CN209215642U - The monolith substrate formula coupled structure of planar optical waveguide light splitter - Google Patents

The monolith substrate formula coupled structure of planar optical waveguide light splitter Download PDF

Info

Publication number
CN209215642U
CN209215642U CN201822079144.7U CN201822079144U CN209215642U CN 209215642 U CN209215642 U CN 209215642U CN 201822079144 U CN201822079144 U CN 201822079144U CN 209215642 U CN209215642 U CN 209215642U
Authority
CN
China
Prior art keywords
optical fibre
substrate
type groove
chip
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201822079144.7U
Other languages
Chinese (zh)
Inventor
李勇奇
朱虹茜
马小翠
张克非
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Southwest University of Science and Technology
Original Assignee
Southwest University of Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Southwest University of Science and Technology filed Critical Southwest University of Science and Technology
Priority to CN201822079144.7U priority Critical patent/CN209215642U/en
Application granted granted Critical
Publication of CN209215642U publication Critical patent/CN209215642U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses a kind of monolith substrate formula coupled structures of planar optical waveguide light splitter, its both ends is separately connected input optical fibre and output optical fibre array, substrate is coupled including whole, one end upper surface of whole coupling substrate is equipped with first " V " type groove corresponding with input optical fibre, the other end upper surface of whole coupling substrate is equipped with multiple the second " V " type grooves being parallel to each other and multiple second " V " type grooves form " V " type groove array corresponding with output optical fibre array, the middle part upper surface of whole coupling substrate is equipped with the chip groove for placing PLC chip, the both ends of chip groove are connected with the first " V " type groove and second " V " type groove respectively.The utility model not only increases the stability of coupled structure, hence it is evident that improves the stress deviation in device work, extends device service life, and processing technology and encapsulation process are relatively easy, reduce production difficulty and encapsulation difficulty, reduce processing cost.

