CN208156595U - A kind of radiator - Google Patents
A kind of radiator Download PDFInfo
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- CN208156595U CN208156595U CN201720899070.4U CN201720899070U CN208156595U CN 208156595 U CN208156595 U CN 208156595U CN 201720899070 U CN201720899070 U CN 201720899070U CN 208156595 U CN208156595 U CN 208156595U
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Abstract
A kind of radiator, including heat source, at least one heat conducting pipe；Described heat conducting pipe one end is connect with the heat source with heat-conducting mode, it is characterised in that thermal insulation layer is coated in the thermally conductive pipe outer wall, except the radiating end that the heat conducting pipe is not connect with the heat source.Its heat dissipation effect is good, is applicable to a variety of industry heat transmissions.
Description
Technical field
There are pyrotoxins in some equipment and instruments or smaller space, but equipment and instrument or smaller space control temperature
Exigent situation is generally required to special radiator and distributes the thermal energy that pyrotoxin generates.The utility model
Radiator be related in equipment and instrument or smaller space radiating for pyrotoxin, refer in particular to that there are pyrotoxins, still
Again in the very high equipment and instrument of temperature requirement.
Background technique
With pyrotoxin, and in the very high situation of ambient temperature requirements, radiator generally is used to pyrotoxin
Heat dissipation, to reduce the temperature and surrounding working environment temperature of pyrotoxin.By taking laptop as an example.Due to CPU and display card chip
A large amount of heat can be generated at work, generally heat is conducted to cooling fin by heat-conducting copper pipe at present, then fan is
It blows, heat will be scattered to outside laptop with convection current or radiation mode against cooling fin.In heat-conducting copper pipe, it is filled with phase
Become material, is provided with capillary pipe structure.Heat-conducting copper pipe is welded with the heat-conducting plate in CPU, display card chip respectively, in heat-conducting copper pipe
The other end is provided with cooling fin and fan.In order to which the thermal energy preferably by generations such as CPU, display card chips gives out through heat-conducting copper pipe
It goes, flat-shaped pipe structure is arranged in the heat-conducting copper pipe place of being in contact with it, and increases thermal conductive contact area.Heat-conducting plate extends always from CPU
Cooling fin to fan mouth, then be scattered to thermal energy outside laptop through thermovent by fan.In heat-conducting copper pipe, with CPU,
Heat-conducting copper pipe one end of display card chip heat-conducting plate contact is evaporation ends, and the one end connecting with cooling fin is condensation end, notebook electricity
When brain works, CPU, display card chip work start to generate heat, and the phase-change material in heat-conducting copper pipe is by copper pipe and CPU, display card chip
The heat-conducting plate that is connected carries out heat exchange, and the phase-change material of the evaporation ends in heat-conducting copper pipe becomes gas because heat exchange is absorbed heat from liquid
State, because of the variation of pressure, the phase-change material of gaseous state flows to condensation end, and since condensation end is connect with cooling fin, fan is always
Cooling fin is blown by the thermal energy of cooling fin to being discharged outside notebook, therefore the heat-conducting copper pipe of condensation end inside and outside has certain temperature
Difference, the gaseous state phase-change material of condensation end discharges thermal energy outward becomes liquid, and the thermal energy of release is further made through cooling fin in fan
With lower quickly to shedding outside laptop.Condensed liquid state phase change material is under capillary pipe structure effect, via condensation
End is back to evaporation ends, and repeated evaporation condenses phase transition process.Most of thermal energy of heat-conducting copper pipe is transmitted to via its internal phase
Become material and carry out heat exchange heat dissipation, other thermal energy are then directly radiated by heat-conducting copper pipe surface to laptop inner space.
Due to narrow space in laptop, when notebook after a period of work, through heat-conducting copper pipe surface directly to notebook sky
Between the thermal energy that distributes reach certain balance, then will lead to the temperature inside laptop and be maintained at higher temperature, will cause electricity
Brain surface (top or lower part) local temperature is excessively high, and especially in long-time service, bottom is hot or surface is hot.It is internal
Temperature is excessively high, impacts to other electronic components in notebook, causes notebook runnability to decline, slows,
Sometimes it even crashes.
Summary of the invention
The technical problem to be solved by the utility model is to provide a kind of radiators, while guaranteeing heat dissipation, resistance
The heat exchange and heat radiation of disconnected radiator and its surrounding space make the reduction of surrounding space temperature.
In order to solve the above technical problems, technical solution provided by the utility model is a kind of radiator, including heat source, until
A few heat conducting pipe；Described heat conducting pipe one end is connect with the heat source with heat-conducting mode, it is characterised in that the heat conducting pipe not
Thermal insulation layer is coated in the thermally conductive pipe outer wall except the radiating end connecting with the heat source；The heat conducting pipe and it is described every
Superconduction thermosphere is provided between thermosphere, the thermal coefficient of the superconduction thermosphere is greater than the thermal coefficient of the heat conducting pipe.
