CN208385414U - A kind of metal-oxide-semiconductor of included heat dissipation - Google Patents
A kind of metal-oxide-semiconductor of included heat dissipation Download PDFInfo
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- CN208385414U CN208385414U CN201820956921.9U CN201820956921U CN208385414U CN 208385414 U CN208385414 U CN 208385414U CN 201820956921 U CN201820956921 U CN 201820956921U CN 208385414 U CN208385414 U CN 208385414U
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- heat dissipation
- aluminium sheet
- radiating shell
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Abstract
The utility model discloses a kind of metal-oxide-semiconductors of included heat dissipation, it is related to metal-oxide-semiconductor technical field；The bottom of chip body is electrically connected with chip pin, radiation aluminium sheet body is provided on the upside of chip body, radiation aluminium sheet body is connected to chip body internal circuit, it is corresponding on the outer upper side wall of the radiation aluminium sheet body to be provided with clamping groove, clamping groove is arc, aluminum enclosure is internally provided with installation slotted eye, several supporting blocks are symmetrically installed on the inner sidewall of installation slotted eye, radiating shell is installed in installation slotted eye, the lateral wall of radiating shell is connected with several supporting blocks, radiating shell is hollow type, and the inner sidewall of radiating shell is corrugated, chip body is plugged on aluminum strip；The utility model is able to achieve rapid cooling, and radiating efficiency is high, while can save the heat dissipation time, and manufacturing cost is low；This product realizes auxiliary heat dissipation by aluminum strip convenient for the installation of quick plug-in；This product structure is simple, and designs rationally.
Description
Technical field:
The utility model belongs to technical field, and in particular to a kind of metal-oxide-semiconductor of included heat dissipation.
Background technique:
Metal-oxide-semiconductor is metal (metal)-oxide (oxide)-semiconductor (semiconductor) field effect transistor, or
Person claims to be metal-insulator (insulator)-semiconductor.The source and drain of metal-oxide-semiconductor can be exchanged, they are
The N-type region formed in p-type backgate.In most cases, this area Liang Ge is the same, will not both ends are exchanged
Influence the performance of device.Such device is considered symmetrical.
Existing metal-oxide-semiconductor when in use its own cannot radiate or poor radiation, height can occur after causing metal-oxide-semiconductor to be installed
The phenomenon of temperature, shortens the working life, complicated for operation.
Utility model content:
For solve existing metal-oxide-semiconductor when in use its own cannot radiate or poor radiation, energy after causing metal-oxide-semiconductor to be installed
There is the phenomenon that high temperature, shortens the working life, problem complicated for operation；It is included scattered that the purpose of this utility model is to provide one kind
The metal-oxide-semiconductor of heat.
A kind of metal-oxide-semiconductor of included heat dissipation of the utility model, it includes chip body, chip pin, radiation aluminium sheet body；Core
The bottom of piece ontology is electrically connected with chip pin, and radiation aluminium sheet body, radiation aluminium sheet body and chip are provided on the upside of chip body
Body interior circuit communication, corresponding on the outer upper side wall of the radiation aluminium sheet body to be provided with clamping groove, clamping groove is arc, institute
Stating radiation aluminium sheet body includes aluminum enclosure, supporting block, radiating shell；Aluminum enclosure is internally provided with installation slotted eye, installation slotted eye
Several supporting blocks are symmetrically installed on inner sidewall, radiating shell, the lateral wall and number of radiating shell are installed in installation slotted eye
A supporting block is connected, and radiating shell is hollow type, and the inner sidewall of radiating shell be it is corrugated, chip body is plugged on aluminum strip
On, it is provided with insulating film on the lateral wall of aluminum strip, chip inserted slot is provided on aluminum strip, the interior upside of chip inserted slot is equipped with
Clamping apparatus, clamping apparatus are mutually clamped with radiation aluminium sheet body, and heat dissipation block is equipped on the interior upper side wall of chip inserted slot, heat dissipation
The upper end of block is fixedly connected with several heat-dissipating pipes, and several heat-dissipating pipes are worn and connect in the jack hole of aluminum strip, several heat-dissipating pipes
Upper end is connected with heat radiation seat body, and heat radiation seat body is fixed on the upper surface of aluminum strip.
