CN205193318U - High -speed light electric chip grating passive coupling device - Google Patents
High -speed light electric chip grating passive coupling device Download PDFInfo
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- CN205193318U CN205193318U CN201521030788.7U CN201521030788U CN205193318U CN 205193318 U CN205193318 U CN 205193318U CN 201521030788 U CN201521030788 U CN 201521030788U CN 205193318 U CN205193318 U CN 205193318U
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Abstract
The utility model relates to a high -speed light electric chip grating passive coupling device, it includes first passive alignment subassembly, the passive alignment subassembly of second and passive coupling subassembly, first passive alignment subassembly includes: a fixed platform, DFB laser instrument silicon are aimed at the platform, are in through the encapsulation of flip chip bonding mode the DFB laser instrument on the platform is aimed at to DFB laser instrument silicon to and first plus lens, the passive alignment subassembly of second includes: to eka silicon platform subassembly, optical interface component and through to eka silicon platform subassembly and the fixed fiber array of optical interface component, to being equipped with the second plus lens on the eka silicon platform subassembly, the passive coupling subassembly includes: PCB board, light electric chip are to eka silicon platform and light electric chip, the terminal surface of first plus lens and second plus lens is 40 inclined planes, 40 the reflectance coating has been plated on the inclined plane. The passive alignment of grating coupler can be realized to the silicon structure platform that the rational design light path is accurate with the design, greatly reduced the device cost.
Description
Technical field
The utility model belongs to optical communication field, is specifically related to a kind of high speed optoelectronic chip grating passive coupling arrangement.
Background technology
In recent years due to the development of Internet technology, also requirements at the higher level are proposed to network transfer speeds for the whole world; Bandwidth also promotes steadily under the promotion of demand and technology, and increasing data center comes into operation.The integrated required high speed optoelectronic chip of these Iarge-scale system also faces more challenges.Due to the raising of whole system integrated level, device size is more and more less, and transfer rate is more and more higher, and power consumption requirements is more and more lower, and price has more and more cheaply become a trend.Under such requirement, integrated photon technology will become the most suitable implementation of high speed device of future generation.Although this integrated technology has many benefits, as high speed, low-power consumption, volume is little; But another very severe problem but hinders its development, Here it is and the coupling of optical fiber.In order to obtain higher response speed, integrated level is higher, also means the reduction of waveguide dimensions, and this exacerbates again the difficulty of coupling; General end coupling method is applicable to large waveguiding structure, but tolerance is also very little, and 1, in 2 microns, coupling difficulty is quite large.For little waveguide, often adopt grating coupling process, this coupling scheme tolerance is large, is conducive to industry.
Utility model content
For solving the problems of the technologies described above, the utility model provides a kind of high speed optoelectronic chip grating passive coupling arrangement, by appropriate design light path and the accurate silicon structure platform of design, can realize grating coupled packaging passive alignment, greatly reduce device cost.
For achieving the above object, the technical solution of the utility model is as follows:
A kind of high speed optoelectronic chip grating passive coupling arrangement, it comprises the first packaging passive alignment assembly, second packaging passive alignment assembly and described first packaging passive alignment assembly and the second packaging passive alignment assembly are realized the passive coupling assembly of passive coupling, described first packaging passive alignment assembly and the second packaging passive alignment assembly realize aiming at respectively as incident assembly and the grafting of outgoing assembly on described passive coupling assembly, described first packaging passive alignment assembly comprises: the first stationary platform, be fixed on the Distributed Feedback Laser silicon alignment stage in described first stationary platform, the Distributed Feedback Laser bottom described Distributed Feedback Laser silicon alignment stage is encapsulated in by flip chip bonding mode, and the first plus lens be fixed in described first stationary platform, described second packaging passive alignment assembly comprises: to eka-silicon platform assembly, optical interface assemblies and by the described fiber array fixing to eka-silicon platform assembly and optical interface assemblies, is describedly provided with the second plus lens to eka-silicon platform assembly, described passive coupling assembly comprises: pcb board, be arranged on photoelectric chip on described pcb board to eka-silicon platform and be arranged on described photoelectric chip to the waveguide optical grating on eka-silicon platform, the end face of described first plus lens and the second plus lens is 40 ° of inclined-planes, and described 40 ° of inclined-planes are coated with reflectance coating, glancing incidence light after described first plus lens reflection with the angle coupled light grating of vertical direction 10 degree, realize being coupled.
