KR20190117907A - Substrate processing apparatus - Google Patents

Abstract

The present invention relates to a substrate processing apparatus. The substrate processing apparatus, in which a polishing process of a substrate is performed, includes: a substrate holding unit on which the substrate is held; and a polishing brush polishing the substrate while rolling-rotating with respect to a surface of the substrate, thereby increasing processing efficiency of the substrate and improving polishing stability and polishing uniformity.

Description

Substrate Processing Unit {SUBSTRATE PROCESSING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of increasing processing efficiency of a substrate and improving polishing stability and polishing uniformity.

Recently, with increasing interest in information display and increasing demand for using a portable information carrier, a lightweight flat panel display (FPD), which replaces a conventional display device, a cathode ray tube (CRT), is used. The research and commercialization of Korea is focused on.

In the field of flat panel display devices, the light and low power consumption of the liquid crystal display device (LCD) has been the most noticeable display device, but the liquid crystal display device is not a light emitting device but a light receiving device, and the brightness and contrast ratio (contrast) Due to disadvantages such as ratio, viewing angle, and the like, development of a new display device capable of overcoming these disadvantages is being actively developed. Among these, one of the next-generation displays that are in the spotlight recently is an organic light emitting display (OLED).

In general, a glass substrate having excellent strength and transmittance is used in a display apparatus. In recent years, since a display apparatus is aimed at slimming and high-pixel, a corresponding glass substrate should be prepared.

For example, as one of the OLED processes, in the laser laser annealing (ELA) process in which a laser is injected to amorphous silicon (a-Si) and crystallized into polysilicon (poly-Si), polysilicon crystallizes and projections may occur on the surface. And such protrusions may generate mura-effects, so the glass substrate must be able to be polished to remove the protrusions.

To this end, in recent years, various studies have been made to efficiently polish the surface of a substrate, but there is still a need for development thereof.

An object of this invention is to provide the substrate processing apparatus which can raise the processing efficiency of a board | substrate, and can improve polishing stability and polishing uniformity.

In addition, an object of the present invention is to be able to improve the conditioning efficiency of the polishing brush for polishing the substrate.

In addition, it is an object of the present invention to shorten the time required to process a substrate and to improve productivity and yield.

Moreover, an object of this invention is to be able to process and supply a board | substrate continuously.

In addition, an object of the present invention can be to simplify the equipment, and to reduce the manufacturing cost.

The present invention for achieving the above object of the present invention provides a substrate processing apparatus including a substrate mounting portion on which the substrate is mounted, and a polishing brush for rolling the substrate while rolling about the surface of the substrate.

As described above, according to the present invention, it is possible to obtain an advantageous effect of increasing the processing efficiency of the substrate and improving polishing stability and polishing uniformity.

In addition, according to the present invention, it is possible to obtain an advantageous effect of improving the conditioning efficiency of the polishing brush for polishing the substrate, and shortening the time required for conditioning time.

In addition, according to the present invention, it is possible to shorten the time required for processing the substrate and to obtain an advantageous effect of improving productivity and yield.

In addition, according to the present invention, an advantageous effect of continuously supplying and processing a substrate can be obtained.

In addition, according to the present invention, it is possible to simplify the equipment, reduce the manufacturing cost, and obtain an advantageous effect of improving the space utilization.

1 is a plan view showing the configuration of a substrate processing apparatus according to the present invention;
Figure 2 is a substrate processing apparatus according to the present invention, a side view for explaining a polishing brush,
3 is a substrate processing apparatus according to the present invention, a side view for explaining a conditioner;
4 is a side view for explaining another embodiment of the conditioner as the substrate processing apparatus according to the present invention;
5 is a substrate processing apparatus according to the present invention, which illustrates a polishing brush controller;
6 and 7 is a substrate processing apparatus according to the present invention, a view for explaining the shape change of the brush body according to the pressure change of the pressure chamber,
8 to 10 are views for explaining a substrate processing apparatus according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, in the present description, the same numbers refer to substantially the same elements, and may be described by referring to the contents described in the other drawings under these rules, and the contents determined to be obvious to those skilled in the art or repeated may be omitted.

1 is a plan view showing the configuration of a substrate processing apparatus according to the present invention, Figure 2 is a substrate processing apparatus according to the present invention, a side view for explaining a polishing brush. 3 is a side view illustrating a conditioner as a substrate processing apparatus according to the present invention, and FIG. 4 is a side view illustrating another embodiment of a conditioner as a substrate processing apparatus according to the present invention. And, Figure 5 is a substrate processing apparatus according to the present invention, a view for explaining a polishing brush control unit, Figures 6 and 7 are substrate processing apparatus according to the present invention, the shape of the brush body according to the pressure change of the pressure chamber It is a figure for demonstrating a change.