Preferably, the clamping apparatus includes two elasticity of plastics pieces, clamping pillar, two elasticity of plastics pieces are symmetrically set
The interior upside of chip inserted slot is set and be mounted on, clamping pillar is mounted on the interior upper side wall of two elasticity of plastics pieces, is clamped
Pillar is mutually clamped with clamping.
Preferably, the heat dissipation block includes heat-dissipating casing and interior heat-collecting strip；The inside of heat-dissipating casing is equipped with interior collection
Hot item is provided with the arc groove of several indents on the lateral wall of heat-dissipating casing.
Preferably, the heat radiation seat body 8 is honeycomb-type heat radiation pedestal.
Compared with prior art, the utility model has the following beneficial effects:
One, it is able to achieve rapid cooling, and radiating efficiency is high, while the heat dissipation time can be saved, manufacturing cost is low；
Two, this product is convenient for the installation of quick plug-in, and realizes auxiliary heat dissipation by aluminum strip；
Three, this product structure is simple, and designs rationally.
Detailed description of the invention:
The present invention is described in detail by the following detailed description and drawings for ease of explanation,.
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the structural schematic diagram of metal-oxide-semiconductor in the utility model；
Fig. 3 is the structural schematic diagram of heat dissipation block in the utility model；
Fig. 4 is the structural schematic diagram of radiation aluminium sheet body in the utility model；
Fig. 5 is the structural schematic diagram of clamping apparatus in the utility model.
In figure: 1- chip body；2- chip pin；3- radiation aluminium sheet body；4- aluminum strip；5- clamping apparatus；6- heat dissipation block；
7- heat-dissipating pipe；8- heat radiation seat body；3-1- aluminum enclosure；3-2- supporting block；3-3- radiating shell；3-4- clamping groove.
Specific embodiment:
To make the objectives, technical solutions and advantages of the present invention clearer, below by shown in the accompanying drawings
Specific embodiment describes the utility model.However, it should be understood that these descriptions are merely illustrative, and it is not intended to limit this reality
With novel range.In addition, in the following description, descriptions of well-known structures and technologies are omitted, to avoid unnecessarily mixing
Confuse the concept of the utility model.
Here, it should also be noted that, in order to avoid having obscured the utility model because of unnecessary details, in the accompanying drawings
It illustrate only the structure and/or processing step closely related with scheme according to the present utility model, and be omitted practical with this
The little other details of new relationship.
As shown in figure 1, figure 2, figure 3, figure 4 and figure 5, present embodiment uses following technical scheme: it includes chip sheet
Body 1, chip pin 2, radiation aluminium sheet body 3；The bottom of chip body 1 is electrically connected with chip pin 2, and chip pin 2 is able to achieve core
The electrical connection of piece ontology 1, and radiation aluminium sheet body 3 is able to achieve the heat dissipation of chip body 1, the upside of chip body 1 is provided with heat dissipation
Aluminium flake body 3, radiation aluminium sheet body 3 are connected to 1 internal circuit of chip body,
As shown in Figure 3, Figure 4, corresponding on the outer upper side wall of the radiation aluminium sheet body 3 to be provided with clamping groove 3-4, clamping groove
3-1 is arc, and the quick plug-in that clamping groove is able to achieve chip body is fixed, the radiation aluminium sheet body 3 include aluminum enclosure 3-1,
Supporting block 3-2, radiating shell 3-3；Aluminum enclosure 3-1's is internally provided with installation slotted eye, and aluminum enclosure 3-1 is able to achieve external auxiliary
It radiates, several supporting block 3-2 is symmetrically installed on the inner sidewall of installation slotted eye, supporting block 3-2 is able to achieve whole support, peace
Radiating shell 3-3 is installed, radiating shell 3-3 is able to achieve internal heat dissipation, can improve thermal diffusivity, radiating shell 3- in tankage hole
3 lateral wall is connected with several supporting block 3-2, and radiating shell 3-3 is hollow type, and the inner sidewall of radiating shell 3-3 is wave
Line formula, the radiating shell of hollow type is able to achieve the revolution of heat, while corrugated inner sidewall can improve contact area, convenient for fast
Speed heat dissipation.
