CN208480040U - A kind of circuit board with heat sinking function - Google Patents
A kind of circuit board with heat sinking function Download PDFInfo
- Publication number
- CN208480040U CN208480040U CN201821153690.4U CN201821153690U CN208480040U CN 208480040 U CN208480040 U CN 208480040U CN 201821153690 U CN201821153690 U CN 201821153690U CN 208480040 U CN208480040 U CN 208480040U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- heat sink
- chip
- sinking function
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010521 absorption reaction Methods 0.000 claims abstract description 3
- 239000006185 dispersion Substances 0.000 claims abstract description 3
- 238000001816 cooling Methods 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 230000011218 segmentation Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 4
- 238000004080 punching Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N al2o3 Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005755 formation reaction Methods 0.000 description 2
- 230000001681 protective Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 240000004282 Grewia occidentalis Species 0.000 description 1
- 229920002456 HOTAIR Polymers 0.000 description 1
- 229920001721 Polyimide Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910001884 aluminium oxide Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000001680 brushing Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Abstract
The utility model discloses a kind of circuit boards with heat sinking function, its key points of the technical solution are that: including pcb board, the pcb board side is welded with chip, the side that the pcb board is welded with chip is connected with heat sink, the conflict piece that heat is conducted for contradicting chip being stamped and formed out is provided on the heat sink, the on piece that contradicts is provided with the thermally conductive sheet for being stamped and formed out the heat rapid dispersion for that will contradict piece absorption.The utility model has the advantages that: the radiating efficiency of circuit board is improved, to improve the service life of heat sink.
Description
Technical field
The utility model relates to field of circuit boards, and in particular to a kind of circuit board with heat sinking function.
Background technique
The title of circuit board has: ceramic circuit board, aluminium oxide ceramics circuit board, aluminium nitride ceramics circuit board, wiring board,
Pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin wiring board, ultrathin circuit board print (copper lithographic technique)
Circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, and the batch production and optimization electrical appliance for fixed circuit are laid out lifting
It acts on.Circuit board can be described as printed wiring board or printed circuit board, and FPC wiring board, which is also known as flexible circuit board flexible circuit board, is
There is height reliability, excellent flexible printed circuit using polyimides or polyester film as one kind made of substrate.Tool
Have the characteristics that Distribution density is high, light-weight, thickness is thin, bending is good) and Rigid Flex FPC and PCB birth and development, urge
This new product of Rigid Flex is given birth to.Therefore, Rigid Flex is exactly flexible circuit board and rigid wiring board, by pressing
Etc. processes, combined by related process requirement, the wiring board with FPC characteristic and PCB characteristic of formation.
However, traditional circuit board can brush anticorrosive paint in circuit board surface during production, but brushing has
During use, the temperature of generation is limited the circuit board of anticorrosive paint by anticorrosive paint, is not easy quickly to disperse, thus
Affect the integral heat sink of circuit board.
Utility model content
The purpose of the utility model is to provide a kind of circuit boards with heat sinking function, its advantage is that improving circuit board
Radiating efficiency, to improve the service life of heat sink.
The above-mentioned technical purpose of the utility model has the technical scheme that
A kind of circuit board with heat sinking function, including pcb board, the pcb board side are welded with chip, the pcb board
The side for being welded with chip is connected with heat sink, and the chip that is used to contradict being stamped and formed out is provided on the heat sink and conducts heat
Piece is contradicted, the on piece that contradicts is provided with the thermally conductive sheet for being stamped and formed out the heat rapid dispersion for that will contradict piece absorption.
Through the above technical solutions, conflict piece and thermally conductive sheet are all stamped and formed out for heat sink, to improve heat sink
Preparation efficiency.The setting for contradicting piece is quickly conducted the heat of chip cooling to heat sink by contradicting chip, to mention
The high radiating efficiency of chip.The setting of thermally conductive sheet can quickly conduct the heat for contradicting piece conduction into external air,
The radiating efficiency of circuit board is improved, to improve the service life of heat sink.
The utility model is further arranged to: there are two the thermally conductive sheet is at least arranged in conflict on piece.
Through the above technical solutions, by thermally conductive sheet at least provided with two, to improve the efficiency of calorie spread, make to
The heat conducted on contact is quickly disseminated in external air.
The utility model is further arranged to: the thermally conductive sheet deviates from the end connecting with conflict piece and offers several points
Slot is cut, so that the end of thermally conductive sheet be made to form several auxiliary heat dissipation blocks.
