CN208480038U - A kind of circuit board with active heat radiating device - Google Patents
A kind of circuit board with active heat radiating device Download PDFInfo
- Publication number
- CN208480038U CN208480038U CN201821149790.XU CN201821149790U CN208480038U CN 208480038 U CN208480038 U CN 208480038U CN 201821149790 U CN201821149790 U CN 201821149790U CN 208480038 U CN208480038 U CN 208480038U
- Authority
- CN
- China
- Prior art keywords
- heat
- chip
- circuit board
- radiating device
- dissipating ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000000875 corresponding Effects 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims description 13
- 239000004519 grease Substances 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 230000011218 segmentation Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- 230000002093 peripheral Effects 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 240000004282 Grewia occidentalis Species 0.000 description 1
- 229920002456 HOTAIR Polymers 0.000 description 1
- 229920001721 Polyimide Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910001884 aluminium oxide Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
The utility model discloses a kind of circuit boards with active heat radiating device, its key points of the technical solution are that: including pcb board, chip is welded on the pcb board, the active heat radiating device includes the heat sink for being fixed in pcb board and being welded with chip-side；Position corresponding with chip offers heat release hole on the heat sink, and the heat sink is connected with the heat dissipating ring being connected to heat release hole away from the side of chip；The sleeve being arranged towards chip is folded in heat dissipating ring, internal thread of sleeve is connected with for the screw rod mobile towards chip, and one end of screw rod towards chip is connected with the conflict piece for contradicting chip.The utility model has the advantages that: the radiating efficiency of circuit board is improved, to improve the service life of heat sink.
Description
Technical field
The utility model relates to circuit board technology fields, and in particular to a kind of circuit board with active heat radiating device.
Background technique
The title of circuit board has: ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting
It acts on.Circuit board can be described as printed wiring board or printed circuit board, and FPC wiring board, which is also known as flexible circuit board flexible circuit board, is
There is height reliability, excellent flexible printed circuit using polyimides or polyester film as one kind made of substrate.Tool
Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good) and Rigid Flex FPC and PCB birth and development, urge
This new product of Rigid Flex is given birth to.Therefore, Rigid Flex is exactly flexible circuit board and rigid wiring board, by pressing
Etc. processes, combined by related process requirement, the wiring board with FPC characteristic and PCB characteristic of formation.
However, traditional circuit board can brush anticorrosive paint in circuit board surface during production, but brushing has
During use, the temperature of generation is limited the circuit board of anticorrosive paint by anticorrosive paint, is not easy quickly to disperse, thus
Affect the integral heat sink of circuit board.
Utility model content
The purpose of the utility model is to provide a kind of circuit boards with active heat radiating device, its advantage is that improving circuit
The radiating efficiency of plate, to improve the service life of heat sink.
The above-mentioned technical purpose of the utility model has the technical scheme that
A kind of circuit board with active heat radiating device, including pcb board are welded with chip, the active on the pcb board
Radiator includes the heat sink for being fixed in pcb board and being welded with chip-side；Position corresponding with chip opens up on the heat sink
There is heat release hole, the heat sink is connected with the heat dissipating ring being connected to heat release hole away from the side of chip；Court is folded in heat dissipating ring
The sleeve being arranged to chip, internal thread of sleeve are connected with for the screw rod mobile towards chip, and screw rod is solid towards one end of chip
It is connected to the conflict piece for contradicting chip.
Through the above technical solutions, the setting of active heat radiating device, by contradicting contact of the piece with chip, by chip operation
When the heat that generates conducted heat on heat dissipating ring by screw rod and sleeve, to accelerate the radiating efficiency of circuit board,
The service life of circuit board is improved indirectly.By the threaded connection of screw rod and sleeve, so that staff is adjustable to contradict piece
With the contact pressure of chip, thus reduce contradict piece and chip contact pressure it is excessive, lead to the possibility of wafer damage, and
So that the heat on chip has obtained quick propagation.
The utility model is further arranged to: several are connected on the circumferential surface of the sleeve for that will contradict piece conduction
The thermally conductive sheet that heat is dispersed.
Through the above technical solutions, the heat of chip cooling is contradicted piece, screw rod is conducted to sleeve, thermally conductive sheet is set
It sets, reduce heat build-up cannot get good heat dissipation on sleeve, thus effectively by the heat accumulated in sleeve by leading
Backing is dispersed into air.
