CN201796890U

CN201796890U - LED substrate structure

Info

Publication number: CN201796890U
Application number: CN2010205300512U
Authority: CN
Inventors: 李武龙; 郭伦春; 徐廷军; 王飞
Original assignee: SHENZHEN JIUZHOU PHOTOELECTRON CO Ltd
Current assignee: SHENZHEN JIUZHOU PHOTOELECTRON CO Ltd
Priority date: 2010-09-15
Filing date: 2010-09-15
Publication date: 2011-04-13
Anticipated expiration: 2020-09-15

Abstract

The utility model relates to an LED substrate structure, in particular an LED substrate structure with improved structure and process, which comprises an LED substrate, a wafer arranged on the front surface of the LED substrate, a fluorescent adhesive arranged on the wafer and a lens, wherein a pad is arranged on the front surface of the LED substrate, a positioning mark is formed on the pad, and the wafer is positioned on the positioning mark. The LED substrate structure is flat, doesn't need the cup ring and can improve the wafer fixation accuracy by use of the positioning mark on the substrate. The colors and the temperatures of the LEDs of the same batch are approximate or the same, and the uniformity of light from the same one LED is improved. The substrates are connected in series in one row or column through a circuit and the pads are arranged at the two ends of each row or column. The utility model solves the problem of the prior art adopting the self-exposure technique, such as difference in exposure times of the LEDs and low efficiency, improves the uniformity in color and temperature of the LEDs of the same batch, and improves the efficiency of electrical test.

Description

A kind of LED board structure

Technical field:

The utility model relates to a kind of LED board structure, particularly a kind of LED board structure of structure-improved technology.

Background technology:

The solid brilliant place of substrate at present commonly used is the cup ring, at the bottom of wafer is welded on glass, again with fluorescent glue point to glass in, cover on the led chip, its structure processing is complicated, and efficient is not high, and differ in the wafer fixed position, fluorescent coating is in uneven thickness, and it is poor to cause with batch LED aberration colour temperature homogeneity.In addition, at present the substrate electrical detection is that single lamp detects, and promptly by by a detection, produces limited efficiency in batches; Using in the technology of exposing, need load little electric current to lamp body and carry out the phosphor slurry exposure, promptly by by a loading current, make that the overall exposing time is long, produce limited efficiency in batches, simultaneously, time difference, the current difference of each exposure can cause the phosphor powder layer variable thickness, cause LED aberration colour temperature homogeneity poor.

The utility model content:

The utility model is a kind of LED board structure of utility model in order to solve above-mentioned prior art problem just.

The utility model is realized by following technological means:

A kind of LED board structure comprises the LED substrate, is arranged on wafer, the fluorescent glue on the wafer and lens on the LED substrate front side; Also be provided with pad on the described LED substrate front side, sign has telltale mark on the pad, and wafer orientation is on telltale mark.

Described LED substrate can utilize circuit one row or row to be cascaded, and bores an aperture every row or every row two ends, and by aperture, circuit is communicated to the front pad.

The LED board structure that the utility model provides, this structure are dull and stereotyped, do not need the cup ring, utilize the location Mark on the substrate, improve solid brilliant precision.Can be so that same batch LED colour temperature to be near consistent, the bright dipping of same LEDs evenly causing property also is improved.Utilize circuit to be cascaded a row or a row substrate, and at every row or every row two ends design pad.Solved and used when exposing technology, every LEDs time for exposure differs, and the problem of inefficiency has improved the colour temperature homogeneity with batch LED; Improved electrical detection efficient.

Description of drawings:

Fig. 1 is existing LED board structure schematic diagram;

Fig. 2 is existing LED substrate connection diagram;

Fig. 3 is the utility model LED board structure schematic diagram;

Fig. 4 is that the utility model LED substrate connects front schematic view;

Fig. 5 is that the utility model LED substrate connects schematic rear view;

Fig. 6 is the utility model pad structure schematic diagram.

Embodiment:

Comparative illustration book accompanying drawing 1 and Fig. 3 are the common structure of existing LED substrate as can be seen among Fig. 1,

As shown in Figure 1, substrate 2 solid brilliant places commonly used at present are glass ring structures.Its wafer 3 fixed position accuracy are not high, and fluorescent material 4 coating thicknesss are inhomogeneous, and it is poor to cause with batch LED aberration colour temperature homogeneity.

As Fig. 3, shown in Figure 6, the utility model is a kind of LED board structure, comprises LED substrate 2, is arranged on wafer 3, the fluorescent glue 4 on the wafer 3 and lens 1 on LED substrate 1 front; Described LED substrate also is provided with pad 6 on 2 fronts, and sign has telltale mark on the pad 6, and wafer 3 is positioned on the telltale mark.Shadow region wherein shown in Figure 6 is a pad 5, forms telltale mark, and is accurately solid brilliant, is Zener diode, bipolar electrode wafer headspace simultaneously.

As shown in Figure 2, substrate 2 commonly used at present, single lamp detects during electrical detection, inefficiency, colour temperature aberration homogeneity is low.

4 Fig. 5 in conjunction with the accompanying drawings, described LED substrate 2 can utilize circuit one row or row to be cascaded, and bore an aperture every row or every row two ends, are communicated to front pad 5.When detecting, electric current is loaded on a row or row that are cascaded, each like this can the detection more than tens of (can adjust quantity) according to product needed, and single detection has improved electrical detection efficient relatively; When exposing technology certainly, permanent little electric current is loaded on a row or row that are cascaded, electric current unanimity, the mistake electricity time that then can guarantee every lamp body are identical, solved and used when exposing technology, every LEDs time for exposure differs, the problem of inefficiency has improved the colour temperature homogeneity with batch LED.

More than be that a kind of LED board structure provided by the utility model is described in detail, used specific case herein structure of the present utility model and principle are set forth, above embodiment just is used for helping to understand method of the present utility model and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, part in specific embodiments and applications all can change.In sum, this description should not be construed as restriction of the present utility model.

Claims

1. a LED board structure is characterized in that described LED board structure comprises the LED substrate, is arranged on wafer, the fluorescent glue on the wafer and lens on the LED substrate front side; Also be provided with pad on the described LED substrate front side, sign has telltale mark on the pad, and wafer orientation is on telltale mark.

2. LED board structure according to claim 1 is characterized in that described LED substrate can utilize circuit one row or row of substrate back to be cascaded, and bores an aperture every row or every row two ends that by aperture, circuit is communicated to the front pad.