CN210835351U - Optical module - Google Patents
Optical module Download PDFInfo
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- CN210835351U CN210835351U CN201922002268.XU CN201922002268U CN210835351U CN 210835351 U CN210835351 U CN 210835351U CN 201922002268 U CN201922002268 U CN 201922002268U CN 210835351 U CN210835351 U CN 210835351U
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Abstract
The application discloses an optical module, which comprises a shell, a wavelength division demultiplexer, a first lens group, an optical fiber array assembly and a light receiving chip group, wherein the wavelength division demultiplexer, the first lens group, the optical fiber array assembly and the light receiving chip group are arranged in the shell; the distance between adjacent light receiving chips on the light receiving chip set is smaller than the distance between two adjacent paths of beam splitting light decomposed and output by the wavelength division demultiplexer; the spacing between adjacent optical fibers at a first end of the optical fiber array assembly adjacent to the first lens group is larger than the spacing between adjacent optical fibers at a second end of the optical fiber array assembly adjacent to the light receiving chip group. The optical module is provided with a wavelength division demultiplexer, a small-size optical receiving chip set and a thin film optical filter type wavelength division demultiplexer, wherein the wavelength division demultiplexer is arranged on the optical module and is used for receiving optical signals transmitted by the optical fiber array assembly, and the optical fiber array assembly is arranged on the optical module.
Description
Technical Field
The application relates to the technical field of optical communication, in particular to an optical module.
Background
In order to improve the integration of a high-speed optical module, it is necessary to use a smaller-sized component. However, in the light module package, the development of the conventional optical element is significantly lagged behind the optoelectronic device, but the usage ratio of the conventional optical element in the mainstream module package is still at a relatively high level. For example, the pitch of the light receiving chips of a conventional light receiving chip assembly can reach 250 micrometers, while the conventional wavelength division demultiplexing assembly in the current industry has the channel pitch of 750 micrometers and 500 micrometers, and the 250 micrometer pitch thin film filter wavelength division demultiplexing assembly is limited by process capability and practicability. There is often a problem of a mismatch in the pitch between the conventional thin film filter wavelength division demultiplexing assembly and the light-receiving chip assembly.
Although the wavelength division multiplexing module with a channel spacing of 250 micrometers in the AWG (Arrayed Waveguide Grating) scheme is already in commercial use, the performance of the wavelength division multiplexing module still needs to be improved, and the wavelength division multiplexing module of the thin film optical filter is better in performance and lower in cost in an optical module with higher requirements.
Disclosure of Invention
The application aims to provide an optical module which has high integration level, good insertion loss, high bandwidth and high temperature stability.
In order to achieve one of the above objects, the present application provides an optical module, including a housing, a wavelength division demultiplexer and a light receiving chip set, which are disposed in the housing;
a first lens group and an optical fiber array component are sequentially arranged between the wavelength division demultiplexer and the optical receiving chip set; incident light is decomposed into at least two paths of split light by the wavelength division demultiplexer and is output, and each split light is coupled into each optical fiber of the optical fiber array assembly through each lens of the first lens group and is incident on each light receiving chip of the light receiving chip group after being transmitted and output through each optical fiber;
the wavelength division demultiplexer comprises a thin film optical filter component, and the distance between adjacent light receiving chips on the light receiving chip set is smaller than the distance between two adjacent paths of beam splitting light decomposed and output by the wavelength division demultiplexer;
the optical fiber array assembly comprises a first end adjacent to the first lens group and a second end adjacent to the light receiving chip group; the spacing between adjacent optical fibers at the first end of the fiber array assembly is greater than the spacing between adjacent optical fibers at the second end.
As a further improvement of the embodiment, the optical fiber array assembly includes a first positioning member, an optical fiber array, and a second positioning member; the first positioning piece is used for fixing the position of each optical fiber at the input end of the optical fiber array; the second positioning piece is used for fixing the position of each optical fiber at the output end of the optical fiber array.
As a further improvement of the embodiment, the first positioning member comprises a first groove member and a first cover plate; the first groove piece comprises a plurality of first positioning grooves which are respectively used for placing each optical fiber at the input end of the optical fiber array; the first cover plate covers the first positioning grooves, and the optical fibers at the input end are respectively fixed in the first positioning grooves.