Preferably, described first packaging passive alignment assembly also comprises: the first plus lens fixture and the second plus lens fixture, described first plus lens is fixed in described first stationary platform by described first plus lens fixture and the second plus lens fixture, and described first plus lens fixture and the second plus lens fixture are provided with 54.7 ° of V-type deep trouths.
Preferably, described Distributed Feedback Laser passes through metal pad upside-down mounting in described Distributed Feedback Laser silicon alignment stage, and by the cooperation between the height of described first plus lens fixture, the second plus lens fixture, Distributed Feedback Laser silicon alignment stage and described first stationary platform, the light that described Distributed Feedback Laser and detector are sent beats the center at described first plus lens just, achieves the packaging passive alignment of described Distributed Feedback Laser and described first plus lens; Also comprise the circuit board of a QFN encapsulation, the driving chip of described Distributed Feedback Laser and the trans-impedance amplifier of detector are all arranged on described circuit board, by described metal pad, the port that described Distributed Feedback Laser, detector are corresponding with the trans-impedance amplifier of detector to the driving chip of described Distributed Feedback Laser is respectively connected, be connected with other circuit part by described pcb board again, make luminescence component work.
Preferably, described eka-silicon platform assembly also to be comprised: the second stationary platform, be arranged on the first optical fiber fixture in described second stationary platform and the second optical fiber fixture, described first optical fiber fixture is equipped with relative V-type groove with on the second optical fiber fixture, and described first optical fiber fixture and the second optical fiber fixture fix described fiber array by described V-type groove; Described second stationary platform is also provided with the 3rd plus lens fixture and the 4th plus lens fixture, by described 3rd plus lens fixture and the 4th plus lens fixture, described second plus lens is fixed in described second stationary platform; Described second plus lens and described fiber array are coupled together by two guide pins, are realized the packaging passive alignment of described second plus lens and fiber array by the height of described 3rd plus lens fixture and the 4th plus lens fixture and described second stationary platform.
Preferably, described pcb board comprises pcb board body and is arranged on the first groove on described pcb board body, and a side of described first groove is through, and described pcb board is provided with the vertical height that described first groove reduces silicon platform.
Preferably, the center of described photoelectric chip to the upper surface of eka-silicon platform is provided with the second groove, and described second groove is for holding waveguide optical grating, and the two ends of described waveguide optical grating are grating, and the centre of described waveguide optical grating is waveguide.
Preferably, described first packaging passive alignment assembly and the second packaging passive alignment assembly are structurally symmetrical mutually, the light that described Distributed Feedback Laser sends is after described first plus lens reflection, light is to be incident in the grating of one end with the direction of vertical plane 10 ° of angles, then light is transmitted in the grating of the other end in horizontal waveguide, light, again to be incident to described second plus lens with the direction of vertical plane 10 ° of angles, finally to enter described fiber array and propagates.
Preferably, described optical interface assemblies is MT tail optical fiber or MPO tail optical fiber, and the centre wavelength of described optical interface assemblies is 1310nm.
The beneficial effects of the utility model are:
One, the utility model adopt the mode to plus lens polishing 40 degree of inclined-planes and plating reflectance coating in light path design, allow light in vertical direction with the incident grating in 10 degree of angles, can complete coupling; Adopt the mode of the welding of falling stake to be connected with pcb board by DFB on the other hand, this electrical coupling mode goes for the high-speed transfer of 25Gb/s.Moreover laser instrument and plus lens, the location by Si and O isotopes between fiber array and plus lens realizes packaging passive alignment, and this directly passive Coupling Design greatly reduces device assembling difficulty, improves the yield of work task efficiency and product.
