CN208733217U - 磁控溅射平面阴极镀膜机用阴极背板及磁控溅射平面阴极镀膜机 - Google Patents
磁控溅射平面阴极镀膜机用阴极背板及磁控溅射平面阴极镀膜机 Download PDFInfo
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Effective date of registration: 20191212 Granted publication date: 20190412 |
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Date of cancellation: 20200804 Granted publication date: 20190412 |
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Effective date of registration: 20200914 Address after: 050035 No. 9, the Yellow River Avenue, hi tech Zone, Hebei, Shijiazhuang Patentee after: DONGXU OPTOELECTRONIC TECHNOLOGY Co.,Ltd. Address before: The 100075 Beijing Seahawks Fengtai District Science City Road No. 9 Building No. 2 room 266 (Park) Co-patentee before: TUNGHSU GROUP Co.,Ltd. Patentee before: TUNGHSU TECHNOLOGY GROUP Co.,Ltd. |
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EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hunan Lanxin Microelectronics Technology Co.,Ltd. Assignor: DONGXU OPTOELECTRONIC TECHNOLOGY Co.,Ltd. Contract record no.: X2023110000110 Denomination of utility model: Cathode backplate and magnetron sputtering planar cathode coating machine for magnetron sputtering planar cathode coating machine Granted publication date: 20190412 License type: Common License Record date: 20230905 |
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