Through the above technical solutions, opening up for slot segmentation, not only facilitates staff when preparing heat sink, work is simplified
Make the operation of personnel, and be formed by auxiliary heat dissipation block, thermally conductive sheet is divided into several tiny blocks, improves and is connect with air
The area of touching, so that radiating efficiency is higher.
The utility model is further arranged to: the heat sink is installed with several cooling fins away from the side of chip.
Through the above technical solutions, the setting of cooling fin, conducts to the heat of heat sink so that contradicting piece, passes through cooling fin
It is disseminated in external air, improves the efficiency of heat sink heat dissipation.
The utility model is further arranged to: several heat release holes are offered on the heat sink.
Through the above technical solutions, heat release hole opens up, the air circulation between heat sink and pcb board is increased, thus
The heat generated when circuit board being made to work distributes faster.
The utility model is further arranged to: offered on the pcb board several for heat dissipation deflector hole.
Through the above technical solutions, deflector hole opens up the air flowing increased around pcb board, so that hot-air
It is circulated, improves the radiating efficiency of pcb board.
The utility model is further arranged to: the heat sink and cooling fin are set as heat sink and the heat dissipation of copper material
Piece.
Through the above technical solutions, the thermal coefficient due to copper is higher, so setting copper material for heat sink and cooling fin
Matter, accelerates the spread speed of heat, to improve the radiating efficiency of circuit board.
The utility model is further arranged to: the heat sink is set as the heat sink of 0.2cm -0.4cm thickness.
Through the above technical solutions, 0.2cm -0.4cm is set by the thickness of heat sink, so that heat sink itself is not easy
Bending, also plays certain protective effect to circuit board.
In conclusion the utility model has the following beneficial effects:
One, the radiating efficiency of circuit board is improved.The setting for contradicting piece is fast by the heat of chip cooling by contradicting chip
In the conduction to heat sink of speed, to improve the radiating efficiency of chip.The setting of thermally conductive sheet can will contradict the heat of piece conduction
Quickly conduction improves the radiating efficiency of circuit board into external air；
Two, the manufacturing cost for reducing heat sink is all stamped and formed out due to contradicting piece and thermally conductive sheet for heat sink, technique letter
It is single, so not only increasing the manufacture efficiency of heat sink, also reduce the manufacturing cost of heat sink.
Detailed description of the invention
Fig. 1 is the overall structure diagram of circuit board；
Fig. 2 is the explosive view for embodying circuit board；
Fig. 3 is the enlarged drawing at Fig. 2 details A, and embodies slot segmentation；
Fig. 4 is the side view of circuit board.
In figure, 1, pcb board；11, chip；12, deflector hole；2, heat sink；21, support leg；22, screw；23, rubber pad；
24, piece is contradicted；25, thermally conductive sheet；26, slot segmentation；27, auxiliary heat dissipation block；28, heat release hole；3, cooling fin.
Specific embodiment
A kind of circuit board with heat sinking function, as depicted in figs. 1 and 2, including pcb board 1, the side of pcb board 1 are welded with
In several chips 11(the present embodiment there are four the settings of chip 11).
As shown in Fig. 2, the side that pcb board 1 is welded with chip 11 is provided with the heat sink 2 being parallel to each other with pcb board 1, heat dissipation
The side four corners of plate 2 towards pcb board 1 are connected with the support leg 21 of L-type, and affixed by screw 22 and pcb board 1.And it props up
Pad, which is equipped with rubber pad 23, between support foot 21 and pcb board 1 prevents screw 22 to prevent support leg 21 from directly contacting with pcb board 1
Screw pressure is excessive to damage pcb board 1.The copper sheet with a thickness of 0.3cm is set by heat sink 2, does not influence not only to radiate
The heat transfer property of plate 2, but also make heat sink 2 that there is good support performance, certain protective effect is played to pcb board 1.
As shown in Figures 2 and 3, position opposite with chip 11 on heat sink 2 is provided with the conflict piece 24 being stamped and formed out, and supports
Contact 24 is bent to the direction of chip 11, and contacts at the surface of chip 11, so that the heat that the work of chip 11 generates is by supporting
In the conduction to heat sink 2 of contact 24, to improve the radiating efficiency of chip 11.And contradicting setting on piece 24, there are two punching presses
The thermally conductive sheet 25 of formation, thermally conductive sheet 25 are turned down towards the direction away from chip 11, to make to contradict shape between piece 24 and thermally conductive sheet 25
At angle.When contradicting piece 24 and conducting the heat that chip 11 radiates to thermally conductive sheet 25, the contact surface of thermally conductive sheet 25 and air
Product is big, so as to quickly conduct heat in air.Thermally conductive sheet 25 deviates from the end connecting with conflict piece 24 along thermally conductive sheet
25 length directions are opened up there are five slot segmentation 26, so that thermally conductive sheet 25 be made to deviate from and contradict the end that piece 24 is connect and form six
Auxiliary heat dissipation block 27 is dispersed heat when on calorie spread to auxiliary heat dissipation block 27, to be easier to contact with air
It dissipates the heat to the air.