1 to 7, the substrate processing apparatus 10 according to the present invention includes a substrate mounting portion 210 on which the substrate W is mounted, and the substrate W while rolling on the surface of the substrate W. ), A polishing brush 232 for polishing.

This is to increase the processing efficiency of the substrate of the substrate W and to improve polishing accuracy and polishing uniformity.

That is, it is possible to polish the substrate by rotating the plate-shaped circular polishing pad having a smaller size than the substrate about the rotation axis perpendicular to the upper surface of the substrate, but for each region of the substrate to which the polishing pad is in contact (different polishing sites). When the error of the pressing force for pressing the polishing pad to the substrate occurs, there is a problem that a difference in polishing amount occurs for each region of the substrate and polishing uniformity is lowered.

In addition, the polishing pad having a larger size than the substrate can be rotated to polish the substrate. However, since the rotating apparatus and the installation space are required to rotate the polishing pad of a large size, space efficiency and design freedom are reduced. There is a problem.

However, in the present invention, the polishing of the substrate by the polishing brush 232 rolling in rotation with respect to the substrate (W), it is possible to simultaneously polish the substrate from one end to the other end of the substrate without significantly reducing the space efficiency and design freedom It is possible to achieve an advantageous effect of keeping the polishing amount by the polishing brush 232 uniformly from one end to the other end of the substrate as a whole and increasing the polishing uniformity of the substrate.

In addition, in the method of polishing the substrate by rotating the polishing pad by rotating, the slurry supplied between the polishing pad and the substrate does not immediately exit to the outside of the polishing pad, but rotates in a state remaining between the polishing pad and the substrate. There is a problem in that fine micro scratches are generated on the surface of the substrate by particles contained in the slurry.

However, according to the present invention, by polishing the substrate with the polishing brush 232, the slurry supplied between the substrate W and the polishing brush 232 may be discharged immediately to the outside of the polishing brush 232 without remaining. Therefore, an advantageous effect of minimizing the occurrence of micro scratches by the slurry particles during the polishing process can be obtained.

The substrate mounting unit 210 is disposed between the loading part 100 and the unloading part 300, and the substrate W supplied to the loading part is transferred to the substrate mounting unit 210, thereby providing a substrate mounting unit 210. After being ground in the state seated in, it is unloaded through the unloading part 300.

More specifically, the loading part 100 is provided for loading the substrate W to be polished into the polishing part 200.

The loading part 100 may be formed in various structures capable of loading the substrate W on the polishing part 200, and the present invention is not limited or limited by the structure of the loading part 100.

For example, the loading part 100 may include a plurality of loading transfer rollers 110 spaced apart from each other at predetermined intervals, and the substrate W supplied on the plurality of loading transfer rollers 110 may be a loading transfer roller. As the 110 rotates, it is mutually cooperatively transported by a plurality of loading feed rollers. In some cases, the loading part may be configured to include a circulation belt which is circulated by the loading conveying roller.

In addition, the substrate W supplied to the loading part 100 may be aligned in a posture and a position in which postures and positions are determined by an alignment unit (not shown) before being supplied to the loading part 100.

For reference, as the substrate W used in the present invention, a rectangular substrate W having one side length larger than 1 m may be used. For example, as the substrate W to be subjected to the chemical mechanical polishing process, a sixth generation glass substrate W having a size of 1500 mm * 1850 mm may be used. In some cases, it is also possible to use 7th and 8th generation glass substrates as the substrate to be processed. Alternatively, it is also possible to use a substrate (eg, a second generation glass substrate) whose length of one side is smaller than 1 m.

The substrate mounting portion 210 and the polishing unit 230 are provided to constitute the polishing part 200 between the loading part 100 and the unloading part 300.

The substrate mounting unit 210 may be provided in various structures capable of mounting the substrate W, and the structure and shape of the substrate mounting unit 210 may be variously changed according to required conditions and design specifications.

For example, the substrate mounting portion 210 may include a substrate support portion 212 and a surface pad 214 provided on the upper surface of the substrate support portion 212 to suppress a slip by increasing a coefficient of friction for the substrate W. The substrate W is mounted on the top surface of the surface pad 214.

For reference, in the present invention, polishing the substrate W is defined as polishing the substrate W by a mechanical polishing process or a chemical mechanical polishing (CMP) process on the substrate W. For example, in the polishing part, a slurry for chemical polishing is supplied together while a mechanical polishing on the substrate W is performed, and a chemical mechanical polishing (CMP) process is performed. In this case, the slurry may be supplied from the inner region of the polishing brush 232 or from the outer region of the polishing brush 232.

The substrate support part 212 is provided to support the bottom surface of the substrate (W).