As shown in Figure 1, chip body 1 is plugged on aluminum strip 4, it is able to achieve the fast-spliced installation of chip body 1, and insert
It is able to achieve quick clamping after connecing, insulating film is provided on the lateral wall of aluminum strip 4, insulating film is able to achieve insulation, for blocking aluminium flake
It electrically conducts with aluminum strip, improves safety, be provided with chip inserted slot on aluminum strip 4, the interior upside of chip inserted slot is equipped with card
Connection device 5, clamping apparatus 5 is clamped with 3 phase of radiation aluminium sheet body, convenient for the clamping of radiation aluminium sheet body 3, the interior upside of chip inserted slot
Heat dissipation block 6 is installed, the auxiliary heat dissipation of 6 energy radiation aluminium sheet body 3 of heat dissipation block, the upper end of heat dissipation block 6 is fixedly connected on wall
There are several heat-dissipating pipes 7, the heat of heat dissipation block 6 is transmitted to heat radiation seat body by heat-dissipating pipe 7, is radiated, can be subtracted again by heat radiation seat body
The time radiated less, and several heat-dissipating pipes 7 are worn and are connect in the jack hole of aluminum strip 4, the upper end of several heat-dissipating pipes 7 is connected with radiating seat
Body 8, and heat radiation seat body 8 is fixed on the upper surface of aluminum strip 4.
Further, the clamping apparatus 5 includes two elasticity of plastics piece 5-1, clamping pillar 5-2, two elasticity of plastics
Piece 5-1 is symmetrical arranged and is mounted on the interior upside of chip inserted slot, is mounted on the interior upper side wall of two elasticity of plastics piece 5-1
It is clamped pillar 5-2, clamping pillar 5-2 is clamped with clamping groove 3-4 phase, and elasticity of plastics piece 5-1 deformation can occur in grafting, be convenient for
Quickly clamping, while it being clamped the clamping that pillar 5-2 is able to achieve radiation aluminium sheet body 3, it is easy to implement Fast Installation.
Further, the heat dissipation block 6 includes heat-dissipating casing 6-1 and interior heat-collecting strip 6-2；The inside of heat-dissipating casing 6-1
Interior heat-collecting strip 6-2 is installed, the arc groove 6-1 of several indents is provided on the lateral wall of heat-dissipating casing 6-1, passes through interior heat-collecting strip
6-2 realizes quick heat-collector, and realizes heat dissipation by heat-dissipating casing 6-1, can improve thermal diffusivity.
Further, the heat radiation seat body 8 is honeycomb-type heat radiation pedestal, can improve heat dissipation performance.
The working principle of the present embodiment is as follows: radiation aluminium sheet body 3 is connected to chip body internal circuit, for core
Piece radiates.Electric vehicle metal-oxide-semiconductor is both secured on aluminum strip, is fixed in such a way that card slot is fixed, is able to achieve quickly solid
It is fixed, the time of installation can be saved, and stability is high, the surface of aluminum strip is covered with insulating film, for blocking aluminium flake and aluminum strip electrical
Conducting, while aluminium flake again can be by aluminum strip rapid cooling, and aluminum strip is made up of heat dissipation block 6, heat-dissipating pipe 7, heat radiation seat body 8
Heat transfer radiating device realize by internal heat be transmitted to it is external carry out rapid cooling, heat dissipation performance can be improved.