As a further improvement of the embodiment, the distance between adjacent first positioning grooves is equal to the distance between adjacent split beams of light split and output by the wavelength division demultiplexer.
As a further improvement of the implementation, the optical module further includes a second lens group, the second lens group is disposed between the second positioning element and the light receiving chip group, and each split beam output by the optical fiber array assembly is coupled to each light receiving chip of the light receiving chip group through each lens of the second lens group.
As a further improvement of the embodiment, the optical module further includes an optical carrier and a circuit board, the wavelength division demultiplexer and the first lens group are disposed on the optical carrier, and the light receiving chip group is disposed on the circuit board; the first positioning piece of the optical fiber array assembly is arranged on the optical carrier plate close to the first lens group, and the second positioning piece is arranged on the circuit board close to the light receiving chip group.
As a further improvement of the embodiment, the second positioning member includes a second slot member and a second cover plate; the second groove piece comprises a plurality of second positioning grooves which are respectively used for placing each optical fiber at the output end of the optical fiber array; the second cover plate covers the second positioning grooves, and the optical fibers at the output end are respectively fixed in the second positioning grooves.
As a further improvement of the embodiment, the first positioning groove and the second positioning groove are V-shaped grooves and/or semicircular grooves.
As a further improvement of the embodiment, the pitch between the adjacent second positioning grooves is equal to the pitch between the adjacent light receiving chips of the light receiving chip group.
As a further refinement of the embodiment, the second lens group is an integrated multi-path parallel lens array;
the second positioning piece is a multi-optical fiber connector which is mechanically aligned;
the second positioning part is mechanically aligned with the second lens group, so that each optical fiber of the optical fiber array is aligned with each lens of the second lens group respectively.
The beneficial effect of this application: the optical module has better insertion loss performance, higher bandwidth and temperature stability by adopting the variable-spacing optical fiber array assembly to transmit optical signals between the Thin-film optical filter type wavelength division demultiplexer and the small-size light receiving chipset, so that the small-size light receiving chipset can be adopted in the optical module to improve the integration level of the optical module, and the optical module can be matched with the Thin-film optical filter (TFF) type wavelength division demultiplexer.
Drawings
FIG. 1 is a schematic diagram of a light module;
FIG. 2 is a schematic diagram of an optical receiving module in an optical module according to the present application;
fig. 3 is a schematic view of a light receiving optical system in an optical module according to embodiment 1 of the present application;
fig. 4 is an exploded schematic view of an optical fiber array assembly in an optical module according to embodiment 1 of the present application;
fig. 5 is a schematic view of a light-receiving optical system in an optical module according to embodiment 2 of the present application;
fig. 6 is a schematic view of a light receiving optical system in an optical module according to embodiment 3 of the present application.
Detailed Description
The present application will now be described in detail with reference to specific embodiments thereof as illustrated in the accompanying drawings. These embodiments are not intended to limit the present application, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present application.
In the various illustrations of the present application, certain dimensions of structures or portions may be exaggerated relative to other structures or portions for ease of illustration and, thus, are provided to illustrate only the basic structure of the subject matter of the present application.
Also, terms used herein such as "upper," "above," "lower," "below," and the like, denote relative spatial positions of one element or feature with respect to another element or feature as illustrated in the figures for ease of description. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. When an element or layer is referred to as being "on," or "connected" to another element or layer, it can be directly on, connected to, or intervening elements or layers may be present.
As shown in fig. 1, the optical module generally includes a housing 10, an optical module 20 and a circuit board 30 disposed in the housing 10, and an electrical module. The present application provides a solution for a light receiving module at the receiving end of an optical module 20 in an optical module.
