CN209045607U - A kind of LED-G9 filament support - Google Patents

A kind of LED-G9 filament support Download PDF

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Publication number
CN209045607U
CN209045607U CN201821815992.3U CN201821815992U CN209045607U CN 209045607 U CN209045607 U CN 209045607U CN 201821815992 U CN201821815992 U CN 201821815992U CN 209045607 U CN209045607 U CN 209045607U
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China
Prior art keywords
substrate
led
filament
support
metallic support
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CN201821815992.3U
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Chinese (zh)
Inventor
林成通
翁欣强
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ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
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ZHEJIANG INTELED OPTOELETRONIC TECHNOLOGY Co Ltd
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Priority to CN201821815992.3U priority Critical patent/CN209045607U/en
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Abstract

The utility model discloses a kind of LED-G9 filament support, including substrate, metallic support, it is characterized by: the substrate both ends are respectively equipped with more than one substrate wrapped end, the metallic support is equipped with multiple metal connecting terminals, and described metal connecting terminal one end is connect with the metallic support, the other end is equipped with and presses the metal packet pawl being fixedly connected with the substrate wrapped end.Beneficial effect using this structure is: using the structure of this LED-G9 filament support, its shape and LED filament bracket, RGB bracket are essentially identical, its manufacturing process, fixture and LED filament production line are essentially identical, board can be mutually general with fixture, without redesigning board, fixture and production line because of substrate width variation, research and development and production cost are reduced.

Description

A kind of LED-G9 filament support
Technical field
The utility model relates to a kind of filament supports, and in particular to a kind of LED-G9 filament support.
Background technique
Existing LED-G9 lamp support substantially full wafer rectangular substrate (such as 120mm long, 40mm wide, 0.4mm are thick), uses Circuit is printed on substrate by the techniques such as thick-film technique, low temperature co-fired, sputter, electricity/chemical deposition, then by LED wafer and its Its chip links LED component by the encapsulation technology and its heat-radiating substrate of routing, eutectic or flip, puts gum forming.Separation Chip is fixed on system board again afterwards and is connected to lamp source mould group.With high cost-effectiveness, route design is simple, saves system board The advantages that space.
Existing LED-G9 lamp support pin generally uses the wires such as molybdenum filament, is sintered wire by substances such as silver pastes On substrate, while formed product is subsequent obtains final product by repeatedly splitting plate, there is what multistage generation was scrapped in production process Link.Because its substrate holder and LED filament, RGB bracket difference are big, fixture poor universality.
Utility model content
To solve the above problems, the utility model provides, a kind of production cost is low, processing procedure link is simple, production risk is few LED-G9 filament support.The utility model uses following technical scheme:
A kind of LED-G9 filament support, including substrate (1), metallic support (2), it is characterised in that: substrate (1) both ends It is respectively equipped with more than one substrate wrapped end (3), the metallic support (2) is equipped with multiple metal connecting terminals (5), the gold Category connection terminal (5) one end is connect with the metallic support (2), the other end is equipped with the substrate wrapped end (3) pressing admittedly Surely the metal packet pawl (6) connected.
Preferably, being equipped with impression slot (4) in the middle part of substrate (1) reverse side.
Preferably, being equipped at intervals with polarity mark hole (7) on the metal connecting terminal (5).
Preferably, being equipped with adhesive between the substrate wrapped end (3) and the metal packet pawl (6).
Preferably, the end of the substrate wrapped end (3) is equipped with limit buckle (8).
The beneficial effects of the utility model are: using the structure of this LED-G9 filament support, shape and LED filament Bracket, RGB bracket are essentially identical, and manufacturing process, fixture and LED filament production line are essentially identical, and board being capable of phase with fixture It is mutually general, without redesigning board, fixture and production line because of substrate width variation, reduce research and development and production cost.This The substrate of utility model is split in advance, and it is primary only to need to split plate after formed product again, is effectively reduced rejection rate and is split plate bring Hidden danger of quality.LED wafer routing may be coupled directly to stent substrate wrapped end, reduce the wire consumptions such as molybdenum filament, reduce processing procedure Link reduces production cost, reduces production risk.
Detailed description of the invention
Fig. 1 is the utility model embodiment main view
Fig. 2 is the utility model embodiment rearview
Fig. 3 is the utility model embodiment substrate schematic diagram
Fig. 4 is the utility model embodiment metallic support partial enlargement diagram
Fig. 5 is the utility model embodiment metallic support and substrate assembling schematic diagram
Fig. 6 is that the utility model embodiment splits single LED-G9 filament support schematic diagram after plate
Figure number explanation: 1, substrate;2, metallic support;3, substrate wrapped end;4, impression slot;5, metal connecting terminal;6, golden Belong to packet pawl;7, polarity indicates hole;8, limit buckle.
Specific embodiment
It is specific embodiment of the utility model and in conjunction with attached drawing below, the technical solution of the utility model is made further Description, but the utility model is not limited to these examples.
A kind of LED-G9 filament support, including 12 pieces of rectangle filament substrates 1 and two metallic supports 2, each piece of rectangular lamps 1 both ends of silk substrate are respectively equipped with two substrate wrapped ends 3, and the end of each substrate wrapped end 3 is equipped with limit buckle 8,1 reverse side of substrate Middle part is equipped with impression slot 4, is the both sides axis of symmetry of substrate 1, substrate 1 is divided for the identical two parts of shape, on metallic support 2 Equipped with 24 metal connecting terminals 5, be equipped at intervals in metal connecting terminal 5 polarity mark hole 7,5 one end of metal connecting terminal with Metallic support 2 is connected, the other end is equipped with metal packet pawl 6, and adhesive, metal are equipped between metal packet pawl 6 and substrate wrapped end 3 Connection terminal 5 is fixedly connected by metal packet pawl 6 with the pressing of substrate wrapped end 3.
Shown in above implementation explanation and attached drawing, it is one of the utility model preferred embodiment, this reality is not limited to this With novel, therefore such as approximate with the construction of the utility model, device, feature etc., identical person, should all belong to the utility model It founds within purpose and claim.

