CN204903820U - Substrate, big unit laser array and array modules , light detector array and array modules , optic fibre transmission and receiving module - Google Patents
Substrate, big unit laser array and array modules , light detector array and array modules , optic fibre transmission and receiving module Download PDFInfo
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- CN204903820U CN204903820U CN201520316921.9U CN201520316921U CN204903820U CN 204903820 U CN204903820 U CN 204903820U CN 201520316921 U CN201520316921 U CN 201520316921U CN 204903820 U CN204903820 U CN 204903820U
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Abstract
The utility model relates to a technical field is received in the optic fibre transmission, specifically be an optical clear substrate, big unit laser array and array modules, big unit light detector array and array modules, optic fibre emission module and receiving module, its optical fiber communication that can realize the megamega bit, optical clear substrate and because the big unit laser array of optical clear substrate, after the laser array module, can realize utilizing the integration of a plurality of little array laser instrument to come synthetic big unit to count laser array, thereby solve the problem of laser array yield, thereby rethread wavelength devision multiplex's method reduces the figure of required optic fibre uses standard optic fibre connector to become the possibility, again with its and the integrated optic fibre emission module who obtains the megamega bit of VLSI driver chip, the big unit light detector array of same use optical clear substrate, light detector array modules and receive the optic fibre emission module of the integrated megamega bit of chip with VLSI.
Description
Technical field
The present invention relates to fibre optical transmission reception technique field, be specially a kind of optical transparent substrate, big unit laser array and array module, big unit photodetector array and array module, optic fiber emission modules and receiver module.
Background technology
Large wideband data communication plays a part more and more important to contemporary electronic systems performance at a high speed.Along with the develop rapidly of Internet technology, cloud computing, network, computer system towards more on a large scale, higher property development, more to calculate, store, exchange and Database Systems etc. needs to become organic high performance information search, process and an exchange system by large wideband data communication tight interconnects at a high speed.The fibre optical transmission receiver in large broadband is the gordian technique realizing modern communication, interconnected/mass data transfers communication such as internet of things and data center.Ten thousand megabit fiber optic emitters of all size have been widely used in the various systems such as high performance computing system, wireless network and data center.100000 megabits and 400,000 megabit fibre optical transmission receivers have had multiple technologies implementation, and be standardized gradually, along with technology constantly progress, the transmission of larger data needs the fibre optical transmission receiver of tril bit, and this is the gordian technique of the interconnected transmission of Future Data.
Use directly modulation distributed Feedback (DFB) laser instrument of integral lens to realize the optical transmitting set of 25Gbps in prior art.Traditional DFB is edge emitter laser, penetrate mould size and single-mode fiber basic mode size there is larger difference because its laser wave is derived, the external lens of general needs realize being coupled with the low-loss of optical fiber, this integrated Method compare complexity making fiber optic emitter with multiple discrete device, cost of manufacture is also higher, particularly the module in large broadband needs integrated multiple smooth transmission channel, the difficulty of integration packaging is just very high, directly modulation distributed Feedback (DFB) laser instrument (LISEL) of integral lens solves this problem well, can greatly simplify integrated technique, as shown in Figure 1, laser waveguide reflecting surface can be realized by method that is wet or dry etching on DFB surface, the emergent light of DFB laser can lead vertical substrate outgoing by 45 degree of waveguide reflective faces, by the method for etching, plus lens is directly integrated in the back side of DFB substrate again, select suitable substrate thickness and the focal length of lens that matches with it just can realize the low-loss direct-coupling with optical fiber, the fiber array adopting 1 × 425GLISEL array and match, the optic fiber emission modules of 100,000 megabits can be realized with very low cost.And to realize more large bandwidth as the fiber optic emitter of tril bit, if adopt the modulation rate of same 25G, the fibre optical transmission of ten thousand megabits just needs at least 40 passages, not only cost is very high, and with current technology, the yield rate of the laser array of 40 unit can be very low, and the hyperchannel single-mode fiber connector of standard at most only supports 2 × 12, i.e. 24 passages, cannot realize the fibre optical transmission receiver of hundred megabits.
Summary of the invention
In order to solve the problem, the invention provides a kind of optical transparent substrate, big unit laser array and array module, big unit photodetector array and array module, optic fiber emission modules and receiver module, it can realize the optical-fibre communications of tril bit.
Its technical scheme is such: a kind of optical transparent substrate, it is characterized in that, described optical transparent substrate upper and lower surface is respectively arranged with N number of wave-division multiplexer filter, N be greater than 1 integer, the described wave-division multiplexer filter in described optical transparent substrate upper and lower surface is staggeredly arranged.
