CN208378737U - A kind of ceramic packaging body - Google Patents
A kind of ceramic packaging body Download PDFInfo
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- CN208378737U CN208378737U CN201820809363.3U CN201820809363U CN208378737U CN 208378737 U CN208378737 U CN 208378737U CN 201820809363 U CN201820809363 U CN 201820809363U CN 208378737 U CN208378737 U CN 208378737U
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Abstract
The utility model discloses a kind of ceramic packaging body, including base of ceramic and cover board, the base of ceramic includes bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；The bonding layer includes: the first metal layer, and the first metal layer is formed in the upper surface of side wall；Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer.Ceramic packaging body described in the utility model makes ceramic packaging body be able to maintain good air-tightness by the selection of setting utilizingthebrazing material layer and implementation in the bonding layer of ceramic packaging body, meets properties of product, reduces base of ceramic embrittlement risk, reduces production cost.
Description
Technical field
The utility model relates to a kind of ceramic packaging bodies, and in particular to a kind of ceramic packaging body of electronic component.
Background technique
Inside and outside electrified connection is realized for placing electronic component, by metallization coating in the inside of ceramic packaging body, extensively
It is general to be applied to quartz oscillator resonator.
The structural schematic diagram of existing ceramic packaging body is as shown in Fig. 1, wherein 1 is base of ceramic；2 be electric slurry tungsten
Slurry；3 be electronickelling；4 be yellow gold solder；5 be that can cut down (Fe-Co-Ni) ring；6 be electronickelling；7 be electroplating gold；8 be cover board
(material can be cut down)；In the prior art, by will buy be covered with yellow gold solder cut down ring and ceramic substrate (containing 2,3 layers)
Heat treatment is after pressing to prepare structure shown in 4 and 5, and thickness >=25um of yellow gold solder.
Since yellow gold solder is thicker (>=25um) in current used material, silver content is high, and silver is used as noble metal, at
This is higher；And the use that can cut down ring also increases cost, process flow is complex；During soldering and sealing, envelope is participated in cover board
Wlding material is that can cut down material, and fusing point is higher, and moment is also easy to produce amount of heat, and ground porcelain body is easy to produce larger thermal stress, is held
Easily ground porcelain body is cracked.
Summary of the invention
The purpose of the utility model is to overcome provide a kind of ceramic packaging body in place of the shortcomings of the prior art.
To achieve the above object, the technical solution that the utility model is taken are as follows: a kind of ceramic packaging body, including base of ceramic
And cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described to connect
Closing layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer；
The utilizingthebrazing material layer is layers of copper, silver layer, nickel layer, Ni-P layers, the overlapping layer of silver layer and layers of copper, silver layer and layers of copper
The overlapping layer of alternately stacked layer, Ni-P layers and silver layer, the stacked layers of Ni-P layers and silver layer, nickel layer and silver layer overlapping layer,
Alternately stacked layer, Ni-P layers and the layers of copper of nickel layer and the alternately stacked layer of silver layer, the overlapping layer of nickel layer and layers of copper, nickel layer and layers of copper
Overlapping layer, overlapping layer, nickel layer and Ni-P layers of alternately stacked layer, nickel layer and Ni-P layers of Ni-P layers and layers of copper alternately stacked
The alternately stacked layer of the overlapping layer or nickel layer and Ni-P of layer, nickel layer and Ni-P layers and silver layer layer and silver layer.