The utility model is further arranged to: the conflict piece is towards being coated with heat dissipating silicone grease on the end face of chip.
Through the above technical solutions, the setting of heat dissipating silicone grease, improve the contact area contradicted between piece and chip, also plus
Fast chip and the heat conduction between piece is contradicted, to improve the radiating efficiency of chip.
The utility model is further arranged to: the heat dissipating ring is provided at the port of chip for active heat removal
Heat-absorbing body；The heat-absorbing body includes the suspended hood affixed away from the port of chip with heat dissipating ring, and the suspended hood connection is set
It is equipped with the fan that heat in heat dissipating ring is sucked out.
Through the above technical solutions, after starting fan air stream can be accelerated to air draught work is carried out in heat dissipating ring
It is logical, the heat of chip cooling is quickly disseminated away by the water conservancy diversion of wind scooper, improves the radiating efficiency of circuit board.
The utility model is further arranged to: several cooling fins are connected on the outer peripheral surface of the heat dissipating ring.
Through the above technical solutions, the setting of cooling fin, improves the radiating efficiency of heat dissipating ring, so that accumulating in heat dissipating ring
Heat be quickly disseminated to by cooling fin in external air.
The utility model is further arranged to: the cooling fin deviates from side of the side affixed with heat dissipating ring towards heat dissipating ring
To offering several slot segmentations.
Through the above technical solutions, slot segmentation opens up, so that several regions are partitioned on heat sink, thus will heat dissipation
The heat of on piece is dispersed, and the accumulation of heat is reduced, and improves the radiating efficiency of cooling fin.
The utility model is further arranged to: several thermal vias are offered on the heat sink.
Through the above technical solutions, thermal vias opens up the air circulation improved between pcb board and heat sink, it is convenient for
The conduction of hot-air, to improve the radiating efficiency of circuit board.
The utility model is further arranged to: contradicting the conflict that piece, screw rod, sleeve and thermally conductive sheet are both configured to copper material
Piece, screw rod, sleeve and thermally conductive sheet.
Through the above technical solutions, the thermal coefficient due to copper is higher, so piece, screw rod, sleeve and thermally conductive sheet will be contradicted
It is set as copper material, the heat conduction of chip is accelerated, improves the radiating efficiency of circuit board.
In conclusion the utility model has the following beneficial effects:
One, the radiating efficiency of circuit board is improved.By contradicting contact of the piece with chip, the heat generated when by chip operation
Amount is conducted heat on heat dissipating ring by screw rod and sleeve, to accelerate the radiating efficiency of circuit board, is also improved indirectly
The service life of circuit board；
Two, the conduction of heat is accelerated.The setting of heat dissipating silicone grease improves the contact area contradicted between piece and chip,
Also it accelerates chip and contradicts the heat conduction between piece, to improve the radiating efficiency of chip.
Detailed description of the invention
Fig. 1 is the overall structure diagram of circuit board；
Fig. 2 is the explosive view of circuit board；
Fig. 3 is the enlarged drawing at Fig. 2 details A, and embodies slot segmentation；
Fig. 4 is the cross-sectional view of active heat radiating device.
In figure, 1, pcb board；11, chip；2, active heat radiating device；21, heat sink；211, heat release hole；212, heat dissipation is logical
Hole；22, support leg；23, screw；24, rubber pad；25, heat dissipating ring；251, thermally conductive sheet；252, sleeve；253, screw rod；254, it supports
Contact；255, heat dissipating silicone grease；256, groove；26, cooling fin；261, slot segmentation；27, heat-absorbing body；271, suspended hood；272, bullet
Piece；273, fixture block；274, fan；275, pod；276, diversion pipe.
Specific embodiment
A kind of circuit board with active heat radiating device, as depicted in figs. 1 and 2, including pcb board 1, the side weldering of pcb board 1
It is connected in several chips 11(the present embodiment there are four the settings of chip 11).
