fever is illustrated for being preheated.

Preferably, the calorific value that is generated by grinding pad 222 with the contact of preheating part 410 and by grinding pad 222 and substrate W Contact and the calorific value that generates is configured in same range.

As described above, grinding pad 222 is contacted with preheating under conditions of similar when being contacted with substrate W with grinding pad 222 Portion 410, it is possible thereby to obtain following advantageous effects: improving the preheating accuracy of grinding pad 222, and improve stability and reliable Property.

As reference, calorific value between grinding pad 222 and preheating part 410 can by preheating part 410 material and will grind Mill pad 222 stresses on the decision such as plus-pressure of preheating part 410.Preferably, so that preheating part 410 is by material identical with substrate W Formed, and be contacted with the condition of substrate W under the same conditions with grinding pad 222 is made so that grinding pad 222 be contacted with it is pre- Hot portion 410, it is possible thereby to make the calorific value generated by the contact of grinding pad 222 and preheating part 410 and by grinding pad 222 and base The calorific value that the contact of plate W generates is formed to identical range.

In addition, including the preheating lapping liquid supply unit 420 that will be preheated lapping liquid and be supplied between preheating part 410 and substrate W.

It is defined as being heated to the lapping liquid of defined temperature range in advance here, lapping liquid will be preheated.

As described above, during grinding pad 222 is contacted with preheating part 410 and is preheated, it will be heated in advance Preheating lapping liquid is supplied between grinding pad 222 and preheating part 410, it is possible thereby to obtain following advantageous effects: can be improved and grind The pre- thermal efficiency of pad 222 is ground, the time required for preheating is shortened, and more improves the preheating accuracy of grinding pad 222 and steady It is qualitative.

In addition, substrate W processing unit includes temperature detecting part detection 500, temperature detecting part 500 is pre- in grinding pad 222 Heat process in detect grinding pad 222 temperature, if temperature detecting part 500 detect grinding pad 222 temperature defined In temperature range, then grinding pad 222 is made to be contacted with substrate W.

As temperature detecting part 500, the common temperature sensor 510 for being able to detect 222 temperature of grinding pad can be used. It is, for example, possible to use common temperature sensors 510.For example, infrared ray (IR) temperature can be used as temperature detecting part 500 Spend sensor.According to different situations, other different non-contact temperature sensors can be used as temperature detecting part.It is different Temperature detecting part can be configured to contact type temperature sensor by ground.

As described above, if temperature detecting part 500 detect grinding pad 222 temperature within the specified temperature range, So that grinding pad 222 is contacted with substrate W, it is possible thereby to obtain following advantageous effects: will initially enter in grinding pad 222 to substrate The region of W inside region (enters grinding section；EZ the amount of grinding per unit time in) critically controls as defined amount of grinding.

Referring to Fig. 3, temperature regulation section 400 is configured to, so that grinding pad 222 is contacted with configuration stopping on the periphery substrate W Grinding pad 222 is preheated to defined temperature range by the form of moving part 216.

As described above, setting retainer 216 in advance to reduce the rebound of grinding unit 220, the stop is utilized Part 216 preheats grinding pad 222, it is possible thereby to obtain following advantageous effects: because It is not necessary to being in addition arranged for grinding The preheating device that pad 222 is preheated, it is possible to simplify equipment and equipment, and improve space utilization degree.

It is further preferable that retainer 216 is configured at the entrance road of the grinding pad 222 entered inwardly from the outside of substrate W Diameter PL, preheating part 410 are set to one side of retainer 216, and grinding pad 222 connects before entering inwardly from the outside of substrate W It touches one side in retainer 216 and is preheated.Hereinafter, being illustrated by taking following situation as an example: grinding pad 222 passes through retainer 216 bottom edge (on the basis of Fig. 3) enters to the inside region of substrate W, and grinding pad 222 is in the inside region for entering substrate W Before, it is preheated on 216 bottom edge of retainer.

As described above, making grinding pad 222 on one side of the retainer 216 for the access path PL for being configured at grinding pad 222 It is preheated, it is possible thereby to obtain following advantageous effects:, can also be even if not changing or adding the movement routine of grinding pad 222 It enters to before the inside region of substrate W, grinding pad 222 is preheated, so preventing by carrying out the pre- of preheating grinding pad 222 Process efficiency declines caused by thermal process, so that the process time needed for pre-heating technique minimizes.

As reference, grinding pad 222 is configured to, and is carried out back and forth with being contacted with the state of retainer 216 along left and right directions It is preheated while mobile and rotation by rubbing.According to different situations, grinding pad also can be to be contacted with the shape of retainer It is preheated while state is only rotated by friction.

As described above, grinding pad 222 is prior before the inside region that the lateral area of substrate W enters to substrate W It is preheated to defined temperature range, equably controls amount of grinding RR1 per unit time and every as shown in fig. 6, can obtain as a result, The advantageous effects of unit time amount of grinding RR2, amount of grinding RR1 is to initially enter in grinding pad 222 to substrate W per unit time (enter grinding section in the region of inside region；EZ amount of grinding), amount of grinding RR2 is existed in grinding pad 222 per unit time The mobile region of the inside region of substrate W (mobile grinding section；MZ the amount of grinding in).

Moreover, for the present invention, so that grinding pad 222 is rubbed before being contacted with substrate W in preheating part repeatedly, by This can obtain following advantageous effects: grinding pad 222 can be made to be able to planarization (contact in advance before being contacted with substrate W Flat condition is adjusted in the contact surface of the grinding pad of substrate), so improving the contact of the grinding pad 222 relative to substrate W Stability improves grinding stability.

In addition, being set to retainer in above mentioned and shown the embodiment of the present invention with preheating part 410 For be illustrated, but according to different situations, preheating part can be also set to the outside of substrate placement section.

For example, referring to Figure 10,410 ' of preheating part can be configured at substrate placement in the form being spaced with substrate placement section The outside in portion, and grinding pad 222 can enter to the inside of substrate W after 410 ' of preheating part preheating.

In addition, being contacted with preheating part in above mentioned and shown the embodiment of the present invention with grinding pad 222 410 and grinding pad 222 be illustrated for the fever generated by friction is preheated, but according to different feelings Condition, preheating part also can in a non contact fashion preheat grinding pad.