The silver layer and the overlapping layer of layers of copper indicate to form one layer of silver layer on the first metal layer, then one is formed on silver layer
Layer layers of copper, or one layer of layers of copper is formed on the first metal layer, then one layer of silver layer is formed in layers of copper.The silver layer and layers of copper
Alternately stacked layer indicates to form silver layer on the first metal layer and layers of copper is alternately stacked, the alternately stacked layer of silver layer and layers of copper and the
The relationship of one metal layer can be with are as follows: the first metal layer-layers of copper-silver layer-layers of copper, or the first metal layer-layers of copper-silver layer-
Layers of copper-silver layer.The overlapping layer of described Ni-P layers and silver layer indicates to form layer of Ni-P layers on the first metal layer, then at Ni-P layers
One layer of silver layer of upper formation, or one layer of silver layer is formed on the first metal layer, then layer of Ni-P layers is formed on silver layer.It is described
The stacked layers expression of Ni-P layers and silver layer forms Ni-P layers and silver layer of formation on the first metal layer on the first metal layer
Alternately stacked, the relationship of Ni-P layers and the alternately stacked layer of silver layer and the first metal layer can be with are as follows:-Ni-P layers of the first metal layer-silver
- Ni-P layers of layer, or the first metal layer-Ni-P layers-silver layer of-Ni-P layers-silver layer.The overlapping layer table of the nickel layer and silver layer
Show one layer of silver layer of formation on the first metal layer, then forms one layer of nickel layer on silver layer, or form one on the first metal layer
Layer nickel layer, then one layer of silver layer is formed on nickel layer.The alternately stacked layer of the nickel layer and silver layer indicates shape on the first metal layer
Alternately stacked at silver layer and nickel layer, the relationship of the alternately stacked layer and the first metal layer of silver layer and nickel layer can be with are as follows: the first metal
Layer-nickel layer-silver layer-nickel layer, or the first metal layer-nickel layer-silver layer-nickel layer-silver layer.The overlapping of the nickel layer and layers of copper
Layer indicates to form one layer of layers of copper on the first metal layer, then one layer of nickel layer, or shape on the first metal layer are formed in layers of copper
At one layer of nickel layer, then one layer of layers of copper is formed on nickel layer.The nickel layer and the alternately stacked layer of layers of copper are indicated in the first metal layer
Upper formation layers of copper and nickel layer are alternately stacked, and the relationship of the alternately stacked layer and the first metal layer of layers of copper and nickel layer can be with are as follows: first
Metal layer-nickel layer-layers of copper-nickel layer, or the first metal layer-nickel layer-layers of copper-nickel layer-layers of copper.Ni-P layers and the layers of copper
Overlapping layer indicate to form layer of Ni-P layer on the first metal layer, then one layer of layers of copper of formation on Ni-P layer, or first
One layer of layers of copper is formed on metal layer, then layer of Ni-P layers is formed in layers of copper.The alternately stacked layer table of described Ni-P layers and layers of copper
Show to be formed on the first metal layer and forms Ni-P layers of, Ni-P layer and layers of copper alternating weight alternately stacked with layers of copper on the first metal layer
The relationship of lamination and the first metal layer can be with are as follows:-Ni-P layers of-Ni-P layers-layers of copper of the first metal layer, or the first metal
Layer-Ni-P layers-layers of copper of-Ni-P layers-layers of copper.The overlapping layer of the nickel layer and Ni-P indicate to form one layer of nickel on the first metal layer
Layer, then layer of Ni-P layers is formed on nickel layer, or form layer of Ni-P layers on the first metal layer, then formed on Ni-P layers
One layer of nickel layer.The alternately stacked layer of the nickel layer and Ni-P indicate to form nickel layer on the first metal layer and Ni-P layers alternately heavy
Folded, the relationship of nickel layer and Ni-P layers of alternately stacked layer and the first metal layer can be with are as follows: the first metal layer-- Ni-P layers-nickel of nickel layer
Layer, or the first metal layer-- Ni-P layers of-Ni-P layers-nickel layer of nickel layer.The overlapping layer table of the nickel layer and Ni-P and silver layer
Show on the first metal layer formation one layer of nickel layer, on nickel layer formed layer of Ni-P layer, on Ni-P layer formation one layer of silver layer or
Person forms-P layers of layer of Ni on the first metal layer, and one layer of nickel layer is formed on Ni-P layer, then one layer of silver layer is formed on nickel layer,
Sequence between three layers can be replaced.The expression of the alternately stacked layer of the nickel layer and Ni-P and silver layer is formed on the first metal layer
Nickel layer and Ni-P layers it is alternately stacked, then form silver layer on nickel layer or Ni-P layers.Nickel layer and Ni-P layers and silver layer it is alternately stacked
Layer and the relationship of the first metal layer can be with are as follows: the first metal layer-- Ni-P layers of nickel layer-silver layer-nickel layer, or the first metal
- Ni-P layers of layer-nickel layer-silver layer-- Ni-P layers-silver layer of nickel layer.