The substrate support 212 may be configured to support the bottom surface of the substrate W in various ways depending on the required conditions and design specifications.

Hereinafter, an example in which the substrate support 212 is formed in a substantially rectangular plate shape will be described. In some cases, the substrate support may be formed in other shapes and structures, and it is also possible to support the bottom of the substrate by using two or more substrate supports.

In addition, a stone tablet may be used as the substrate support 212. In some cases, the substrate support part may be formed of a metal material or a porous material, and the present invention is not limited or limited by the material of the substrate support part.

The upper surface of the substrate support 212 is provided with a surface pad 214 to suppress the slip by increasing the coefficient of friction for the substrate (W).

As such, the surface pad 214 is provided on the upper surface of the substrate support 212, and the substrate W is seated on the outer surface of the surface pad 214, whereby the substrate W is attached to the substrate support 212. In the mounted state, the movement of the substrate W with respect to the substrate support 212 can be restrained (slip restrained), and an advantageous effect of stably maintaining the arrangement position of the substrate W can be obtained.

The surface pad 214 may be formed of various materials having adhesion to the substrate W, and the present invention is not limited or limited by the material of the surface pad 214. For example, the surface pad 214 may be formed using any one or more of polyurethane, engineering plastic, and silicone having excellent elasticity and adhesiveness (friction). In some cases, the surface pad may be formed of another material having a non-slip function.

In addition, the surface pad 214 is formed to have a relatively high compression ratio. Here, the surface pad 214 is formed to have a relatively high compressibility, it can be expressed that the surface pad 214 has a relatively high elongation, the soft material that the surface pad 214 can be easily compressed Is defined as formed.

Preferably, the surface pad 214 is formed to have a compression ratio of 20 to 50%. As such, by forming the surface pad 214 to have a compression ratio of 20 to 50%, even if foreign matter flows between the substrate W and the surface pad 214, the surface pad 214 is as easy as the thickness of the foreign matter. Since it can be compressed, it is possible to minimize the height deviation (specific portions of the substrate W locally protruded by foreign matter) due to the foreign matter, and as a specific portion of the substrate W locally protrudes An advantageous effect of minimizing the reduction of polishing uniformity can be obtained.

Meanwhile, in the above-described and illustrated embodiments of the present invention, the substrate support 212 is configured to support the substrate W in a contact manner, but in some cases, the substrate support portion may contact the bottom surface of the substrate in a non-contact manner. It is also possible to configure to support.

For example, the substrate support unit may be configured to inject a fluid to the bottom of the substrate, and to support the bottom (or bottom of the surface pad) of the substrate by the injection force by the fluid. In this case, the substrate support unit may spray at least one of a gas (for example, air) and a liquid (for example, pure water) to the bottom surface of the substrate, and the type of fluid may vary depending on the required conditions and design specifications. can be changed.

In some cases, the substrate support may be configured to support the inner surface of the substrate in a non-contact manner by using magnetic force (for example, repulsive force) or floating force by ultrasonic vibration.

The polishing brush 232 is provided to constitute a polishing unit for polishing the upper surface of the substrate on the upper portion of the substrate.

More specifically, the polishing brush 232 rollingly rotates (planarizes) the surface of the substrate W while rolling about the substrate. Here, the rotation of the polishing brush 232 with respect to the substrate is defined as including both the axis of rotation of the polishing brush disposed horizontally or slightly inclined with respect to the surface of the substrate.

For example, the polishing brush 232 is configured to rotate about a rotation axis 231 horizontal to the substrate.

The polishing brush 232 may be combined in various structures rotatable about a rotating shaft 231 horizontal to the substrate, and the present invention is not limited or limited by the rotating method and the rotating structure of the polishing brush 232. .

In this case, the contact area of the polishing brush 232 to the substrate may be changed in various ways depending on the required conditions and design specifications.

For example, referring to FIGS. 2 and 6, the polishing brush 232 is provided to be in line contact with the surface of the substrate.

Here, while the polishing brush 232 is in linear contact with the surface of the substrate, the polishing brush 232 in contact with the substrate (plane) is defined as having a circular or spherical shape. The polishing brush 232 may be formed in various structures capable of linear contact with the substrate. For example, the polishing brush 232 is formed in the shape of a circular roll having a circular cross section.

As another example, referring to FIG. 7, the polishing brush 232 may be configured to be in surface contact with the surface of the substrate.

