CN208189633U - One kind being based on silicon substrate high-power LED encapsulation - Google Patents
One kind being based on silicon substrate high-power LED encapsulation Download PDFInfo
- Publication number
- CN208189633U CN208189633U CN201820887462.3U CN201820887462U CN208189633U CN 208189633 U CN208189633 U CN 208189633U CN 201820887462 U CN201820887462 U CN 201820887462U CN 208189633 U CN208189633 U CN 208189633U
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- fixedly connected
- outer housing
- heat sink
- outside
- silicon substrate
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses one kind to be based on silicon substrate high-power LED encapsulation, including outer housing, pin is provided on the outside of the outer housing, the outer housing is fixedly connected with the pin, it is provided on the inside of the outer housing heat sink, the outer housing heat sink is fixedly connected with described, the heat sink bottom surface is provided with cooling fin, it is described heat sink to be fixedly connected with the cooling fin, frame is provided on the outside of the cooling fin, the cooling fin is fixedly connected with the frame, and connecting plate is provided on the outside of the frame, and the frame is fixedly connected with the connecting plate；Cooling fin is set in existing LED encapsulation, it can use cooling fin to radiate to heat sink, the speed of heat sink heat dissipation is set to become faster, to make it, there is no the hidden danger for burning out chip, and diffusion sheet is set in existing LED encapsulation, it can use the work that diffusion sheet distribute light source, the range for distributing LED packaged light source becomes larger, to achieve the effect that easy to use.
Description
Technical field
The utility model belongs to LED encapsulation technology field, and in particular to one kind is based on silicon substrate high-power LED encapsulation.
Background technique
LED encapsulates the encapsulation for referring to luminescence chip, has relatively big difference compared to integrated antenna package, the encapsulation of LED is not only wanted
Wick can be protected by asking, but also want can light transmission, so the encapsulation of LED has special requirement to encapsulating material.
Existing LED be encapsulated in use, because its only pass through it is heat sink radiate, cause its radiating rate slower, exist
The hidden danger of chip is burnt out, and existing LED is encapsulated in use, because of the device that it lacks diffusion light source, its light source is caused to be sent out
Scattered range is smaller.
Utility model content
The purpose of this utility model is to provide one kind to be based on silicon substrate high-power LED encapsulation, to solve above-mentioned background skill
Itd is proposed in art existing LED be encapsulated in use, because its only pass through it is heat sink radiate, cause its radiating rate slower, exist
The hidden danger of chip is burnt out, and existing LED is encapsulated in use, because of the device that it lacks diffusion light source, its light source is caused to be sent out
The lesser problem of scattered range.
To achieve the above object, the utility model provides the following technical solutions: one kind is sealed based on silicon substrate great power LED
It fills, including outer housing, is provided with pin on the outside of the outer housing, the outer housing is fixedly connected with the pin, described outer
Be provided on the inside of shell it is heat sink, the outer housing with it is described it is heat sink be fixedly connected, the heat sink bottom surface is provided with cooling fin,
It is described it is heat sink be fixedly connected with the cooling fin, be provided with frame on the outside of the cooling fin, the cooling fin and the frame
It is fixedly connected, connecting plate is provided on the outside of the frame, the frame is fixedly connected with the connecting plate, described heat sink upper
Surface is provided with silicon substrate, it is described it is heat sink be fixedly connected with the silicon substrate, the upper surface of the silicon substrate is provided with chip, institute
It states silicon substrate to be fixedly connected with the chip, the upper surface of the chip is provided with gold thread, and the chip and the gold thread are removable
Connection is unloaded, layer of silica gel is provided on the outside of the gold thread, the gold thread is adhesively fixed with the layer of silica gel, outside the layer of silica gel
Side wall is provided with fluorescence coating, and the layer of silica gel is fixedly connected with the fluorescence coating, and the outside of the fluorescence coating is close to the shell
The upper surface of body is provided with lens, and the layer of silica gel is fixedly connected with the lens, is provided on the outside of the lens
Reinforcing layer, the lens are fixedly connected with the reinforcing layer, and light guide sheet, the reinforcing layer are provided on the outside of the reinforcing layer
It is adhesively fixed with the light guide sheet, the chip and external power supply are electrically connected.