The material of base of ceramic be can be general ceramic material, such as aluminium oxide, aluminium nitride, silicon carbide, zirconium oxide.Lid
The material of plate can be aluminium silicon carbide, 42 alloys (Fe-42%Ni), 194 alloys (Cu-2.3%-0.03%P) etc..This is practical new
The utilizingthebrazing material layer selection above-mentioned material of ceramic packaging body described in type substitutes current silver-copper brazing alloy solder+can cut down part (in Fig. 1
4 and 5), have the advantage that
(1), temperature when can reduce soldering and sealing: in the prior art, ring can be cut down by generalling use welds with cover board, can cut down ring preparation
When need to prepare one layer of solder layer ring bottom can be being cut down, solder layer is generally yellow gold solder layer or silver-tin alloy solder layer,
In order to reach preferable sealing effect, the soldering and sealing temperature that ring needs about 1400 DEG C with cover board welding can be cut down, using the utility model
Utilizingthebrazing material layer, brazing material and the direct soldering and sealing of cover board, soldering and sealing temperature can be reduced to significantly lower than 1400 DEG C, reduce pottery
Porcelain pedestal embrittlement risk, and soldering and sealing works well, good seal performance；
(2) reduce production cost: existing way yellow gold solder layer is thicker, silver be used as noble metal, higher cost, and this
Utilizingthebrazing material layer described in utility model can reduce the usage amount of silver, reduce the consumption of silver, and without using that can cut down ring；
(3), utilizingthebrazing material layer described in the utility model can be real by plating, chemical plating, vapor deposition, sputtering kinds of processes
Existing, there are many process choice, feasibility is high；
(4), new brazing material layer processing range is wider, this layer of overall thickness can be controlled in 1~30um, and technology controlling and process is simple.
As the preferred embodiment of ceramic packaging body described in the utility model, the bonding layer further includes protective layer；Institute
Protective layer is stated to be formed on utilizingthebrazing material layer.Protective layer can prevent utilizingthebrazing material layer affected by environment and cause under brazing property
Drop.
As the preferred embodiment of ceramic packaging body described in the utility model, the overlapping layer and institute of the silver layer and layers of copper
It states in silver layer and the alternately stacked layer of layers of copper, contacting with cover board or protective layer is silver layer；
The overlapping layer of described Ni-P layers and silver layer and it is described Ni-P layer in the stacked layers of silver layer, with cover board or protection
Layer contact is silver layer；
In the overlapping layer and the nickel layer of the nickel layer and silver layer and the alternately stacked layer of silver layer, connect with cover board or protective layer
Touching is silver layer；
In the overlapping layer and the nickel layer of the nickel layer and layers of copper and the alternately stacked layer of layers of copper, connect with cover board or protective layer
Touching is layers of copper；
The overlapping layer of described Ni-P layers and layers of copper and it is described Ni-P layer in the alternately stacked layer of layers of copper, with cover board or protection
Layer contact is layers of copper；
In the nickel layer and Ni-P layers of overlapping layer and the nickel layer and Ni-P layers of alternately stacked layer, with cover board or protection
Layer contact is Ni-P layers；
The overlapping layer and the nickel layer of the nickel layer and Ni-P layers and silver layer and Ni-P layer in the alternately stacked layer of silver layer,
Contacting with cover board or protective layer is silver layer.
As the preferred embodiment of ceramic packaging body described in the utility model, the utilizingthebrazing material layer be layers of copper, silver layer,
Silver layer and the overlapping layer of layers of copper, Ni-P layers and the overlapping layer of silver layer, the overlapping layer of nickel layer and silver layer, nickel layer and Ni-P layers of overlapping
The overlapping layer of layer or nickel layer and Ni-P layer and silver layer.Using the layers of copper or silver layer of one layer of structure, or using the silver of double-layer structure
Overlapping layer, Ni-P layers and the overlapping layer of silver layer, the overlapping layer of nickel layer and silver layer, nickel layer and Ni-P layers of the overlapping layer of layer and layers of copper
Or the overlapping layer of nickel layer and Ni-P layers and silver layer can more be achieved at low cost the using effect of utilizingthebrazing material layer.
As the more preferable embodiment of ceramic packaging body described in the utility model, the utilizingthebrazing material layer is silver layer and copper
Overlapping layer, Ni-P layers and the overlapping layer of silver layer, the overlapping layer of nickel layer and silver layer, nickel layer and Ni-P layers of the overlapping layer or nickel layer of layer
With Ni-P layers and the overlapping layer of silver layer.The inter-layer bonding force of bonding layer can be made more excellent using above-mentioned utilizingthebrazing material layer.