The heat conducting pipe be it is hollow, hollow portion is filled with phase-change material, and is provided with and allows liquid state phase change material from one end
It is back to the capillary pipe structure of the other end.
Superconduction thermosphere and heat-insulated is disposed on the heat source surface for the two sides that the heat source is connect with the heat conducting pipe
Layer, the superconduction thermosphere and thermal insulation layer of the heat source surface connect respectively with the superconduction thermosphere on the heat conducting pipe and thermal insulation layer
It connects.
The superconduction thermosphere material is metal, graphite, graphene, heat-conducting interface material, heat-conducting silicone grease, thermally conductive mica, leads
Thermal Ceramics, heat conductive rubber and other Heat Conduction Materials, with a thickness of 0.01mm-2.0mm.
The superconduction thermosphere material is artificial graphite flake, and thermal coefficient is greater than 1000w/ (mk), with a thickness of
0.02mm-0.10mm。
The heat-barrier material material be aeroge, polyimides, PE film, thermal insulating paper, glass fibre cotton plate/felt,
Polyurethane foam material, centrifugation removing cellucotton/rock wool, vacuum heat insulation material and other heat-barrier materials, with a thickness of
0.05mm-10mm。
The heat-barrier material material is aerosil, and thermal coefficient is less than 0.03w/ (mk), with a thickness of
0.2mm-1.0mm。
A kind of radiator of laptop, including CPU, display card chip, cooling fin, fan have evaporator section and cold
The heat conducting pipe of solidifying section；The evaporator section of the heat conducting pipe is connect with the heat-conducting plate in the CPU and display card chip with heat-conducting mode, institute
It states condensation segment and is connect with the cooling fin with heat-conducting mode；In the condensation segment and with heat-conducting mode and the CPU, display core
Thermal insulation layer is coated in the thermally conductive pipe outer wall except the position that piece, cooling fin connect；The heat conducting pipe with it is described heat-insulated
One layer of superconduction thermosphere is provided between layer, the thermal coefficient of the superconduction thermosphere is greater than the thermal coefficient of the heat conducting pipe.
One layer is disposed on the surface that the heat-conducting plate of the CPU, display chip is not connect with the heat conducting pipe to surpass
Heat-conducting layer and thermal insulation layer, the CPU, the superconduction thermosphere of display chip and thermal insulation layer respectively with the superconduction thermosphere on the heat conducting pipe
It is connected with thermal insulation layer.
The radiator of the utility model increases superconduction thermosphere and thermal insulation layer outside heat conducting pipe, heat can be made quick
Conduction carries out heat exchange to superconduction thermosphere and by heat conducting pipe and phase-change material, on the other hand can quickly pass a part of thermal energy
It is handed at the heat conducting pipe of condensation segment one end, radiates outward, since thermal insulation layer exists, equipment and instrument space is entered by heat radiation
Thermal energy is with regard to fewer.When superconduction thermosphere uses electrographite piece, since electrographite lamella transverse direction thermal coefficient is very high, it is greater than
1000 w/ (mk), but its longitudinal thermal coefficient is less than 30w/ (mk), when use electrographite lamella is as superconduction thermosphere
When, thermal energy can quickly be conducted to condensation end one end along heat conducting pipe length direction and be radiated outward, and longitudinal direction then only has fraction
Thermal energy is entered in equipment and instrument space by thermal insulation layer.When thermal insulation layer uses aerosil, although silica gas
The thermal coefficient of gel and air conduction coefficient are similar, but aerosil thermal coefficient as the temperature rises variation
Very little, air conduction coefficient as the temperature rises can gradually curved increase.When take thermal oxidation silicon aeroge as thermal insulation layer
When, the thermal energy that radiation is contacted with air more direct than heat conducting pipe is much lower.
When only increasing thermal insulation layer outside heat conducting pipe, thermally conductive tube wall longitudinal direction thermal energy exchange is prevented to greatest extent, is forced
Through phase-change material and heat conducting pipe transverse direction tube wall heat loss through conduction.
When using superconduction thermosphere being arranged outside heat conducting pipe and when thermal insulation layer, can laterally improve exchange rate and
In working space where preventing thermal energy from entering equipment and instrument component in longitudinal direction.When laptop is practical new using this
The radiator of type, key position temperature can reduce at least 5 degrees Celsius in laptop, and the temperature at cooling fin also accordingly drops
Low 5 degrees Celsius or more, heat dissipation effect is obvious, and notebook runnability is stablized.
