CN208225852U - Plate and wafer butt-joint equipment - Google Patents
Plate and wafer butt-joint equipment Download PDFInfo
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- CN208225852U CN208225852U CN201820809782.7U CN201820809782U CN208225852U CN 208225852 U CN208225852 U CN 208225852U CN 201820809782 U CN201820809782 U CN 201820809782U CN 208225852 U CN208225852 U CN 208225852U
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Abstract
The utility model discloses a kind of plate and wafer butt-joint equipment, and plate and wafer butt-joint equipment include: that wafer places mould group, including the first position detection components for detecting the wafer position on the wafer film；Butt-joint mould group, including the welding stage for placing wafer；Wafer carries mould group, and including placing the extracting piece moved between mould group and the butt-joint mould group in the wafer, the extracting piece extracts the wafer according to the wafer position that the first position detection components detect, and the wafer is carried on the welding stage.In technical solutions of the utility model, the position for determining wafer is detected by the first detection components, it carries mould group by wafer wafer is carried on welding stage, plate and wafer are being welded directly together by butt-joint component, the process for avoiding die bond, bonding, dispensing, punching IC, rubberizing paper, module from loading, to reduce the process that wafer is processed into module and module processing, a kind of equipment directly by wafer together with plate butt-joint is provided.
Description
Technical field
The utility model relates to technical field of intelligent card, in particular to a kind of plate and wafer butt-joint equipment.
Background technique
With the development of high and new technology, contactless smart card is widely used in life, traditional in smart card manufacturing industry
Needed in manufacturing process by wafer by die bond, bonding, dispensing, punching IC, rubberizing paper, module load after these processes with plate
Butt-joint is carried out, process is cumbersome, and complicated for operation, wafer and the process of plate butt-joint are cumbersome in the prior art, and it is complicated for operation, not
The equipment that wafer and plate are carried out direct butt-joint, is not easy to the production and production of smart card.
Utility model content
The main purpose of the utility model is to propose plate and wafer butt-joint equipment, it is intended to solve in the prior art wafer with
The problem of plate butt-joint process complexity.
To achieve the above object, the utility model proposes a kind of plates and wafer butt-joint equipment, are used for plate and wafer
Directly weld, the plate and wafer butt-joint equipment include: that wafer places mould group, including for placing wafer wafer film and
For detecting the first position detection components of the wafer position on the wafer film；Butt-joint mould group, including for placing wafer
Welding stage；Wafer carries mould group, described to mention including placing the extracting piece moved between mould group and the butt-joint mould group in the wafer
Pickup extracts the wafer according to the wafer position that the first position detection components detect, and the wafer is carried to institute
It states on welding stage.
Preferably, the butt-joint mould group further includes the fine adjustment stage being oppositely arranged with the wafer on the welding stage, described micro-
Leveling platform is used to adjust the position of the wafer on the welding stage.
Preferably, the fine adjustment stage includes two relatively-movable movable plates, on the opposite face of the movable plate
Equipped with groove, when the movable plate relatively moves, two grooves enclose the accommodating space being adapted to the wafer, to adjust
The placement location of the wafer.
Preferably, the butt-joint mould group includes soldering tip, turntable, the rotation motor of the driving turntable rotation and multiple institutes
Welding stage is stated, multiple welding stages are uniformly arranged on the turntable, and the rotation motor drives the turntable rotation so that each
The welding stage is corresponding with the soldering tip respectively.
Preferably, the welding stage is equipped with vacuum sucking holes at position corresponding with the accommodating space, and the vacuum is inhaled
Hole is used to wafer being fastened on the welding stage.
Preferably, the butt-joint mould group further includes the second position detection components for detection plate discharge position.
Preferably, the first position detection components and the second position detection components include camera and installation
Frame, the camera are installed in the wafer by the mounting rack and place in mould group and the butt-joint mould group.
Preferably, it includes the ejection assembly by wafer from the wafer UF membrane, the ejection that the wafer, which carries mould group,
Component includes the vacuum top cap and thimble for being tensioned the wafer film, and the thimble removable installation is in the axis of the vacuum top cap
To, the thimble along the vacuum top cap axial movement so that wafer and the wafer UF membrane.
Preferably, the wafer carry mould group further include horizontal drive part and be installed in it is vertical on the horizontal drive part
Actuator, the extracting piece are installed on the vertical actuator, and the horizontal drive part drives the extracting piece in the crystalline substance
It is moved between diaphragm and the welding stage, the vertical actuator drives the extracting piece to move in the vertical direction.
Preferably, the plate and wafer butt-joint equipment further include card reader, marker pen and controller, the card reader
It is connected with the controller with the marker pen, the controller detects that plate and wafer butt-joint occur in the card reader
When defect, the marker pen marking of defects is controlled.
In technical solutions of the utility model, the position for determining wafer is detected by the first detection components, mould is carried by wafer
Wafer is carried on welding stage by group, is being welded directly together plate and wafer by butt-joint component, is being avoided die bond, bonding, point
The process that glue, punching IC, rubberizing paper, module load provides one to reduce the process that wafer is processed into module and module processing
Equipment of the kind directly by wafer together with plate butt-joint.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the schematic perspective view of the utility model plate and wafer butt-joint equipment；
Fig. 2 is enlarged drawing at A in Fig. 1；
Fig. 3 is that the wafer placement mould group of the utility model plate and wafer butt-joint equipment and the stereochemical structure of ejection assembly are shown
It is intended to；
Fig. 4 is the schematic perspective view of the ejection assembly of the utility model plate and wafer butt-joint equipment；
Fig. 5 is that the stereochemical structure of the extracting piece of the wafer carrying mould group of the utility model plate and wafer butt-joint equipment is illustrated
Figure；
Fig. 6 is the first visual angle schematic diagram of the butt-joint mould group of the utility model plate and wafer butt-joint equipment；
Fig. 7 is the second visual angle schematic diagram of the butt-joint mould group of the utility model plate and wafer butt-joint equipment.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 10 | Wafer places mould group | 101 | Wafer film |
| 102 | First position detection components | 20 | Butt-joint mould group |
| 201 | Welding stage | 202 | Movable plate |
| 203 | Accommodating space | 204 | Soldering tip |
| 205 | Turntable | 206 | Second position detection components |
| 30 | Ejection assembly | 301 | Vacuum top cap |
| 302 | Thimble | 40 | Extracting piece |
| 50 | Card reader | 60 | Marker pen |
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that if related in the utility model embodiment directionality instruction (such as up, down, left, right, before and after,
It is horizontal, vertical ...), then directionality instruction is only used for explaining in the phase under a certain particular pose (as shown in the picture) between each component
To positional relationship, motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith
Become.
In addition, if relating to the description of " first ", " second " etc. in the utility model embodiment, " first ", " the
Two " etc. description is used for description purposes only, and is not understood to indicate or imply its relative importance or is implicitly indicated meaning
The quantity of the technical characteristic shown." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one
A this feature.It in addition, the technical solution between each embodiment can be combined with each other, but must be with ordinary skill
Based on personnel can be realized, this technical side will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of case is not present, also not within the protection scope of the requires of the utility model.
The utility model proposes a kind of plate and wafer butt-joint equipment, a kind of plate directly welding wafer and plate with
Wafer butt-joint equipment reduces the manufacturing procedure of wafer and plate.
- Fig. 7 referring to Fig.1, the utility model proposes a kind of plates and wafer butt-joint equipment, for plate is direct with wafer
Welding, the plate and wafer butt-joint equipment include: that wafer places mould group 10, including the wafer film 101 for placing wafer with
And the first position detection components 102 for detecting the wafer position on the wafer film 101；Butt-joint mould group 20, including be used for
Place the welding stage 201 of wafer；Wafer carries mould group (being not marked in figure), is included in the wafer and places mould group 10 and the butt-joint
The extracting piece 40 moved between mould group 20, the wafer that the extracting piece 40 is detected according to the first position detection components 102
The wafer is extracted in position, and the wafer is carried on the welding stage 201.
