CN112002689A - Processing technology of LED lamp filament support with protective film - Google Patents
Processing technology of LED lamp filament support with protective film Download PDFInfo
- Publication number
- CN112002689A CN112002689A CN202010950000.3A CN202010950000A CN112002689A CN 112002689 A CN112002689 A CN 112002689A CN 202010950000 A CN202010950000 A CN 202010950000A CN 112002689 A CN112002689 A CN 112002689A
- Authority
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- China
- Prior art keywords
- led filament
- protective film
- processing technology
- support
- temperature
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 title claims abstract description 26
- 238000005516 engineering process Methods 0.000 title claims abstract description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 10
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 238000004140 cleaning Methods 0.000 claims abstract description 8
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims abstract description 5
- 239000000919 ceramic Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 13
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 239000004332 silver Substances 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000003223 protective agent Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 11
- 238000005299 abrasion Methods 0.000 abstract description 3
- 239000013078 crystal Substances 0.000 abstract description 2
- 239000002699 waste material Substances 0.000 abstract description 2
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
Abstract
The invention discloses a processing technology of an LED filament support with a protective film, which comprises the steps of silver wire printing, modified resin ink protective film adhesion, primary curing, splitting, riveting, cleaning, primary baking, crystal solidification, secondary baking, gluing and secondary curing; by the method, the conducting silver wire can be subjected to a next-stage process under the protection of the protective film, so that the abrasion of the silver wire in the processing process is reduced, the yield of the LED filament support is greatly improved, and the waste is reduced.
Description
Technical Field
The invention relates to the field of LED lamp filaments, in particular to a processing technology of an LED lamp filament support with a protective film.
Background
In the production of the LED filament support, the connecting wires for conducting are all very thin metal wires, after the metal wires are attached to the substrate, the phenomena of abrasion and even breakage are easy to occur in subsequent processes, so that the LED filament is conductive and unstable or non-conductive after being produced, the yield is not high, the LED filament support cannot be detected in the subsequent production, the LED filament support can be detected only when the LED filament support is integrally processed and electrified for detection, and at the moment, the LED filament support cannot be repaired, is scrapped and is seriously wasted.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides the processing technology of the LED filament support with the protective film, and the protective film is attached to the surface of the silver wire used for conducting electricity on the LED filament support, so that the silver wire is not easily abraded in the subsequent working procedures, and the yield of the LED filament support is greatly improved.
The technical scheme adopted by the embodiment of the invention for solving the technical problem is as follows: a processing technology of an LED filament support with a protective film comprises the following steps:
step 1, printing a conductive wire on a ceramic wafer by using a silver wire;
step 2, spraying or coating a modified resin ink protective film on the ceramic sheet;
step 3, delivering the ceramic wafer into a curing chamber at the temperature of 100-;
step 4, splitting the solidified ceramic wafer into a plurality of LED filament base plates, and riveting the LED filament base plates on the metal support;
step 5, putting the metal bracket into hot water with the temperature of 75-80 ℃, and washing for 2-5min by using an ultrasonic cleaner in a vibration way;
step 6, putting the metal bracket into hot water with the temperature of 50-60 ℃ and added with a silver layer protective agent for cleaning for 5-10 min;
step 7, placing the cleaned metal support in an oven or a tunnel furnace at the temperature of 105-;
step 8, fixing the LED chip on the LED filament bottom plate through die attach adhesive;
step 9, delivering the LED filament bottom plate into a baking furnace at 180 ℃ for baking for 2-3 h;
and 11, gluing the two sides of the LED filament base plate by using fluorescent powder glue, and then heating the LED filament base plate in a curing furnace at the temperature of 150-170 ℃ for 8 hours.
Between step 6 and step 7 also include:
and 6.1, putting the metal bracket cleaned in hot water added with the silver layer protective agent into normal-temperature clean water, and cleaning for 2-3min by ultrasonic vibration.
Between step 7 and step 8 also include:
and 7.1, placing the dried metal support into a nitrogen cabinet for later use.
The ceramic plate is made of white ceramic.
The power of the ultrasonic cleaning machine is set to 200-300W.