A kind of big unit laser array, it is characterized in that, it comprises optical transparent substrate described above, described optical transparent substrate lower surface is provided with the dfb laser array of (N+1) individual integral lens, remove the dfb laser array of a described integral lens of one end, the dfb laser array of remaining N number of described integral lens and N number of described wave-division multiplexer filter one_to_one corresponding respectively, the wavelength of the dfb laser array of each described integral lens is different.
It is further characterized in that, the emergent light of the dfb laser array of described integral lens in described optical transparent substrate with the angle θ of substrate bottom surface vertical line
1, adjacent integral lens dfb laser array spacing p
1, optical transparent substrate thickness D
1meet relation: p
1=2D
1* tan θ
1.
A kind of laser array module, it is characterized in that, it is by fiber array, microlens array, reflecting prism and a kind of big unit laser array described above is integrated forms, and the emergent light of the dfb laser array of described integral lens sequentially passes through described reflecting prism, microlens array, fiber array; Or it is by fiber array, planar lens array with a kind of big unit laser array described above is integrated forms, the emergent light of the dfb laser array of described integral lens sequentially passes through described planar lens array, fiber array.
A kind of optic fiber emission modules, it is characterized in that, it is formed by VLSI driving chip and a kind of laser array module integration described above.
A kind of big unit photodetector array, it is characterized in that, it comprises optical transparent substrate described above, described optical transparent substrate lower surface is provided with the vertical PD array in (N+1) individual PIN surface, the vertical PD array in described PIN surface, the vertical PD array in remaining N number of described PIN surface and N number of described wave-division multiplexer filter one_to_one corresponding respectively of removing one end.
It is further characterized in that, the vertical PD array received in described PIN surface to incident light in described optical transparent substrate with the angle θ of substrate bottom surface vertical line
2, the adjacent vertical PD array pitch p in PIN surface
2, optical transparent substrate thickness D
2meet relation: p
2=2D
2* tan θ
2.
A kind of photodetector array module, it is characterized in that, it is by fiber array, microlens array, reflecting prism and a kind of big unit photodetector array described above is integrated forms, and the incident light received sequentially passes through described fiber array, microlens array, reflecting prism enter described optical transparent substrate; Or it is by fiber array, planar lens array with a kind of big unit laser array described above is integrated forms, the incident light received sequentially passes through described fiber array, planar lens array enters described optical transparent substrate.
A kind of optic fiber transceiver module, it is characterized in that, it is formed by VLSI receiving chip and above-mentioned a kind of photodetector array module integration.
Adopt optical transparent substrate of the present invention and the big unit laser array based on optical transparent substrate, after laser array module, can realize using that multiple little array laser is integrated synthesizes a big unit number laser array, thus solve the problem of laser array yield rate, the number of required optical fiber is reduced again thus use standard fiber connector becomes possibility by the method for wavelength-division multiplex, again itself and VLSI driving chip are integrated the optic fiber emission modules of tril bit, the big unit photodetector array of same use optical transparent substrate, photodetector array module and the optic fiber emission modules with the integrated tril bit of VLSI receiving chip, achieve the optical-fibre communications of tril bit.
Accompanying drawing explanation
Fig. 1 is the dfb laser array schematic diagram of integral lens in prior art;
Fig. 2 is big unit laser array schematic diagram in the present invention;
Fig. 3 is a kind of laser array module schematic front view in the present invention;
Fig. 4 is Fig. 3 elevational schematic view;
Fig. 5 is another kind of laser array module schematic front view in the present invention;
Fig. 6 is optic fiber emission modules schematic diagram in the present invention;
Fig. 7 is big unit photodetector array schematic diagram in the present invention;
Fig. 8 is a kind of photodetector array module diagram in the present invention;
Fig. 9 is another kind of photodetector array module diagram in the present invention;
Figure 10 is optic fiber transceiver module schematic diagram in invention.
Embodiment
See Fig. 2, Fig. 3, shown in Fig. 4, a kind of optical transparent substrate, here optical base-substrate can be glass substrate, optical transparent substrate 1 upper and lower surface is respectively arranged with three wave-division multiplexer filters, the wave-division multiplexer filter in optical transparent substrate upper and lower surface is equidistantly staggeredly arranged, and is designated as the first upper filter 2-1, the second upper filter 2-2, the 3rd upper filter 2-3, first time wave filter 2-4, second time wave filter 2-5, the 3rd time wave filter 2-6 from right to left respectively, a kind of big unit laser array, it comprises above-mentioned optical transparent substrate 1, optical transparent substrate 1 lower surface is provided with the dfb laser array 3 of four integral lens, the dfb laser array 3 of an integral lens of removing low order end, the dfb laser array 3 of remaining three integral lens and three wave-division multiplexer filters, i.e. first time wave filter 2-4, second time wave filter 2-5, 3rd time wave filter 2-6 one_to_one corresponding respectively, the dfb laser array 3 of each integral lens can engrave fine registration mark 4, can ensure corresponding neat, the wavelength of the dfb laser array 3 of each integral lens is different.By a small amount of translation of integral lens center relative to laser waveguide reflecting surface, or with dry etching obtain method realize special angle laser waveguide reflecting surface and make the emergent light of the dfb laser array 3 of above-mentioned integral lens in optical transparent substrate 1 with the angle θ of substrate bottom surface vertical line
1, adjacent integral lens dfb laser array 3 spacing p
1, optical transparent substrate 1 thickness D
1meet relation: p
1=2D
1* tan θ
1.