Specifically, the wafer places that mould group 10 further includes wafer disks and to drive wafer disks to move in the horizontal plane dynamic
Power component, the Power Component include servo motor, by the servo motor drive screw rod and compatible with the screw rod
Feed screw nut, the feed screw nut connect with the screw rod worm and gear, and the servo motor is driven by the feed screw nut
Wafer disks are mobile, to drive the wafer film 101 mobile, the wafer placement module further includes sliding rail and sliding block, passes through institute
The effect of sliding rail and the sliding block is stated so that the wafer disks steadily move, is provided in the wafer disks for placing the crystalline substance
The through-hole of diaphragm 101, the Power Component drive the wafer on the wafer film 101 to move in the horizontal plane by wafer disks,
The first position detection components 102 are installed in the rack of the plate and wafer butt-joint equipment, in 101 band of wafer film
When dynamic wafer moves in the horizontal plane, the first position detection components 102 include camera, and the camera is first to described
Wafer on wafer film 101 is taken pictures, and then position analysis is carried out to the wafer in photo by controller, according to wafer position
The analysis set drives wafer to be moved to predeterminated position by the wafer film 101, and the predeterminated position is taking pictures for the camera
Central point the extraction in mould group is then carried by the wafer so that it is determined that the wafer position on the wafer film 101
Part 40 takes out the wafer on the wafer film 101, and wafer is driven to be moved on the welding stage 201, the butt-joint mould group 20
The driving assembly for further including the soldering tip 204 being oppositely arranged with the welding stage 201 and driving plate mobile, is moved to institute in wafer
When stating on welding stage 201, driving assembly drives plate to be moved at position corresponding with the wafer on the welding stage 201, then
By 201 collective effect of soldering tip 204 and welding stage, wafer and plate are welded directly together, thus avoid by wafer by die bond,
The processes such as bonding, dispensing are welded after being processed into module with plate, to reduce the production process of smart card, convenient for smart card
Production and production.
In the utility model embodiment, the crystalline substance on the wafer film 101 is detected by the first position detection components 102
Round position, then the wafer carries the wafer position information that mould group is detected according to the first position detection components 102,
It controls the extracting piece 40 and extracts wafer on the wafer film 101, and the wafer is carried on the welding stage 201, lead to
The effect that the first position detection components 102 and the wafer carry mould group is crossed, during improving wafer and plate butt-joint
Position precision, convenient for the butt-joint mould group 20 by wafer together with the direct butt-joint of plate, after avoiding wafer from being filled into module
Butt-joint is carried out with plate, so that eliminating module thickness influences the drawbacks of loading effect, reduces the appearance impression of smart card.Together
When, the manufacturing process of traditional smart card are as follows: beat location hole, punching, it is online, rush IC, rubberizing paper/dispensing, module load, touch
Weldering, folded pot weldering, it is pre-laminated, tear open, cutting edge, a folded pot welds, are laminated, tear open, punching blocks, set by the plate and wafer butt-joint
It is standby by wafer together with the direct butt-joint of plate so that the manufacturing procedure of smart card becomes: beat location hole, punching, it is online, touch
Weldering, folded pot weldering, it is pre-laminated, tear open, cutting edge, a folded pot welds, are laminated, are torn open, punching card, avoid wafer from passing through die bond, bonding, point
The process of glue has also skipped the process that punching IC, rubberizing paper, module load, has solved wafer in the prior art and plate butt-joint
The problem of process complexity, reduces the production process of smart card, and then reduces the cost of manufacture of smart card.