As the most preferred embodiment of ceramic packaging body described in the utility model, the utilizingthebrazing material layer is silver layer and copper
The overlapping layer of layer.
As the preferred embodiment of ceramic packaging body described in the utility model, the first metal layer be tungsten layer, silver layer,
Layers of copper, molybdenum layer or molybdenum manganese alloy layer.
As the more preferable embodiment of ceramic packaging body described in the utility model, the first metal layer is tungsten layer.
As the preferred embodiment of ceramic packaging body described in the utility model, the first metal layer with a thickness of 3~
30μm。
As the preferred embodiment of ceramic packaging body described in the utility model, the utilizingthebrazing material layer with a thickness of 1~
30μm。
As the preferred embodiment of ceramic packaging body described in the utility model, the protective layer is layer gold, silver layer, nickel layer
With the overlapping layer or nickel layer of silver layer and the overlapping layer of layer gold；
In the overlapping layer of the nickel layer and silver layer, contacting with utilizingthebrazing material layer is nickel layer；
In the nickel layer and the overlapping layer of layer gold, contacting with utilizingthebrazing material layer is nickel layer.
The outside environmental elements such as humidity and oxygen in air may have an impact to utilizingthebrazing material layer, therefore preferably be brazed
Protective layer is set in material surface, and the protective layer contacted with cover board is preferably inert metal coating, it is not easy to external environment
It reacts, more preferably gold plate.
As the preferred embodiment of ceramic packaging body described in the utility model, the protective layer is the weight of nickel layer and silver layer
The overlapping layer of lamination or nickel layer and layer gold.Nickel layer is formed on brazing material surface, then forms layer gold or silver layer on nickel layer surface,
Nickel layer can be such that layer gold or silver layer and brazing material preferably engages.
As the preferred embodiment of ceramic packaging body described in the utility model, the protective layer with a thickness of 0.1~
10um.The thickness of protective layer is thin, on soldering and sealing almost without influence.
As the preferred embodiment of ceramic packaging body described in the utility model, the generation type of the utilizingthebrazing material layer is
At least one of plating, chemical plating, vapor deposition and sputtering.The utilizingthebrazing material layer can be realized by kinds of processes mode, rich
The diversity of rich process choice.
As the more preferable embodiment of ceramic packaging body described in the utility model, the generation type of the utilizingthebrazing material layer
For plating.Electroplating technology is more convenient compared to other techniques, but the plating preparation of existing yellow gold layer or silver-tin alloy layer
Technique is immature, and utilizingthebrazing material layer described in the utility model is the same coat of metal, is easy to realize by electroplating technology.
The utility model has the beneficial effects that: the utility model provides a kind of ceramic packaging body.The utility model institute
Ceramic packaging body is stated by the selection of setting utilizingthebrazing material layer and implementation in the bonding layer of ceramic packaging body, makes ceramic envelope
It fills physical efficiency and keeps good air-tightness, meet properties of product, reduce base of ceramic embrittlement risk, reduce production cost.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of existing ceramic packaging body；
Fig. 2 is the structural schematic diagram of the ceramic packaging body of embodiment 1；
Fig. 3 is the structural schematic diagram of the ceramic packaging body of embodiment 5；
Wherein, 1, base of ceramic；2, electric slurry tungsten is starched；3, electronickelling；4, yellow gold solder；5, ring can be cut down；6, electric
Nickel plating；7, electroplating gold；8, cover board；9, base of ceramic；10, the first metal layer；11, utilizingthebrazing material layer；12, cover board；13, ceramic base
Seat；14, the first metal layer；15, Ni-P layers；16, layers of copper；17, nickel layer；18, silver layer；19 cover boards.
Specific embodiment
To better illustrate the purpose of this utility model, technical solution and advantage, below in conjunction with specific embodiment to this
Utility model is described further.
The material of base of ceramic described in the utility model embodiment is the ceramic material based on aluminium oxide；The cover board
Material be kovar alloy.
Embodiment 1
A kind of embodiment of ceramic packaging body described in the utility model, as shown in Fig. 2, ceramic packaging body described in the present embodiment
Including base of ceramic 9 and cover board 12, the base of ceramic 9 includes bottom and side wall, between the upper surface and cover board of the side wall
Equipped with bonding layer；The bonding layer includes:
The first metal layer 10, the first metal layer are formed in the upper surface of side wall, and the first metal layer 10 is molybdenum manganese
Alloy-layer, with a thickness of 20 μm；
Utilizingthebrazing material layer 11, the utilizingthebrazing material layer 11 are formed on the first metal layer 10, and the utilizingthebrazing material layer 11 is
Layers of copper, with a thickness of 30 μm.