Preferably, the cooling fin is fixedly connected with the outer housing by the frame and the connecting plate.
Preferably, the quantity of the pin is two, and two pins symmetrically divide along the longitudinal section of the outer housing
Cloth.
Preferably, diffusion sheet is provided on the outside of the light guide sheet, the light guide sheet is fixedly connected with the diffusion sheet.
Preferably, waterproof layer is provided on the outside of the outer housing, the outer housing is adhesively fixed with the waterproof layer.
Compared with prior art, the utility model has the beneficial effects that cooling fin is set in existing LED encapsulation, it can
To radiate using cooling fin to heat sink, the speed of heat sink heat dissipation is made to become faster, thus make it that the hidden danger for burning out chip be not present,
And diffusion sheet is set in existing LED encapsulation, can use the work that diffusion sheet distribute light source, LED is made to encapsulate light
The range that source distributes becomes larger, to achieve the effect that easy to use.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the heat sink structure illustration in the utility model；
Fig. 3 is the lens structural schematic diagram in the utility model；
In figure: 1, outer housing；2, gold thread；3, lens；4, chip；5, silicon substrate；6, heat sink；7, layer of silica gel；8, pin；
11, connecting plate；12, cooling fin；13, frame；31, fluorescence coating；32, reinforcing layer；33, light guide sheet；34, diffusion sheet.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to Fig. 1-3, the utility model provides a kind of technical solution: one kind is based on silicon substrate high-power LED encapsulation, packet
Outer housing 1 is included, the outside of outer housing 1 is provided with pin 8, and outer housing 1 is fixedly connected with pin 8, and the inside of outer housing 1 is provided with
Heat sink 6, outer housing 1 is fixedly connected with heat sink 6, and heat sink 6 bottom surface is provided with cooling fin 12, and heat sink 6 fix company with cooling fin 12
It connects, the outside of cooling fin 12 is provided with frame 13, and cooling fin 12 is fixedly connected with frame 13, and the outside of frame 13 is provided with connection
Plate 11, frame 13 are fixedly connected with connecting plate 11, and heat sink 6 upper surface is provided with silicon substrate 5, and heat sink 6 fix company with silicon substrate 5
It connects, the upper surface of silicon substrate 5 is provided with chip 4, and silicon substrate 5 is fixedly connected with chip 4, and the upper surface of chip 4 is provided with gold thread
2, chip 4 is detachably connected with gold thread 2, and the outside of gold thread 2 is provided with layer of silica gel 7, and gold thread 2 is adhesively fixed with layer of silica gel 7, silica gel
The lateral wall of layer 7 is provided with fluorescence coating 31, and layer of silica gel 7 is fixedly connected with fluorescence coating 31, and the outside of fluorescence coating 31 is close to outer housing 1
Upper surface be provided with lens 3, layer of silica gel 7 is fixedly connected with lens 3, and the outside of lens 3 is provided with reinforcing layer 32, thoroughly
Eyeglass 3 is fixedly connected with reinforcing layer 32, and the outside of reinforcing layer 32 is provided with light guide sheet 33, and reinforcing layer 32 is Nian Jie with light guide sheet 33 solid
Fixed, chip 4 and external power supply are electrically connected.