The invention has the beneficial effects that: a processing technology of an LED filament support with a protective film comprises the steps of printing silver wires, attaching a modified resin ink protective film, performing primary curing, splitting, riveting, cleaning, performing primary baking, fixing crystals, performing secondary baking, gluing and performing secondary curing; by the method, the conducting silver wire can be subjected to a next-stage process under the protection of the protective film, so that the abrasion of the silver wire in the processing process is reduced, the yield of the LED filament support is greatly improved, and the waste is reduced.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of an LED filament support.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, a plurality of means is two or more, and greater than, less than, more than, etc. are understood as excluding the present number, and greater than, less than, etc. are understood as including the present number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present invention, unless explicitly defined otherwise, the terms "disposed," "mounted," "connected," and the like are to be understood in a broad sense, and for example, may be directly connected or indirectly connected through an intermediate; can be fixedly connected, can also be detachably connected and can also be integrally formed; may be a mechanical connection; either as communication within the two elements or as an interactive relationship of the two elements. The specific meaning of the above-mentioned words in the present invention can be reasonably determined by those skilled in the art in combination with the detailed contents of the technical solutions.
Referring to fig. 1, a processing technology of an LED filament support with a protective film includes the following steps:
step 1, printing a conductive wire on a ceramic sheet 20 by using a silver wire 30;
step 2, spraying or coating a modified resin ink protective film 50 on the ceramic plate 20; step 3, the ceramic plate 20 is sent into a curing chamber with the temperature of 100-;
step 4, splitting the solidified ceramic sheet 20 into a plurality of LED filament base plates 21, and then riveting the LED filament base plates on the metal support 10;
step 5, putting the metal bracket into hot water with the temperature of 75-80 ℃, and washing for 2-5min by using an ultrasonic cleaner in a vibration way;
step 6, putting the metal bracket into hot water with the temperature of 50-60 ℃ and added with a silver layer protective agent for cleaning for 5-10 min;
step 7, placing the cleaned metal support in an oven or a tunnel furnace at the temperature of 105-;
step 8, fixing the LED chip on the LED filament bottom plate through die attach adhesive;
step 9, delivering the LED filament bottom plate into a baking furnace at 180 ℃ for baking for 2-3 h;
and 11, gluing the two sides of the LED filament base plate by using fluorescent powder glue, and then heating the LED filament base plate in a curing furnace at the temperature of 150-170 ℃ for 8 hours.
Between step 6 and step 7 also include:
and 6.1, putting the metal bracket cleaned in hot water added with the silver layer protective agent into normal-temperature clean water, and cleaning for 2-3min by ultrasonic vibration.
Between step 7 and step 8 also include:
and 7.1, placing the dried metal support into a nitrogen cabinet for later use.
The ceramic plate is made of white ceramic.
The power of the ultrasonic cleaning machine is set to 200-300W; approximately the amount of power at which the human ear can hear the ultrasonic vibration sound.
In the invention, the LED filament support comprises a metal support 10, a ceramic sheet 20, a silver wire 30, an LED chip 40 and a modified resin ink protective film 50, and by the method, during processing, the modified resin ink protective film 50 is attached on the silver wire 30, after the ceramic sheet 20 is cracked, the modified resin ink protective film 50 is cleaned by an ultrasonic cleaner, in the production and processing process of the LED filament support, the silver wire 30 is most easily worn when the ceramic sheet 20 is split into the LED filament bottom plate 21, in the splitting process, the splitting mold is used to place the ceramic sheet 20 on the splitting mold, the ceramic sheet 20 is split by rolling, preferably, the ceramic sheet 20 is split into a fixed-size split line on the ceramic sheet 20 before splitting, the ceramic sheet 20 can be more easily cracked when being cracked while the LED filament bottom plate 21 with fixed size is fixed; curing and drying the modified resin ink protective film 50 in the step 3, and stripping the modified resin ink protective film 50 from the silver wire 30 and the LED filament bottom plate 21 in the step 5; and in step 6, the hot water containing tank is required to have a lifting function, and the lifting stroke is 5-10 cm.
The ceramic plate is made of white ceramic.
The power of the ultrasonic cleaning machine is set to 200-300W; the power of the ultrasonic cleaner cannot be too high when the ultrasonic cleaner is in operation, otherwise the silver wire 30 is easy to shake off.
It is to be understood that the present invention is not limited to the above-described embodiments, and that equivalent modifications and substitutions may be made by those skilled in the art without departing from the spirit of the present invention, and that such equivalent modifications and substitutions are to be included within the scope of the appended claims.