The LISEL array of Unit 1 × 12 is provided with in the dfb laser array 3 of integral lens, the dfb laser array 3 of four integral lens can go out the emergent light of injection four different wave lengths, be designated as the first emergent light, the second emergent light, the 3rd emergent light, the 4th emergent light from right to left respectively, wavelength is respectively λ
1, λ
2, λ
3, λ
4,first upper filter 2-1, first time wave filter 2-4 reflects the first emergent light, first time wave filter 2-4 is through the second emergent light, second upper filter 2-2, second time wave filter 2-5 reflects the first emergent light, second emergent light, second time wave filter 2-5 is through the 3rd emergent light, 3rd upper filter 2-3, 3rd time wave filter 2-6 reflects the first emergent light, second emergent light, 3rd emergent light, 3rd time wave filter 2-6 is through the 4th emergent light, first emergent light of dextrosinistral like this four different wave lengths, second emergent light, 3rd emergent light, 4th emergent light is synthesized together from the outgoing of optical transparent substrate upper surface, by discrete integrated, 4 × 12DFB laser array that one has precise distance has been synthesized with the laser arrays of four 1 × 12.
A kind of laser array module, it is by fiber array 5, microlens array 6, reflecting prism 7 and above-mentioned a kind of big unit laser array is integrated forms, the emergent light of the synthesis of the dfb laser array 3 of four above-mentioned integral lens sequentially passes through reflecting prism 7, microlens array 6, fiber array 5, by reflecting prism 7 by emergent light steering horizontal direction, then realize low-loss with one with the microlens array 6 of above-mentioned big unit laser array uniform distances and be coupled.As shown in Figure 5, another kind of laser array module also can by fiber array 5, planar lens array 8 and above-mentioned a kind of big unit laser array be integrated forms, the emergent light of the synthesis of the dfb laser array 3 of four above-mentioned integral lens sequentially passes through planar lens array 8, fiber array 5, by planar lens array 8, emergent light is focused on planar lens array 8 upper surface, then with fiber array 5 direct-coupling of AnglePolished, in the occasion be not particularly limited module height size, this is the more simple implementation of one.Adopt optical plastic mould pressing technology, namely above-mentioned reflecting prism 7 and microlens array 6 can become a device, fiber array 5 can be located with V-type groove array, also can be integrated together by it, greatly simplify the integrated of whole module and install, the tril bit laser array of such a wavelength-division multiplex is integrated by the BondingPads on surface and multichannel VLSI driving chip 9 and forms a kind of tril bit optic fiber emission modules completed, and is wherein a kind of optic fiber emission modules as shown in Figure 6.
And the optic fiber transceiver module of correspondence adopts identical optical design, the dfb laser array of integral lens is just replaced with the vertical PD array 10 in PIN surface, the vertical PD array 10 in PIN surface is also prior art, the dfb laser array 3 of its structure and integral lens is similar, its role is to receive incident light, is not Emission Lasers.As shown in Figure 7, a kind of big unit photodetector array, it comprises above-mentioned optical transparent substrate 1, optical transparent substrate 1 lower surface is provided with four vertical PD arrays 10 in PIN surface equidistantly arranged, a vertical PD array 10 in PIN surface of removing right-hand member, the vertical PD array 10 in remaining three PIN surface and three wave-division multiplexer filters, i.e. first time wave filter 2-4, second time wave filter 2-5, 3rd time wave filter 2-6 one_to_one corresponding respectively, because photodetector array yield rate will be much better than laser array, the vertical PD array in the PIN of single 4 × 12 surface can be adopted in this side and not use the array combination of four 1 × 12, its optical principle is same as described above, just light transmission route is contrary, repeat no more here.