In the present embodiment, LED encapsulation is linked together with equipment to be applied is needed, is then turned on external power supply, this
When electric current flow at chip 4 by the internal gold thread 2 of LED encapsulation, so that chip 4 is powered operation, and generate radiance, then radiance warp
Lens 3 is transmitted at light guide sheet 33, then is transmitted at diffusion sheet 34 through light guide sheet 33, and diffusion sheet 34 is allow to carry out diverging light
The work in source, thus after the range for distributing LED packaged light source becomes larger, while cooling fin 12 first absorbs the heat on heat sink 6,
It distributes again to engine body exterior, so that the speed of heat sink 6 heat dissipation be made to become faster, achievees the purpose that make it there is no chip 4 is burnt out, then
The waterproof layer that the outside of outer housing 1 has completely cuts off the water quality in air, prevents water quality from entering inside it, causes inside it
Component wear, so that its internal element be made to be protected.
Further, cooling fin 12 is fixedly connected with outer housing 1 by frame 13 and connecting plate 11.
In the present embodiment, cooling fin 12 is fixedly connected with outer housing 1 by frame 13 and connecting plate 11, passes through 13 He of frame
Connecting plate 11 links together cooling fin 12 and outer housing 1, then can first be absorbed the heat on heat sink 6 by cooling fin 12
Afterwards, it then distributes to engine body exterior, so that the speed of heat sink 6 heat dissipation be made to become faster, reaching makes it that the mesh for burning out chip 4 be not present
's.
Further, the quantity of pin 8 is two, and two pins 8 are symmetrical along the longitudinal section of outer housing 1.
In the present embodiment, the quantity of pin 8 is two, and two pins 8 are symmetrical along the longitudinal section of outer housing 1, is led to
Crossing pin 8 can link together LED encapsulation with equipment to be applied is needed, to make LED encapsulation that can operate normally, and produce
The work that third contact of a total solar or lunar eclipse awns is illuminated.
Further, the outside of light guide sheet 33 is provided with diffusion sheet 34, and light guide sheet 33 is fixedly connected with diffusion sheet 34.
In the present embodiment, the outside of light guide sheet 33 is provided with diffusion sheet 34, and light guide sheet 33 is fixedly connected with diffusion sheet 34, leads to
Crossing diffusion sheet 34 can carry out distributing the work of light source, and the range for distributing LED packaged light source becomes larger.
Further, the outside of outer housing 1 is provided with waterproof layer, and outer housing 1 is adhesively fixed with waterproof layer.
In the present embodiment, the outside of outer housing 1 is provided with waterproof layer, and outer housing 1 is adhesively fixed with waterproof layer, passes through waterproof
Layer can completely cut off the water quality in air, prevent water quality from entering inside it, its internal component damage is caused, to make in it
Portion's element is protected.
The working principle and process for using of the utility model: after the utility model installs, when being encapsulated using LED,
It is first taken to working region, then it is linked together with equipment to be applied is needed, be then turned on external power supply, it is electric at this time
Stream is flow at chip 4 by the gold thread 2 inside LED encapsulation, so that chip 4 is powered and is run, and generate radiance, then radiance are through lens
Piece 3 is transmitted at light guide sheet 33, then is transmitted at diffusion sheet 34 through light guide sheet 33, and diffusion sheet 34 is allow to carry out divergent light source
Work, thus after the range for distributing LED packaged light source becomes larger, while cooling fin 12 first absorbs the heat on heat sink 6, then dissipate
It is sent to engine body exterior, so that the speed of heat sink 6 heat dissipation be made to become faster, achievees the purpose that make it there is no chip 4 is burnt out, then shell
The waterproof layer that the outside of body 1 has completely cuts off the water quality in air, prevents water quality from entering inside it, causes its internal element
Damage after LED encapsulates use, disconnects external power supply so that its internal element be made to be protected.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. one kind is based on silicon substrate high-power LED encapsulation, it is characterised in that: including outer housing (1), outside the outer housing (1)
