CN208255626U - A kind of raising exposure production capacity direct-write photoetching mechanism - Google Patents
A kind of raising exposure production capacity direct-write photoetching mechanism Download PDFInfo
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- CN208255626U CN208255626U CN201820863286.XU CN201820863286U CN208255626U CN 208255626 U CN208255626 U CN 208255626U CN 201820863286 U CN201820863286 U CN 201820863286U CN 208255626 U CN208255626 U CN 208255626U
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Abstract
The utility model discloses a kind of raisings to expose production capacity direct-write photoetching mechanism, including multiaxial motion platform, substrate table top, exposure system, alignment system, pedestal and gantry mechanism, the pedestal are connected with gantry mechanism；The exposure time used can be effectively promoted on the cost basis for not increasing litho machine, it can be completed at the same time more than a piece of plank, two panels plank even N piece plank while upper and lower plates, alignment and exposure are completed, effectively shorten the time for exposure of substrate, the production capacity for improving direct write exposure machine, effectively raises the yield of client's production, while being also well positioned to meet the quality of exposure figure.
Description
Technical field:
The utility model relates to technical field of lithography more particularly to a kind of raising to expose production capacity direct-write photoetching mechanism.
Background technique:
Photoetching technique is for printing the composition with feature on the surface of a substrate.Such substrate may include for manufacturing
Semiconductor devices, a variety of integrated circuits, flat-panel screens (such as liquid crystal display), circuit board, biochip, micromechanics electronics
The substrate of chip, photoelectron circuit chip etc..Direct-write photoetching technology is to substitute the exposures such as traditional mask plate or film egative film
The direct transfer techniques of image have very important effect in semiconductor and PCB production field.Exposing production capacity is customer demand
One important indicator, then improving direct write exposure machine exposure production capacity then becomes most important.
Direct write exposure currently on the market is mostly scanned exposure with single table surface exposure machine or dual stage face exposure machine.Single table surface exposes
Light production capacity is slower, and each sheet exposure needs to complete upper plate, is aligned, exposure, the processes such as lower plate, and the whole flow process time is longer.It is double
Although the mode of table top exposure saves the upper and lower plates time can complete exposure and upper and lower plates parallel, but since system structure is multiple
It is miscellaneous, it increases manufacturing cost, client's purchasing price and maintenance price after sale is caused to increase.
Utility model content:
In view of the above-mentioned problems, the technical problem to be solved by the present invention is to provide a kind of raisings to expose production capacity direct-write photoetching
Mechanism.
A kind of raising of the utility model exposes production capacity direct-write photoetching mechanism, including multiaxial motion platform, substrate table top, exposure
Photosystem, alignment system, pedestal and gantry mechanism, the pedestal are connected with gantry mechanism, and the pedestal is equipped with multiaxial motion
Platform, the multiaxial motion platform include y-axis moving parts, x-axis moving parts and z-axis and θ shaft assembly, the y-axis exercise group
Part is fixed on the base, and the x-axis moving parts are fixed on y-axis moving parts, and the z-axis and θ shaft assembly are fixed on x-axis fortune
On dynamic component, the substrate table top carrying is placed 2 or 2 or more exposure bases and is fixed in z-axis and θ shaft assembly, described
Exposure system and alignment system are separately fixed on gantry mechanism.
Preferably, the pedestal is marble pedestal.
Preferably, the exposure system is made of exposure cameras, and the alignment system is by CCD camera, alignment camera lens and photograph
Mingguang City source composition, the CCD camera and is directed at camera lens and is connected by hickey, and the lighting source is locked to pair by screw
On quasi- camera lens.
Preferably, locator is set on the substrate table top, the locator is locked on substrate table top by screw.
The utility model the utility model has the advantages that the utility model a kind of raising expose production capacity direct-write photoetching mechanism, can simultaneously it is complete
At a piece of plank is more than, two panels plank even N piece plank simultaneously complete by upper and lower plates, alignment and exposure, effectively shortens substrate
Time for exposure, improve the production capacity of direct write exposure machine, can on the cost basis for not increasing litho machine effectively promoted expose
Time used in light, including upper and lower plates time, position aligning time and time for exposure effectively raise the yield of client's production, together
When be also well positioned to meet the quality of exposure figure.
Detailed description of the invention:
The present invention is described in detail by the following detailed description and drawings for ease of explanation,.