Description

The monolith substrate formula coupled structure of planar optical waveguide light splitter
Technical field
The utility model relates to a kind of coupled structure of planar optical waveguide light splitter more particularly to a kind of planar optical waveguides The monolith substrate formula coupled structure of optical splitter.
Background technique
Planar optical waveguide (Planar Lightwave Circuit, PLC) optical splitter is connection optical line terminal and light The core optical device of network unit, as the core optical passive component of FTTH system, apply passive optical network (EPON, BPON, GPON etc.) in connection local side and terminal device, major function is to complete the distribution of optical signal power, i.e., equably by optical signal Multiple outlets or reverse operation respectively are inputted from single or double a imports, and multiple optical signals are imported into single or double joint optical fiber.
When fiber array (FA) inside planar optical waveguide light splitter is coupled with PLC chip, precision, stability etc. are straight Connect the transmission quality of the overall performance and optical signal that influence device.Improve the light passing performance and optimization of planar optical waveguide light splitter Device coupling and encapsulating structure, become the developing direction and mainstream of next-generation planar optical waveguide light splitter.
Currently, the production of planar optical waveguide light splitter coupled structure and encapsulation are mainly in terms of following three come raising property Energy and quality:
1, couple board structure: side substrate is used to place input optical fibre, and Intermediate substrate is used to place PLC chip, another Side group plate is used to place output optical fibre array;
2, it generallys use the sextuple light field for being closely aligned with method to realize between fiber array and PLC chip to couple, improve Alignment precision reaches high coupling efficiency;
3, it is bonded after planar optical waveguide chip is aligned with fiber array using adhesive.
Traditional 1 × 8 planar optical waveguide light splitter coupled structure is as shown in Figure 1, include input optical fibre cover board 2, input light Fine substrate 3, PLC chip substrate 4, output optical fibre array substrate 5 and output optical fibre array cover plate 6, in application, input optical fibre 1 is set It is pushed down on input optical fibre substrate 3 and with input optical fibre cover board 2, output optical fibre array 7 is placed in output optical fibre array substrate 5 simultaneously It is pushed down with output optical fibre array cover plate 6, disadvantage is as follows:
1, substrate includes input optical fibre substrate 3, PLC chip substrate 4 and output optical fibre array substrate 5 independent, knot Structure dispersion, substrate processing technology step is more, and increases encapsulation difficulty;
2, the encapsulation of planar optical waveguide light splitter is related to fiber array and the 6 DOF of optical waveguide is closely aligned with, the technique Operating procedure is various, complicated for operation, difficulty is big, at high cost, and technical threshold is higher;
3, input optical fibre 1 and output optical fibre array 7 generally are fixed using bonding glue in encapsulation process, and with bonding Glue connects input optical fibre substrate 3, PLC chip substrate 4 and output optical fibre array substrate 5, is affected by temperature, with device It is used for a long time, glue denaturation, relative displacement may occur for each component, directly result in coupling efficiency and decline to a great extent or even device damage It is bad.
Utility model content
The purpose of this utility model is that provides a kind of planar optical waveguide light splitter to solve the above-mentioned problems Monolith substrate formula coupled structure.
The utility model achieves the above object through the following technical schemes:
A kind of monolith substrate formula coupled structure of planar optical waveguide light splitter, both ends are separately connected input optical fibre and defeated One end upper surface of fiber array out, including whole coupling substrate, the whole coupling substrate is equipped with one and the input light The other end upper surface of fine corresponding first " V " type groove, the whole coupling substrate is equipped with multiple second " V " types being parallel to each other Slot and multiple second " V " type grooves form " V " corresponding with output optical fibre array type groove array, the whole coupling base The middle part upper surface of plate is equipped with chip groove for placing PLC chip, and the both ends of the chip groove are respectively with described first " V " type groove and described second " V " type groove are connected.
Further, the both ends end face of the chip groove from bottom to top outward inclination and its end face and it is vertical between Angle is 8 °.
The utility model has the beneficial effects that:
The utility model is using monolith substrate structure and designs corresponding " V " shape slot, by input optical fibre, output optical fibre array An entirety is merged into planar optical waveguide chip, that is, PLC chip mounting structure, not only increases the stability of coupled structure, The stress deviation in device work is significantly improved, extends device service life, and processing technology and encapsulation process are opposite Simply, production difficulty and encapsulation difficulty are reduced, processing cost is reduced;Oblique 8 ° are carried out by the both ends end face to chip groove Processing, it is possible to increase return loss guarantees to export stable optical power, realizes the efficient coupling of optical signal, the optimization coupled structure Coupling efficiency up to 93%.
Detailed description of the invention
Fig. 1 is the schematic perspective view of the coupled structure of conventional planar optical waveguide optical splitter, shows perspective in figure Effect;
Fig. 2 is that the stereochemical structure of the monolith substrate formula coupled structure of planar optical waveguide light splitter described in the utility model is shown It is intended to, shows transparent effect in figure;
Solid when Fig. 3 is the monolith substrate formula coupled structure application of planar optical waveguide light splitter described in the utility model Structural schematic diagram shows transparent effect in figure.
Specific embodiment
The utility model is described in further detail with reference to the accompanying drawing:
As shown in Figures 2 and 3, the monolith substrate formula coupled structure of planar optical waveguide light splitter described in the utility model, Its both ends is separately connected input optical fibre 1 and output optical fibre array 7, including whole coupling substrate 9, whole one end for coupling substrate 9 Upper surface is equipped with first " V " type groove 8 corresponding with input optical fibre 1, and the whole other end upper surface for coupling substrate 9 is equipped with more A the second " V " type groove being parallel to each other and multiple second " V " type groove formation " V " type groove corresponding with output optical fibre array 7 Array 12, the whole middle part upper surface for coupling substrate 9 are equipped with the chip groove 10 for placing PLC chip 13, chip groove 10 All described second " V " type grooves respectively with described first " V " type groove 1 and " V " type groove array 12 of both ends be connected;Chip The both ends end face 11 of groove 10 from bottom to top outward inclination and its end face 11 and it is vertical between angle be 8 °.
As shown in Figures 2 and 3, in application, PLC chip 13 is fixed in chip groove 10 when installing using adhesive, the It is fixed the corresponding installation of input optical fibre 1 and with adhesive with cover board (not shown) in one " V " type groove 8, on " V " type groove array 12 It is fixed the corresponding installation of output optical fibre array 7 and with adhesive with cover board (not shown).When work, temperature rises, input light There are gaps to be able to carry out buffering for fibre 1 and output optical fibre array 7, due to coupling substrate 9 using whole, so worker's transferring device When accidentally fall or situations such as working environment shakes the stress that generates also be difficult to make input optical fibre 1 and output optical fibre array 7 with Biggish relative displacement occurs for the coupling unit of PLC chip 13, to considerably increase stability when device work, extender The service life of part.
Device size can be such that whole coupling substrate 9 is 30mm long, width 3mm, high 3mm, and the left and right ends part 8mm is used for " V " type groove is processed to place input optical fibre 1 and output optical fibre array 7;The length of chip groove 10 is 14mm, width 2mm, depth Degree is 1mm;The overall width for placing output optical fibre array 7 is 2mm.
Illustrate: above-mentioned whole coupling substrate 9 is that traditional coupled structure is no, whole first " V " type coupled on substrate 9 Slot 8, " V " type groove array 12, chip groove 10 respectively with the " V " shape slot on input optical fibre substrate 3, output optical fibre array substrate 5 On " V " type groove array, the groove on PLC chip substrate 4 it is corresponding, but its overall structure is different, so using different Reference numerals;The input optical fibre 1 of Fig. 2 and Fig. 3 and the input optical fibre 1 of output optical fibre array 7 and Fig. 1 and output optical fibre array 7 are complete It is complete corresponding and identical, so using identical reference numerals.In addition, according to needs are applied, above-mentioned input optical fibre 1 is also possible to Fiber array, output optical fibre array 7 are also possible to individual output optical fibre, and corresponding " V " shape slot then can adaptive change.
Above-described embodiment is the preferred embodiment of the utility model, is not the limit to technical solutions of the utility model System, as long as being regarded as falling into without the technical solution that creative work can be realized on the basis of the above embodiments In the rights protection scope of the utility model patent.