The generation type of the utilizingthebrazing material layer 11 is plating.
Embodiment 2
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is layers of copper, thickness
It is 7 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer；The utilizingthebrazing material layer is silver layer, thickness
It is 5 μm.
The generation type of the utilizingthebrazing material layer is plating.
Embodiment 3
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is tungsten layer, thickness
It is 3 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, and the utilizingthebrazing material layer is silver layer and copper
The overlapping layer of layer, layers of copper is formed on the first metal layer, and silver layer is formed in layers of copper, the utilizingthebrazing material layer with a thickness of 15 μ
m。
The generation type of the utilizingthebrazing material layer is chemical plating.
Embodiment 4
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is tungsten layer, thickness
It is 30 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, the utilizingthebrazing material layer be Ni-P layer with
The overlapping layer of silver layer, Ni-P layers are formed on the first metal layer, and silver layer is formed on Ni-P layer, the thickness of the utilizingthebrazing material layer
It is 3 μm.
The generation type of the utilizingthebrazing material layer is plating.
Embodiment 5
A kind of embodiment of ceramic packaging body described in the utility model, as shown in figure 3, ceramic packaging body described in the present embodiment
Including base of ceramic 13 and cover board 19, the base of ceramic includes bottom and side wall, between the upper surface and cover board of the side wall
Equipped with bonding layer；The bonding layer includes:
The first metal layer 14, the first metal layer 14 are formed in the upper surface of side wall, and the first metal layer is silver layer,
With a thickness of 20 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer 14, and the utilizingthebrazing material layer is Ni-P layers
15 and layers of copper 16 overlapping layer, Ni-P layer 15 is formed on the first metal layer 14, and layers of copper 16 is formed on Ni-P layer 15, the pricker
The wlding bed of material with a thickness of 10 μm；
Protective layer, the protective layer are formed on utilizingthebrazing material layer, protective layer with a thickness of 1.5 μm, the protective layer is
The overlapping layer of nickel layer 17 and silver layer 18, nickel layer 17 are formed on utilizingthebrazing material layer, nickel layer 17 with a thickness of 1 μm, the formation of silver layer 18
In on nickel layer 17, silver layer 18 with a thickness of 0.5 μm.
The generation type of the utilizingthebrazing material layer is vapor deposition.
Embodiment 6
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is molybdenum layer, thickness
It is 20 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, and the utilizingthebrazing material layer is layers of copper and silver
The overlapping layer of layer, layers of copper is formed on the first metal layer, and silver layer is formed in layers of copper, the utilizingthebrazing material layer with a thickness of 10 μ
m；
Protective layer, the protective layer are formed on utilizingthebrazing material layer, protective layer with a thickness of 1.1 μm, the protective layer is
The overlapping layer of nickel layer and layer gold, nickel layer are formed on utilizingthebrazing material layer, nickel layer with a thickness of 1 μm, layer gold is formed on nickel layer, gold
Layer with a thickness of 0.1 μm.
The generation type of the utilizingthebrazing material layer is plating.
Embodiment 7
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is molybdenum manganese alloy
Layer, with a thickness of 20 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, and the utilizingthebrazing material layer is layers of copper and silver
The alternately stacked layer of layer, layers of copper are formed on the first metal layer, and silver layer is formed in layers of copper, and layers of copper is formed on silver layer, described
Utilizingthebrazing material layer with a thickness of 10 μm；
Protective layer, the protective layer are formed on utilizingthebrazing material layer, protective layer with a thickness of 0.1 μm, the protective layer is
Layer gold.
The generation type of the utilizingthebrazing material layer is plating.
Embodiment 8
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is layers of copper, thickness
It is 10 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, and the utilizingthebrazing material layer is nickel layer and silver
The overlapping layer of layer, nickel layer is formed on the first metal layer, and silver layer is formed on nickel layer, the utilizingthebrazing material layer with a thickness of 15 μ
m；
Protective layer, the protective layer are formed on utilizingthebrazing material layer, protective layer with a thickness of 1 μm, the protective layer is silver
Layer.