Fig. 1 is the utility model overall structure diagram；
Fig. 2 is to promote 2 exposure bases of production capacity to place schematic diagram；
Fig. 3 is to promote production capacity N piece exposure base to place schematic diagram；
Fig. 4 is gradually to put exposure base 4 times and 4 exposure bases while placing comparison diagram；
Fig. 5 is gradually to put exposure base 4 times and 4 exposure bases while placing time for exposure comparison diagram；
Fig. 6 multiaxial motion platform structure schematic diagram；
Fig. 7 aligns process and algorithm description；
Fig. 8 exposure process and algorithm description.
In figure: 1- marble pedestal；2- gantry mechanism；3- exposure system；4- alignment system；5-x axis moving parts；6-y
Axis moving parts；7-z axis and θ shaft assembly；8- substrate table top；9- exposure base；10- locator；11- loci.
Specific embodiment:
To make the objectives, technical solutions and advantages of the present invention clearer, below by shown in the accompanying drawings
Specific embodiment describes the utility model.However, it should be understood that these descriptions are merely illustrative, and it is not intended to limit this reality
With novel range.In addition, in the following description, descriptions of well-known structures and technologies are omitted, to avoid unnecessarily mixing
Confuse the concept of the utility model.
As shown in figures 1-8, a kind of raising of the utility model exposes production capacity direct-write photoetching mechanism, including multiaxial motion is put down
Platform, substrate table top 8, exposure system 3, alignment system 4, marble pedestal 1 and gantry mechanism 2, the marble pedestal 1 and gantry
Mechanism 2 connect, the marble pedestal 1 be equipped with multiaxial motion platform, the multiaxial motion platform include y-axis moving parts 6,
X-axis moving parts 5 and z-axis and θ shaft assembly 7, the y-axis moving parts 6 are fixed on marble pedestal 1, the x-axis exercise group
Part 5 is fixed on y-axis moving parts 6, and the z-axis and θ shaft assembly 7 are fixed on x-axis moving parts 5, and the substrate table top 8 is held
Placing is set 2 or 2 or more exposure bases 8 and is fixed by screws in z-axis and θ shaft assembly 7, the exposure system 3 and right
Position system 4 is separately fixed on gantry mechanism 2, and the exposure system 3 is made of exposure cameras, and the alignment system 4 is by CCD phase
Machine, alignment camera lens and lighting source composition.
A kind of raising of the utility model exposes production capacity direct-write photoetching mechanism, exposure method the following steps are included:
(1) graph exposure substrate 9 is moved to corresponding position: x-axis moving parts 5 are with exposure base 9 along the direction x
Stepping is mobile, and y-axis moving parts 6 are realized vertically with exposure base 9y direction scanning motion, z-axis component with exposure base 9
Movement, θ shaft assembly realize that graph exposure substrate 9 is quickly moved to corresponding position by the rotation of 9 table top of exposure base, realization；
(2) it places exposure base 9 and completes quickly positioning: while placing on the exposure base 9 to substrate table top 8 of 2-N piece,
Exposure base 9 is positioned by the locator 10 being arranged on substrate table top 8；
(3) complete client's graph exposure: after the completion of placement, alignment system 4 quickly grabs exposure base 9 along scanning direction
On loci 11, to exposure figure conversion process after the completion of contraposition, the figure of transformation is presented to N piece by exposure system 3 in real time
Client's graph exposure is completed in the designated position of exposure base 9.
Specifically, marble pedestal 1 and gantry mechanism 2 are connected by screw to, and carry multiaxial motion platform and exposure system
System 3.Y-axis moving parts 6 are locked on marble pedestal 1 by screw, and x-axis moving parts 5 are locked to y-axis by screw and move
On component 6, z-axis and θ shaft assembly 7 are locked on x-axis moving parts 5 by screw, constitute entire kinematic system, and wherein x-axis is transported
Dynamic component 5 is realized with exposure base 9 by its guide rail in the direction x stepping movement, guarantees that the exposed width of camera lens covers base
The width of plate, y-axis moving parts 6 are realized with exposure base 9 by its guide rail in the scanning motion of the direction y, realize exposure system 3
Exposure length covers the length areas of substrate, and z-axis component is realized by its guide rail moves to exposure and contraposition with exposure base 9
Focal plane, θ shaft assembly by its guide rail realize 9 table top of exposure base rotation, realize it is quickly that graph exposure substrate 9 is corresponding
Position.Exposure base 9 is placed in the carrying of substrate table top 8, is locked in z-axis and θ shaft assembly 7 by screw, in addition exposure base 9 is put
Setting positioning on substrate table top 8, against the Position Scale on substrate table top 8, Position Scale is locked to substrate table top 8 by screw
On.Exposure system 3 is made of exposure cameras, completes exposure base 9 during the motion, and the synchronous figure for needing client is real
When instantaneous exposure to the substrate of table top on, exposure system 3 is locked on gantry mechanism 2 by screw, guarantee exposure system stablize
Property.Alignment system 4 quickly quickly can grab 11 coordinate of loci by the multi-disc exposure base 9 to substrate table top 8, complete exposure
Figure is presented to the specified position of exposure base 9 afterwards, and alignment system increases the contraposition mould according to the piece number of exposure base 9
The number of block, alignment system 3 are made of CCD camera, alignment camera lens and lighting source, and CCD camera and alignment camera lens pass through screw thread
Interface connection, lighting source are locked on alignment camera lens by screw, and entire alignment system is locked to gantry mechanism 2 by screw
On.