The polishing brush 232 is formed of a material suitable for mechanical polishing of the substrate (W). For example, the abrasive brush 232 may be made of polyurethane, polyurea, polyester, polyether, epoxy, polyamide, polycarbonate, polyethylene, polypropylene, fluoropolymer, vinyl polymer, acrylic and methacrylic polymer, Silicon, latex, nitride rubber, isoprene rubber, butadiene rubber, and various copolymers of styrene, butadiene, and acrylonitrile may be formed, and the materials and properties of the abrasive brush 232 may be adjusted to the required conditions and design specifications. It can be changed in various ways.

Preferably, the polishing brush 232 is formed to have a sufficient length for continuous contact from one end to the other end of the substrate in a direction orthogonal to the direction in which the substrate is transferred. In some cases, it is also possible to form the polishing brush with a length shorter than that of the substrate (shorter than the length from one end to the other end of the substrate in the direction orthogonal to the direction in which the substrate is conveyed).

The abrasive brush 232 is configured to move relative to the substrate by the gantry unit 201.

For example, the gantry unit 201 may include a moving body (not shown) that linearly moves along a first direction (eg, the X-axis direction) in which the substrate is transferred, and the polishing brush 232 is mounted to the moving body. The substrate W is polished while moving along the first direction.

At this time, the moving body is configured to move along a guide rail (not shown) disposed along the first direction. Permanent magnets of the N pole and the S pole are alternately arranged in the guide rail, and the movable body may be driven by the principle of a linear motor capable of precise position control by current control applied to a coil provided in the movable body.

In the exemplary embodiment of the present invention, the polishing brush 232 is moved with respect to the substrate, and an example in which the substrate W is polished is described. However, in some cases, the substrate is mounted with respect to the polishing brush in a state where the polishing brush is fixed. It is also possible to polish the substrate while moving (for example, moving the substrate placement portion).

As described above, the polishing of the substrate by the polishing brush 232 rotating about the rotation axis 231 horizontal to the substrate can obtain an advantageous effect of improving the polishing uniformity and the polishing efficiency of the substrate.

That is, it is possible to polish the substrate by rotating the plate-shaped circular polishing pad having a smaller size than the substrate about the rotation axis perpendicular to the upper surface of the substrate, but for each region of the substrate to which the polishing pad is in contact (different polishing sites). When the error of the pressing force for pressing the polishing pad to the substrate occurs, there is a problem that a difference in polishing amount occurs for each region of the substrate and polishing uniformity is lowered.

On the contrary, although a polishing pad having a size larger than that of the substrate may be used, a very large rotating equipment and a space are required to rotate the polishing pad of a large size, and thus there is a problem that space efficiency and design freedom are lowered and stability is lowered. .

However, the present invention is polished by a polishing brush 232 that rotates on the substrate (eg, rotates about a horizontal axis of rotation that is horizontal with respect to the substrate), so that the space efficiency and design freedom are not significantly reduced. It is possible to simultaneously polish the substrate from one end to the other end of the substrate, and the advantageous effect of maintaining the overall polishing amount uniformly by the polishing brush 232 from one end to the other end of the substrate and increasing the polishing uniformity can be obtained.

In addition, referring to FIG. 5, the substrate processing apparatus includes a polishing brush controller 250 that controls the polishing amount per unit time of the polishing brush 232.

The polishing brush control unit 250 may be configured to control the amount of polishing per unit time by the polishing brush 232 in various ways according to the required conditions and design specifications.

For example, the polishing brush controller 250 may control the polishing rate per unit time by the polishing brush 232 by controlling the rotational speed V of the polishing brush 232. In some cases, it is also possible to control the polishing amount per unit time by the polishing brush by adjusting the height (separation interval) of the polishing brush on the substrate.

As another example, the polishing brush controller 250 may control the polishing amount per unit time by the polishing brush 232 by adjusting the contact pressure at which the polishing brush 232 contacts the substrate.

More specifically, the polishing brush 232, the brush body 232a in contact with the substrate, and the pressure chamber 232b is formed inside the brush body 232a and selectively expands or contracts the brush body 232a. The polishing brush control unit 250 controls the contact pressure of the polishing brush 232 to the substrate by adjusting the pressure of the pressure chamber 232b.

In this case, the pressure of the pressure chamber 232b may be controlled by adjusting the supply pressure of the fluid (for example, gas) supplied to the pressure chamber 232b.

More specifically, as shown in FIG. 6, when the pressure in the pressure chamber 232b is maintained at the first pressure P1, the brush body 232a is expanded and is in line contact with the substrate. As shown in FIG. 7, the pressure chamber 232b is provided. When the pressure is maintained at the second pressure P2 lower than the first pressure P1, the brush body 232a is contracted and is in surface contact with the substrate.

In this case, the first pressure P1 and the second pressure P2 may be pressure values determined as one or in a predetermined range. In addition, the contact pressure of the polishing brush 232 to the substrate increases as the pressure of the pressure chamber 232b increases from the second pressure P2 to the first pressure P1.

Preferably, the substrate processing apparatus 10 includes a thickness measuring unit 260 for measuring the thickness of the substrate W, and the polishing brush control unit 250 includes a pressure chamber (A) according to the thickness variation of each region of the substrate (W). Adjust the pressure of 232b).

As the thickness measuring unit 260, a conventional thickness measuring sensor capable of measuring the thickness of the substrate W may be used. For example, an optical sensor that emits light having one or more wavelengths and receives reflected light reflected from the substrate as a reception signal may be used as the thickness measurement unit 260. In some cases, other sensors capable of measuring the thickness of the substrate may be used instead of the optical sensor, and the present invention is not limited or limited by the type and measuring method of the thickness measuring unit 260.

In this way, by measuring the thickness variation for each region of the substrate W and adjusting the pressure of the pressure chamber 232b according to the thickness variation for each region of the substrate W, the thickness variation of the substrate W can be eliminated. Can be.

That is, since the thickness distribution occurs when the thickness of the substrate W is not uniform at the time of initial formation of the substrate W or when the variable of the polishing process is incorrectly controlled, the thickness variation of the substrate during the polishing process is required to increase the polishing uniformity of the substrate W. According to the pressure control by the polishing brush 232 should be possible.

Accordingly, the present invention, by adjusting the pressure of the pressure chamber 232b according to the thickness variation of the substrate (W), it is possible to adjust the amount of polishing different for each region of the substrate (W), the thickness of the substrate (W) By removing the deviation, the thickness profile of the substrate W may be uniformly adjusted as a whole, and an advantageous effect of improving the polishing quality of the substrate W may be obtained.

In the above-described and illustrated embodiments of the present invention, the abrasive brush rotates about the substrate about a horizontal axis of rotation, but in some cases, the abrasive brush is inclined with respect to the surface of the substrate. It is also possible to roll around the substrate about the axis of rotation.

For example, the axis of rotation of the polishing brush may be inclined with respect to the surface of the substrate, and the polishing brush may be gradually thicker (or thinner) from one end to the other (or the other end) in response to the inclination of the rotation axis. For example, trapezoidal cross-sectional shape).

Alternatively, it is also possible to adjust the internal pressure (pressure chamber pressure) of the polishing brush so that the polishing brush is brought into uniform contact with the substrate as a whole with the rotating shaft of the polishing brush inclined with respect to the surface of the substrate.

The substrate processing apparatus 10 also includes a conditioner 240 for modifying (conditioning) the outer surface (surface in contact with the substrate) of the polishing brush 232.

For reference, the conditioner 240 condition the polishing brush 232, the fine pores formed on the outer surface of the polishing brush 232 by finely pressing the outer surface of the polishing brush 232 to a predetermined pressing force It is defined as modifying to appear on the surface.

In other words, the conditioner 240 finely cuts the outer surface of the conditioner 240 so as not to block the numerous foamed pores that serve to contain the slurry of the abrasive and chemical mixed on the outer surface of the polishing brush 232, The slurry filled in the foamed pores of the conditioner 240 is smoothly supplied to the substrate.

Preferably, the conditioner 240 is provided to condition the polishing brush 232 while the polishing brush 232 polishes the substrate (W). In particular, in the present invention, the polishing brush 232 rotates about the rotation axis 231 horizontal to the substrate W to polish the substrate W, and the outer surface of the polishing brush 232 is exposed to the outside during the polishing process. As such, the polishing process of the substrate by the polishing brush 232 may be performed and the conditioning process of the polishing brush 232 may be performed together.

This is to simplify the processing process of the substrate W and shorten the processing time.

That is, the polishing brush 232 for polishing the substrate should be able to be modified (conditioned) or replaced periodically according to a certain use time. However, since the processing efficiency and productivity of the substrate decreases as the time required for reforming the polishing brush 232 increases, the time required for reforming the polishing brush 232 should be shortened.

However, in the conventional polishing method of polishing a substrate with a plate-shaped polishing pad, since the polishing surface of the polishing pad is in contact with the substrate and cannot be exposed to the outside during the polishing process, the polishing process of the substrate and the modifying process of the polishing pad are performed together. Can't be done. Therefore, conventionally, as the polishing process of the substrate is to be stopped while the polishing pad is being modified, the processing efficiency and productivity of the substrate are reduced, and the processing time of the substrate is increased. In particular, the modification process of the polishing pad takes more than a few minutes (for example, 10 minutes). During the modification process of the polishing pad, the polishing process of the substrate by the polishing pad is stopped, which inevitably increases the processing time of the substrate. There is a problem that the processing efficiency is lowered.