Further, the butt-joint mould group 20 further includes the fine adjustment stage being oppositely arranged with the wafer on the welding stage 201
(being not marked in figure), the fine adjustment stage are used to adjust the position of the wafer on the welding stage 201.In the butt-joint mould group 20 also
Including installing fine adjustment stage on the rack, the position of the fine adjustment stage is opposite with the wafer position on the welding stage 201 to be set
It sets, the position of the wafer on the welding stage 201 is adjusted by the fine adjustment stage, improve position of the wafer on the welding stage 201
Precision is set, is convenient for the butt-joint mould group 20 by wafer together with the direct butt-joint of plate.It is described micro- in the utility model embodiment
Leveling platform includes two relatively-movable movable plates 202, and the movable plate 202 is all provided with fluted, the work on opposite face
When movable plate 202 relatively moves, two grooves enclose the accommodating space 203 being adapted to the wafer, to adjust the wafer
Placement location.The fine adjustment stage further includes controlling the clamping jaw cylinder and adjust clamping jaw cylinder that movable plate 202 relatively moves
Micrometer finely tune slide unit, the movable plate 202 is installed in the movable end of the clamping jaw cylinder, in two movable plates 202
When opposite face abuts, two grooves enclose accommodating space 203 compatible with wafer, are adjusted by the accommodating space 203
Angles and positions of the wafer on the welding stage 201 are saved, to improve position precision of the wafer on the welding stage 201, it is ensured that
The consistency of wafer position on the welding stage 201 carries out butt-joint to plate and wafer convenient for the butt-joint mould group 20.
Further, the butt-joint mould group 20 includes soldering tip 204, turntable 205, the rotation for driving the turntable 205 to rotate
Motor (being not marked in figure) and multiple welding stages 201, multiple welding stages 201 are uniformly arranged on the turntable 205, institute
Stating rotation motor drives the rotation of turntable 205 so that each welding stage 201 is corresponding with the soldering tip 204 respectively.It is described
Butt-joint mould group 20 further includes the first actuator for driving the soldering tip 204 to move in the vertical direction and the driving welding stage
201 the second actuators moved in the vertical direction, first actuator and second actuator are oppositely arranged, and described
One actuator and second actuator are high-precision linear mould group, the rotation motor drive the rotation of turntable 205 with
Keep each welding stage 201 individually corresponding with the soldering tip 204, is then driven in first actuator and described second
Under the action of moving part, 201 relative motion of the welding stage 201 and the welding stage is driven, thus to the soldering tip 204 and the welding stage
Wafer and plate between 201 carry out butt-joint.In the utility model embodiment, the butt-joint mould group 20 includes four welding stages
201, one of them described welding stage 201 is oppositely arranged with the soldering tip 204, completes crystalline substance with the soldering tip 204 in the welding stage 201
After the round butt-joint between plate, the rotation motor drives the turntable 205 to rotate so that next welding stage 201 with
The soldering tip 204 is opposite, to carry out the butt-joint between next group of wafer and plate.By uniform on the turntable 205
Four welding stages 201 are set, drive each welding stage 201 corresponding with the soldering tip 204 by the turntable 205, are contracted
The waiting time of the short soldering tip 204 quickly carries out butt-joint with plate convenient for wafer, improves the production efficiency of smart card.
Further, the welding stage 201 is equipped with vacuum sucking holes (figure at position corresponding with the accommodating space 203
In do not mark), the vacuum sucking holes are used to wafer being fastened on the welding stage 201.In the utility model embodiment, the weldering
Platform 201 is equipped with the vacuum sucking holes for fastening wafer, the position phase of the position of the vacuum sucking holes and the accommodating space 203
Corresponding, when the accommodating space 203 adjusts the position of wafer on the welding stage 201, the fine adjustment stage is in adjustment wafer
In the process, the movable plate 202 is greater than the suction of the vacuum sucking holes to the adjustment thrust of wafer, is convenient for the accommodating space
203 adjust the position of the wafer on the welding stage 201, after the fine adjustment stage adjustment completes adjustment to wafer position, two institutes
202 back movement of movable plate is stated, and avoids the wafer；After the accommodating space 203 is completed to the adjustment of the position of wafer,
When the turntable 205 drives the welding stage 201 to rotate, ensure wafer in the welding stage by suction of the vacuum sucking holes to wafer
It will not be moved on 201, position of the wafer on the welding stage 201 is avoided to shift, improve wafer on the welding stage 201
Position precision carries out butt-joint to wafer and plate convenient for the welding stage 201 and the soldering tip 204.