Claims (4)
1. a kind of metal-oxide-semiconductor of included heat dissipation, it is characterised in that: it includes chip body, chip pin, radiation aluminium sheet body；Chip
The bottom of ontology is electrically connected with chip pin, and radiation aluminium sheet body, radiation aluminium sheet body and chip sheet are provided on the upside of chip body
Internal portion's circuit communication, corresponding on the outer upper side wall of the radiation aluminium sheet body to be provided with clamping groove, clamping groove is arc, described
Radiation aluminium sheet body includes aluminum enclosure, supporting block, radiating shell；Aluminum enclosure is internally provided with installation slotted eye, installation slotted eye it is interior
Several supporting blocks are symmetrically installed on side wall, radiating shell is installed in installation slotted eye, the lateral wall of radiating shell with it is several
Supporting block is connected, and radiating shell is hollow type, and the inner sidewall of radiating shell be it is corrugated, chip body is plugged on aluminum strip
On, it is provided with insulating film on the lateral wall of aluminum strip, chip inserted slot is provided on aluminum strip, the interior upside of chip inserted slot is equipped with
Clamping apparatus, clamping apparatus are mutually clamped with radiation aluminium sheet body, and heat dissipation block is equipped on the interior upper side wall of chip inserted slot, heat dissipation
The upper end of block is fixedly connected with several heat-dissipating pipes, and several heat-dissipating pipes are worn and connect in the jack hole of aluminum strip, several heat-dissipating pipes
Upper end is connected with heat radiation seat body, and heat radiation seat body is fixed on the upper surface of aluminum strip.
2. a kind of metal-oxide-semiconductor of included heat dissipation according to claim 1, it is characterised in that: the clamping apparatus includes two
Elasticity of plastics piece, clamping pillar, two elasticity of plastics pieces are symmetrical arranged and are mounted on the interior upside of chip inserted slot, two plastics
Clamping pillar is mounted on the interior upper side wall of elastic piece, clamping pillar is mutually clamped with clamping.
3. a kind of metal-oxide-semiconductor of included heat dissipation according to claim 1, it is characterised in that: the heat dissipation block includes heat dissipation
Shell and interior heat-collecting strip；The inside of heat-dissipating casing is equipped with interior heat-collecting strip, and several indents are provided on the lateral wall of heat-dissipating casing
Arc groove.
4. a kind of metal-oxide-semiconductor of included heat dissipation according to claim 1, it is characterised in that: the heat radiation seat body is honeycomb fashion
Heat radiation seat body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820956921.9U CN208385414U (en) | 2018-06-21 | 2018-06-21 | A kind of metal-oxide-semiconductor of included heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820956921.9U CN208385414U (en) | 2018-06-21 | 2018-06-21 | A kind of metal-oxide-semiconductor of included heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208385414U true CN208385414U (en) | 2019-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820956921.9U Active CN208385414U (en) | 2018-06-21 | 2018-06-21 | A kind of metal-oxide-semiconductor of included heat dissipation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111916412A (en) * | 2020-08-06 | 2020-11-10 | 互升科技(深圳)有限公司 | MOS (Metal oxide semiconductor) tube and preparation method thereof |
| CN112687541A (en) * | 2020-12-28 | 2021-04-20 | 江苏晟华半导体有限公司 | FRD device with high heat dissipation performance and manufacturing process thereof |
-
2018
- 2018-06-21 CN CN201820956921.9U patent/CN208385414U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111916412A (en) * | 2020-08-06 | 2020-11-10 | 互升科技(深圳)有限公司 | MOS (Metal oxide semiconductor) tube and preparation method thereof |
| CN111916412B (en) * | 2020-08-06 | 2022-07-12 | 互升科技(深圳)有限公司 | MOS (Metal oxide semiconductor) tube and preparation method thereof |
| CN112687541A (en) * | 2020-12-28 | 2021-04-20 | 江苏晟华半导体有限公司 | FRD device with high heat dissipation performance and manufacturing process thereof |
| CN112687541B (en) * | 2020-12-28 | 2021-07-27 | 江苏晟华半导体有限公司 | FRD device and manufacturing process thereof |
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