For example, referring to Figure 11,410 ＂ of preheating part is configured to that grinding pad 222 is preheated to defined temperature using radiant heat Spend range.According to different situations, grinding pad also can be preheated to defined temperature range using conduction heat by preheating part.

It is to unload the substrate W for completing milled processed from means of abrasion that unloading part (referring to Fig.1 the 300 of 4), which is arranged,.

In other words, the substrate W isolated from substrate placement section 210 is unloaded at unloading part 300.

Unloading part 300 can be formed to unload the various structures of carried base board W from means of abrasion, and the present invention is not unloaded Carry the limitation or restriction of the structure of part 300.

For example, unloading part 300 includes the multiple unloadings transfer roller for separating configuration in the form of being separated by specified interval 310, when unloading transfer roller 310 rotates, is co-operatively transferred by multiple unloadings transfer roller 310 and be supplied to multiple unloadings Transfer the substrate W on the top of roller 310.According to different situations, unloading part also can include tape loop, and tape loop is by unloading It carries transfer roller and carries out circulation rotating.

In addition, Figure 12 to Figure 14 is for being illustrated to substrate board treatment according to another embodiment of the invention Figure.Meanwhile to it is identical as the composition and be equivalent to same section assign it is same or equivalent in identical reference numeral, and Omit the detailed description to this.

Referring to Fig.1 2 to Figure 14, according to another embodiment of the invention, 210 ' of substrate placement section includes: transfer band 214 ' are moved along defined path, and are mounted with substrate W in outer surface；Substrate support 212 is configured at transfer Inside with 214 ', and the bottom surface of substrate W is supported in the state of across 214 ' of transfer band.

Identical as the embodiment as reference, temperature regulation section 400 will be ground before grinding pad 222 is contacted with substrate W The temperature of mill pad 222 is adjusted to defined temperature range, if the temperature in the grinding pad 222 of the detection of temperature detecting part 500 is located at Defined temperature range then makes grinding pad 222 be contacted with substrate W and starts the grinding of substrate.Meanwhile 214 ''s of transfer band Retainer 216 has can be set in outer surface.

214 ' of transfer band may be constructed for according to required condition and design specification in many ways along defined road Diameter is moved.For example, 214 ' of transfer band is configured to along defined path circulation rotating.

The circulation rotating of 214 ' of transfer band can carry out in many ways according to required condition and design specification.Example Such as, 214 ' of transfer band carries out circulation rotating, and following by 214 ' of transfer band along defined path by roller unit 150 The substrate W for being placed in 214 ' of transfer band is transferred in ring rotation along linear travel paths.

The movement routine (for example, circulating path) of 214 ' of transfer band can be changed according to required condition and design specification It is a variety of.For example, roller unit 150 includes: the first roller 152；Second tin roller 154 is configured to parallel with the first roller 152 Ground separates, and 214 ' of transfer band carries out circulation rotating by the first roller 152 and second tin roller 154 in a manner of Infinite Cyclic.

As reference, the outer surface of 214 ' of transfer band refers to the outer surface being exposed on the outside of 214 ' of transfer band, and base Plate W is placed in the outer surface of 214 ' of transfer band.Also, the inner surface of 214 ' of transfer band refers to the first roller 152 and second tin roller The inner surface of 154 214 ' of transfer band contacted.

In addition, the above property of can choose of any one in the first roller 152 and second tin roller 154 is configured to close to each other And the direction separated moves linearly.For example, the position of the first roller 152 is fixed, second tin roller 154 is configured to, to It moves linearly close to the first roller 152 and the direction being spaced with the first roller 152.As described above, according to manufacturing tolerance And assembling tolerance etc., second tin roller 154 is spaced close to the first roller 152 and with the first roller 152, it is possible thereby to adjust transfer Tension with 214 '.

Here, the so-called tension for adjusting 214 ' of transfer band is defined as, adjusted by tensing or loosening 214 ' of transfer band Tension.According to different situations, can also be provided with other tension adjustment roller, by make tension adjustment roller mobile come Adjust the tension of transfer band.It is, however, preferable that make any one in the first roller and second tin roller above mobile, in order to To improve structure and space utilization degree.

In addition, substrate board treatment includes loading control unit (not shown), transferred from loading station 100 to means of abrasion In the loading transfer technique of substrate W, loading screen and transfer that control unit makes loading station 100 transfer substrate W are loaded Band screen with 214 ' transfer substrate W is synchronous.

More specifically, if one end of substrate W is configured at predefined in the placement starting position SP of 214 ' of transfer band, Loading control unit makes loading screen synchronous with screen.

Here, so-called predefined is defined as in the placement starting position SP of 214 ' of transfer band, pass through 214 ' of transfer band Circulation rotating can start transfer substrate W position, placement starting position SP on assign transfer band 214 ' and substrate W between Zygosity.For example, it is facing with the front end of the substrate W transferred from loading station 100 to dispose starting position SP may be set in Substrate receiving portion 216a on one side (or while position for adjoininging with substrate receiving portion).

As reference, if perceiving substrate receiving portion by the common sensing device as sensor or vision camera 216a's is located at placement starting position SP on one side, then 214 ' of transfer band stops rotating, to keep the one of substrate receiving portion 216a Side is located at the state of placement starting position SP.

Later, in the state that 214 ' of transfer band stops rotating, if perceiving the front-end configuration of substrate W by sensing device In placement starting position SP, then control unit is loaded so that loading screen and becoming speed same to each other with screen Form make 214 ' of transfer band rotate (synchronous rotary), and substrate W is transferred to abrasion site, loading screen is to load The speed of substrate W is transferred in part 100, is the speed that 214 ' of transfer band transfers substrate W with screen.

In addition, 214 ' of transfer band in the state of making the substrate W for completing to grind transfer certain section or more to substrate W The direction that is spaced of bottom surface it is mobile.

More specifically, referring to Fig.1 4,214 ' of transfer band are configured to carry out circulation rotating along defined path and transfer Substrate W, and moved since along rotating path with 214 ' of transfer band position (transfer band along curved path move Dynamic position, curved path are the paths along second tin roller outer surface) it is spaced to the bottom surface of 214 ' of transfer band and substrate W Direction is mobile, and substrate W is separated from 214 ' of transfer band.