Example 1
As shown in fig. 2 to 4, the optical module of this embodiment includes a wavelength division demultiplexer 40, a first lens group 50, an optical fiber array assembly 60, and a light receiving chipset 70 disposed in the housing, where the light receiving chipset 70 is disposed on the circuit board 30 and electrically connected to corresponding lines of the circuit board 30. Incident light received by the optical module is decomposed into at least two split beams by the wavelength division demultiplexer 40 and output, and each split beam is coupled into each optical fiber of the optical fiber array assembly 60 by each lens of the first lens group 50, and is transmitted and output by each optical fiber and then is incident on each light receiving chip of the light receiving chipset 70. The wavelength division demultiplexer 40 includes a thin film optical filter assembly 41, and the distance between adjacent light receiving chips on the light receiving chip set 70 is smaller than the distance between two adjacent split beams decomposed and output by the wavelength division demultiplexer 40. The fiber array assembly 60 includes a first end adjacent to the first lens group 50 and a second end adjacent to the light receiving chip group 70, and a spacing between adjacent optical fibers at the first end of the fiber array assembly 60 is greater than a spacing between adjacent optical fibers at the second end. That is, the optical fiber array assembly 60 with variable pitch is used between the wavelength division demultiplexer 40 and the light receiving chipset 70 with larger channel pitch difference to transmit optical signals, and the optical fiber array assembly 60 with variable pitch is used to reduce the pitch of the multi-beam splitting light with larger pitch output by the wavelength division demultiplexer 40, so that the pitch between the split light is matched with the pitch between the light receiving chips of the light receiving chipset 70 with small size. Therefore, the optical module can adopt a small-sized light receiving chip set to improve the integration level of the optical module, and can be matched with a Thin-film filter (TFF) type wavelength division demultiplexer to enable the optical module to have better insertion loss performance, higher bandwidth and temperature stability.
In this embodiment, the fiber array assembly 60 includes a first positioning member 61, a fiber array 62, and a second positioning member 63, wherein the first positioning member 61 is used for fixing the position of each fiber at the input end 621 of the fiber array 62, and the second positioning member 63 is used for fixing the position of each fiber at the output end 622 of the fiber array 62. The first positioning member 61 includes a first trough member 611 and a first cover 613, and the first trough member 611 includes a plurality of first positioning grooves 612 for receiving the optical fibers at the input end 621 of the optical fiber array 62. The first cover 613 covers the first positioning grooves 612 to fix the optical fibers at the input end 621 of the optical fiber array 62 in the first positioning grooves 612. The second positioning member 63 includes a second trough 631 and a second cover 633, and the second trough 631 includes a plurality of second positioning slots 632 for respectively receiving the optical fibers at the output ends 622 of the optical fiber array 62. The second cover 633 is covered on the second positioning groove 632 to fix the optical fibers at the output end 622 of the optical fiber array 62 in the second positioning groove 632 respectively. In this embodiment, the first positioning groove 612 and the second positioning groove 632 are both V-shaped grooves, and in other embodiments, the first positioning groove and the second positioning groove may also be grooves with other shapes, such as semi-circular grooves or rectangular grooves. The distance d1 between adjacent first positioning slots 612 is equal to the distance between adjacent split lights decomposed and output by the wavelength demultiplexer 40, so that the fiber input ends 621 fixed in the first positioning slots 612 are aligned with the split lights output by the wavelength demultiplexer 40. The distance d2 between the adjacent second positioning grooves 632 is equal to the distance between the adjacent light-receiving chips of the light-receiving chip set 70, so that the optical fiber output ends 622 fixed in the second positioning grooves 632 are aligned with the light-receiving chips of the light-receiving chip set 70, respectively. In this embodiment, the distance between the channels of the output decomposed by the wavelength division demultiplexer 40 is 750 micrometers, and the distance between the light receiving chips of the light receiving chip set 70 is 250 micrometers, where "distance" refers to the center-to-center distance between two adjacent channels. The spacing between adjacent first positioning grooves 612 of the first positioning member 61 is 750 micrometers, and the spacing between adjacent second positioning grooves 632 of the second positioning member 63 is 250 micrometers. Of course, in other embodiments, other different spacings may be employed.
Taking a 4-channel light beam as an example, the incident light received by the optical module is decomposed by the wavelength division demultiplexer 40 to output 4 split beams, the distance between adjacent split beams is 750 μm, and the 4 split beams are respectively focused and coupled into 4 optical fibers at the input end 621 of the optical fiber array 62 fixed in the 4 first positioning grooves 612 of the first positioning member 61 through the 4 lenses of the first lens group 50. The 4 paths of split light output by the output end 622 of the optical fiber array 62 are respectively aligned to be incident on each light receiving chip of the light receiving chip group 70, and are converted into electric signals by each light receiving chip to be output.
