CN203364502U - Refrigerating system device with radiating guide pipe - Google Patents
Refrigerating system device with radiating guide pipe Download PDFInfo
- Publication number
- CN203364502U CN203364502U CN 201320272858 CN201320272858U CN203364502U CN 203364502 U CN203364502 U CN 203364502U CN 201320272858 CN201320272858 CN 201320272858 CN 201320272858 U CN201320272858 U CN 201320272858U CN 203364502 U CN203364502 U CN 203364502U
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- copper pipe
- cold
- hot
- aluminum
- aluminium
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A refrigerating system device with a radiating guide pipe comprises a semiconductor refrigerating piece, cold aluminum, a heat conduction substrate, hot aluminum, a thermal insulation part and a fan. The fan is opposite to the hot aluminum, the heat conduction substrate is attached to a hot surface of the semiconductor refrigerating piece, the semiconductor refrigerating piece is fixed in a fixing hole of the thermal insulation part, and a cold conduction substrate of the cold aluminum stretches into the fixing hole and is attached to a refrigerating surface of the semiconductor refrigerating piece. The refrigerating system device is characterized by further comprising a radiating copper pipe, one end of the radiating copper pipe is fixedly connected with the heat conduction substrate, the other end of the radiating copper pipe penetrates through the hot aluminum and stretches out, and coolant is contained in the radiating copper pipe. By the adoption of the radiating copper pipe, the hot aluminum can be separated from the cold aluminum by a certain distance, and operating conditions of the semiconductor refrigerating piece are improved; the size of the hot aluminum can be increased, and the radiating effect is improved; finally, efficiency of the semiconductor refrigerating piece is improved.
Description
Technical field
The utility model relates to a kind of semiconductor refrigerating assembly.
Background technology
Currently available technology, a kind of refrigerating system device that heat radiation conduit is set, comprise semiconductor chilling plate, cold aluminium, thermally conductive substrate, hot aluminium, thermal insulation barriers and fan, fan is relative with hot aluminium, thermally conductive substrate and the hot side laminating of partly leading cooling piece, partly lead cooling piece and be fixed in the fixing hole of thermal insulation barriers, the cold conductive substrate of cold aluminium stretches in fixing hole and fits with the chill surface of partly leading cooling piece.Existing problems are: heat radiation is slow, poor refrigerating efficiency.
Summary of the invention
The purpose of this utility model is: a kind of refrigerating system device that heat radiation conduit is set is provided, and it can change layout, improves refrigeration.
The utility model is achieved in that a kind of refrigerating system device that heat radiation conduit is set, comprise semiconductor chilling plate, cold aluminium, thermally conductive substrate, hot aluminium, thermal insulation barriers and fan, fan is relative with hot aluminium, thermally conductive substrate and the hot side laminating of partly leading cooling piece, partly lead cooling piece and be fixed in the fixing hole of thermal insulation barriers, the cold conductive substrate of cold aluminium stretches in fixing hole and fits with the chill surface of partly leading cooling piece; Its special character is: also comprise heat dissipation copper pipe,
Described heat dissipation copper pipe one end is fixedly connected with thermally conductive substrate, the other end is worn superheated aluminum and stretch out; In described heat dissipation copper pipe, refrigerant is arranged.
A kind of refrigerating system device that heat radiation conduit is set of the utility model, owing to adopting such structure, the setting of heat dissipation copper pipe, the one, can make hot aluminium and cold aluminium at a certain distance, improve the condition of work of semiconductor chilling plate, the 2nd, the volume of hot aluminium can be increased, improve radiating effect; Thereby improve the efficiency of semiconductor chilling plate.
The accompanying drawing explanation
Fig. 1 is stereogram of the present utility model.
Fig. 2 is three-dimensional exploded view of the present utility model.
The specific embodiment
Below in conjunction with accompanying drawing, the utility model is further described.