As described above, being moved in the state that 214 ' of transfer band for transferring substrate W makes substrate W transfer certain section or more The direction for sending 214 ' of band to be spaced to the bottom surface with substrate W is mobile, it is possible thereby to obtain following advantageous effects: not additional In the state of pick-up process (for example, utilizing the pick-up process of substrate absorption device), naturally from 214 ' separating base plate of transfer band W。

In the prior art, it in order to enable the substrate of supply to loading station is loaded to means of abrasion, is picked up using additional It takes device (for example, substrate absorption device) after loading station pickup substrate, substrate should be placed in means of abrasion again, therefore have There is following problem: loading the cost several seconds~tens of seconds of time required for substrate, to increase the processing time.Moreover, existing In technology, in order to which the substrate for completing grinding is offloaded to unloading part, using additional pick device (for example, substrate adsorption fills Set) after means of abrasion pickup substrate W, substrate should be placed in unloading part again, therefore have a problem in that and unload carried base board W The required time spends several seconds~tens of seconds, to increase the processing time.

But the present invention is directly being transferred the shape for being supplied to the substrate W of loading station by 214 ' of transfer band of circulation rotating Under state, the grinding technics for substrate W is carried out, and substrate W is directly transferred to unloading part 300 from 214 ' of transfer band, It is possible thereby to obtain following advantageous effects: simplifying the treatment process of substrate W, and shorten the processing time.

Additional pick-up process excluded in addition, for the present invention, when loading and unload carried base board W external, utilizes circulation 214 ' of transfer band of rotation handles substrate W by straight column mode, it is possible thereby to obtain following advantageous effects: simplifying substrate W's Loading time and unloading process shorten to load and revolve and unload the time required for carried base board W.

Moreover, in the present invention, because It is not necessary to for picking up the pickup of substrate W when loading is arranged and unloading carried base board W Device, it is possible to obtain following advantageous effects: can simplify equipment and equipment, improve space utilization degree.

As another example of transfer band, transfer band can also be configured to wind and transfer from a direction to other direction Substrate W.(not shown)

Here, so-called transfer band is defined as from a direction to other direction winding, transfer band passes through common box type magnetic The winding method of the reel-to-reel (reel to reel) of band (is wound in the first volume and then is wound in volume Two round about again Mode) along the motion track of open loop form move (winding).

Hereinafter, the substrate board treatment to second embodiment according to the present invention is illustrated.

Referring to Fig.1 and Figure 15 to Figure 18, the substrate board treatment 10 of second embodiment according to the present invention include: that substrate is put Portion 210 is set, is used to place substrate W；Grinding unit 220 comprising carry out mobile grinding pad to be contacted with the state of substrate W 222, and the upper surface of substrate W is ground；Speed controlling portion 600, according to the position of the grinding pad 222 relative to substrate W It sets, different controls is carried out to the movement speed of grinding unit 220.

For the present invention, according to the position of the grinding pad relative to substrate, so that the movement speed of grinding unit is mutual Difference, it is possible thereby to obtain following advantageous effects: can reduce the amount of grinding deviation of substrate abradant surface, improve the grinding uniformity. In other words, the position low in amount of grinding per unit time, so that the movement speed of grinding unit is low, on the contrary, in per unit Between the high position of amount of grinding so that the movement speed of grinding unit is high, it is possible thereby to obtain the amount of grinding so that substrate abradant surface Uniform advantageous effects.

Substrate placement section 210 be configured at loading station (referring to Fig.1 the 100 of 3) and unloading part (referring to Fig.1 the 300 of 4) it Between, and the substrate W for being supplied to loading station is transferred to substrate placement section 210, in the state for being placed in substrate placement section 210 Under it is polished, by unload part 300 be unloaded.

More specifically, setting loading station 100 is in order to which the substrate W that will be ground is loaded into means of abrasion (not shown).

Loading station 100 can be formed by the various structures that substrate W can be loaded into means of abrasion, and the present invention is simultaneously The non-structure by loading station 100 is limited or restriction.

Substrate placement section 210, grinding unit 220 constitute means of abrasion between loading station 100 and unloading part 300.

Substrate placement section 210 can be set to place the various structures of substrate W, and the knot of substrate placement section 210 Structure and form can be changed to a variety of according to required condition and design specification.

For example, substrate placement section 210 includes: substrate support 212；Surface cushion 214 is configured at substrate support 212 The upper surface of, and inhibit to slide by improving the coefficient of friction relative to substrate W, substrate W is placed in the upper of surface cushion 214 Face.

Substrate support 212 in order to supporting substrate W bottom surface and be arranged.

Substrate support 212 may be constructed for according to required condition and design specification in many ways come supporting substrate The bottom surface of W.

Hereinafter, being illustrated so that substrate support 212 is generally formed into quadrangle plate as an example.According to different situations, Substrate support can be formed as other different shapes and structure, and can also be propped up using more than two substrate supports The bottom surface of support group plate.

The upper surface of substrate support 212 is provided with surface cushion 214, surface cushion 214 is by improving rubbing relative to substrate W Coefficient is wiped to inhibit to slide.

As described above, surface cushion 214 is provided in the upper surface of substrate support 212, so that substrate W is placed in surface cushion 214 outer surface, it is possible thereby to obtain following advantageous effects:, can be in the state that substrate W is placed in substrate support 212 Movement of the constraint (constraint sliding) relative to the substrate W of substrate support 212, and stably keep the allocation position of substrate W.

Preferably, surface cushion 214 is formed to have 20~50% compression ratio.As described above, surface cushion 214 is formed as having Have 20~50% compression ratio, it is possible thereby to obtain following advantageous effects: even if foreign matter flow in substrate W and surface cushion 214 it Between, surface cushion 214 can also easily be pressed to the thickness degree of foreign matter, it is possible to so that the height of the substrate W as caused by foreign matter It spends deviation (privileged site of substrate is locally protruded because of foreign matter) to minimize, and makes the privileged site part by substrate W Uniformity reduced minimum is ground caused by protrusion.