As shown in fig. 2, in this embodiment, an optical carrier 90 and a circuit board 30 are disposed in the optical module, the wavelength division demultiplexer 40 and the first lens group 50 are disposed on the optical carrier 90, and the light receiving chipset 70 is disposed on the circuit board 30. The first positioning member 61 of the optical fiber array component 60 is disposed on the optical carrier 90 near the first lens set 50, the second positioning member 63 is disposed on the circuit board 30 near the light receiving chip set 70, and the middle is connected by optical fibers, so as to play a tolerance role, reduce the requirement on the assembly precision, and facilitate the assembly. During assembly, the wavelength division demultiplexer 40 and the first lens group 50 may be assembled on the optical carrier 90, the light receiving chip set 70 is mounted or welded on the circuit board 30, the optical carrier 90 and the circuit board 30 are mounted in the housing, and the first lens group 50 and the light receiving chip set 70 are coupled by the optical fiber array assembly 60, so that the assembly is convenient. As shown in fig. 3 and 4, in this embodiment, each fiber end face of the output end 622 of the fiber array 62 is provided with an inclined total reflection surface to reflect each light beam at the output end 622 downward for direct incidence on each light receiving chip.
Example 2
As shown in fig. 2 and 5, unlike embodiment 1, in this embodiment, the optical module further includes a second lens group 80, and the second lens group 80 is disposed between the second positioning member 63 and the light receiving chip group 70. The split light output from the optical fiber array 62 is coupled to the light receiving chips of the light receiving chip set 70 through the lenses of the second lens group 80.
As in embodiment 1, in this embodiment, each fiber end face of the output end 622 of the fiber array 62 is also provided with an inclined total reflection surface to reflect and output each light beam at the output end 622 downward. The second lens group 80 is disposed under the second positioning member 63, so that each lens of the second lens group 80 is respectively located on the optical path of each output light beam to couple each output light beam onto each light receiving chip respectively. In this embodiment, the second lens assembly 80 can be fixed on the second positioning member 63 by glue, and the like, so that the structure is simple and the assembly is convenient.
Example 3
As shown in fig. 2 and 6, unlike embodiment 2, in this embodiment, the second lens group 80 employs an integrated multi-path parallel lens array, and the second positioning member 63 employs a mechanically aligned multi-fiber connector. The second positioning member 63 is mechanically aligned with the second lens assembly 80 such that the optical fibers of the fiber array 62 are aligned with the lenses of the second lens assembly 80, respectively. In this embodiment, the second lens assembly 80 further includes a fixing frame 81, each lens is disposed on the fixing frame 81, and a positioning pin 82 is disposed at an end of the fixing frame 81 opposite to the second positioning element 63. The second positioning member 63 has a positioning hole 634 at an end opposite to the second lens group 80, and the positioning pin 82 of the fixing frame 81 is matched with the positioning hole 634. During assembly, the positioning pin 82 of the fixing frame 81 is directly inserted into the positioning hole 634 of the second positioning member 63, so that the optical fibers at the output end of the optical fiber array 62 in the second positioning member 634 are aligned with the lenses of the second lens set 80, the assembly is facilitated, and the production efficiency can be effectively improved.
The above list of details is only for the concrete description of the feasible embodiments of the present application, they are not intended to limit the scope of the present application, and all equivalent embodiments or modifications that do not depart from the technical spirit of the present application are intended to be included within the scope of the present application.
Claims (11)
1. An optical module comprises a shell, a wavelength division demultiplexer and a light receiving chip set, wherein the wavelength division demultiplexer and the light receiving chip set are arranged in the shell; the method is characterized in that:
a first lens group and an optical fiber array component are sequentially arranged between the wavelength division demultiplexer and the optical receiving chip set; incident light is decomposed into at least two paths of split light by the wavelength division demultiplexer and is output, and each split light is coupled into each optical fiber of the optical fiber array assembly through each lens of the first lens group and is incident on each light receiving chip of the light receiving chip group after being transmitted and output through each optical fiber;
the wavelength division demultiplexer comprises a thin film optical filter component, and the distance between adjacent light receiving chips on the light receiving chip set is smaller than the distance between two adjacent paths of beam splitting light decomposed and output by the wavelength division demultiplexer; the optical fiber array assembly comprises a first end adjacent to the first lens group and a second end adjacent to the light receiving chip group; the spacing between adjacent optical fibers at the first end of the fiber array assembly is greater than the spacing between adjacent optical fibers at the second end.