The incident light that the vertical PD array 10 in PIN surface receives in optical transparent substrate 1 with the angle θ of substrate bottom surface vertical line
2, the adjacent vertical PD array pitch p in PIN surface
2, optical transparent substrate thickness D
2meet relation: p
2=2D
2* tan θ
2.As shown in Figure 8, a kind of photodetector array module, it is by fiber array 5, microlens array 6, reflecting prism 7 and above-mentioned a kind of big unit photodetector array is integrated forms, and the incident light received sequentially passes through fiber array 5, microlens array 6, reflecting prism 7 enter optical transparent substrate 1; As shown in Figure 9, another kind of photodetector array module is by fiber array 5, planar lens array 8 and above-mentioned a kind of big unit laser array is integrated forms, and the incident light received sequentially passes through fiber array 5, planar lens 8 array enters optical transparent substrate 1.A kind of optic fiber transceiver module, by VLSI receiving chip 11 and above-mentioned two kinds of photodetector array modules, any one integratedly forms for it, as shown in Figure 10, is wherein a kind of optic fiber transceiver module.
Because different wavelength channels has different light paths, each lens arra can be designed to different focal lengths by us, to realize being coupled with the lowest loss of optical fiber, in addition, same Integrated Solution also can be used for increasing further the bandwidth of fibre optical transmission or receiver module, as long as increase the number of wavelengths of wavelength-division multiplex, namely the 4*12 laser array of more different wave lengths is just passable, the number of corresponding wavelength-division multiplex and VLSI drive or receiving chip also to increase accordingly make change corresponding with it.
Claims (9)
1. an optical transparent substrate, is characterized in that, described optical transparent substrate upper and lower surface is provided with N number of wave-division multiplexer filter, N be greater than 1 integer, the described wave-division multiplexer filter in described optical transparent substrate upper and lower surface is staggeredly arranged.
2. a big unit laser array, it is characterized in that, it comprises optical transparent substrate according to claim 1, described optical transparent substrate lower surface is provided with the dfb laser array of N+1 integral lens, N be greater than 1 integer, remove the dfb laser array of a described integral lens of one end, the dfb laser array of remaining N number of described integral lens and N number of described wave-division multiplexer filter one_to_one corresponding respectively, the wavelength of the dfb laser array of each described integral lens is different.
3. a kind of big unit laser array according to claim 2, is characterized in that, the emergent light of the dfb laser array of described integral lens in optical transparent substrate with the angle θ of substrate bottom surface vertical line
1, adjacent integral lens dfb laser array spacing p
1, optical transparent substrate thickness D
1meet relation: p
1=2D
1* tan θ
1.
4. a laser array module, it is characterized in that, it is by fiber array, microlens array, reflecting prism and a kind of big unit laser array according to claim 2 is integrated forms, and the emergent light of the dfb laser array of described integral lens sequentially passes through described reflecting prism, microlens array, fiber array; Or it is by fiber array, planar lens array with a kind of big unit laser array according to claim 2 is integrated forms, the emergent light of the dfb laser array of described integral lens sequentially passes through described planar lens array, fiber array.
5. an optic fiber emission modules, is characterized in that, it is formed by VLSI driving chip and a kind of laser array module integration according to claim 4.
6. a big unit photodetector array, it is characterized in that, it comprises optical transparent substrate according to claim 1, described optical transparent substrate lower surface is provided with N+1 the vertical PD array in PIN surface, N be greater than 1 integer, the vertical PD array in removing one of one end described PIN surface, the vertical PD array in remaining N number of described PIN surface and N number of described wave-division multiplexer filter difference one_to_one corresponding.
7. a kind of big unit photodetector array according to claim 6, is characterized in that, the vertical PD array received in described PIN surface to incident light in optical transparent substrate with the angle θ of substrate bottom surface vertical line
2, the adjacent vertical PD array pitch p in PIN surface
2, optical transparent substrate thickness D
2meet relation: p
2=2D
2* tan θ
2.
8. a photodetector array module, it is characterized in that, it is by fiber array, microlens array, reflecting prism and a kind of big unit photodetector array according to claim 6 is integrated forms, and the incident light received sequentially passes through described fiber array, microlens array, reflecting prism enter described optical transparent substrate; Or it is by fiber array, planar lens array with a kind of big unit laser array according to claim 6 is integrated forms, the incident light received sequentially passes through described fiber array, planar lens array enters described optical transparent substrate.
9. an optic fiber transceiver module, is characterized in that, it is formed by VLSI receiving chip and a kind of photodetector array module integration according to claim 8.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104865654A (en) * | 2015-05-18 | 2015-08-26 | 无锡清辉光电科技有限公司 | Substrate, laser array, light detector array, module, and transmitting and receiving module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104865654A (en) * | 2015-05-18 | 2015-08-26 | 无锡清辉光电科技有限公司 | Substrate, laser array, light detector array, module, and transmitting and receiving module |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151223 Termination date: 20160518 |
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