Grinding unit 220 includes grinding pad 222, and is set as grinding the surface of substrate W, grinding pad 222 with The state for being contacted with substrate W surface is mobile.

For example, grinding pad 222 is formed as less than the size of substrate W, and while to be contacted with the state rotation of substrate W It is mobile.

More specifically, grinding pad 222 is installed on grinding pad carrier (not shown), and to be contacted with substrate W surface (planarization) is linearly ground to the surface of substrate W while state rotation.

Grinding pad 222 is formed by the material for being suitable for carrying out substrate W mechanical lapping.For example, grinding pad 222 can use Polyurethane, polyureas (polyurea), polyester, polyethers, epoxy resin, polyamide, polycarbonate, polyethylene, polypropylene, fluorine polymerization Object, polyvinyl, acrylic acid and methacrylic (methacrylic) polymer, silicon materials, latex, nitrite elastomer, A variety of copolymers of isoprene rubber, butadiene rubber and styrene, butadiene and acrylonitrile are formed, and can be according to institute It is required that condition and design specification numerous variations are carried out to the material and characteristic of grinding pad 222.Preferably, size is less than substrate The circular abrasive pad 222 of W is used as grinding pad 222.

Grinding unit 220 is configured to move by gantry (gantry) unit 20 along X-direction and Y direction.

More specifically, gantry unit 20 includes: gantry main body 22, and (for example, X-direction) carries out along a first direction Linear movement；Moving body 24 is installed on gantry main body 22, along with the decussate second direction of first direction (for example, Y Axis direction) it moves linearly, and grinding unit 220 is installed on moving body 24, moves along X-direction and Y direction Simultaneous grinding substrate W.

At this point it is possible to carry out a variety of changes according to the abrasion path of required condition and design specification to grinding unit 220 More.

For example, grinding pad 222 is configured to, along one side inclined first oblique line path L1 relative to substrate W and to Movement in a zigzag is repeated in the opposite direction inclined second oblique line path L2 of one oblique line path L1, while to the table of substrate W It is ground in face.(referring to Fig. 8)

For another example, grinding pad can also be repeated in a zigzag along first straight line path (not shown) and second straight line path The surface of substrate W is ground while mobile, first straight line path is along the path of an edge direction of substrate W second Straight line path is the path of the opposite direction in first straight line path.Here, first straight line path refers to, such as along from substrate W Bottom edge one end towards the direction of the other end path.In addition, second straight line path refers to towards opposite with first straight line path The path in direction.

Means of abrasion includes retainer 130, and retainer 130 is set as protruding in the form of the perimeter for wrapping up substrate W Form in 214 outer surface of surface cushion.(referring to Fig. 7)

Retainer 130 is arranged for following purpose: in grinding technics, the grinding pad 210 of grinding unit 220 from When the lateral area of substrate W enters to the inside region of substrate W, so that grinding pad 210 shows what the edge of substrate W was rebounded As (phenomenon of rebounding) minimizes, and make caused by the rebound phenomena by grinding pad 210 in the edge substrate W non-grinds Region (dead zone) (region without grinding pad grinding) is ground to minimize.

More specifically, substrate corresponding with the form of substrate W receiving portion 130a is formed through in retainer 130, The inside of substrate receiving portion 130a, substrate W are placed in the outer surface of surface cushion 214.

In the state that substrate W is contained in substrate receiving portion 130a, the apparent height of retainer 130 has and the side substrate W The similar height of the apparent height of edge.As described above, making the edge of substrate W and adjacent with the edge of substrate W The lateral area (retainer region) of close substrate W has mutually similar height, it is possible thereby to obtain following advantageous effects: It is mobile from the lateral area of substrate W to the inside region of substrate W in grinding pad 210 in grinding technics, or out of substrate W During side region is moved to the lateral area of substrate W, it can make between inside region and lateral area by substrate W The rebound phenomena of grinding pad 210 caused by height tolerance minimizes, and makes the non-ground region as caused by rebound phenomena It minimizes.

Meanwhile retainer 130 is set as protruding from the placed side for the substrate placement section 210 for being placed with substrate W, grinding unit 220 grinding pad 210 is configured to, to be contacted with the state of the upper surface of the upper surface of retainer 130 and substrate W simultaneously by substrate W Edge and the upper surface of substrate W is ground.

Preferably, the grinding technics that substrate W is carried out by the grinding pad 210 of grinding unit 220, in grinding for the substrate W On the grinding starting position that grinding process starts, a part of grinding pad 210 is configured to be contacted with the shape of the upper surface of retainer 130 State, other a part of grinding pad 210 are configured to be contacted with the state of the upper surface of substrate W.

As described above, the grinding pad 210 of grinding unit 220 is contacted with the upper of substrate W at the same time on grinding starting position Start to grind in the state of the upper surface of face and retainer 130, it is possible thereby to obtain following advantageous effects: in grinding unit 220 Grinding pad 210 can more inhibit the phenomenon that grinding pad 210 rebounds from substrate W when passing through the edge of substrate W.

Preferably, retainer 130 is formed to have thickness (T1 >=T2) thinner than substrate W or identical with substrate W.As above It is described, so that retainer 130 is formed to have thickness (T2) thinner than substrate W or identical with substrate W, it is possible thereby to obtain such as Lower advantageous effects: during grinding pad 210 is mobile to the inside region of substrate W from the lateral area of substrate W, so that occurring It is minimized by the rebound phenomena of grinding unit 220 caused by the collision of grinding pad 210 and retainer 130.

Speed controlling portion 400 is set as the shifting according to the position of the grinding pad 222 relative to substrate W to grinding unit 220 Dynamic speed carries out different controls.

It is defined as, is grinding here, the so-called movement speed to the grinding unit 220 relative to substrate W carries out control It is mobile relative to substrate W to grinding unit 220 during pad 222 grinds substrate W with to be contacted with the state of substrate W Speed controlled.

More specifically, speed controlling portion 400 is according to the position of the grinding pad 222 relative to substrate W to grinding unit 220 Movement speed controlled, so that the amount of grinding per unit time that is carried out by grinding pad 222 is in defined amount of grinding range.