Further, the butt-joint mould group 20 further includes the second position detection components 206 for detection plate discharge position.Institute
It states butt-joint mould group 20 and detects plate position according to the second position detection components 206, be easy to the position of plate and wafer
Position it is corresponding, consequently facilitating by plate together with the direct butt-joint of wafer.In the utility model embodiment, the butt-joint mould
Group 20 further includes driving the actuator that moves in the horizontal plane of plate, and the actuator includes motor, is connected with the motor
Screw rod and feed screw nut compatible with the screw rod, the motor drives the screw rod rotation, so that the feed screw nut
Along the axial movement of the screw rod, to drive plate for linear motion, the butt-joint mould group 20 further includes the cunning for orientation
Rail and sliding block compatible with the sliding rail, the plate are connected with the sliding block, and the sliding block moves on the sliding rail, from
And the precision that the plate moves along a straight line is improved, according to the plate position that the second position detection components 206 detect, by
Plate is moved at position corresponding with the wafer on the welding stage 201 by the actuator, is examined by the second position
The effect of component 206 is surveyed, the position for being easy to ensure plate is corresponding with the position of wafer, is convenient for the soldering tip 204 and the weldering
Platform 201 is by plate and the direct butt-joint of wafer.Wherein, the first position detection components 102 and the second position detection components
206 include camera (being not marked in figure) and mounting rack (being not marked in figure), and the camera is rack-mounted by the installation
The wafer is located to place in mould group 10 and the butt-joint mould group 20.The first position detection components 102 and the second
Set detection components 206 and further include CCD vision detection system, the camera is used to shoot the photo of wafer or plate, and by
Controller analyzes photo, so that it is determined that the position of wafer and plate, consequently facilitating by the position of the position of wafer and plate
It sets corresponding.In the utility model embodiment, the position of plate is detected by the second position detection components 206, by described
Actuator driving plate, which is moved at position corresponding with wafer, carries out direct butt-joint, to realize that plate is set with wafer butt-joint
Standby automatic charging, without human intervention, convenient for the manufacturing of smart card.
Please continue to refer to Fig. 4, further, it includes separating wafer from the wafer film 101 that the wafer, which carries mould group,
Ejection assembly 30, the ejection assembly 30 includes the vacuum top cap 301 and thimble 302 for being tensioned the wafer film 101, described
302 removable installation of thimble is moved in the axial direction of the vacuum top cap 301, the thimble 302 along the axial direction of the vacuum top cap 301
It moves so that wafer is separated with the wafer film 101.In the utility model embodiment, the ejection assembly 30 and the first position
Detection components 102 are located at the opposite sides of the wafer film 101, are bonded with several wafers, the ejection on the wafer film 101
Component 30 includes the vacuum top cap 301 and the thimble 302, when the vacuum top cap 301 is abutted with the wafer film 101,
Several through-holes are evenly arranged on the end face of the vacuum top cap 301, are produced convenient for the vacuum top cap 301 by several through-holes
The wafer film 101 is tensioned by raw suction, and the thimble 302 is under the action of actuator along the axial direction of the vacuum top cap 301
Upper movement, pierces through the wafer film 101 by the thimble 302 so that wafer is separated with the wafer film 101, this reality
It applies in example, by the way that the ejection assembly 30 is arranged, is easy to separate wafer from the wafer film 101, be mentioned convenient for described
Wafer is carried in pickup 40.