Two, the utility model is by appropriate design light path with design accurate silicon structure platform, and can realize grating coupled packaging passive alignment, this passive passive coupling scheme, greatly simplify the complexity of assembling, greatly reduce device cost.Further, technique of alignment of the present utility model, can be extended in the scheme of higher rate equally, and transplanting performance is good, effectively can solve a high-speed communication difficult problem for narrow space.
Three, the fixation kit of coupling device of the present utility model adopts silicon materials to make, and ensure that assembly precision is high under identical mismachining tolerance; Light path design adopts the mode on plus lens polishing inclined-plane achieve the turning of light, saved the space of device; And all electrical coupling modes of above-mentioned coupling device all adopt the mode of face-down bonding, ensure the transmission quality of radiofrequency signal.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment technology, be briefly described to the accompanying drawing used required in the description of embodiment technology below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Structural representation after Fig. 1 coupling device assembling of the present utility model.
Fig. 2 is the structural representation of the first passive alignment structures in Fig. 1.
Fig. 3 is the structural representation of the second passive alignment structures in Fig. 1.
Fig. 4 is the structural representation of PCB substrate of the present utility model.
Fig. 5 is the structural representation of photoelectric chip of the present utility model to eka-silicon platform.
Fig. 6 is the structural representation of optical fiber and photoelectric chip coupled mode in Fig. 1.
Fig. 7 is the utility model index path in the horizontal direction.
Wherein, 1-passive coupling assembly, 2-first packaging passive alignment assembly, 3-second packaging passive alignment assembly, 4-incidence or emergent ray, 5-waveguide optical grating, 6-plus lens 40 ° of reflectings surface, 11-PCB plate, 12-photoelectric chip is to eka-silicon platform, 21-first stationary platform, 22-DFB laser instrument silicon alignment stage, 23-first plus lens fixture, 24-second plus lens fixture, 25-first plus lens, 26-DFB laser instrument, 27-metal pad, 28-V type groove, 31-is to eka-silicon platform assembly, 32-fiber array, 33-optical interface assemblies, 311-second stationary platform, 312-first optical fiber fixture, 313-second optical fiber fixture, 314-the 3rd plus lens fixture, 315-the 4th plus lens fixture, 316-second plus lens.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Embodiment
As shown in Figure 1, a kind of high speed optoelectronic chip grating passive coupling arrangement is disclosed in the present embodiment, it mainly comprises: passive coupling assembly 1, first packaging passive alignment assembly 2 and the second packaging passive alignment assembly 3, above-mentioned first packaging passive alignment assembly 2 and the second packaging passive alignment assembly 3 are realized passive coupling by above-mentioned passive coupling assembly 1, and above-mentioned first packaging passive alignment assembly 2 and the second packaging passive alignment assembly 3 realize aiming at respectively as incident assembly and the grafting of outgoing assembly on above-mentioned passive coupling assembly 1.
Concrete, as shown in Figure 2, above-mentioned first packaging passive alignment assembly 2 comprises: first fixing flat 21, be fixed on the Distributed Feedback Laser silicon alignment stage 22 in above-mentioned first stationary platform 21, be encapsulated in the Distributed Feedback Laser 26 bottom above-mentioned Distributed Feedback Laser silicon alignment stage 22 by flip chip bonding mode, and be fixed on the first plus lens 25 in above-mentioned first stationary platform 21; In the present embodiment, by the first plus lens fixture 23 and the second plus lens fixture 24, above-mentioned first plus lens 25 is fixed in above-mentioned first stationary platform 21.Above-mentioned first plus lens fixture 23 and the second lens holder 24 are based on silicon micromachining technology, and utilizing wet etching silicon wafer face to realize, 54.7 degree of " V " moldeed depth grooves make.