As reference, referring to Fig.1 6, following form is shown as by the amount of grinding per unit time that grinding pad 222 carries out: with Relative to substrate W grinding unit 220 movement speed increase and be gradually reduced.More specifically, if in grinding pad 222 The low velocity interval A2 of movement speed in, then be shown as equably protecting by the amount of grinding per unit time that grinding pad 222 carries out It holds as the form of defined amount of grinding range, if in the high velocity interval A1 of the movement speed of grinding pad 222, by grinding pad 222 amount of grinding per unit time carried out are shown as the form reduced gradually.

Based on this, speed controlling portion 400 is according to the position of the grinding pad 222 relative to substrate W to grinding unit 220 Mobile speed is adjusted, so that the amount of grinding per unit time that is carried out by grinding pad 222 is according to the grinding relative to substrate The position of pad 222 is equably shown.

In addition, if the temperature of grinding pad 222 in cryogenic temperature range A1, when the per unit carried out by grinding pad 222 Between amount of grinding be shown as the form being gradually increased, if the temperature of grinding pad 222 increase to as defined in temperature range A2 (for example, 40 DEG C~80 DEG C), then it is shown as equably remaining defined amount of grinding model by the amount of grinding per unit time that grinding pad 222 carries out The form enclosed.(referring to Fig. 4)

In other words, if carrying out grinding for substrate W in the state that the temperature of grinding pad 222 reaches defined temperature range Mill, then quickly removal is covered in the film of substrate W grinding layer under high temperature environment, thus promote mechanical lapping, at the same time, if It is set to the temperature of the chemical reaction of most suitable lapping liquid, to more can be shortened the chemical grinding time, so being carried out by grinding pad 222 Amount of grinding per unit time be sufficiently shown as defined in amount of grinding range.

As described above, can pass through during grinding pad 222 carries out mobile to be contacted with the state of substrate W surface The fever generated by the friction between grinding pad 222 and substrate W is so that the temperature of grinding pad 222 is maintained at defined temperature model It encloses.But when grinding pad 222 is initially contacted with substrate W, the temperature of grinding pad 222 is formed as lower than defined temperature range, Amount of grinding per unit time that the region EZ of substrate W is carried out by grinding pad 222 is initially contacted with not in grinding pad 222 so having The problem of being lower avoidablely has a problem in that the amount of grinding deviation delta RR of substrate W abradant surface becomes larger accordingly, and substrate W's grinds Grind uniformity decline.

As a result, for the present invention, the movement speed of grinding unit 220 is controlled based on the temperature of grinding pad 222, The temperature of grinding pad 222 is according to the temperature of the abrasion site of the grinding pad 222 relative to substrate W, it is possible thereby to obtain as follows Advantageous effects: the amount of grinding deviation of substrate W abradant surface can be controlled into obtain very little, and improves the grinding uniformity.

It preferably, is the first position (for example, entering grinding section) of the first temperature range in the temperature of grinding pad 222, It (is ground for example, moving with the temperature in grinding pad 222 for the second position of the second temperature range higher than first temperature range Mill section) it compares, the movement speed of grinding unit 220 is controlled very low by speed controlling portion 400.

In other words, compared with the high second position of the temperature in grinding pad 222, the temperature of grinding pad 222 it is low The movement speed of grinding unit 220 is controlled very low, thus also showed that in first position by one position, speed controlling portion 400 Amount of grinding per unit time corresponding with the second position.

More specifically, 7 and Figure 18 referring to Fig.1, speed controlling portion 400 to grinding pad 222 from the lateral area of substrate W to The mobile grinding mobile in the inside region of substrate W into grinding rate V1 and grinding pad 222 that the inside region of substrate W enters Speed V2, V2 ' carries out different controls.For example, speed controlling portion 400, which will enter grinding rate V1, controls for and moves grinding rate V2, V2 ' are compared to relatively slowly.

(enter grinding section it is intended that grinding pad 222 is initially entered to the region of substrate W inside region；EZ) In the control of amount of grinding per unit time be that defined amount of grinding is (identical as the amount of grinding per unit time in mobile grinding section Range).

In other words, if not under the state (state that grinding pad and substrate are spaced) that grinding pad 222 generates heat, Grinding pad 222 enters to the inside region of substrate and is contacted with cool substrate W, then the temperature of grinding pad 222 is formed as lower than regulation Temperature range, thus into grinding section EZ in amount of grinding per unit time become smaller.

But for the present invention, grinding pad 222 is entered from the lateral area of substrate W to the inside region of substrate W Into grinding rate V1 control for (grinding pad 222 is mobile with the state contacted in the inside region of substrate W with mobile grinding rate Speed) V2 compared to relatively slowly, it is possible thereby to obtain will enter grinding section EZ in amount of grinding per unit time control be The advantageous effects of defined amount of grinding.

In addition, substrate board treatment 10 may include temperature regulation section 400, temperature regulation section 400 is contacted in grinding pad 222 The temperature of grinding pad 222 is adjusted to defined temperature range in advance before to substrate W.(referring to Fig. 3)

It is defined as here, the so-called temperature by grinding pad 222 is adjusted to defined temperature range, by grinding pad 222 Temperature is adjusted to that the temperature model of defined amount of grinding range can be shown as by the amount of grinding per unit time that grinding pad 222 carries out It encloses.

As described above, if every list that the temperature of grinding pad 222 in cryogenic temperature range A1, is carried out by grinding pad 222 Position time amount of grinding is shown as the form being gradually increased, if the temperature of grinding pad 222 increases to defined temperature range A2 (example Such as, 40 DEG C~80 DEG C), then it is shown as being uniformly maintained in defined grind by the amount of grinding per unit time that grinding pad 222 carries out The form of mill amount range.(referring to Fig. 4)

Based on this, temperature regulation section 400 is so that the temperature of grinding pad 222 becomes the shape of defined temperature range A2 Formula the temperature of grinding pad 222 is adjusted, it is specified that temperature range A2 be shown as before grinding pad 222 touches substrate W The form of defined amount of grinding range is equably remained by the amount of grinding per unit time that grinding pad 222 carries out.