However, the present invention allows the polishing brush 232 to be polished by the polishing process of the substrate W by the polishing brush 232 and the conditioning process of the polishing brush 232. The advantageous effect of shortening the time and improving the processing efficiency and productivity of the substrate W can be obtained.

Furthermore, by allowing the conditioning process to be performed directly at the polishing position without moving the polishing brush 232 to a separate conditioning position, the movement path of the polishing brush 232 is minimized, and the design freedom and space utilization are improved. It is possible to obtain an advantageous effect.

Preferably, the conditioner 240 is disposed above the polishing brush 232 to press the polishing brush 232 to the substrate (W).

In this way, by placing the conditioner 240 on top of the polishing brush 232 and by causing the polishing brush 232 to be pressed on the substrate (W) by the conditioner 240, the brush body of the polishing brush 232 ( Even if 232a is contracted, an advantageous effect of stably maintaining the surface contact state between the brush body 232a and the substrate W can be obtained.

The conditioner 240 may be formed in various structures capable of conditioning the polishing brush 232 during the polishing process.

For example, referring to FIG. 3, the conditioner 240 includes a planar conditioning pad 242 that is in line contact with the outer circumferential surface of the polishing brush 232.

For example, the planar conditioning pad 242 may be formed in the form of a plate which can be in line contact with the outer circumferential surface of the polishing brush 232. In some cases, it is also possible to form the planar conditioning pad in any other form capable of linear contact with the outer circumferential surface of the polishing brush.

As another example, referring to FIG. 4, the conditioner 240 includes a curved conditioning pad 242 ′ that is in surface contact with an outer circumferential surface of the polishing brush 232.

Preferably, the curved conditioning pad 242 ′ is formed in a curved shape corresponding to the outer circumferential surface of the polishing brush 232 and is in surface contact with the outer circumferential surface of the polishing brush 232. As described above, the surface conditioning pad 242 'is brought into surface contact with the outer circumferential surface of the polishing brush 232, thereby sufficiently securing the contact area between the polishing brush 232 and the curved conditioning pad 242'. An advantageous effect of shortening the conditioning time of the polishing brush 232 and increasing the conditioning efficiency can be obtained.

More preferably, the conditioner 240 (plane conditioning pad or curved conditioning pad) is continuously contacted from one end to the other end of the polishing brush 232 along the longitudinal direction of the polishing brush 232.

As such, the conditioner 240 is continuously contacted from one end to the other end of the polishing brush 232 along the longitudinal direction of the polishing brush 232, thereby increasing the conditioning uniformity of the polishing brush 232 and improving the conditioning time. An advantageous effect of shortening can be obtained.

The conditioner 240 is mounted to the gantry unit 201 that moves the polishing brush 232 relative to the substrate. In this manner, by attaching the conditioner 240 to the gantry unit 201, an advantageous effect of simplifying the mounting and moving structure of the conditioner 240 can be obtained. In some cases it is also possible to mount the conditioner on other structures spaced apart from the cantree unit.

8 to 10 are diagrams for describing a substrate treating apparatus according to another exemplary embodiment of the present invention. In addition, the same or equivalent reference numerals are given to the same or equivalent components as those described above, and detailed description thereof will be omitted.

8 to 10, according to another embodiment of the present invention, the substrate mounting unit 210 may include a transfer belt 214 ′ moving along a predetermined path and seating the substrate W on an outer surface thereof; And a substrate support 212 disposed inside the transfer belt 214 'and supporting the bottom surface of the substrate W with the transfer belt 214' interposed therebetween.

For reference, similar to the above-described embodiment, the polishing brush 232 rotates about the rotation axis 231 horizontal to the substrate to polish the substrate (W).

The transfer belt 214 'may be configured to move along a defined path in various ways depending on the desired conditions and design specifications. As an example, the transfer belt 214 'may be configured to rotate in a defined path.

Circular rotation of the transfer belt 214 'may be done in a variety of ways depending on the conditions and design specifications required. For example, the transfer belt 214 'is circulated and rotated along a path defined by the roller unit 217, and the substrate W seated on the transfer belt 214' is circulated by the rotation of the transfer belt 214 '. It is conveyed along this linear movement path.

The movement path (eg, circulation path) of the transfer belt 214 'may be variously changed according to the required conditions and design specifications. For example, the roller unit 217 includes a first roller 217a and a second roller 217b spaced apart from the first roller 217a in parallel, and the conveying belt 214 'includes the first roller. 217a and the second roller 217b are cyclically rotated in an endless loop manner.

For reference, the outer surface of the transfer belt 214 'means an outer surface exposed to the outside of the transfer belt 214', and the substrate W is seated on the outer surface of the transfer belt 214 '. . In addition, the inner surface of the conveyance belt 214 'means the inner surface of the conveyance belt 214' to which the first roller 217a and the second roller 217b are in contact.