The generation type of the utilizingthebrazing material layer is plating.
Embodiment 9
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is tungsten layer, thickness
It is 10 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, and the utilizingthebrazing material layer is nickel layer, described
Utilizingthebrazing material layer with a thickness of 10 μm；
Protective layer, the protective layer are formed on utilizingthebrazing material layer, protective layer with a thickness of 3 μm, the protective layer is silver
Layer.
The generation type of the utilizingthebrazing material layer is sputtering.
Embodiment 10
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is tungsten layer, thickness
It is 10 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, and the utilizingthebrazing material layer is Ni-P layers, institute
State utilizingthebrazing material layer with a thickness of 10 μm；
Protective layer, the protective layer are formed on utilizingthebrazing material layer, protective layer with a thickness of 10 μm, the protective layer is nickel
The overlapping layer of layer and layer gold, nickel layer is formed on utilizingthebrazing material layer, nickel layer with a thickness of 9.5 μm, layer gold is formed on nickel layer, gold
Layer with a thickness of 0.5 μm.
The generation type of the utilizingthebrazing material layer is plating.
Embodiment 11
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is tungsten layer, thickness
It is 10 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, and the utilizingthebrazing material layer is nickel layer and copper
The overlapping layer of layer, nickel layer is formed on the first metal layer, and layers of copper is formed on nickel layer, the utilizingthebrazing material layer with a thickness of 15 μ
m；
Protective layer, the protective layer are formed on utilizingthebrazing material layer, protective layer with a thickness of 10 μm, the protective layer is nickel
The overlapping layer of layer and layer gold, nickel layer is formed on utilizingthebrazing material layer, nickel layer with a thickness of 9.5 μm, layer gold is formed on nickel layer, gold
Layer with a thickness of 0.5 μm.
The generation type of the utilizingthebrazing material layer is plating.
Embodiment 12
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is tungsten layer, thickness
It is 10 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, and the utilizingthebrazing material layer is nickel layer and Ni-
P layers of overlapping layer, nickel layer are formed on the first metal layer, and Ni-P layers are formed on nickel layer, the utilizingthebrazing material layer with a thickness of
20μm；
Protective layer, the protective layer are formed on utilizingthebrazing material layer, protective layer with a thickness of 10 μm, the protective layer is nickel
The overlapping layer of layer and layer gold, nickel layer is formed on utilizingthebrazing material layer, nickel layer with a thickness of 9.5 μm, layer gold is formed on nickel layer, gold
Layer with a thickness of 0.5 μm.
The generation type of the utilizingthebrazing material layer is plating.
Embodiment 13
A kind of embodiment of ceramic packaging body described in the utility model, ceramic packaging body described in the present embodiment includes ceramic base
Seat and cover board, the base of ceramic include bottom and side wall, and bonding layer is equipped between the upper surface and cover board of the side wall；It is described
Bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is tungsten layer, thickness
It is 10 μm；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer, and the utilizingthebrazing material layer is nickel layer and Ni-
The overlapping layer of P layers and silver layer, nickel layer are formed on the first metal layer, and Ni-P layers are formed on nickel layer, and silver layer is formed in Ni-P layers
On, the utilizingthebrazing material layer with a thickness of 20 μm；
Protective layer, the protective layer are formed on utilizingthebrazing material layer, protective layer with a thickness of 3 μm, the protective layer is silver
Layer.
The generation type of the utilizingthebrazing material layer is plating.
Comparative example 1
A kind of comparative example of ceramic packaging body described in the utility model, ceramic packaging body described in this comparative example is the same as embodiment 7
It compares, this comparative example is free of utilizingthebrazing material layer and protective layer, using silver-tin alloy layer and can cut down ring instead of utilizingthebrazing material layer and guarantor
Sheath, i.e. this comparison ceramic packaging body include base of ceramic and cover board, and the base of ceramic includes bottom and side wall, described
Bonding layer is equipped between the upper surface and cover board of side wall；The bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall, and the first metal layer is tungsten layer, thickness
It is 20 μm；
Silver-tin alloy layer, the silver-tin alloy layer are formed on the first metal layer, the silver-tin alloy layer with a thickness of 30 μ
m；
Ring can be cut down, the ring that cuts down is formed on silver-tin alloy layer.