In other words, during grinding pad 222 is mobile with the state for being contacted with substrate W surface, by by grinding pad The fever that friction between 222 and substrate W generates, the temperature of grinding pad 222 can remain defined temperature range.But When grinding pad 222 is initially contacted with substrate W, the temperature of grinding pad 222 is formed as lower than defined temperature range, so having The region EZ that grinding pad 222 is initially contacted with substrate W is inevitably become by the amount of grinding per unit time that grinding pad 222 carries out Small problem has a problem in that the amount of grinding deviation delta RR of substrate W abradant surface becomes larger, under the grinding uniformity of substrate W accordingly Drop.

But for the present invention, so that grinding pad 222 before being contacted with substrate W by preheated state in advance (at For the state of defined temperature range) under substrate W is ground, it is possible thereby to obtain following advantageous effects: base can be made The amount of grinding deviation of plate W abradant surface becomes smaller, and improves the grinding uniformity and grinding stability.

As described above, being only adjusted by the movement speed to grinding unit 200, so that it may which control is by grinding pad 222 The amount of grinding per unit time carried out, but in order to which the control of amount of grinding per unit time that will enter in grinding section EZ is regulation Amount of grinding, enter grinding section EZ grinding unit 200 movement speed should very slowly, so inevitably making work The skill time (milling time) increases.As a result, for the present invention, so that grinding pad 222 before touching substrate W by pre- in advance Substrate W is ground in the state of heat, it is possible thereby to obtain following advantageous effects: can to grind entering grinding section EZ The movement speed reduced minimum of unit 200 is ground, and improves process efficiency, shortens the process time.

Preferably, the temperature of grinding pad 222 is adjusted to the temperature higher than room temperature by temperature regulation section 400.As described above, with The temperature of grinding pad 222 is adjusted to the state higher than room temperature temperature and starts the grinding carried out by grinding pad 222, it is possible thereby to obtain It obtains following advantageous effects: improving the grinding uniformity of substrate W, reduce the amount of grinding deviation of substrate W abradant surface.

Temperature regulation section 400 may be constructed to adjust grinding pad in many ways according to required condition and design specification 222 temperature.

For example, temperature regulation section 400 is configured at the lateral area of substrate W, and including preheating part 410, preheating part 410 will Grinding pad 222 is preheated to defined temperature range.Hereinafter, being contacted with preheating part 410 with grinding pad 222 and by being generated by friction Fever and be illustrated for being preheated.

Preferably, the calorific value that is generated by the contact of grinding pad 222 and preheating part 410 and by grinding pad 222 and substrate W The calorific value generated is contacted in range same to each other.

As described above, under conditions of similar when being contacted with substrate W with grinding pad 222, so that grinding pad 222 is contacted with Preheating part 410, it is possible thereby to obtain following advantageous effects: improving the preheating accuracy of grinding pad 222, improve stability and reliable Degree.

As reference, calorific value between grinding pad 222 and preheating part 410 can by preheating part 410 material and will grind Mill pad 222 stresses on plus-pressure of preheating part 410 etc. to determine.Preferably, so that preheating part 410 is by material identical with substrate W Material is formed, and is being contacted with the condition of substrate W under the same conditions with grinding pad 222 is made, so that grinding pad 222 is contacted with Preheating part 410, can be by the calorific value generated by the contact of grinding pad 222 and preheating part 410 and by grinding pad 222 and substrate W Contact generate calorific value formed to range same to each other.

Furthermore, it is possible to include preheating lapping liquid supply unit 420, preheating lapping liquid supply unit 420 will preheat lapping liquid supply Between preheating part 410 and substrate W.

It is defined as being heated to the lapping liquid of defined temperature range in advance here, lapping liquid will be preheated.As described above, During grinding pad 222 is contacted with preheating part 410 and is preheated, the preheating lapping liquid preheated in advance is supplied to grinding pad Between 222 and preheating part 410, it is possible thereby to obtain following advantageous effects: the pre- thermal efficiency of grinding pad 222 can be improved, shorten Time required for preheating, it can more improve the preheating accuracy and stability of grinding pad 222.

In addition, substrate W processing unit includes temperature detecting part 500, temperature detecting part 500 is preheated in grinding pad 222 The temperature of grinding pad 222 is detected in the process, if the temperature for the grinding pad 222 that temperature detecting part 500 detects is in defined temperature model In enclosing, then grinding pad 222 is made to be contacted with substrate W.

As temperature detecting part 500, the common temperature sensor for the temperature for being able to detect grinding pad 222 can be used 510.It is, for example, possible to use common temperature sensors 510.For example, infrared ray can be used as temperature detecting part 500 (IR) temperature sensor.According to different situations, other different non-contact temperature sensors can be used as temperature detecting part. Different from this, temperature detecting part can be configured to contact type temperature sensor.

As described above, if the temperature for the grinding pad 222 that temperature detecting part 500 detects within the specified temperature range, makes It obtains grinding pad 222 and is contacted with substrate W, it is possible thereby to obtain following advantageous effects: so that initially entering in grinding pad 222 to substrate The region of W inside region (enters grinding section；EZ the amount of grinding per unit time in) is accurately defined amount of grinding.

Temperature regulation section 400 is configured to, so that grinding pad 222 is contacted with configuration in the retainer on the periphery substrate W 216, and grinding pad 222 is preheated to defined temperature range.(referring to Fig. 3)

As described above, making to grind using the retainer 216 set to reduce the rebound of grinding unit 220 Mill pad 222 be preheated, it is possible thereby to obtain following advantageous effects: because It is not necessary in addition setting for grinding pad 222 into The preheating device of row preheating, it is possible to simplify equipment and equipment, and improve space utilization degree.

It is further preferable that retainer 216 is configured at the entrance road of the grinding pad 222 entered inwardly from the outside of substrate W Diameter PL, preheating part 410 are set to one side of the retainer 216, and grinding pad 222 is entering it from the outside of substrate W inwardly Before, it is contacted with one side of retainer 216 and is preheated.Hereinafter, being illustrated by taking following situation as an example: grinding pad 222 is by stopping The bottom edge (on the basis of Fig. 3) of moving part 216 enters to the inside region of substrate W, and grinding pad 222 is in the inside for entering substrate W Before region, it is preheated on 216 bottom edge of retainer.