As shown in Figure 1, Figure 2, Figure 3, Figure 4, a kind of refrigerating system device that heat radiation conduit is set, comprise semiconductor chilling plate 1, cold aluminium 2, thermally conductive substrate 3, hot aluminium 4, thermal insulation barriers 5 and fan 6, fan 6 is relative with hot aluminium 4, thermally conductive substrate 3 and the hot side laminating of partly leading cooling piece 1, partly lead cooling piece 1 and be fixed in the fixing hole 51 of thermal insulation barriers 5, the cold conductive substrate 21 of cold aluminium 2 stretches in fixing hole 51 and fits with the chill surface of partly leading cooling piece 1;
Described hot aluminium 4 consists of several aluminium flakes 41, gapped between adjacent two aluminium flakes.
Also comprise heat dissipation copper pipe 7,
Described heat dissipation copper pipe 7 one ends are fixedly connected with thermally conductive substrate 3, the other end is worn superheated aluminum 4 and stretches out; In described heat dissipation copper pipe 7, refrigerant is arranged.Described heat dissipation copper pipe 7 is through the aluminium flake 41. that forms hot aluminium 4
Also comprise fan base 8, fan base 8 is fixedly connected with hot aluminium 4, and fan 6 is fixed on the support 81 of fan base 8.
Connector 9 screws togather with nut through collet 91, thermally conductive substrate 3, thermal insulation barriers 5, and there is the end that covers nut and connector 9 every cold cover 92 end of connecting rod 9.
Above-described is only preferential embodiment of the present utility model.It should be pointed out that for the person of ordinary skill of the art, in the situation that do not break away from the utility model principle, can also make some improvement and modification, this also is considered as protection domain of the present utility model.
Claims (1)
1. the refrigerating system device that heat radiation conduit is set, comprise semiconductor chilling plate, cold aluminium, thermally conductive substrate, hot aluminium, thermal insulation barriers and fan, fan is relative with hot aluminium, thermally conductive substrate and the hot side laminating of partly leading cooling piece, partly lead cooling piece and be fixed in the fixing hole of thermal insulation barriers, the cold conductive substrate of cold aluminium stretches in fixing hole and fits with the chill surface of partly leading cooling piece; It is characterized in that: also comprise heat dissipation copper pipe,
Described heat dissipation copper pipe one end is fixedly connected with thermally conductive substrate, the other end is worn superheated aluminum and stretch out; In described heat dissipation copper pipe, refrigerant is arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320272858 CN203364502U (en) | 2013-05-20 | 2013-05-20 | Refrigerating system device with radiating guide pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320272858 CN203364502U (en) | 2013-05-20 | 2013-05-20 | Refrigerating system device with radiating guide pipe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203364502U true CN203364502U (en) | 2013-12-25 |
Family
ID=49812252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320272858 Expired - Lifetime CN203364502U (en) | 2013-05-20 | 2013-05-20 | Refrigerating system device with radiating guide pipe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203364502U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106123659A (en) * | 2016-08-12 | 2016-11-16 | 中山市凯得电器有限公司 | The heat pipe of a kind of Electronic Wine Cabinet and cold and hot generating means |
| CN109469992A (en) * | 2018-12-06 | 2019-03-15 | 广州强睿电子有限公司 | A kind of Portable movable semiconductor refrigerating stick |
-
2013
- 2013-05-20 CN CN 201320272858 patent/CN203364502U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106123659A (en) * | 2016-08-12 | 2016-11-16 | 中山市凯得电器有限公司 | The heat pipe of a kind of Electronic Wine Cabinet and cold and hot generating means |
| CN106123659B (en) * | 2016-08-12 | 2018-01-16 | 中山市凯得电器有限公司 | A kind of heat pipe of Electronic Wine Cabinet and cold and hot generating means |
| CN109469992A (en) * | 2018-12-06 | 2019-03-15 | 广州强睿电子有限公司 | A kind of Portable movable semiconductor refrigerating stick |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180327 Address after: No. 41, No. 41, Xingye North Road, Nantou Town, Zhongshan, Guangdong Patentee after: ZHONGSHAN CANDOR ELECTRICAL APPLIANCE CO.,LTD. Address before: Huangpu town, Guangdong city of Zhongshan Province, the 528429 Industrial Zone No. three East Yan Kaide Electric Co. Ltd. Patentee before: Zhongshan Candor Electric Appliances Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131225 |