Above-mentioned Distributed Feedback Laser 26 in above-mentioned Distributed Feedback Laser silicon alignment stage 22, ensure that the high speed performance of optical assembly by metal pad 27 upside-down mounting.And by the cooperation between the height of described first plus lens fixture 23, second plus lens fixture 24, Distributed Feedback Laser silicon alignment stage 22 and described first stationary platform 21, the light that described Distributed Feedback Laser 26 and detector are sent beats the center at described first plus lens 25 just, achieves the packaging passive alignment of described Distributed Feedback Laser 26 and described first plus lens 25.
Passive coupling arrangement in the present embodiment is also provided with circuit board as circuit part, foregoing circuit plate is the circuit board (QFN encapsulation) of QFN encapsulation, the driving chip of above-mentioned Distributed Feedback Laser 26 and the trans-impedance amplifier of detector are all arranged on foregoing circuit plate, by above-mentioned metal pad 27, the port that above-mentioned Distributed Feedback Laser 26, detector are corresponding with the trans-impedance amplifier of detector to the driving chip of above-mentioned Distributed Feedback Laser 26 is respectively connected, be connected with other circuit part by above-mentioned pcb board 11 again, make luminescence component work.
In the present embodiment, the mode of all electrical couplings all adopts flip-chip bonding process, ensure that the transmission quality of radiofrequency signal.
As shown in Figure 3, above-mentioned second packaging passive alignment assembly comprises: to eka-silicon platform assembly 31, optical interface assemblies 33 and by above-mentioned to eka-silicon platform assembly 31 and the fixing fiber array 32 of optical interface assemblies 33, above-mentioned eka-silicon platform assembly 31 to be comprised: the second stationary platform 311, be arranged on the first optical fiber fixture 312 and the second optical fiber fixture 313 in above-mentioned second stationary platform 311, above-mentioned first optical fiber fixture 312 is equipped with relative V-type groove with on the second optical fiber fixture 313, above-mentioned first optical fiber fixture 312 and the second optical fiber fixture 313 fix above-mentioned fiber array 32 by above-mentioned V-type groove, above-mentioned second stationary platform 311 is also provided with the 3rd plus lens fixture 314 and the 4th plus lens fixture 315, by above-mentioned 3rd plus lens fixture 314 and the 4th plus lens fixture 315, second plus lens 316 is fixed in above-mentioned second stationary platform 311.
Described second plus lens 316 is coupled together by two guide pins with described fiber array 32, is realized the packaging passive alignment of described second plus lens 316 and fiber array 32 by the height of described 3rd plus lens fixture 314 and the 4th plus lens fixture 315 and described second stationary platform 311.
Interface module 33 is MT tail optical fiber or MPO tail optical fiber, and the centre wavelength of above-mentioned optical interface assemblies is 1310nm, when light by above-mentioned fiber array 32 is transferred to eka-silicon platform assembly 31 after, then have above-mentioned interface module 33 to export.
In the present embodiment, the end face of above-mentioned first plus lens 23 and the second plus lens 316 is 40 ° of inclined-planes, and above-mentioned 40 ° of inclined-planes are coated with reflectance coating.Above-mentioned plus lens is realized light in the mode on inclined-plane of polishing turn, can the space of saving components.Glancing incidence light after described first plus lens 23 reflects with the angle coupled light grating of vertical direction 10 degree, realize being coupled.
As shown in Figure 7, above-mentioned passive coupling assembly comprises: pcb board 11, be arranged on photoelectric chip on above-mentioned pcb board 11 to eka-silicon platform 12 and be arranged on above-mentioned photoelectric chip to the waveguide optical grating 5 on eka-silicon platform 12.
Concrete, as shown in Figure 4, the first groove 111 that above-mentioned pcb board 11 comprises pcb board body 110 and is arranged on above-mentioned pcb board body 110, above-mentioned first groove 111 reduces the vertical height of silicon platform; One side of above-mentioned first groove 111 is through, in above-mentioned first groove 111, fix above-mentioned photoelectric chip to eka-silicon platform 12.As shown in Figure 5, the center of above-mentioned photoelectric chip to the upper surface of eka-silicon platform 12 is provided with the second groove 121, and above-mentioned second groove 121 is for holding waveguide optical grating 5.After they are fixing as shown in Figure 7.The two ends of above-mentioned waveguide optical grating 5 are grating, and the centre of described waveguide optical grating is waveguide.
Described first packaging passive alignment assembly 2 and the second packaging passive alignment assembly 3 are structurally symmetrical mutually, the light that described Distributed Feedback Laser 26 sends is after described first plus lens 23 reflects, light is to be incident in one end grating of above-mentioned waveguide optical grating 5 with the direction of vertical plane 10 ° of angles, then light is transmitted in the grating of the other end in horizontal waveguide, light to be incident to described second plus lens 316 with the direction of vertical plane 10 ° of angles, finally to enter described fiber array 32 and propagates again.
The principle of the high speed optoelectronic chip grating passive coupling arrangement in the present embodiment:
With chip, coupling scheme and high-speed stable running, for aim, in the process of radiofrequency signal, adopt the mode of face-down bonding to realize ensureing the transmission quality of high-frequency signal to device in the present embodiment easily.According to the chip thickness of reality and the size of Distributed Feedback Laser, the silicon platform of Distributed Feedback Laser can be designed, be used for accurate positioning laser position, to realize packaging passive alignment in follow-up technique; The present embodiment is for high-speed chip, and therefore, DFB adopts the mode of upside-down mounting to be welded on silicon platform; After whole incident assembly (laser instrument, plus lens are aimed at and spelled pin) assembling, can directly face-down bonding on pcb board.
The silicon materials assembly that the present embodiment adopts high precision to process in the lump as fixing plus lens, laser instrument, the fixture of fiber array; Adopt the silicon natural crystal face V groove of wet etching, size Control is accurate, and owing to being same material, assembly precision is high.All platform fixtures all process with silicon materials, this guarantees the tolerance of assembling, for last passive general assembly provides possibility.
Grating coupling scheme General Requirements optical fiber near normal incides grating surface, and in order to prevent the reflection of end face from causing interference, optical fiber is with in vertical direction 10 degree of incidences.This kind of coupling scheme cause and take up room excessive, and for the current requirement to chip size, such mode is ungratified.Therefore, the present embodiment proposes to carry out polishing inclined-plane to reflect the incident light to plus lens, makes glancing incidence light vertically can enter grating and realizes coupling.As shown in Figure 7, incident light or emergent light 4, through plus lens 40 ° of reflectings surface 6, make glancing incidence light vertically can enter grating, the mode that this kind of light is turned, and can save a large amount of spaces, reduce the effective dimensions of device.
As shown in Figure 6, wherein, in figure 64 is incident or emergent ray, and 5 is waveguide optical grating for fiber array 32 and waveguide optical grating 5 coupled mode.
The utility model adopts the mode to plus lens polishing 40 degree of inclined-planes and plating reflectance coating in light path design, allows light in vertical direction with the incident grating in 10 degree of angles, can complete coupling; Adopt the mode of the welding of falling stake to be connected with pcb board by DFB on the other hand, this electrical coupling mode goes for the high-speed transfer of 25Gb/s.Moreover laser instrument and plus lens, the location by Si and O isotopes between fiber array and plus lens realizes packaging passive alignment, and this directly passive Coupling Design greatly reduces device assembling difficulty, improves the yield of work task efficiency and product.
The utility model is by appropriate design light path and the accurate silicon structure platform of design, and can realize grating coupled packaging passive alignment, this passive passive coupling scheme, greatly simplify the complexity of assembling, greatly reduce device cost.Further, technique of alignment of the present utility model, can be extended in the scheme of higher rate equally, and transplanting performance is good, effectively can solve a high-speed communication difficult problem for narrow space.