Claims (2)

1. a kind of monolith substrate formula coupled structure of planar optical waveguide light splitter, both ends are separately connected input optical fibre and output Fiber array, it is characterised in that: couple substrate including whole, one end upper surface of the whole coupling substrate is equipped with one and institute State corresponding first " V " type groove of input optical fibre, the other end upper surface of the whole coupling substrate is equipped with multiple be parallel to each other Second " V " type groove and multiple described second " V " type groove formation " V " corresponding with output optical fibre array type groove arrays, it is described The middle part upper surface of whole coupling substrate is equipped with the chip groove for placing PLC chip, the both ends difference of the chip groove It is connected with the described first " V " type groove and described second " V " type groove.
2. the monolith substrate formula coupled structure of planar optical waveguide light splitter according to claim 1, it is characterised in that: institute State the both ends end face of chip groove from bottom to top outward inclination and its end face and it is vertical between angle be 8 °.
CN201822079144.7U 2018-12-12 2018-12-12 The monolith substrate formula coupled structure of planar optical waveguide light splitter Expired - Fee Related CN209215642U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822079144.7U CN209215642U (en) 2018-12-12 2018-12-12 The monolith substrate formula coupled structure of planar optical waveguide light splitter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822079144.7U CN209215642U (en) 2018-12-12 2018-12-12 The monolith substrate formula coupled structure of planar optical waveguide light splitter

Publications (1)

Publication Number Publication Date
CN209215642U true CN209215642U (en) 2019-08-06

Family

ID=67464208

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822079144.7U Expired - Fee Related CN209215642U (en) 2018-12-12 2018-12-12 The monolith substrate formula coupled structure of planar optical waveguide light splitter

Country Status (1)

Country Link
CN (1) CN209215642U (en)

Similar Documents

Publication Publication Date Title
US20200264392A1 (en) Optical module
CN205229520U (en) Two -way BOSA structure of single fiber
CN104808298B (en) Active Optical Fiber coupled apparatus
CA2244496A1 (en) Optical fiber passive alignment apparatus using alignment platform
CN205193318U (en) High -speed light electric chip grating passive coupling device
CN102301739B (en) Method for multiplexing optical signals and optical multiplexer
CN105425351A (en) Packaging structure of light receiving/ transmitting sub module and manufacturing method thereof
CN103257411B (en) A kind of parallel light transceiver component for broadband high-speed transmission
CN102998751A (en) Planar optical waveguide and optical fiber coupling method and structure
CN103278894A (en) Coupling assembly, optical fiber array module using coupling assembly and optical transceiver engine module using coupling assembly
CN218158413U (en) Silicon optical integrated chip and multi-wavelength parallel optical module component
CN103226223A (en) Optical engine micro-packaging structure for high-speed parallel light transmitting/receiving module
CN202995094U (en) Easily packaged parallel transmission optical device
CN203414640U (en) Coupling assembly, optical fiber array module employing coupling assembly and optical transceiver engine module employing coupling assembly
CN210835351U (en) Optical module
CN105717586B (en) A kind of coupling process and its optical transceiver module of composition of SIP chips and laser
US10422967B2 (en) Optical coupling apparatus and method
CN203324522U (en) Light engine micro-packaging structure used for high-speed parallel light transmitting-receiving module
CN206684343U (en) A kind of non-equidistant fiber array of more diameter optical fibers
CN209215642U (en) The monolith substrate formula coupled structure of planar optical waveguide light splitter
CN107526138A (en) A kind of Double End fiber array and its manufacture method
CN107643570A (en) Optics of parallel encapsulation and preparation method thereof
CN103257414B (en) For the parallel light transceiver component of broadband high-speed transmission
CN203811852U (en) Chip array and parallel optical fiber passive coupled optical assembly
CN108983372A (en) It is a kind of for converting the electricity into the optical device of light

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190806

Termination date: 20211212

CF01 Termination of patent right due to non-payment of annual fee