Comparative example 2
A kind of comparative example of ceramic packaging body described in the utility model, the structural representation of ceramic packaging body described in this comparative example
Figure is shown in that Fig. 1, this comparison ceramic packaging body include base of ceramic 1 and cover board 8, and the base of ceramic includes bottom and side wall,
Bonding layer is equipped between the upper surface and cover board of the side wall；The bonding layer includes:
The first metal layer 2, the first metal layer 2 are formed in the upper surface of side wall；
Electroless nickel layer 3, the electroless nickel layer 3 are formed on the first metal layer 2；
Yellow gold solder 4, the yellow gold solder 4 are formed on electroless nickel layer 3；
Ring 5 can be cut down, the ring that cuts down is formed on yellow gold solder 4；
Electroless nickel layer 6, the electroless nickel layer 6 are formed in and can cut down on ring 5；
Layer gold 7 is electroplated, the plating layer gold 7 is formed on electroless nickel layer 6.
Embodiment 14
Embodiment 1~13 and comparative example 1,2 are carried out to the comparison of performance, test result is shown in Table 1.
The performance of 1 embodiment 1~13 of table and comparative example 1,2 compares
| Group | Weld cracking rate/% | Leak rate/% | Product frequency shift (FS) | Soldering and sealing temperature/DEG C |
| Embodiment 1 | 0 | <0.05 | ±5 | 1100 |
| Embodiment 2 | 0 | <0.05 | ±5 | 950 |
| Embodiment 3 | 0 | <0.05 | ±5 | 980 |
| Embodiment 4 | 0 | <0.05 | ±5 | 1000 |
| Embodiment 5 | 0 | <0.05 | ±5 | 1050 |
| Embodiment 6 | 0 | <0.05 | ±5 | 980 |
| Embodiment 7 | 0 | <0.05 | ±5 | 1000 |
| Embodiment 8 | 0 | <0.05 | ±5 | 1060 |
| Embodiment 9 | 0 | <0.05 | ±5 | 1080 |
| Embodiment 10 | 0 | <0.05 | ±5 | 1100 |
| Embodiment 11 | 0 | <0.05 | ±5 | 1100 |
| Embodiment 12 | 0 | <0.05 | ±5 | 1090 |
| Embodiment 13 | 0 | <0.05 | ±5 | 1030 |
| Comparative example 1 | 0.28 | <0.05 | ±5 | 1250 |
| Comparative example 2 | 0.32 | <0.05 | ±5 | 1420 |
From the results shown in Table 1, the weld cracking rate of the ceramic packaging body of embodiment 1~13 is almost nil, leakage
Gas rate is respectively less than 0.05% (i.e. 1 × 10-9Pa.m3/ s), product frequency shift (FS) is ± 5PPM, but the pottery of embodiment 1~13
The cost of porcelain packaging body is lower than comparative example 1,2, and the cost of utilizingthebrazing material layer is low compared to conventional silver copper alloy solder solution
10% or more.Thus, it could be seen that ceramic packaging body described in the utility model can be in the premise for not reducing ceramic packaging body properties of product
Under, base of ceramic soldering and sealing embrittlement risk is effectively reduced, and reduce product cost.
Finally, it should be noted that above embodiments are only to illustrate the technical solution of the utility model rather than to this realities
With the limitation of novel protected range, although being explained in detail referring to preferred embodiment to the utility model, this field it is common
It will be appreciated by the skilled person that can be with the technical solution of the present invention is modified or equivalently replaced, without departing from this reality
With the spirit and scope of new technique scheme.
Claims (12)
1. a kind of ceramic packaging body, which is characterized in that including base of ceramic and cover board, the base of ceramic includes bottom and side
Wall is equipped with bonding layer between the upper surface and cover board of the side wall；The bonding layer includes:
The first metal layer, the first metal layer are formed in the upper surface of side wall；
Utilizingthebrazing material layer, the utilizingthebrazing material layer are formed on the first metal layer；
The utilizingthebrazing material layer is layers of copper, silver layer, nickel layer, Ni-P layers, the alternating of the overlapping layer of silver layer and layers of copper, silver layer and layers of copper
Overlapping layer, Ni-P layers and the stacked layers of silver layer, the overlapping layer of nickel layer and silver layer, the nickel layer of overlapping layer, Ni-P layers and silver layer
With the weight of the alternately stacked layer of the alternately stacked layer of silver layer, the overlapping layer of nickel layer and layers of copper, nickel layer and layers of copper, Ni-P layers and layers of copper
Alternately stacked layer, nickel layer and Ni-P layers of overlapping layer, nickel layer and Ni-P layers of alternately stacked layer of lamination, Ni-P layers and layers of copper,
The alternately stacked layer of the overlapping layer or nickel layer of nickel layer and Ni-P layers and silver layer and Ni-P layer and silver layer.