2. The optical module of claim 1, wherein:
the optical fiber array component comprises a first positioning piece, an optical fiber array and a second positioning piece; the first positioning piece is used for fixing the position of each optical fiber at the input end of the optical fiber array; the second positioning piece is used for fixing the position of each optical fiber at the output end of the optical fiber array.
3. The light module of claim 2, wherein:
the first positioning piece comprises a first groove piece and a first cover plate; the first groove piece comprises a plurality of first positioning grooves which are respectively used for placing each optical fiber at the input end of the optical fiber array; the first cover plate covers the first positioning grooves, and the optical fibers at the input end are respectively fixed in the first positioning grooves.
4. The light module of claim 3, wherein: the distance between the adjacent first positioning grooves is equal to the distance between the adjacent split beams decomposed and output by the wavelength division demultiplexer.
5. The light module of claim 2, wherein: the optical module further comprises a second lens group, the second lens group is arranged between the second positioning piece and the light receiving chip group, and the split light output by the optical fiber array component is coupled to each light receiving chip of the light receiving chip group through each lens of the second lens group.
6. The light module of claim 2, wherein:
the optical module also comprises an optical carrier plate and a circuit board, the wavelength division demultiplexer and the first lens group are arranged on the optical carrier plate, and the light receiving chip group is arranged on the circuit board;
the first positioning piece of the optical fiber array assembly is arranged on the optical carrier plate close to the first lens group, and the second positioning piece is arranged on the circuit board close to the light receiving chip group.
7. The light module according to any one of claims 2-6, characterized in that:
the second positioning piece comprises a second groove piece and a second cover plate; the second groove piece comprises a plurality of second positioning grooves which are respectively used for placing each optical fiber at the output end of the optical fiber array; the second cover plate covers the second positioning grooves, and the optical fibers at the output end are respectively fixed in the second positioning grooves.
8. The light module of claim 7, wherein: the second positioning groove is a V-shaped groove and/or a semicircular groove.
9. The light module of claim 7, wherein: the distance between the adjacent second positioning grooves is equal to the distance between the adjacent light receiving chips of the light receiving chip group.
10. The light module of claim 5, wherein:
the second lens group is an integrated multi-path parallel lens array;
the second positioning piece is a multi-optical fiber connector which is mechanically aligned;
the second positioning part is mechanically aligned with the second lens group, so that each optical fiber of the optical fiber array is aligned with each lens of the second lens group respectively.
11. The light module according to claim 3 or 4, characterized in that: the first positioning groove is a V-shaped groove and/or a semicircular groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922002268.XU CN210835351U (en) | 2019-11-19 | 2019-11-19 | Optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922002268.XU CN210835351U (en) | 2019-11-19 | 2019-11-19 | Optical module |
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| CN210835351U true CN210835351U (en) | 2020-06-23 |
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| CN201922002268.XU Active CN210835351U (en) | 2019-11-19 | 2019-11-19 | Optical module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022183800A1 (en) * | 2021-03-04 | 2022-09-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN115032750A (en) * | 2021-03-04 | 2022-09-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2023241308A1 (en) * | 2022-06-13 | 2023-12-21 | 华为技术有限公司 | Optical transmission module, optical module, circuit board assembly and optical network device |
-
2019
- 2019-11-19 CN CN201922002268.XU patent/CN210835351U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022183800A1 (en) * | 2021-03-04 | 2022-09-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN115032750A (en) * | 2021-03-04 | 2022-09-09 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| WO2023241308A1 (en) * | 2022-06-13 | 2023-12-21 | 华为技术有限公司 | Optical transmission module, optical module, circuit board assembly and optical network device |
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Effective date of registration: 20220217 Address after: 03-60b, German Center, 25 Singapore International Business Park Patentee after: Xuchuang Technology Co.,Ltd. Address before: 215000 No.8 Xiasheng Road, Suzhou Industrial Park, Jiangsu Province Patentee before: InnoLight Technology (Suzhou) Ltd. |
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