In addition, any one or more of the first roller 217a and the second roller 217b may be selectively configured to linearly move in a direction approaching and spaced apart from each other. For example, the second roller 217b to which the first roller 217a is fixed may be configured to linearly move in a direction approaching and spaced apart from the first roller 217a. As such, the tension of the transfer belt 214 'can be adjusted by allowing the second roller 217b to approach and be spaced apart from the first roller 217a according to manufacturing tolerances and assembly tolerances.

Here, adjusting the tension of the conveying belt 214 'is defined as adjusting the tension by pulling the loosening or loosening of the conveying belt 214'. In some cases, it is also possible to provide a separate tension adjusting roller and to adjust the tension of the transfer belt by moving the tension adjusting roller. However, it is preferable to move any one or more of the first roller and the second roller to improve the structure and space utilization.

In addition, the substrate processing apparatus includes a loading transfer speed at which the loading part 100 transfers the substrate W during a loading transfer step of transferring the substrate W from the loading part 100 to the polishing part 200, The belt 214 'includes a loading control unit (not shown) for synchronizing the belt conveying speed at which the substrate W is conveyed.

More specifically, the loading control unit synchronizes the loading conveyance speed and the belt conveying speed when one end of the substrate W is disposed at a predefined seating start position SP in the conveying belt 214 '.

Here, the starting start position SP in the transfer belt 214 'is defined as a position at which the substrate W can start being transferred by the rotational rotation of the transfer belt 214'. In SP, the bonding property between the conveyance belt 214 'and the board | substrate W is provided. For example, the seating start position SP may be set at one side (or a position adjacent to one side of the substrate receiving portion) facing the front end of the substrate W transferred from the loading part 100. .

For reference, when one side of the board receiving portion 216a is detected as being positioned at the seating start position SP by a general sensing means such as a sensor or a vision camera, one side of the board receiving portion 216a may be placed at the seating starting position ( The rotation of the transfer belt 214 'is stopped so that the state positioned at SP is maintained.

Thereafter, when the rotation of the transfer belt 214 'is stopped, when the front end of the substrate W is detected by the sensing means as being disposed at the seating start position SP, the loading control part is configured to load the load part 100. The feed belt 214 'is rotated (synchronized rotation) so that the loading feed speed for feeding the substrate W and the belt feed speed for feeding the substrate W are the same speed. W) is transferred to the polishing position.

In addition, the transfer belt 214 ′ moves in a direction spaced apart from the bottom surface of the substrate W in a state in which the substrate W on which polishing is completed is transferred for a predetermined period or more.

More specifically, referring to FIG. 10, the transfer belt 214 ′ is configured to circulate and rotate along a predetermined path and to transfer the substrate W. The substrate W has the transfer belt 214 ′ as a rotation path. At the position where it starts to move along (the position at which the conveying belt starts to move along a curved path along the outer surface of the second roller), the conveying belt 214 'moves in a direction spaced apart from the bottom surface of the substrate W. Accordingly separated from the conveying belt ().

As described above, in the state in which the conveyance belt 214 'for conveying the substrate W conveys the substrate W for a predetermined period or more, the conveyance belt 214' is moved in a direction spaced apart from the bottom surface of the substrate W. By doing so, an advantageous effect of naturally separating the substrate W from the transfer belt 214 'can be obtained without a separate pick-up step (for example, a pick-up step using a substrate adsorption device).

Previously, in order to load the substrate supplied to the loading part into the polishing part, a separate pickup device (for example, a substrate adsorption device) had to be used to pick up the substrate from the loading part, and then put the substrate back on the polishing part. Therefore, there is a problem that the processing time increases so that the time required to load the substrate takes several seconds to several tens of seconds. Furthermore, in order to unload the substrate which has been polished previously into the unloading part, the substrate W is picked up from the polishing part using a separate pickup device (for example, a substrate adsorption device), and then the substrate is unloaded again. Since it had to be placed on the loading part, there is a problem that the processing time increases to take several seconds to several tens of seconds for unloading the substrate W.

However, in the present invention, in the state in which the substrate W supplied to the loading part is directly transferred to the transfer belt 214 'which is circulated and rotated, the polishing process is performed on the substrate W, and the substrate W is transferred to the transfer belt ( By being directly transferred to the unloading part 300 on 214 ', an advantageous effect of simplifying the processing process of the substrate W and shortening the processing time can be obtained.

In addition, the present invention is to exclude the separate pick-up process during loading and unloading of the substrate (W), and to allow the substrate (W) to be processed in an in-line manner by using the transfer belt 214 'rotates, Advantageous effects of simplifying the loading time and unloading process of (W) and reducing the time required for loading and unloading the substrate (W) can be obtained.

Furthermore, in the present invention, since it is not necessary to provide a pickup device for picking up the substrate W during loading and unloading of the substrate W, it is possible to simplify the equipment and equipment and to improve the space utilization. Can be obtained.

As another example of the conveying belt, the conveying belt may be wound in one direction to another and may be configured to convey the substrate W (not shown).

Here, the transfer belt is wound from one direction to the other, reel to reel winding method of the conventional cassette tape (wound on the first reel and then again opposite to the second reel) It is defined as moving along a moving trajectory in the form of an open loop (winding) in the manner of winding.

At this time, the substrate is in a position where the transfer path of the transfer belt is bent (for example, the position where the transfer belt starts to move along a curved path along the outer surface of the roller, as shown in FIG. 12). As it moves in a direction away from the bottom, it can be separated from the conveyance belt.

In addition, in the embodiment of the present invention, the transfer belt 214 ′ has been described as an example of a ring-shaped endless structure in which one end and the other end are continuously connected. It is also possible to form a detachable structure. One end and the other end of the transfer belt may be selectively separated by a conventional fastener using a fastening member in a structure in which one end and the other end of the transfer belt are separated.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. It will be appreciated that it can be changed.

100: loading part 110: loading feed roller
200: polishing part 210: substrate mounting portion
212: substrate support 214 ': transfer belt
230: polishing unit 232: polishing brush
232a: brush body 232b: pressure chamber
240: conditioner 242: flat conditioning pad
242 ': curved conditioning pad 250: abrasive brush control unit
260: thickness measurement unit 300: unloading part
310: unloading feed roller

Claims (20)

A substrate processing apparatus in which a substrate polishing process is performed,
A substrate mounting portion on which the substrate is mounted;
A polishing brush for rolling the substrate while rolling on the surface of the substrate;
Substrate processing apparatus comprising a.
The method of claim 1,
And the polishing brush is in line contact with the substrate.
The method of claim 2,
The polishing brush has a circular cross-sectional shape.
The method of claim 1,
And the polishing brush is in surface contact with the substrate.
The method of claim 1,
And a polishing brush controller for controlling an amount of polishing per unit time of the substrate by the polishing brush.
The method of claim 5,
The polishing brush,
A brush body in contact with the substrate;
A pressure chamber formed inside the brush body and selectively expanding or contracting the brush body; Including,
And the polishing brush controller controls the pressure of the pressure chamber.
The method of claim 6,
When the pressure of the pressure chamber is maintained at the first pressure, the brush body is inflated and in line contact with the substrate,
And when the pressure of the pressure chamber is maintained at a second pressure lower than the first pressure, the brush body is contracted and is in surface contact with the substrate.
The method of claim 6,
Including a thickness measuring unit for measuring the thickness of the substrate,
The polishing brush control unit is a substrate processing apparatus, characterized in that for adjusting the pressure of the pressure chamber in accordance with the thickness variation of each area of the substrate.
The method of claim 8,
The polishing brush control unit is a substrate processing apparatus, characterized in that for controlling the rotational speed of the polishing brush according to the thickness variation of each area of the substrate.
The method of claim 1,
And the polishing brush rotates about a rotation axis horizontal to the substrate.
The method of claim 1,
And the polishing brush rotates about an axis of rotation inclined with respect to the substrate.
The method according to any one of claims 1 to 11,
And a conditioner for conditioning the polishing brush.
The method of claim 12,
And the conditioner is configured to condition the polishing brush while the polishing brush polishes the substrate.
The method of claim 12,
And the conditioner is disposed above the polishing brush to press the polishing brush against the substrate.
The method of claim 12,
It includes a gantry unit for moving the polishing brush relative to the substrate,
And the conditioner is mounted to the gantry unit.
The method of claim 12,
And the conditioner includes a planar conditioning pad in line contact with an outer circumferential surface of the polishing brush.
The method of claim 12,
And the conditioner includes a curved conditioning pad in surface contact with an outer circumferential surface of the polishing brush.
The method of claim 12,
And the conditioner is in continuous contact from one end to the other end of the polishing brush in the longitudinal direction of the polishing brush.
The method according to any one of claims 1 to 11,
The substrate mounting portion,
A transfer belt provided to be movable along a predetermined path and having the substrate seated on an outer surface thereof;
A substrate support part disposed inside the transfer belt and supporting a bottom surface of the substrate with the transfer belt interposed therebetween;
Substrate processing apparatus comprising a.
The method according to any one of claims 1 to 11,
The position of the polishing brush is fixed while the polishing on the substrate is performed, the substrate is moved relative to the polishing brush.

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