CN106409691A - Method for preparing metal layers with different thicknesses at different positions of inner cavity of packaging housing - Google Patents
Method for preparing metal layers with different thicknesses at different positions of inner cavity of packaging housing Download PDFInfo
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- CN106409691A CN106409691A CN201610968233.XA CN201610968233A CN106409691A CN 106409691 A CN106409691 A CN 106409691A CN 201610968233 A CN201610968233 A CN 201610968233A CN 106409691 A CN106409691 A CN 106409691A
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- photoresist
- thickness
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- inner chamber
- gold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
Abstract
The invention provides a method for preparing metal layers with different thicknesses at different positions of an inner cavity of a packaging housing. The method comprises the following steps: 1, preparing a multi-layer co-fired ceramic metallization substrate; 2, performing chemical nickel plating on the substrate and a metal housing and realizing mounting through soldering; 3, plating the surface of an integrated housing after the soldering with a layer of thin metal; 4, coating the metallization substrate at the inner cavity of a shell with a photoresist, and heating to solidify the photoresist; 5, removing the photoresist at a position needing to be plated with thick metal in the inner cavity of the shell by use of laser ablation; 6, realizing area gilding of a bare position of the shell by use of a gilding process; and 7, after the photoresist is cleaned, realizing preparation of the metal layers with the different thicknesses at the different positions of the inner cavity of the packaging housing. The method has the following advantages: the technical process is simple, the prepared packaging shell inner cavity satisfies the demands of such processes as soldering, metal fire pressing and the like for different metal layer thicknesses, and at the same time, the method also has the advantages of good reliability, quite good economic benefits and the like.
Description
Technical field
The present invention relates to a kind of preparation method of encapsulating package inner chamber different-thickness layer gold, it belongs to chemical field.
Background technology
Due to the development of electron trade, requirement superintegrated to electronic devices and components is corresponding to improve, MCM assembly
（Multi-Chip Module）The problems referred to above that appear as provide a kind of reliable solution.MCM is close in increase assembling
Degree, shortening interconnection length, the signal delay that reduces, the volume that reduces, raising reliability aspect, have clear advantage.MCM etc. is advanced
The appearance of technology, puts forward higher requirement to encapsulating package.Co-fired ceramic substrate technology is presently the most popular and extensive
Using multilamellar interconnection substrate manufacturing technology, be the basis of MCM technology.
HTCC（HTCC）Technology is the common burning technology that sintering temperature is more than 1000 DEG C.Because firing temperature is high,
HTCC can not be using the low melting point metal material such as gold, silver, copper it is necessary to adopt the insoluble metal material such as tungsten, molybdenum, manganese.These materials
Resistance to oxidation, electrical conductivity be not low, solderability is poor, and therefore, outer contact must nickel plating be gold-plated protects it from oxidized, increases table simultaneously
The electrical conductivity in face simultaneously provides the metal layer that can carry out wire bonding and the attachment of soldering components and parts.It is generally desirable in encapsulating package
The layer gold thickness that chamber is used for wire bonding position is larger（≥1.3μm）To facilitate pressure spun gold；And it is used for the layer gold thickness of the position of core wire piece
Degree is less（0.1~0.3μm）To avoid the crisp phenomenon of the gold between solder and layer gold.At present with regard to encapsulating package inner chamber diverse location
The method of different layer gold preparation be rarely reported.
Therefore, the layer gold realizing the different-thickness of shell inner chamber diverse location deposits to meet the high reliability packaging of MCM
It is this area technical barrier urgently to be resolved hurrily.
Content of the invention
Proposed by the present invention is a kind of preparation method of the different-thickness layer gold of encapsulating package inner chamber diverse location, its purpose
It is intended to overcome the drawbacks described above existing for prior art, the shell inner chamber diverse location deposition solving for MCM package is different thick
Degree layer gold difficulty, and thus cause package reliability difference the problems such as.
The present invention adopts the following technical scheme that：A kind of preparation side of the different-thickness layer gold of package casing inner chamber diverse location
Method, comprises the steps：
（1）According to actual needs, prepare metallized ceramic base plate using multilayer co-firing method；
（2）On metallized substrate and metal outer frame chemical nickel plating and in 700 DEG C ~ 800 DEG C nitrogen environments soldering 20 minutes, real
Existing ceramic substrate and the airtight combination of metal framework；
（3）Using the plating gold process thin layer gold of integrated casing coating surface after brazing, thickness of coating is 0.1 ~ 0.3 μm；
（4）Using brush coating process, photoresist is coated on the metallized substrate of shell inner chamber, coating thickness is about 100 ~ 500 μ
M, and heating is allowed to solidify for 100 minutes in 60 DEG C ~ 90 DEG C of baking oven；
（5）The photoresist that metallization pattern in shell inner chamber needs the thick carat (measure of the purity of gold) of plating to put is removed using laser ablation；
（6）The region realizing shell exposed locations using craft of gilding is gold-plated, and thickness of coating is 1.3 μm ~ 2.0 μm；
（7）Photoresist within cleaning encapsulating package, you can realize package casing inner chamber different metal position difference layer gold thick
The preparation of degree.