Embodiment 1: as shown in Fig. 2, can place simultaneously on 2 exposure bases 9 to substrate table top 8, realizing quick upper and lower plates,
Since exposure base 9 is positioned along locator 10, guarantee positioning accuracy, after the completion of placement, alignment system 3 is fast along scanning direction
Loci 11 on speed crawl exposure base 9, to exposure figure conversion process after the completion of contraposition, exposure system 3 is by the figure of transformation
Shape is presented to the designated position of 2 plate bases in real time, completes client's graph exposure.
Embodiment 2: as shown in figure 3, N piece exposure base 9 can be placed simultaneously to loading floor 8, realizing quick upper and lower plates,
Since exposure base 9 is positioned along locator 10, guarantee positioning accuracy, after the completion of placement, alignment system is fast along scanning direction
Loci 11 on speed crawl exposure base 9, to exposure figure conversion process after the completion of contraposition, exposure system 3 is by the figure of transformation
Shape is presented to the designated position of N plate base in real time, completes client's graph exposure.
Embodiment 3: it as illustrated in figures 4-5, gradually puts exposure base 4 times and 4 exposure bases while placing the time for exposure pair
Compare table.Substrate 4 times exposures and four exposure bases are gradually placed according to monolithic exposure base in Fig. 4 while placing the mould of exposure
Formula lists specific time contrast table.Wherein defining the upper plate time is T1, position aligning time T2, time for exposure T3, when lower plate
Between be T1, when placing the time for exposure simultaneously according to 4 exposure bases of actual exposure result than gradually placing the exposure of 4 exposure bases
Between saved 2*(3T1+T2+T3).
Specifically, as shown in fig. 6, multiaxial motion platform removes y-axis moving parts, x-axis moving parts and z-axis and θ shaft assembly
Outside, mainly by linear motor, guide rail, the composition such as laser position feedback device, linear motor and guide rail are locked to by screw
On the pedestal of multiaxial motion platform, laser position feedback device is locked on the mover seat of multiaxial motion platform by screw.It leads
Rail bearing carries entire multiaxial motion platform, guarantees the straightness of operation, laser position feedback device guarantee system run all right and
The precision of operation.As shown in fig. 7, increasing the CCD camera of alignment system according to the piece number for placing exposure base to ccd_n, aligning
Be concentrate on work at selected units along the contraposition of diagram direction crawl substrate loci.Ccd_1 covers loci along scanning direction crawl ccd_1
Region, ccd_2 cover loci region along scanning direction crawl ccd_2, and ccd_n is covered along scanning direction crawl ccd_n
Loci region obtains the stage coordinate of all locis, and makees normalized to all coordinate points.As shown in figure 8, root
According to the stage coordinate of above-mentioned loci, to figure 1, figure 2 ... figure n etc. all figures carry out graph transformation, will convert
Figure afterwards, which merges, becomes a whole figure, and exposure system completes the exposure of figure on the graph exposure to substrate 1 ... substrate n.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above.Current row
The technical staff of industry is described in above embodiments and description it should be appreciated that the present utility model is not limited to the above embodiments
Only illustrate the principles of the present invention, on the premise of not departing from the spirit and scope of the utility model, the utility model is also
It will have various changes and improvements, these various changes and improvements fall within the scope of the claimed invention.The utility model
Claimed range is defined by the appending claims and its equivalent thereof.