Side is provided with pin (8), and the outer housing (1) is fixedly connected with the pin (8), is provided on the inside of the outer housing (1)
Heat sink (6), the outer housing (1) are fixedly connected with heat sink (6), and the bottom surface of heat sink (6) is provided with cooling fin (12),
Heat sink (6) are fixedly connected with the cooling fin (12), are provided with frame (13) on the outside of the cooling fin (12), described to dissipate
Backing (12) is fixedly connected with the frame (13), is provided with connecting plate (11), the frame on the outside of the frame (13)
(13) be fixedly connected with the connecting plate (11), the upper surface of heat sink (6) is provided with silicon substrate (5), heat sink (6) with
The silicon substrate (5) is fixedly connected, and the upper surface of the silicon substrate (5) is provided with chip (4), the silicon substrate (5) with it is described
Chip (4) is fixedly connected, and the upper surface of the chip (4) is provided with gold thread (2), and the chip (4) and the gold thread (2) are removable
Connection is unloaded, is provided with layer of silica gel (7) on the outside of the gold thread (2), the gold thread (2) is adhesively fixed with the layer of silica gel (7), institute
The lateral wall for stating layer of silica gel (7) is provided with fluorescence coating (31), and the layer of silica gel (7) is fixedly connected with the fluorescence coating (31), institute
The outside for stating fluorescence coating (31) is provided with lens (3) close to the upper surface of the outer housing (1), the layer of silica gel (7) and institute
It states lens (3) to be fixedly connected, be provided with reinforcing layer (32) on the outside of the lens (3), the lens (3) adds with described
Gu layer (32) is fixedly connected, it is provided with light guide sheet (33) on the outside of the reinforcing layer (32), the reinforcing layer (32) is led with described
Mating plate (33) is adhesively fixed, and the chip (4) and external power supply are electrically connected.
2. according to claim 1 a kind of based on silicon substrate high-power LED encapsulation, it is characterised in that: the cooling fin
(12) it is fixedly connected with the outer housing (1) by the frame (13) and the connecting plate (11).
3. according to claim 1 a kind of based on silicon substrate high-power LED encapsulation, it is characterised in that: the pin (8)
Quantity is two, and two pins (8) are symmetrical along the longitudinal section of the outer housing (1).
4. according to claim 1 a kind of based on silicon substrate high-power LED encapsulation, it is characterised in that: the light guide sheet
(33) it is provided on the outside of diffusion sheet (34), the light guide sheet (33) is fixedly connected with the diffusion sheet (34).
5. according to claim 1 a kind of based on silicon substrate high-power LED encapsulation, it is characterised in that: the outer housing (1)
Outside be provided with waterproof layer, the outer housing (1) is adhesively fixed with the waterproof layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820887462.3U CN208189633U (en) | 2018-06-08 | 2018-06-08 | One kind being based on silicon substrate high-power LED encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820887462.3U CN208189633U (en) | 2018-06-08 | 2018-06-08 | One kind being based on silicon substrate high-power LED encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208189633U true CN208189633U (en) | 2018-12-04 |
Family
ID=64428947
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820887462.3U Expired - Fee Related CN208189633U (en) | 2018-06-08 | 2018-06-08 | One kind being based on silicon substrate high-power LED encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208189633U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786761A (en) * | 2020-12-30 | 2021-05-11 | 深圳市峻鸿设备有限公司 | Adjustable LED packaging structure with uniform light mixing |
| CN112951774A (en) * | 2021-01-26 | 2021-06-11 | 徐州市创泽优电子科技有限公司 | Substrate for packaging electronic device |
-
2018
- 2018-06-08 CN CN201820887462.3U patent/CN208189633U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112786761A (en) * | 2020-12-30 | 2021-05-11 | 深圳市峻鸿设备有限公司 | Adjustable LED packaging structure with uniform light mixing |
| CN112951774A (en) * | 2021-01-26 | 2021-06-11 | 徐州市创泽优电子科技有限公司 | Substrate for packaging electronic device |
| CN112951774B (en) * | 2021-01-26 | 2024-02-09 | 徐州市创泽优电子科技有限公司 | Substrate for packaging electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181204 Termination date: 20190608 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |