CN104319273A - Led light source - Google Patents
Led light source Download PDFInfo
- Publication number
- CN104319273A CN104319273A CN201410595578.6A CN201410595578A CN104319273A CN 104319273 A CN104319273 A CN 104319273A CN 201410595578 A CN201410595578 A CN 201410595578A CN 104319273 A CN104319273 A CN 104319273A
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- CN
- China
- Prior art keywords
- led chip
- electrode
- light source
- led
- membrane electrode
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Led Device Packages (AREA)
Abstract
The invention provides an LED light source, and relates to the technical field of illumination. The LED light source comprises a substrate and at least two LED chips. Each LED chip is fixed on the substrate, and at least one film electrode is arranged on the surface of the substrate. At least one electrode of at least one LED chip is electrically connected with the corresponding film electrode, wherein the electrical connection of the electrode of the LED chip is achieved through the film electrode. The film electrodes are arranged on the surface of the substrate, and the LED chips which need mutual electrical connection or the LED chips and other electrical elements are electrically connected with the corresponding film electrodes through welding lines respectively. The length of each film electrode is not limited, benefiting by the characteristic of the film electrodes, by the aid of the film electrodes, one certain LED chip and another LED chip which is far away from the LED chip or other electrical elements can achieve electrical connection as well, the limit that only gold threads are used for conducting electric connection is broken through, and therefore the design of the distribution positions of the LED chips of the LED light source is very flexible.
Description
Technical field
The invention relates to lighting technical field, is specifically related to a kind of LED light source.
Background technology
Along with LED(Light Emitting Diode, light-emitting diode) the improving constantly of light efficiency, at general illumination field, start to show the trend using LED to substitute traditional luminescent device.
All-round smooth LED light source, referring to can the LED light source of full angle luminescence.Full angle LED light source is high owing to also having luminous efficiency, has wide market prospects.
The LED light source of existing all-round light, as shown in Figure 1, comprises substrate 1 and several LED chips 2, and each LED chip 2 is fixing on substrate 1 by crystal-bonding adhesive 3, is welded with gold thread 4 to realize the electrical connection between LED chip 2 between two LED chips 2.
The technical problem that LED light source shown in Fig. 1 exists has: due to the limited length system of gold thread 4, limit the distance between the LED chip 2 that is electrically connected to each other, the electrical connection of certain LED chip 2 and another LED chip 2 far away or other electric components can not be realized, thus cause the design underaction of the distributing position of LED chip 2.
Summary of the invention
The invention provides a kind of LED light source, and the distance between its LED chip be electrically connected to each other or between LED chip and other electric components is unrestricted, thus makes the design comparison of the distributing position of LED chip flexible.
For achieving the above object, the invention provides following technical scheme.
LED light source, comprise substrate and at least two LED chips, each LED chip is fixed on substrate, substrate surface is provided with at least one membrane electrode, at least one electrode of at least one LED chip is electrically connected with corresponding membrane electrode, is realized by this membrane electrode the electrical connection of this electrode of this LED chip.
Wherein, at least one electrode of at least one LED chip and the electrical connection of corresponding membrane electrode is realized by bonding wire, membrane electrode is provided with conducting element, and between the electrode and described conducting element of LED chip, bonding wire is with the electrical connection of the membrane electrode of this electrode and this conducting element place of realizing this LED chip.
Wherein, conducting element is fixed by conducting resinl and membrane electrode.
Wherein, conducting element is semi-conducting material or the metal derby of surperficial metal-plated membrane.
Wherein, described LED chip is the LED chip of horizontal structure or vertical stratification.
Wherein, the LED chip be electrically connected with membrane electrode is vertical stratification, and its bottom electrode is fixed by conducting resinl or tin-based material and described membrane electrode and realized the electrical connection with described membrane electrode.
Wherein, the LED chip be electrically connected with membrane electrode is horizontal structure, and its electrode is electrically connected with described membrane electrode by bonding wire.