As shown in figure 4, heat sink 2 is connected with the cooling fin 3 of several copper materials away from the side of pcb board 1.When heat is logical
When crossing conflict piece 24 on calorie spread to heat sink 2, cooling fin 3 accelerates the propagation of heat, reduces the heat on heat sink 2
Amount accumulation.
Fig. 2 is reviewed, successively offers heat release hole 28 and deflector hole 12 on heat sink 2 and pcb board 1, to increase heat dissipation
Air circulation between plate 2 and pcb board 1, so that the heat that pcb board 1 radiates, is just evacuated by the air of circulation, improved
The radiating efficiency of circuit board.
The course of work: it is by screw 22 that support leg 21 and pcb board 1 is fixed, so that heat sink 2 is set up in pcb board 1 and is welded with core
Then the side of piece 11 will contradict piece 24 and bend, makes to contradict the surface that piece 24 contacts at chip 11, then again by 25 court of thermally conductive sheet
The side of the off-chip that supports or opposes piece 11 is bent, and improves the radiating efficiency of heat sink 2.
This specific embodiment is only the explanation to the utility model, is not limitations of the present invention, ability
Field technique personnel can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but
As long as all by the protection of Patent Law in the scope of the claims of the utility model.
Claims (8)
1. a kind of circuit board with heat sinking function, including pcb board (1), pcb board (1) side is welded with chip (11),
Be characterized in: the side that the pcb board (1) is welded with chip (11) is connected with heat sink (2), is provided with punching on the heat sink (2)
Swaging at for contradicting the conflict piece (24) of chip (11) conduction heat, be provided on the conflict piece (24) and be stamped and formed out use
In the thermally conductive sheet (25) for the heat rapid dispersion that will contradict piece (24) absorption.
2. a kind of circuit board with heat sinking function according to claim 1, it is characterized in that: the thermally conductive sheet (25) is at least
On contradicting piece (24) there are two settings.
3. a kind of circuit board with heat sinking function according to claim 1, it is characterized in that: the thermally conductive sheet (25) deviates from
Several slot segmentations (26) are offered with the end that piece (24) are connect is contradicted, so that the end of thermally conductive sheet (25) be made to form several
Auxiliary heat dissipation block (27).
4. a kind of circuit board with heat sinking function according to claim 1, it is characterized in that: the heat sink (2) deviates from
The side of chip (11) is installed with several cooling fins (3).
5. a kind of circuit board with heat sinking function according to claim 1, it is characterized in that: being opened on the heat sink (2)
Equipped with several heat release holes (28).
6. a kind of circuit board with heat sinking function according to claim 1, it is characterized in that: being opened up on the pcb board (1)
Have several for heat dissipation deflector hole (12).
7. a kind of circuit board with heat sinking function according to claim 4, it is characterized in that: the heat sink (2) and dissipating
Backing (3) is set as the heat sink (2) and cooling fin (3) of copper material.
8. a kind of circuit board with heat sinking function according to claim 1, it is characterized in that: the heat sink (2) is arranged
For the heat sink (2) of 0.2cm -0.4cm thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821153690.4U CN208480040U (en) | 2018-07-19 | 2018-07-19 | A kind of circuit board with heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821153690.4U CN208480040U (en) | 2018-07-19 | 2018-07-19 | A kind of circuit board with heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208480040U true CN208480040U (en) | 2019-02-05 |
Family
ID=65211628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821153690.4U Expired - Fee Related CN208480040U (en) | 2018-07-19 | 2018-07-19 | A kind of circuit board with heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208480040U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351992A (en) * | 2019-07-25 | 2019-10-18 | 天津七一二通信广播股份有限公司 | The LTE module radiator structure and installation method of rail locomotive TAU communication equipment |
-
2018
- 2018-07-19 CN CN201821153690.4U patent/CN208480040U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110351992A (en) * | 2019-07-25 | 2019-10-18 | 天津七一二通信广播股份有限公司 | The LTE module radiator structure and installation method of rail locomotive TAU communication equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190205 Termination date: 20210719 |