Further, the wafer carries mould group and further includes horizontal drive part (being not marked in figure) and be installed in the level
Vertical actuator (being not marked in figure) on actuator, the extracting piece 40 are installed on the vertical actuator, the level
Actuator drives the extracting piece 40 to move between the wafer film 101 and the welding stage 201, the vertical actuator driving
The extracting piece 40 moves in the vertical direction.In the utility model embodiment, in the utility model embodiment, the horizontal drive
Moving part and the ejection assembly 30 two sides that be located at the wafer film 101 opposite, the horizontal drive part are installed in the plate
In the rack (not shown) of wafer butt-joint equipment, the horizontal drive part include motor, the screw rod being connected with the motor with
And feed screw nut compatible with the screw rod, the motor drives the screw rod rotation, so that the feed screw nut is along described
The axial movement of screw rod, the feed screw nut drive the extracting piece 40 to move along a straight line in the horizontal plane, the horizontal drive
Part further includes sliding-rail sliding component, and the sliding-rail sliding component is for improving the precision that the extracting piece 40 moves along a straight line, institute
State the link block that vertical actuator includes motor, connecting rod and the connection motor output shaft and connecting rod, the connecting rod with it is described
Link block rotation connection, the other end of the connecting rod are flexibly connected with the extracting piece 40, and the vertical actuator further includes true
The sliding rail and sliding block that the fixed extracting piece 40 moves in the vertical direction, the motor drives the link block rotation, so that institute
State connecting rod drives the extracting piece 40 to move in the vertical direction under the action of sliding rail and sliding rail cooperate.The present embodiment
In, during feeding, according to the position for the wafer that the first position detection components 102 detect, the horizontal drive
Part drives the extracting piece 40 to be moved horizontally to position corresponding with the wafer and the wafer is sucked, the thimble 302
The wafer is separated with 101 phase of wafer film across the wafer film 101, then as described in the vertical actuator driving
The wafer to be taken away in extracting piece 40, the vertical actuator described later drives the extracting piece 40 to be moved to evacuation position,
When the horizontal drive part drives the extracting piece 40 to be moved to the 201 corresponding position of welding stage, the vertical driving
Part drives the lower general who has surrendered's wafer of the extracting piece 40 to be placed on the welding stage 201, it is to be understood that the extracting piece 40 may be used also
It is moved in the vertical direction with being controlled by cylinder.In the present embodiment, carrying mould group by the wafer will be on the wafer film 101
Wafer be carried on the welding stage 201, avoid wafer from carrying out butt-joint by die bond, bonding, after process for dispensing glue with plate,
The process that punching IC, rubberizing paper, module load has been skipped, the process time of the production of smart card is reduced.
Further, the plate and wafer butt-joint equipment further include that (figure is not for card reader 50, marker pen 60 and controller
Show), the card reader 50 and the marker pen 60 are connected with the controller, and the controller is detected in the card reader 50
When there is defect to plate and wafer butt-joint, 60 marking of defects of marker pen is controlled.In the utility model embodiment, the reading
Card device 50 and 204 laid out in parallel of soldering tip, and the card reader 50 is arranged towards plate, in the butt-joint mould group 20 by wafer
After together with the direct butt-joint of plate, the card reader 50 is Non-contact Media Reader 50, and the marker pen 60 is controlled by cylinder
It moves in the vertical direction, the quality of the butt-joint effect of plate and wafer is detected by the card reader 50, the controller is in institute
It states card reader 50 and detects plate and when defect occurs in wafer, as the card reader 50 detects going out after plate and wafer welding
When existing solder joint deviates or is electrically not turned on, controls the marker pen 60 and plate and wafer butt-joint is marked the product of defect occur, just
Faulty goods is rejected in user's later period.
The above is only the preferred embodiment of the present invention, and therefore it does not limit the scope of the patent of the utility model,
It is all under the inventive concept of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of plate and wafer butt-joint equipment, for directly welding plate with wafer, which is characterized in that the plate and crystalline substance
Justifying butt-joint equipment includes:
Wafer places mould group, including the wafer film for placing wafer and for detecting the wafer position on the wafer film
First position detection components；
Butt-joint mould group, including the welding stage for placing wafer；
Wafer carries mould group, described to mention including placing the extracting piece moved between mould group and the butt-joint mould group in the wafer
Pickup extracts the wafer according to the wafer position that the first position detection components detect, and the wafer is carried to institute
It states on welding stage.
2. plate as described in claim 1 and wafer butt-joint equipment, which is characterized in that the butt-joint mould group further include with it is described
The fine adjustment stage that wafer on welding stage is oppositely arranged, the fine adjustment stage are used to adjust the position of the wafer on the welding stage.