When heat conducting pipe, which directlys adopt thermal coefficient, is greater than the Heat Conduction Material of 1000w/ (mk), then it is not required to fill out in heat conducting pipe
Phase-change material is filled, by the high thermal conductivity of heat conducting pipe directly by the thermal energy conduction at heat source to radiating end to external cooling；For
Prevent the thermal energy of heat conducting pipe from entering in equipment and instrument component working space from longitudinal, need to by outside heat conducting pipe it is increased every
Thermosphere prevents thermal energy from longitudinally radiating.
Detailed description of the invention
Fig. 1, heat radiator for notebook computer structural schematic diagram.
Fig. 2, CPU connect cross-sectional view with heat conducting pipe at existing heat radiator for notebook computer.
The cross-sectional view of Fig. 3, heat conducting pipe cladding superconduction thermosphere and thermal insulation layer.
Fig. 4, CPU connect cross-sectional view with the heat conducting pipe for being coated with superconduction thermosphere, thermal insulation layer.
The cross-sectional view of Fig. 5, heat conducting pipe cladding thermal insulation layer.
Specific embodiment
Scheme in view of the above technology is now lifted preferred embodiment and is specifically described in conjunction with diagram.It is dissipated with laptop
It is illustrated for thermal.Heat radiator for notebook computer includes：CPU, display card chip, cooling fin, fan, heat conducting pipe,
In.
Referring to Fig. 1 and Fig. 2, laptop display card chip 1 and CPU2 setting spaced apart are in computer casing.It dissipates
Backing 3 is arranged in notebook computer casing edge, and fan 4 is provided on the inside of cooling fin.Pass through above CPU and display card chip
Heat-conducting silicone grease 51 is provided with heat-conducting plate 5, and heat-conducting plate 5 is metal material, and it is good to can be the heating conductions such as copper, aluminium alloy, silver
Metal.Heat conducting pipe 6 is flat structure, and tube body material is copper, and phase-change material is filled in heat conducting pipe, is set in heat conducting pipe
It is equipped with capillary pipe structure.Heat conducting pipe one end is welded on CPU heat-conducting plate, above CPU after be welded on leading in display card chip
On hot plate, the other end welding of heat conducting pipe is on a heat sink.When computer work, the thermal energy warp that is generated in CPU and display card chip
Heat-conducting plate and the heat conducting pipe to link together with heat-conducting plate conduction enter in heat conducting pipe, and the phase-change material in heat conducting pipe absorbs heat by liquid
State becomes gaseous state, and the thermally conductive pipeline section connecting with CPU and display card chip then becomes evaporator section, i.e. phase-change material heat absorption is become from liquid
Gaseous process segment occurred.After becoming gaseous state, the air pressure in heat conducting pipe changes, then gaseous state phase-change material under stress along
Heat conducting pipe is mobile to one extreme direction of cooling fin, since the end heat conducting pipe is connect with cooling fin, and heat dissipation is blowed by fan, because
This, the heat conducting pipe internal and external temperature at the end is low, when gaseous state phase-change material to the end, due to the temperature difference, becomes liquid release from gaseous state
Thermal energy, discharge thermal energy through heat conducting pipe and cooling fin, be dissipated to outside laptop under the action of fan.Gaseous state, which occurs, to be become
Heat conducting pipe one end of the phase transition process of liquid becomes condensation segment.