Claims (5)

1. a kind of LED-G9 filament support, including substrate (1), metallic support (2), it is characterised in that: substrate (1) both ends point Not She You more than one substrate wrapped end (3), the metallic support (2) be equipped with multiple metal connecting terminals (5), the metal Connection terminal (5) one end is connect with the metallic support (2), the other end is equipped with and presses fixed connect with the substrate wrapped end (3) The metal packet pawl (6) connect.
2. LED-G9 filament support as described in claim 1, it is characterised in that: be equipped with impression in the middle part of substrate (1) reverse side Slot (4).
3. LED-G9 filament support as described in claim 1, it is characterised in that: be spaced and set on the metal connecting terminal (5) Polarized indicates hole (7).
4. LED-G9 filament support as described in claim 1, it is characterised in that: the substrate wrapped end (3) and the metal Adhesive is equipped between packet pawl (6).
5. LED-G9 filament support as described in claim 1, it is characterised in that: the end of the substrate wrapped end (3) is equipped with Limit buckle (8).
CN201821815992.3U 2018-11-06 2018-11-06 A kind of LED-G9 filament support Active CN209045607U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821815992.3U CN209045607U (en) 2018-11-06 2018-11-06 A kind of LED-G9 filament support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821815992.3U CN209045607U (en) 2018-11-06 2018-11-06 A kind of LED-G9 filament support

Publications (1)

Publication Number Publication Date
CN209045607U true CN209045607U (en) 2019-06-28

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821815992.3U Active CN209045607U (en) 2018-11-06 2018-11-06 A kind of LED-G9 filament support

Country Status (1)

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CN (1) CN209045607U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111883636A (en) * 2019-12-06 2020-11-03 中山市木林森电子有限公司 Manufacturing method of LED lamp filament
CN112002689A (en) * 2020-09-11 2020-11-27 广东百珈亮光电科技有限公司 Processing technology of LED lamp filament support with protective film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111883636A (en) * 2019-12-06 2020-11-03 中山市木林森电子有限公司 Manufacturing method of LED lamp filament
CN112002689A (en) * 2020-09-11 2020-11-27 广东百珈亮光电科技有限公司 Processing technology of LED lamp filament support with protective film

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