Wherein, substrate is transparent.
Wherein, substrate is made up of sapphire, transparent ceramic or glass.
The beneficial effect of the invention is: substrate surface arranges membrane electrode, need between the LED chip that is electrically connected to each other or be electrically connected with corresponding membrane electrode respectively by bonding wire between LED chip to other electric components, the length not restriction of membrane electrode, have benefited from this feature of membrane electrode, by means of membrane electrode, certain LED chip with also can realize between another LED chip apart from each other or other electric components being electrically connected, breaching use only uses gold thread to carry out the restriction of the distance be electrically connected, thus make the design comparison of the distributing position of the LED chip of the LED light source of the invention flexible.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing LED light source.
Fig. 2 is a kind of embodiment of the LED light source of the invention.
Fig. 3 is the another kind of embodiment of the LED light source of the invention.
Reference numeral comprises: substrate 1, LED chip 2, crystal-bonding adhesive 3, gold thread 4, membrane electrode 5, conducting element 6, conducting resinl 7.
Embodiment
Below in conjunction with specific embodiment, the invention is elaborated.
As shown in Figure 2, the LED light source of the present embodiment comprises LED chip 2 and the substrate 1 of several horizontal structures, each LED chip 2 word order evenly and at intervals, each LED chip 2 is fixing on substrate 1 by crystal-bonding adhesive 3, the membrane electrode 5 that a metal material is made is provided with between two often adjacent LED chips 2, make the P electrode of each LED chip 2 and N electrode realize being electrically connected with the membrane electrode 5 of its both sides respectively by the mode of welding gold thread 4, each LED chip 2 is connected by gold thread 4 and membrane electrode 5 thus.Membrane electrode 5 extends to the position of relatively LED chip 2, uses shorter gold thread 4 that LED chip 2 and membrane electrode 5 can be made to complete electrical connection, because the length of gold thread 4 is short, too increases the reliability of welding gold thread 4.
Substrate 1 is made up of sapphire, and the light that the LED light source of the present embodiment can be allowed to send is not stopped from whole angle outgoing, becomes the LED light source of all-round luminescence.As other embodiment, substrate 1 also---glass or transparent ceramic---can be made up of other transparent materials, can realize the object of all-round luminescence equally.
Further, as shown in Figure 2, each membrane electrode 5 two ends are respectively equipped with conducting element 6, and conducting element 6 is fixed by conducting resinl 7 and membrane electrode 5, the gold thread 4 that need be electrically connected with membrane electrode 5 is welded on conducting element 6, realizes the electrical connection with membrane electrode 5 by conducting element 6.The thickness of gold thread 4 welding position is increased by conducting element 6, to reduce the difficulty that gold thread 4 welds, convenient welding.Conducting element 6 is the metal derby of conduction, and conducting resinl 7 is starched by silver and made.
As shown in Figure 3, as another embodiment, LED chip 2 can also be vertical stratification, its bottom electrode is by conducting resinl 7(or tin-based material) to fix with corresponding membrane electrode 5 and realize the electrical connection with this membrane electrode 5, top electrode then realizes being electrically connected with the conducting element 6 be arranged on another membrane electrode 5 by the mode of welding gold thread 4.
Finally should be noted that; above embodiment is only in order to illustrate the technical scheme of the invention; but not the restriction to the invention protection range; although done to explain to the invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to the technical scheme of the invention or equivalent replacement, and not depart from essence and the scope of the invention technical scheme.
Claims (9)
1.LED light source, comprise substrate and at least two LED chips, each LED chip is fixed on substrate, it is characterized in that, substrate surface is provided with at least one membrane electrode, at least one electrode of at least one LED chip is electrically connected with corresponding membrane electrode, is realized by this membrane electrode the electrical connection of this electrode of this LED chip.