As described above, making grinding pad 222 on one side of the retainer 216 for the access path PL for being configured at grinding pad 222 It is preheated, it is possible thereby to obtain following advantageous effects:, can also be even if not changing or adding the movement routine of grinding pad 222 Enter to before the inside region of substrate W, grinding pad 222 preheated, thus prevent by the preheating of carry out grinding pad 222 and Caused process efficiency decline, so that the process time needed for preheating minimizes.

As reference, grinding pad 222 is configured to, and is carried out back and forth with being contacted with the state of retainer 216 along left and right directions It is preheated while mobile and rotation by rubbing.According to different situations, grinding pad also can be to be contacted with the shape of retainer It is preheated while state is only rotated by friction.

As described above, grinding pad 222 is prior before the inside region that the lateral area of substrate W enters to substrate W It is preheated to defined temperature range, amount of grinding RR1 per unit time is equably controlled thus, it is possible to obtain and grinds per unit time The advantageous effects of mill amount RR2, amount of grinding RR1 is to initially enter in grinding pad 222 to the inside region of substrate W per unit time (enter grinding section in region；EZ amount of grinding), amount of grinding RR2 is medial area of the grinding pad 222 in substrate W per unit time The mobile region in domain (mobile grinding section；MZ the amount of grinding in).(referring to Fig. 6)

Moreover, for the present invention, so that grinding pad 222 is rubbed before being contacted with substrate W in preheating part repeatedly, by This can obtain following advantageous effects: grinding pad 222 can be made to be able to planarization (contact in advance before being contacted with substrate W Flat condition is ground in the contact surface of the grinding pad of substrate), so improving steady relative to the contact of the grinding pad 222 of substrate W It is qualitative, improve grinding stability.

In addition, being set to retainer in above mentioned and shown the embodiment of the present invention with preheating part 410 For be illustrated, but according to different situations, preheating part can be also set to the outside of substrate placement section.For example, Preheating part can be configured at the outside of substrate placement section in the form being spaced with substrate placement section, and grinding pad can pass through Cross the inside that substrate W is entered to after preheating part preheats.

In addition, being contacted with preheating part simultaneously with grinding pad in above mentioned and shown the embodiment of the present invention And grinding pad is illustrated for the fever generated by friction is preheated, but according to different situations, preheating part Also grinding pad can be preheated in a non contact fashion.For example, preheating part is configured to utilize radiant heat that grinding pad is pre- Heat is to defined temperature range.According to different situations, grinding pad can be also preheated to defined by preheating part using conduction heat Temperature range.

It is to unload the substrate W for completing milled processed from means of abrasion that unloading part (referring to Fig.1 the 300 of 4), which is arranged,.

In other words, the substrate W isolated from substrate placement section 210 is unloaded at unloading part 300.

Unloading part 300 can be formed to unload the various structures of carried base board W from means of abrasion, and the present invention is not unloaded Carry the limitation or restriction of the structure of part 300.

For example, unloading part 300 includes the multiple unloadings transfer roller for separating configuration in the form of being separated by specified interval 310, when unloading transfer roller 310 rotates, is co-operatively transferred by multiple unloadings transfer roller 310 and be supplied to multiple unloadings Transfer the substrate W on the top of roller 310.According to different situations, unloading part also can include tape loop, and tape loop is by unloading It carries transfer roller and carries out circulation rotating.

In addition, according to another embodiment of the invention, 210 ' of substrate placement section includes: 214 ' of transfer band, along rule Fixed path is mobile, and is mounted with substrate W in outer surface；Substrate support 212 is configured at the inside of 214 ' of transfer band, And the bottom surface of substrate W is supported in the state of across 214 ' of transfer band.(referring to Fig.1 2)

It is identical as the embodiment as reference, the mobile speed of grinding unit 220 is made according to the position of grinding pad 222 Degree is different, so that the amount of grinding per unit time that is carried out by grinding pad 222 is according to the position of the grinding pad 222 relative to substrate W And it equably shows.Meanwhile retainer 216 can be set in the outer surface of 214 ' of transfer band.

214 ' of transfer band may be constructed for according to required condition and design specification in many ways along defined road Diameter is moved.For example, 214 ' of transfer band is configured to along defined path circulation rotating.

As described above, being illustrated referring to the preferred embodiment of the present invention, if it will be appreciated that in affiliated technology Field has the technical staff of general knowledge, then can be detached from thought of the invention documented by following claims no And a variety of modifications and changes are carried out to the present invention in the range of field.

Label declaration

10: substrate board treatment 20: gantry unit

22: gantry main body 24: moving body

100: loading station 110: loading transfer roller

210: substrate placement section 212: substrate support

214: 214 ' of surface cushion: transfer band

216: retainer 217: roller unit

220: grinding unit 222: grinding pad

300: unloading part 310: unloading transfer roller

400: temperature regulation section 410: preheating part

500: temperature detecting part 510: temperature sensor

600: speed controlling portion

Claims (35)

1. a kind of substrate board treatment, the substrate board treatment as the grinding technics for carrying out substrate characterized by comprising

Substrate placement section is used to place substrate；

Grinding unit comprising grinding pad, and the upper surface of described substrate is ground, grinding pad is to be contacted with the substrate State moved；

The temperature of the grinding pad is adjusted to regulation before the grinding pad touches the substrate by temperature regulation section Temperature range.

2. substrate board treatment according to claim 1, which is characterized in that

The temperature of the grinding pad is adjusted to the temperature higher than room temperature by the temperature regulation section.

3. substrate board treatment according to claim 1, which is characterized in that

The temperature regulation section is configured at the lateral area of the substrate, and including preheating part, and preheating part is by the grinding pad It is preheated to the defined temperature range.

4. substrate board treatment according to claim 3, which is characterized in that

The grinding pad is contacted with the preheating part, and is preheated and by the fever of friction generation.

5. substrate board treatment according to claim 4, which is characterized in that

The calorific value contact with by the grinding pad and the substrate generated by the contact of the grinding pad and the preheating part The calorific value of generation is in identical range.

6. substrate board treatment according to claim 4, which is characterized in that

The preheating part is formed by material identical with the substrate.