The fixation kit of coupling device of the present utility model adopts silicon materials to make, and ensure that assembly precision is high under identical mismachining tolerance; Light path design adopts the mode on plus lens polishing inclined-plane achieve the turning of light, saved the space of device; And all electrical coupling modes of above-mentioned coupling device all adopt the mode of face-down bonding, ensure the transmission quality of radiofrequency signal.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (8)
1. a high speed optoelectronic chip grating passive coupling arrangement, it comprises the first packaging passive alignment assembly, second packaging passive alignment assembly and described first packaging passive alignment assembly and the second packaging passive alignment assembly are realized the passive coupling assembly of passive coupling, described first packaging passive alignment assembly and the second packaging passive alignment assembly realize aiming at respectively as incident assembly and the grafting of outgoing assembly on described passive coupling assembly, it is characterized in that, described first packaging passive alignment assembly comprises: the first stationary platform, be fixed on the Distributed Feedback Laser silicon alignment stage in described first stationary platform, the Distributed Feedback Laser bottom described Distributed Feedback Laser silicon alignment stage is encapsulated in by flip chip bonding mode, and the first plus lens be fixed in described first stationary platform, described second packaging passive alignment assembly comprises: to eka-silicon platform assembly, optical interface assemblies and by the described fiber array fixing to eka-silicon platform assembly and optical interface assemblies, is describedly provided with the second plus lens to eka-silicon platform assembly, described passive coupling assembly comprises: pcb board, be arranged on photoelectric chip on described pcb board to eka-silicon platform and be arranged on described photoelectric chip to the waveguide optical grating on eka-silicon platform, the end face of described first plus lens and the second plus lens is 40 ° of inclined-planes, and described 40 ° of inclined-planes are coated with reflectance coating, glancing incidence light after described first plus lens reflection with the angle coupled light grating of vertical direction 10 degree, realize being coupled.
2. high speed optoelectronic chip grating passive coupling arrangement according to claim 1, it is characterized in that, described first packaging passive alignment assembly also comprises: the first plus lens fixture and the second plus lens fixture, described first plus lens is fixed in described first stationary platform by described first plus lens fixture and the second plus lens fixture, and described first plus lens fixture and the second plus lens fixture are provided with 54.7 ° of V-type deep trouths.
3. high speed optoelectronic chip grating passive coupling arrangement according to claim 2, it is characterized in that, described Distributed Feedback Laser passes through metal pad upside-down mounting in described Distributed Feedback Laser silicon alignment stage, and by the cooperation between the height of described first plus lens fixture, the second plus lens fixture, Distributed Feedback Laser silicon alignment stage and described first stationary platform, the light that described Distributed Feedback Laser and detector are sent beats the center at described first plus lens just, achieves the packaging passive alignment of described Distributed Feedback Laser and described first plus lens; Also comprise the circuit board of a QFN encapsulation, the driving chip of described Distributed Feedback Laser and the trans-impedance amplifier of detector are all arranged on described circuit board, by described metal pad, the port that described Distributed Feedback Laser, detector are corresponding with the trans-impedance amplifier of detector to the driving chip of described Distributed Feedback Laser is respectively connected, be connected with other circuit part by described pcb board again, make luminescence component work.
4. high speed optoelectronic chip grating passive coupling arrangement according to claim 1, it is characterized in that, described eka-silicon platform assembly also to be comprised: the second stationary platform, be arranged on the first optical fiber fixture in described second stationary platform and the second optical fiber fixture, described first optical fiber fixture is equipped with relative V-type groove with on the second optical fiber fixture, and described first optical fiber fixture and the second optical fiber fixture fix described fiber array by described V-type groove; Described second stationary platform is also provided with the 3rd plus lens fixture and the 4th plus lens fixture, by described 3rd plus lens fixture and the 4th plus lens fixture, described second plus lens is fixed in described second stationary platform; Described second plus lens and described fiber array are coupled together by two guide pins, are realized the packaging passive alignment of described second plus lens and fiber array by the height of described 3rd plus lens fixture and the 4th plus lens fixture and described second stationary platform.
5. high speed optoelectronic chip grating passive coupling arrangement according to claim 1, it is characterized in that, described pcb board comprises pcb board body and is arranged on the first groove on described pcb board body, one side of described first groove is through, and described pcb board is provided with the vertical height that described first groove reduces silicon platform.