Claims (5)
1. The processing technology of the LED filament support with the protective film is characterized by comprising the following steps of:
step 1, printing a conductive wire on a ceramic wafer by using a silver wire;
step 2, spraying or coating a modified resin ink protective film on the ceramic sheet;
step 3, delivering the ceramic wafer into a curing chamber at the temperature of 100-;
step 4, splitting the solidified ceramic wafer into a plurality of LED filament base plates, and riveting the LED filament base plates on the metal support;
step 5, putting the metal bracket into hot water with the temperature of 75-80 ℃, and washing for 2-5min by using an ultrasonic cleaner in a vibration way;
step 6, putting the metal bracket into hot water with the temperature of 50-60 ℃ and added with a silver layer protective agent for cleaning for 5-10 min;
step 7, placing the cleaned metal support in an oven or a tunnel furnace at the temperature of 105-;
step 8, fixing the LED chip on the LED filament bottom plate through die attach adhesive;
step 9, delivering the LED filament bottom plate into a baking furnace at 180 ℃ for baking for 2-3 h;
step 10, connecting the LED chips by welding wires by using a wire welding machine;
and 11, gluing the two sides of the LED filament base plate by using fluorescent powder glue, and then heating the LED filament base plate in a curing furnace at the temperature of 150-170 ℃ for 8 hours.
2. The processing technology of the LED filament support with the protective film according to claim 1, further comprising between step 6 and step 7:
and 6.1, putting the metal bracket cleaned in hot water added with the silver layer protective agent into normal-temperature clean water, and cleaning for 2-3min by ultrasonic vibration.
3. The processing technology of the LED filament support with the protective film according to claim 1, further comprising between step 7 and step 8:
and 7.1, placing the dried metal support into a nitrogen cabinet for later use.
4. The processing technology of the LED filament support with the protective film according to claim 1, characterized in that: the ceramic plate is made of white ceramic.
5. The processing technology of the LED filament support with the protective film according to claim 1, characterized in that: the power of the ultrasonic cleaning machine is set to 200-300W.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010950000.3A CN112002689A (en) | 2020-09-11 | 2020-09-11 | Processing technology of LED lamp filament support with protective film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010950000.3A CN112002689A (en) | 2020-09-11 | 2020-09-11 | Processing technology of LED lamp filament support with protective film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112002689A true CN112002689A (en) | 2020-11-27 |
Family
ID=73469348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010950000.3A Pending CN112002689A (en) | 2020-09-11 | 2020-09-11 | Processing technology of LED lamp filament support with protective film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112002689A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104598072A (en) * | 2014-12-30 | 2015-05-06 | 深圳市华星光电技术有限公司 | Method for protecting touch lines for touch panel |
| CN104617211A (en) * | 2015-01-08 | 2015-05-13 | 苏州热驰光电科技有限公司 | LED (light-emitting diode) bracket and production method thereof |
| CN105428500A (en) * | 2015-11-25 | 2016-03-23 | 苏州晶品新材料股份有限公司 | Preparation method for high precision LED flip ceramic filament support |
| CN209045607U (en) * | 2018-11-06 | 2019-06-28 | 浙江英特来光电科技有限公司 | A kind of LED-G9 filament support |
| US20190386185A1 (en) * | 2017-12-26 | 2019-12-19 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Led filament and led light bulb |
-
2020
- 2020-09-11 CN CN202010950000.3A patent/CN112002689A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104598072A (en) * | 2014-12-30 | 2015-05-06 | 深圳市华星光电技术有限公司 | Method for protecting touch lines for touch panel |
| CN104617211A (en) * | 2015-01-08 | 2015-05-13 | 苏州热驰光电科技有限公司 | LED (light-emitting diode) bracket and production method thereof |
| CN105428500A (en) * | 2015-11-25 | 2016-03-23 | 苏州晶品新材料股份有限公司 | Preparation method for high precision LED flip ceramic filament support |
| US20190386185A1 (en) * | 2017-12-26 | 2019-12-19 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Led filament and led light bulb |
| CN209045607U (en) * | 2018-11-06 | 2019-06-28 | 浙江英特来光电科技有限公司 | A kind of LED-G9 filament support |
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Application publication date: 20201127 |