3. plate as claimed in claim 2 and wafer butt-joint equipment, which is characterized in that the fine adjustment stage can phase including two
To mobile movable plate, be all provided on the opposite face of the movable plate it is fluted, the movable plate relatively move when, two grooves
The accommodating space being adapted to the wafer is enclosed, to adjust the placement location of the wafer.
4. plate as claimed in claim 3 and wafer butt-joint equipment, which is characterized in that the butt-joint mould group includes soldering tip, turns
The rotation motor and multiple welding stages that platform, the driving turntable rotate, multiple welding stages are uniformly arranged on the turntable
On, the rotation motor drives the turntable rotation so that each welding stage is corresponding with the soldering tip respectively.
5. plate as claimed in claim 4 and wafer butt-joint equipment, which is characterized in that the welding stage with the accommodating space
Vacuum sucking holes are equipped at corresponding position, the vacuum sucking holes are used to wafer being fastened on the welding stage.
6. plate as described in any one in claim 1-5 and wafer butt-joint equipment, which is characterized in that the butt-joint mould group is also wrapped
Include the second position detection components for detection plate discharge position.
7. plate as claimed in claim 6 and wafer butt-joint equipment, which is characterized in that the first position detection components and institute
Stating second position detection components includes camera and mounting rack, and the camera is installed in the crystalline substance by the mounting rack
Circle is placed in mould group and the butt-joint mould group.
8. plate as described in claim 1 and wafer butt-joint equipment, which is characterized in that the wafer carrying mould group includes will be brilliant
For circle from the ejection assembly of the wafer UF membrane, the ejection assembly includes vacuum top cap and the top for being tensioned the wafer film
Needle, the thimble removable installation in the axial direction of the vacuum top cap, the thimble along the vacuum top cap axial movement with
Make wafer and the wafer UF membrane.
9. plate as claimed in claim 8 and wafer butt-joint equipment, which is characterized in that it further includes water that the wafer, which carries mould group,
Flat actuator and the vertical actuator being installed on the horizontal drive part, the extracting piece are installed in the vertical actuator
On, the horizontal drive part drives the extracting piece to move between the wafer film and the welding stage, the vertical actuator
The extracting piece is driven to move in the vertical direction.
10. plate as described in claim 1 and wafer butt-joint equipment, which is characterized in that the plate and wafer butt-joint equipment
It further include card reader, marker pen and controller, the card reader and the marker pen are connected with the controller, the control
Device processed controls the marker pen marking of defects when the card reader detects that defect occur in plate and wafer butt-joint.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820809782.7U CN208225852U (en) | 2018-05-28 | 2018-05-28 | Plate and wafer butt-joint equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820809782.7U CN208225852U (en) | 2018-05-28 | 2018-05-28 | Plate and wafer butt-joint equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208225852U true CN208225852U (en) | 2018-12-11 |
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ID=64506601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820809782.7U Active CN208225852U (en) | 2018-05-28 | 2018-05-28 | Plate and wafer butt-joint equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208225852U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493144A (en) * | 2018-05-28 | 2018-09-04 | 深圳源明杰科技股份有限公司 | Plate and wafer butt-joint equipment |
| CN113092476A (en) * | 2021-04-12 | 2021-07-09 | 江苏坚力电子科技股份有限公司 | Automatic butt-joint of vision detects all-in-one |
-
2018
- 2018-05-28 CN CN201820809782.7U patent/CN208225852U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493144A (en) * | 2018-05-28 | 2018-09-04 | 深圳源明杰科技股份有限公司 | Plate and wafer butt-joint equipment |
| CN108493144B (en) * | 2018-05-28 | 2024-02-13 | 深圳源明杰科技股份有限公司 | Butt-welding equipment for plates and wafers |
| CN113092476A (en) * | 2021-04-12 | 2021-07-09 | 江苏坚力电子科技股份有限公司 | Automatic butt-joint of vision detects all-in-one |
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