Further, described substrate is multilamellar aluminium oxide or nitride multilayer aluminum metallization substrate.
Further, described chemical Ni-plating layer thickness is 2 ~ 10 μm, and solder is AgCu28 weld tabs.
Further, described photoresist is positive photoresist.
Further, described optical maser wavelength is 355nm, and beam spot diameter, is 0.02mm.
The present invention has the advantages that：Different metal position using present invention preparation possesses different layer gold thickness
Encapsulating package can meet the encapsulation of MCM and require, the layer gold thickness being used for wire bonding position in shell inner chamber is larger（≥
1.3μm）；Layer gold thickness for the position of welding chip is less（0.1~0.3μm）.This technique has low cost, high reliability concurrently
The advantages of.
Brief description：
Fig. 1 is the flow chart of the preparation method of different-thickness layer gold of package casing inner chamber diverse location of the present invention.
Specific embodiment
Embodiment 1
The method preparing the package casing of different layer gold thickness of inner chamber diverse location, comprises the steps：
Step 1：Prepare 92%Al using multilayer co-firing technology2O3Multilayer co-firing substrate；
Step 2：On multilayer co-firing metallized substrate and metal outer frame chemical nickel plating and in 700 DEG C of nitrogen environments 20 points of soldering
Clock, realizes the airtight combination of ceramic substrate and metal framework；
Step 3：Using the plating gold process thin layer gold of integrated casing coating surface after brazing, thickness of coating is 0.1 μm；
Step 4：Photoresist is brushed on the metallized substrate of shell inner chamber, coating thickness is about 100 μm, in 60 DEG C of baking oven
Heating is allowed to solidify for 100 minutes；
Step 5：Laser ablation removes the photoresist that metallization pattern in shell inner chamber needs the thick carat (measure of the purity of gold) of plating to put；
Step 6：The region realizing shell exposed locations using plating gold process is gold-plated, and thickness of coating is 1.3 μm；
Step 7：Photoresist within cleaning encapsulating package.
Embodiment 2
The method preparing the package casing of different layer gold thickness of inner chamber diverse location, comprises the steps：
Step 1：Prepare the multilayer co-firing substrate of AlN using multilayer co-firing technology；
Step 2：On multilayer co-firing metallized substrate and metal outer frame chemical nickel plating and in 800 DEG C of nitrogen environments 20 points of soldering
Clock, realizes the airtight combination of ceramic substrate and metal framework；
Step 3：Using the plating gold process thin layer gold of integrated casing coating surface after brazing, thickness of coating is 0.3 μm；
Step 4：Photoresist is brushed on the metallized substrate of shell inner chamber, coating thickness is about 500 μm, in 90 DEG C of baking oven
Heating is allowed to solidify for 100 minutes；
Step 5：Laser ablation removes the photoresist that metallization pattern in shell inner chamber needs the thick carat (measure of the purity of gold) of plating to put；
Step 6：The region realizing shell exposed locations using plating gold process is gold-plated, and thickness of coating is 2.0 μm；
Step 7：Photoresist within cleaning encapsulating package.
Embodiment 3
The method preparing the package casing of different layer gold thickness of inner chamber diverse location, comprises the steps：
Step 1：Prepare 92%Al using multilayer co-firing technology2O3Multilayer co-firing substrate；
Step 2：On multilayer co-firing metallized substrate and metal outer frame chemical nickel plating and in 810 DEG C of nitrogen environments 20 points of soldering
Clock, realizes the airtight combination of ceramic substrate and metal framework；
Step 3：Using the plating gold process thin layer gold of integrated casing coating surface after brazing, thickness of coating is 0.35 μm；
Step 4：Photoresist is brushed on the metallized substrate of shell inner chamber, coating thickness is about 520 μm, in 82 DEG C of baking oven
Heating is allowed to solidify for 100 minutes；
Step 5：Laser ablation removes the photoresist that metallization pattern in shell inner chamber needs the thick carat (measure of the purity of gold) of plating to put；
Step 6：The region realizing shell exposed locations using plating gold process is gold-plated, and thickness of coating is 2.1 μm；
Step 7：Photoresist within cleaning encapsulating package.