2. LED light source according to claim 1, it is characterized in that, at least one electrode of at least one LED chip and the electrical connection of corresponding membrane electrode is realized by bonding wire, membrane electrode is provided with conducting element, and between the electrode and described conducting element of LED chip, bonding wire is with the electrical connection of the membrane electrode of this electrode and this conducting element place of realizing this LED chip.
3. LED light source according to claim 2, is characterized in that, conducting element is fixed by conducting resinl and membrane electrode.
4. LED light source according to claim 2, is characterized in that, conducting element is semi-conducting material or the metal derby of surperficial metal-plated membrane.
5. LED light source according to claim 1, is characterized in that, described LED chip is the LED chip of horizontal structure or vertical stratification.
6. LED light source according to claim 5, is characterized in that, the LED chip be electrically connected with membrane electrode is vertical stratification, and its bottom electrode is fixed by conducting resinl or tin-based material and described membrane electrode and realized the electrical connection with described membrane electrode.
7. LED light source according to claim 5, is characterized in that, the LED chip be electrically connected with membrane electrode is horizontal structure, and its electrode is electrically connected with described membrane electrode by bonding wire.
8. the LED light source according to claim 1-7 any one, is characterized in that, substrate is transparent.
9. LED light source according to claim 8, is characterized in that, substrate is made up of sapphire, transparent ceramic or glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410595578.6A CN104319273A (en) | 2014-10-30 | 2014-10-30 | Led light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410595578.6A CN104319273A (en) | 2014-10-30 | 2014-10-30 | Led light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104319273A true CN104319273A (en) | 2015-01-28 |
Family
ID=52374483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410595578.6A Pending CN104319273A (en) | 2014-10-30 | 2014-10-30 | Led light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104319273A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104856639A (en) * | 2015-06-12 | 2015-08-26 | 成雨 | Object fetching choledochoscope |
| CN106684077A (en) * | 2017-03-03 | 2017-05-17 | 陈官海 | RGBLED (Red Green Blue Light Emitting Diode) structure and preparation process |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM339781U (en) * | 2007-12-24 | 2008-09-01 | Zheng-Xian Xiao | Heat-conducting and serial-connecting structure of LED substrate |
| CN201547699U (en) * | 2009-10-22 | 2010-08-11 | 深圳市同洲电子股份有限公司 | Led device |
| CN201796890U (en) * | 2010-09-15 | 2011-04-13 | 深圳市九洲光电子有限公司 | LED substrate structure |
| US20110128731A1 (en) * | 2009-12-01 | 2011-06-02 | Shin Zu Shing Co., Ltd. | Light emitting diode substrate assembly |
| CN204204853U (en) * | 2014-10-30 | 2015-03-11 | 夏洪涛 | Led light source |
-
2014
- 2014-10-30 CN CN201410595578.6A patent/CN104319273A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM339781U (en) * | 2007-12-24 | 2008-09-01 | Zheng-Xian Xiao | Heat-conducting and serial-connecting structure of LED substrate |
| CN201547699U (en) * | 2009-10-22 | 2010-08-11 | 深圳市同洲电子股份有限公司 | Led device |
| US20110128731A1 (en) * | 2009-12-01 | 2011-06-02 | Shin Zu Shing Co., Ltd. | Light emitting diode substrate assembly |
| CN201796890U (en) * | 2010-09-15 | 2011-04-13 | 深圳市九洲光电子有限公司 | LED substrate structure |
| CN204204853U (en) * | 2014-10-30 | 2015-03-11 | 夏洪涛 | Led light source |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104856639A (en) * | 2015-06-12 | 2015-08-26 | 成雨 | Object fetching choledochoscope |
| CN106684077A (en) * | 2017-03-03 | 2017-05-17 | 陈官海 | RGBLED (Red Green Blue Light Emitting Diode) structure and preparation process |
| CN106684077B (en) * | 2017-03-03 | 2023-05-23 | 陈官海 | RGBLED structure and preparation process |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150128 |
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| RJ01 | Rejection of invention patent application after publication |