Claims (4)
1. a kind of raising exposes production capacity direct-write photoetching mechanism, which is characterized in that including multiaxial motion platform, substrate table top, exposure
System, alignment system, pedestal and gantry mechanism, the pedestal are connected with gantry mechanism, and the pedestal is flat equipped with multiaxial motion
Platform, the multiaxial motion platform include y-axis moving parts, x-axis moving parts and z-axis and θ shaft assembly, the y-axis moving parts
It is fixed on the base, the x-axis moving parts are fixed on y-axis moving parts, and the z-axis and θ shaft assembly are fixed on x-axis movement
On component, the substrate table top carrying is placed 2 or 2 or more exposure bases and is fixed in z-axis and θ shaft assembly, the exposure
Photosystem and alignment system are separately fixed on gantry mechanism.
2. a kind of raising according to claim 1 exposes production capacity direct-write photoetching mechanism, it is characterised in that: the pedestal is big
Fibrous gypsum pedestal.
3. a kind of raising according to claim 1 exposes production capacity direct-write photoetching mechanism, it is characterised in that: the exposure system
It is made of exposure cameras, the alignment system is made of CCD camera, alignment camera lens and lighting source, the CCD camera and alignment
Camera lens is connected by hickey, and the lighting source is locked on alignment camera lens by screw.
4. a kind of raising according to claim 1 exposes production capacity direct-write photoetching mechanism, it is characterised in that: the substrate table top
Upper setting locator, the locator are locked on substrate table top by screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820863286.XU CN208255626U (en) | 2018-06-05 | 2018-06-05 | A kind of raising exposure production capacity direct-write photoetching mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820863286.XU CN208255626U (en) | 2018-06-05 | 2018-06-05 | A kind of raising exposure production capacity direct-write photoetching mechanism |
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| CN208255626U true CN208255626U (en) | 2018-12-18 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762007A (en) * | 2018-06-05 | 2018-11-06 | 苏州源卓光电科技有限公司 | A kind of raising exposure production capacity direct-write photoetching mechanism and its exposure method |
| CN109856926A (en) * | 2019-03-25 | 2019-06-07 | 合肥芯碁微电子装备有限公司 | Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus and method |
| CN110007569A (en) * | 2019-05-10 | 2019-07-12 | 苏州微影激光技术有限公司 | A kind of write-through exposure machine worktable component and write-through exposure machine |
| CN111221223A (en) * | 2019-12-05 | 2020-06-02 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
| CN112631084A (en) * | 2020-12-30 | 2021-04-09 | 安徽地势坤光电科技有限公司 | Automatic laser direct writing device |
-
2018
- 2018-06-05 CN CN201820863286.XU patent/CN208255626U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108762007A (en) * | 2018-06-05 | 2018-11-06 | 苏州源卓光电科技有限公司 | A kind of raising exposure production capacity direct-write photoetching mechanism and its exposure method |
| CN108762007B (en) * | 2018-06-05 | 2024-05-03 | 苏州源卓光电科技有限公司 | Direct-writing photoetching mechanism for improving exposure productivity and exposure method thereof |
| CN109856926A (en) * | 2019-03-25 | 2019-06-07 | 合肥芯碁微电子装备有限公司 | Direct-write photoetching exposure sources position motion platform orthogonality debugging apparatus and method |
| CN109856926B (en) * | 2019-03-25 | 2024-04-09 | 合肥芯碁微电子装备股份有限公司 | Orthogonalization debugging device and method for positioning motion platform of direct-writing lithography exposure equipment |
| CN110007569A (en) * | 2019-05-10 | 2019-07-12 | 苏州微影激光技术有限公司 | A kind of write-through exposure machine worktable component and write-through exposure machine |
| CN111221223A (en) * | 2019-12-05 | 2020-06-02 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
| CN111221223B (en) * | 2019-12-05 | 2021-02-26 | 源能智创(江苏)半导体有限公司 | Inner-layer plate exposure machine and marking method thereof |
| CN112631084A (en) * | 2020-12-30 | 2021-04-09 | 安徽地势坤光电科技有限公司 | Automatic laser direct writing device |
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Address after: 215000 Room 102, building C5, Ting LAN lane, Suzhou Industrial Park, Jiangsu, China, 192 Patentee after: Yuanzhuo Micro Nano Technology (Suzhou) Co.,Ltd. Address before: 215000 Room 102, building C5, Ting LAN lane, Suzhou Industrial Park, Jiangsu, China, 192 Patentee before: ADVANCED MICRO OPTICS.INC |