As shown in Figures 2 and 3, active heat radiating device 2 includes being set to the heat sink that pcb board 1 is welded with 11 side of chip
21；The side four corners of heat sink 21 towards pcb board 1 are connected with the support leg 22 of L-type, and by pcb board 1 and are propped up by screw 23
Support foot 22 is affixed, and heat sink 21 is made to be set up in the side of pcb board 1.And pad is equipped with rubber pad between support leg 22 and pcb board 1
24, to prevent support leg 22 from directly contacting with pcb board 1, prevent 23 screw pressure of screw is excessive from damaging to pcb board 1.
It is as shown in Figure 4 herein to offer heat release hole 211(for position corresponding with chip 11 on pcb board 1)；And pcb board 1 deviates from chip 11
Side be connected with connection heat release hole 211(it is as shown in Figure 4 herein) heat dissipating ring 25；25 inner wall of heat dissipating ring is towards 25 axis of heat dissipating ring
It is as shown in Figure 4 herein that the direction of the heart is connected with several thermally conductive sheets 251()；Thermally conductive sheet 251(is as shown in Figure 4 herein) close to heat dissipation
It is as shown in Figure 4 herein that the sleeve 252(being arranged towards 11 direction of chip is connected on the end face in 25 axle center of ring jointly), sleeve 252
The side of axis and chip 11 towards heat sink 21 be mutually perpendicular to；252 internal screw thread of sleeve is connected with to be moved axially along sleeve 252
Screw rod 253(it is as shown in Figure 4 herein)；Screw rod 253 is vertically connected with towards one end of chip 11 and contradicts piece 254(herein such as Fig. 4
It is shown), and it is common on the market that chip 11, which is coated with heat dissipating silicone grease 255(heat dissipating silicone grease 255 towards the side for contradicting piece 254,
The heat dissipating silicone grease 255 for being applied to the surface CPU) (herein as shown in Figure 4), not only increase and contradict piece 254(such as Fig. 4 herein
It is shown) and chip 11 contact area, also improve the heat transfer efficiency of chip 11.When staff passes through screw 23 for heat sink
After 21 are fixed to each other with pcb board 1, it can make to contradict piece 254 by rotary screw 253 and the surface of chip 11 mutually contradicts, thus
So that chip 11 radiate heat pass sequentially through contradict piece 254(it is as shown in Figure 4 herein), screw rod 253(it is as shown in Figure 4 herein) and
Sleeve 252(is as shown in Figure 4 herein) conduction it is as shown in Figure 4 herein to thermally conductive sheet 251() and heat dissipating ring 25 on；And contradict piece
254(is as shown in Figure 4 herein), screw rod 253(it is as shown in Figure 4 herein), sleeve 252(it is as shown in Figure 4 herein) and thermally conductive sheet 251
(herein as shown in Figure 4) is all the preferable copper material of thermal coefficient, to accelerate the conduction of heat, improves dissipating for circuit board
Thermal velocity.
As shown in Figures 2 and 3, the cooling fin 26 of three circles is connected on the outer peripheral surface of heat dissipating ring 25, to improve heat dissipating ring
The emission efficiency of heat on 25；And cooling fin 26 offers several slot segmentations on the end face affixed with heat dissipating ring 25
261, so that several regions are partitioned on cooling fin 26, to be delivered in different regions in the communication process of heat
It is interior, disperse heat, accelerates the area that heat is contacted with outside air, improve radiating efficiency.And it is radiating
It is also provided with several thermal vias 212 on plate 21, accelerates the air circulation between heat sink 21 and pcb board 1, accelerates heat
The propagation efficiency of amount.
As shown in Figure 2 and Figure 4, heat dissipating ring 25 is provided on the end face affixed with heat sink 21 accelerates heat dispersion
Heat-absorbing body 27.Heat-absorbing body 27 includes suspended hood 271, and affixed at the port of suspended hood 271 there are four elastic slice 272, elastic slices 272
Fixture block 273 is connected on towards the side at 271 center of suspended hood, and heat dissipating ring 25 is outside one end affixed with heat sink 21
Groove 256 that is corresponding with 273 position of fixture block and accommodating fixture block 273 is offered on circumferential surface, so that suspended hood 271 passes through fixture block
273, which are connected to heat dissipating ring 25 with the cooperation of groove 256, deviates from the port of heat sink 21；Heat sink 21 deviates from the side of pcb board 1
It is connected with fan 274, the side of fan 274 is connected with pod 275；And it is provided between pod 275 and suspended hood 271
It is connected to the diversion pipe 276 of pod 275 and suspended hood 271 simultaneously.When fan 274 start after, drive heat dissipating ring 25 hot gas to
It is sucked through diversion pipe 276 and pod 275 in suspended hood 271, hot gas is discharged from fan 274, to accelerate chip 11
The heat dissipation performance on surface, the accumulation for reducing heat improve the radiating efficiency of circuit board.