2. ceramic packaging body as described in claim 1, which is characterized in that the bonding layer further includes protective layer；The protective layer
It is formed on utilizingthebrazing material layer.
3. ceramic packaging body as claimed in claim 2, which is characterized in that the overlapping layer and the silver layer of the silver layer and layers of copper and
In the alternately stacked layer of layers of copper, contacting with cover board or protective layer is silver layer；
The overlapping layer of described Ni-P layers and silver layer and it is described Ni-P layer in the stacked layers of silver layer, connect with cover board or protective layer
Touching is silver layer；
In the overlapping layer and the nickel layer of the nickel layer and silver layer and the alternately stacked layer of silver layer, contacted with cover board or protective layer
For silver layer；
In the overlapping layer and the nickel layer of the nickel layer and layers of copper and the alternately stacked layer of layers of copper, contacted with cover board or protective layer
For layers of copper；
The overlapping layer of described Ni-P layers and layers of copper and it is described Ni-P layer in the alternately stacked layer of layers of copper, connect with cover board or protective layer
Touching is layers of copper；
In the nickel layer and Ni-P layers of overlapping layer and the nickel layer and Ni-P layers of alternately stacked layer, connect with cover board or protective layer
Touching is Ni-P layers；
The overlapping layer and the nickel layer of the nickel layer and Ni-P layers and silver layer and Ni-P layer in the alternately stacked layer of silver layer, with lid
Plate or protective layer contact are silver layer.
4. ceramic packaging body as claimed in claim 3, which is characterized in that the utilizingthebrazing material layer is layers of copper, silver layer, silver layer and copper
Overlapping layer, Ni-P layers and the overlapping layer of silver layer, the overlapping layer of nickel layer and silver layer, nickel layer and Ni-P layers of the overlapping layer or nickel layer of layer
With Ni-P layers and the overlapping layer of silver layer.
5. ceramic packaging body as claimed in claim 3, which is characterized in that the utilizingthebrazing material layer is the overlapping of silver layer and layers of copper
Layer, Ni-P layers and the overlapping layer of silver layer, the overlapping layer of nickel layer and silver layer, nickel layer and Ni-P layers of overlapping layer or nickel layer and Ni-P layers
With the overlapping layer of silver layer.
6. ceramic packaging body as claimed in claim 3, which is characterized in that the utilizingthebrazing material layer is the overlapping of silver layer and layers of copper
Layer.
7. ceramic packaging body as described in claim 1, which is characterized in that the first metal layer is tungsten layer, silver layer, layers of copper, molybdenum
Layer or molybdenum manganese alloy layer.
8. ceramic packaging body as described in claim 1, which is characterized in that the first metal layer is tungsten layer.
9. ceramic packaging body as described in claim 1, which is characterized in that the first metal layer with a thickness of 3~30 μm.
10. ceramic packaging body as described in claim 1, which is characterized in that the utilizingthebrazing material layer with a thickness of 1~30 μm.
11. ceramic packaging body as claimed in claim 2, which is characterized in that the protective layer is layer gold, silver layer, nickel layer and silver layer
Overlapping layer or nickel layer and layer gold overlapping layer；
In the overlapping layer of the nickel layer and silver layer, contacting with utilizingthebrazing material layer is nickel layer；
In the nickel layer and the overlapping layer of layer gold, contacting with utilizingthebrazing material layer is nickel layer.
12. ceramic packaging body as claimed in claim 2, which is characterized in that the protective layer with a thickness of 0.1~10um.
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|---|---|---|---|
| CN201820809363.3U CN208378737U (en) | 2018-05-28 | 2018-05-28 | A kind of ceramic packaging body |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820809363.3U CN208378737U (en) | 2018-05-28 | 2018-05-28 | A kind of ceramic packaging body |
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|---|---|
| CN208378737U true CN208378737U (en) | 2019-01-15 |
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ID=64968428
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2018
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