6. high speed optoelectronic chip grating passive coupling arrangement according to claim 1, it is characterized in that, the center of described photoelectric chip to the upper surface of eka-silicon platform is provided with the second groove, described second groove is for holding described waveguide optical grating, the two ends of described waveguide optical grating are grating, and the centre of described waveguide optical grating is waveguide.
7. high speed optoelectronic chip grating passive coupling arrangement according to claim 6, it is characterized in that, described first packaging passive alignment assembly and the second packaging passive alignment assembly are structurally symmetrical mutually, the light that described Distributed Feedback Laser sends is after described first plus lens reflection, light is to be incident in the grating of one end with the direction of vertical plane 10 ° of angles, then light is transmitted in the grating of the other end in horizontal waveguide, light, again to be incident to described second plus lens with the direction of vertical plane 10 ° of angles, finally to enter described fiber array and propagates.
8. high speed optoelectronic chip grating passive coupling arrangement according to claim 1, is characterized in that, described optical interface assemblies is MT tail optical fiber or MPO tail optical fiber, and the centre wavelength of described optical interface assemblies is 1310nm.
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| CN201521030788.7U CN205193318U (en) | 2015-12-11 | 2015-12-11 | High -speed light electric chip grating passive coupling device |
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| CN201521030788.7U CN205193318U (en) | 2015-12-11 | 2015-12-11 | High -speed light electric chip grating passive coupling device |
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| CN205193318U true CN205193318U (en) | 2016-04-27 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107065085A (en) * | 2017-05-25 | 2017-08-18 | 中国科学院半导体研究所 | Photoelectric conversion device |
| CN109100833A (en) * | 2018-06-06 | 2018-12-28 | 苏州席正通信科技有限公司 | Opto-electronic integrated circuit board connector of parallel coupling and preparation method thereof |
| CN109212672A (en) * | 2017-07-05 | 2019-01-15 | 禾橙科技股份有限公司 | The fixed bracket of optical fiber and the optical fiber mode group comprising it |
| CN109407231A (en) * | 2018-12-07 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN109521519A (en) * | 2018-11-29 | 2019-03-26 | 武汉电信器件有限公司 | A kind of packaging system and optical system of array waveguide grating |
| CN112346181A (en) * | 2020-11-09 | 2021-02-09 | 长飞光纤光缆股份有限公司 | Optical module |
| CN116859521A (en) * | 2023-08-30 | 2023-10-10 | 之江实验室 | Grating coupler and preparation method thereof |
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2015
- 2015-12-11 CN CN201521030788.7U patent/CN205193318U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107065085A (en) * | 2017-05-25 | 2017-08-18 | 中国科学院半导体研究所 | Photoelectric conversion device |
| CN109212672A (en) * | 2017-07-05 | 2019-01-15 | 禾橙科技股份有限公司 | The fixed bracket of optical fiber and the optical fiber mode group comprising it |
| CN109100833A (en) * | 2018-06-06 | 2018-12-28 | 苏州席正通信科技有限公司 | Opto-electronic integrated circuit board connector of parallel coupling and preparation method thereof |
| CN109521519A (en) * | 2018-11-29 | 2019-03-26 | 武汉电信器件有限公司 | A kind of packaging system and optical system of array waveguide grating |
| CN109521519B (en) * | 2018-11-29 | 2020-07-14 | 武汉电信器件有限公司 | Packaging device and optical system of array waveguide grating |
| CN109407231A (en) * | 2018-12-07 | 2019-03-01 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN112346181A (en) * | 2020-11-09 | 2021-02-09 | 长飞光纤光缆股份有限公司 | Optical module |
| CN116859521A (en) * | 2023-08-30 | 2023-10-10 | 之江实验室 | Grating coupler and preparation method thereof |
| CN116859521B (en) * | 2023-08-30 | 2024-01-09 | 之江实验室 | Grating coupler and preparation method thereof |
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