The course of work: it is by screw 23 that support leg 22 and pcb board 1 is fixed, so that heat sink 21 is set up in pcb board 1 and is welded with
Then the side of chip 11 is coated with heat dissipating silicone grease 255 on the surface of chip 11, then rotary screw 253 makes to contradict the contact of piece 254
In the surface of chip 11, subsequently wind scooper is connected at the port of heat dissipating ring 25, opens fan 274, the heat dissipation of circuit board
Efficiency.
This specific embodiment is only the explanation to the utility model, is not limitations of the present invention, ability
Field technique personnel can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but
As long as all by the protection of Patent Law in the scope of the claims of the utility model.
Claims (8)
1. a kind of circuit board with active heat radiating device, including pcb board (1), chip (11) are welded on the pcb board (1),
It is characterized in that: the active heat radiating device (2) includes being fixed in the heat sink (21) that pcb board (1) is welded with chip (11) side；Institute
It states position corresponding with chip (11) on heat sink (21) to offer heat release hole (211), the heat sink (21) deviates from chip
(11) side is connected with the heat dissipating ring (25) being connected to heat release hole (211)；It is folded in heat dissipating ring (25) towards chip (11)
The sleeve (252) of setting, sleeve (252) internal screw thread are connected with for the screw rod (253) mobile towards chip (11), screw rod
(253) the conflict piece (254) for contradicting chip (11) is connected with towards one end of chip (11).
2. a kind of circuit board with active heat radiating device according to claim 1, it is characterized in that: the sleeve (252)
Circumferential surface on be connected with several for the thermally conductive sheet (251) that disperses of heat of piece (254) conduction will to be contradicted.
3. a kind of circuit board with active heat radiating device according to claim 1, it is characterized in that: the conflict piece
(254) towards being coated with heat dissipating silicone grease (255) on the end face of chip (11).
4. a kind of circuit board with active heat radiating device according to claim 1, it is characterized in that: the heat dissipating ring (25)
The heat-absorbing body (27) for active heat removal is provided at the port of chip (11)；The heat-absorbing body (27) includes and dissipates
Hot ring (25) deviates from the suspended hood (271) of the port card of chip (11), and the suspended hood (271) is provided with and communicated with heat dissipating ring
(25) fan (274) that interior heat is sucked out.
5. a kind of circuit board with active heat radiating device according to claim 1, it is characterized in that: the heat dissipating ring (25)
Outer peripheral surface on be connected with several cooling fins (26).
6. a kind of circuit board with active heat radiating device according to claim 5, it is characterized in that: the cooling fin (26)
Several slot segmentations (261) are offered away from the direction of the side affixed with heat dissipating ring (25) towards heat dissipating ring (25).
7. a kind of circuit board with active heat radiating device according to claim 1, it is characterized in that: the heat sink (21)
On offer several thermal vias (212).
8. a kind of circuit board with active heat radiating device according to claim 2, it is characterized in that: contradicting piece (254), spiral shell
Bar (253), sleeve (252) and thermally conductive sheet (251) are both configured to the conflict piece (254), screw rod (253), sleeve (252) of copper material
With thermally conductive sheet (251).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821149790.XU CN208480038U (en) | 2018-07-19 | 2018-07-19 | A kind of circuit board with active heat radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821149790.XU CN208480038U (en) | 2018-07-19 | 2018-07-19 | A kind of circuit board with active heat radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208480038U true CN208480038U (en) | 2019-02-05 |
Family
ID=65211467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821149790.XU Expired - Fee Related CN208480038U (en) | 2018-07-19 | 2018-07-19 | A kind of circuit board with active heat radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208480038U (en) |
-
2018
- 2018-07-19 CN CN201821149790.XU patent/CN208480038U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190205 Termination date: 20210719 |