Embodiment described above only have expressed embodiments of the present invention, and its description is more concrete and detailed, but can not
Therefore it is interpreted as the restriction to the scope of the claims of the present invention.
Claims (5)
1. a kind of preparation method of the different-thickness layer gold of package casing inner chamber diverse location is it is characterised in that include following walking
Suddenly：
（1）Realize the preparation of metallized ceramic base plate using multilayer co-firing method；
（2）On metallized substrate and metal outer frame, chemical nickel plating is to improve its solderability and in 700 DEG C ~ 800 DEG C nitrogen environments
Middle soldering 20 minutes, realizes the airtight combination of ceramic substrate and metal framework；
（3）Using the plating gold process thin layer gold of integrated casing coating surface after brazing, thickness of coating is 0.1 ~ 0.3 μm；
（4）Using brush coating process, photoresist is coated on the metallized substrate of shell inner chamber, coating thickness is 100 ~ 500 μm,
And in 60 DEG C ~ 90 DEG C of baking oven, baking is allowed to solidify for 100 minutes, forms uniform photoresist film in shell surface of internal cavity；
（5）The photoresist that metallization pattern in shell inner chamber needs the thick carat (measure of the purity of gold) of plating to put is removed using laser ablation；
（6）The region realizing shell exposed locations using craft of gilding is gold-plated, and thickness of coating is 1.3 ~ 2.0 μm；
（7）Photoresist within cleaning encapsulating package, you can realize the different layer gold of package casing inner chamber different metal position
The preparation of thickness.
2. the preparation method of the different-thickness layer gold of package casing inner chamber diverse location according to claim 1, its feature exists
In step（1）Described in substrate be multilamellar aluminium oxide or nitride multilayer aluminum metallization substrate.
3. the preparation method of the different-thickness layer gold of package casing inner chamber diverse location according to claim 1, its feature exists
In step（2）Described chemical Ni-plating layer thickness is 2 ~ 10 μm；Described solder is AgCu28 weld tabs.
4. the preparation method of the different-thickness layer gold of package casing inner chamber diverse location according to claim 1, its feature exists
In step（4）Described photoresist is positive photoresist.
5. the preparation method of the different-thickness layer gold of package casing inner chamber diverse location according to claim 1, its feature exists
In step（5）Described optical maser wavelength is 355nm, and beam spot diameter, is 0.02mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610968233.XA CN106409691A (en) | 2016-10-26 | 2016-10-26 | Method for preparing metal layers with different thicknesses at different positions of inner cavity of packaging housing |
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| CN201610968233.XA CN106409691A (en) | 2016-10-26 | 2016-10-26 | Method for preparing metal layers with different thicknesses at different positions of inner cavity of packaging housing |
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| CN106409691A true CN106409691A (en) | 2017-02-15 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110846643A (en) * | 2019-11-22 | 2020-02-28 | 中国电子科技集团公司第五十八研究所 | Method for enhancing reliability of parallel seam welding packaging salt fog |
| CN112447611A (en) * | 2020-09-28 | 2021-03-05 | 中国电子科技集团公司第二十九研究所 | Local gold-plating enclosure frame structure and processing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290917A (en) * | 2007-04-17 | 2008-10-22 | 南亚电路板股份有限公司 | Structure of welding mat |
| CN104505435A (en) * | 2014-12-17 | 2015-04-08 | 常州天合光能有限公司 | Imaging mask method for manufacturing solar battery |
| CN105355612A (en) * | 2015-11-13 | 2016-02-24 | 中国电子科技集团公司第五十五研究所 | Digital and analog mixed high-density housing |
| US9397017B2 (en) * | 2014-11-06 | 2016-07-19 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
-
2016
- 2016-10-26 CN CN201610968233.XA patent/CN106409691A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101290917A (en) * | 2007-04-17 | 2008-10-22 | 南亚电路板股份有限公司 | Structure of welding mat |
| US9397017B2 (en) * | 2014-11-06 | 2016-07-19 | Semiconductor Components Industries, Llc | Substrate structures and methods of manufacture |
| CN104505435A (en) * | 2014-12-17 | 2015-04-08 | 常州天合光能有限公司 | Imaging mask method for manufacturing solar battery |
| CN105355612A (en) * | 2015-11-13 | 2016-02-24 | 中国电子科技集团公司第五十五研究所 | Digital and analog mixed high-density housing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110846643A (en) * | 2019-11-22 | 2020-02-28 | 中国电子科技集团公司第五十八研究所 | Method for enhancing reliability of parallel seam welding packaging salt fog |
| CN112447611A (en) * | 2020-09-28 | 2021-03-05 | 中国电子科技集团公司第二十九研究所 | Local gold-plating enclosure frame structure and processing method thereof |
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Application publication date: 20170215 |
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