7. substrate board treatment according to claim 4 characterized by comprising

Lapping liquid supply unit is preheated, preheating lapping liquid is supplied between the preheating part and the grinding pad.

8. substrate board treatment according to claim 1 characterized by comprising

Temperature detecting part detects the temperature of the grinding pad,

If the temperature of the temperature detecting part grinding pad detected within the temperature range of the regulation, makes described Grinding pad is contacted with the substrate.

9. substrate board treatment according to claim 1 characterized by comprising

Retainer is set as protruding in the form of the perimeter for wrapping up the substrate.

10. substrate board treatment according to claim 9, which is characterized in that

The temperature regulation section is so that the grinding pad is preheated to institute by the form that the grinding pad is contacted with the retainer State defined temperature range.

11. substrate board treatment according to claim 10, which is characterized in that

The grinding pad is contacted with one side of the retainer, and the retainer is configured at from the outer side of the substrate to the base The access path for the grinding pad that the inside of plate enters.

12. substrate board treatment according to claim 9, which is characterized in that

The retainer is formed to have thickness thinner than the substrate or identical with substrate.

13. substrate board treatment according to claim 9, which is characterized in that

The grinding unit grinds the upper surface of described substrate with the state for being contacted with the upper surface of described retainer.

14. according to claim 1 to substrate board treatment described in any one of 13, which is characterized in that the substrate is placed Portion includes:

Transfer band is configured to move along defined path, and is mounted with the substrate in outer surface；

Substrate support is configured at the inside of the transfer band, and to the base in the state of across the transfer band The bottom surface of plate is supported.

15. substrate board treatment according to claim 14, which is characterized in that

The transfer band is along defined path circulation rotating.

16. substrate board treatment according to claim 14, which is characterized in that

As the direction that the transfer band is spaced to the bottom surface with the substrate is mobile, the substrate is separated from the transfer band And it is unloaded at unloading part.

17. according to claim 1 to substrate board treatment described in any one of 13, which is characterized in that the substrate is placed Portion includes:

Substrate support；

Surface cushion is set to the upper surface of described substrate support, is pressed down by improving the coefficient of friction relative to the substrate System sliding,

The substrate is placed in the upper surface of described surface cushion.

18. substrate board treatment according to claim 17, which is characterized in that

The surface cushion is formed above by any one in engineering plastics, polyurethane, silicon materials.

19. according to claim 1 to substrate board treatment described in any one of 13, which is characterized in that

During carrying out the mechanical lapping for the substrate, while the lapping liquid for being used for chemical grinding is supplied, and changed Learn mechanical milling tech.

20. a kind of substrate board treatment, the substrate board treatment as the grinding technics for carrying out substrate characterized by comprising

Substrate placement section is used to place substrate；

Grinding unit comprising grinding pad, and the upper surface of described substrate is ground, grinding pad is to be contacted with the substrate State moved；

Speed controlling portion, according to the position of the grinding pad relative to the substrate, to the mobile speed of the grinding unit Degree carries out different controls.

21. substrate board treatment according to claim 20, which is characterized in that

The speed controlling portion according to the grinding pad relative to the substrate position, to the mobile speed of the grinding unit Degree is controlled, so that the amount of grinding per unit time that is carried out by the grinding pad is within the scope of defined amount of grinding.

22. substrate board treatment according to claim 21, which is characterized in that

It is higher than described with the temperature in the grinding pad in the first position that the temperature of the grinding pad is the first temperature range The second position of the second temperature range of first temperature range is compared, and the speed controlling portion is by the mobile speed of the grinding unit Degree controls very low.

23. substrate board treatment according to claim 21, which is characterized in that

The speed controlling portion is described into grinding rate to grinding rate control different with mobile grinding rate progress is entered The speed that grinding pad enters from the lateral area of the substrate to the inside region of the substrate, mobile grinding rate are described grind Mill pad carries out mobile speed in the inside region of the substrate with the state for being contacted with the inside region of the substrate.

24. substrate board treatment according to claim 23, which is characterized in that

Described control into grinding rate is relatively slow compared with the mobile grinding rate by the speed controlling portion.

25. substrate board treatment according to claim 20 characterized by comprising

Retainer is set as protruding in the form of the perimeter for wrapping up the substrate.

26. substrate board treatment according to claim 25, which is characterized in that

The retainer is formed to have thickness thinner than the substrate or identical with the substrate.

27. substrate board treatment according to claim 25, which is characterized in that

The grinding unit grinds the upper surface of described substrate with the state for being contacted with the upper surface of described retainer.

28. the substrate board treatment according to any one of claim 20 to 27 characterized by comprising

Temperature regulation section, the temperature of the grinding pad is adjusted to before the grinding pad is contacted with the substrate as defined in Temperature range.

29. substrate board treatment according to claim 28, which is characterized in that

The temperature of the grinding pad is adjusted to the temperature higher than room temperature by the temperature regulation section.

30. substrate board treatment according to claim 28, which is characterized in that

The temperature regulation section is configured at the lateral area of the substrate, and including preheating part, and preheating part is by the grinding pad It is preheated to the defined temperature range.

31. substrate board treatment according to claim 30, which is characterized in that

The grinding pad is contacted with the preheating part, is preheated by the fever generated by friction.

32. substrate board treatment according to claim 31, which is characterized in that

The calorific value contact with by the grinding pad and the substrate generated by the contact of the grinding pad and the preheating part The calorific value of generation is in identical range.

33. substrate board treatment according to claim 28 characterized by comprising

Temperature detecting part detects the temperature of the grinding pad,

If the temperature of the grinding pad of the temperature detecting part detection makes described grind within the temperature range of the regulation Mill pad is contacted with the substrate.

34. the substrate board treatment according to any one of claim 20 to 27, which is characterized in that the substrate is placed Portion includes:

Transfer band is configured to move along defined path, and is mounted with the substrate in outer surface；

Substrate support is configured at the inside of the transfer band, and to the base in the state of across the transfer band The bottom surface of plate is supported.

35. the substrate board treatment according to any one of claim 20 to 27, which is characterized in that

During carrying out the mechanical lapping for the substrate, while the lapping liquid for being used for chemical grinding is supplied, and changed Learn mechanical milling tech.