Referring to Fig. 3, it is coated with one layer of superconduction thermosphere 7 on the periphery wall of heat conducting pipe 6, coats one in the outside of superconduction thermosphere
Layer thermal insulation layer 8, superconduction thermosphere thermal coefficient are greater than heat conducting pipe thermal coefficient.In addition to heat conducting pipe and CPU, display card chip, cooling fin
Junction, thermally conductive pipe outer wall coats superconduction thermosphere and thermal insulation layer, in order to preferably radiate, on the heat conducting pipe of heat dissipation bit end
The superconduction thermosphere of cladding is connect with cooling fin.Heat superconducting thickness degree 0.01mm-2.0mm, material can be metal, graphite, stone
Black alkene, heat-conducting interface material, heat-conducting silicone grease, thermally conductive mica, thermal conductive ceramic, heat conductive rubber and other Heat Conduction Materials.In this reality
It applies and uses material for artificial graphite flake in example, thickness range 0.02mm-0.10mm, preferred thickness 0.03mm.Artificial stone
Ink sheet has low thermal resistance：Thermal resistance lower than aluminium 40%, lower than copper 20%；It is light-weight：Weight ratio aluminium is light by 25%, lighter than copper by 75%；Tool
There is high thermal conductivity, electrographite piece has the characteristics that high, the longitudinal thermal coefficient of lateral thermal coefficient is low.It is used in the present embodiment
Electrographite piece laterally (x/y plane) thermal coefficient is greater than 1000w/ (mk), longitudinal (z-axis direction, i.e. graphite flake thickness side
To) thermal coefficient be lower than 30w/ (mk).7 thickness 0.05mm-10mm of thermal insulation layer, material can be aeroge, polyimides,
PE film, thermal insulating paper, glass fibre cotton plate/felt, polyurethane foam material, centrifugation removing cellucotton/rock wool, vacuum heat-insulation
One or more of material and other heat-barrier materials.In the present embodiment, the material that thermal insulation layer uses is silica gas
Gel, thickness 0.2mm-1.0mm, preferred thickness 0.30mm.The mean free path of air molecule in aerosil
In 70nm or so, and the pore size in SiO2 aeroge is far smaller than this critical dimension, and aperture is about 20nm, in material
Portion eliminates the need for convection current, and gaseous heat conduction rate is just very low；And lower density again limits the part biography of temperature in sparse skeleton
It broadcasts, making solid-state thermal conductivity is only 1/500 or so of unorganic glass state material thermal conductivity, and special structure becomes ideal super
Grade heat-barrier material.Its thermal coefficient is 0.02W/ (mk).The structural advantages are：When working with notebook computer, CPU, show
Phase-change material liquid to gaseous state phase transformation is absorbed heat in evaporator section and is carried out through heat conducting pipe, most of thermal energy by the thermal energy that card chip generates
Heat exchange, the gaseous state phase-change material after phase transformation are moved quickly to condensation segment, and since the temperature difference is condensed, phase-change material is become by gaseous state
Thermal energy is discharged for liquid, thermal energy directly radiates via the cooling fin being attached thereto via thermally conductive tube wall.Another part thermal energy is by leading
Heat pipe wall and superconduction thermosphere carry out heat transfer, and most of thermal energy is conducted via superconduction thermosphere to heat dissipation bit end, further in fan
Under effect, radiated via cooling fin with convection current or radiation mode, a part is conducted via thermally conductive tube wall to cooling fin, in fan
Via cooling fin convection current or radiation mode heat dissipation heat dissipation under effect.Due to being additionally provided with thermal insulation layer outside superconduction thermosphere,
In longitudinal direction, since thermal insulation layer thermal coefficient is very low, enter the just non-of space in notebook computer casing via thermal insulation layer
It is often low, it ensure that temperature is maintained at a lower level relatively in notebook computer casing.When thermal insulation layer uses silica
When aerogel film, due to aerosil film thermal coefficient as temperature change is almost unchanged, led relative to other materials
For hot coefficient becomes larger with temperature increase, heat insulation is good.By increasing electrographite lamella and silica airsetting
Adhesive film improves lateral heat exchanger effectiveness, while in the longitudinal direction, prevention thermal energy spoke in the space into notebook computer casing
Heat dissipation is penetrated, ensure that 5 degree low compared with conventional heat sinks of the temperature of laptop key position or more.
In order to preferably radiate, with reference to Fig. 4, in CPU, display card chip above the heat-conducting plate of heat conducting pipe two sides successively
It is provided with superconduction thermosphere 6 and thermal insulation layer 7, is connect respectively with the superconduction thermosphere and thermal insulation layer being coated on heat conducting pipe.The design
Heat exchange area can be increased.The thermal energy a part generated in CPU and display card chip through heat conducting pipe by phase-change material transmission radiating,
A part is via superconduction thermosphere heat loss through conduction, due at least 3 times or more of height of superconduction thermosphere thermal conductivity ratio heat conducting pipe thermal coefficient,
Heat conducting and radiating effect is relatively good.
Above-described embodiment increases superconduction thermosphere and thermal insulation layer outside heat conducting pipe, improves heat transfer speed by superconduction thermosphere
Rate, heat dissipation effect are good.Referring to Fig. 5, for another construction for heat radiating device that the utility model designs, and above-described embodiment
Difference is directly to coat thermal insulation layer outside heat conducting pipe.The material of thermal insulation layer is same as the previously described embodiments.In above-described embodiment
Heat conducting pipe in filled with phase-change material carry out quick heat exchange.When the thermal coefficient of heat conducting pipe itself is very high, greater than 800w/
(mk) when, heat conducting pipe is then not required to filling phase-change material, efficient heat exchange can be realized by heat conducting pipe itself, thermally conductive
Pipe radiating end realizes heat dissipation, but in order to avoid the thermal energy of heat conducting pipe enters where each component of equipment and instrument from longitudinal direction
Working space then still needs that thermal insulation layer is arranged on heat conducting pipe periphery wall.In short, no matter heat conducting pipe, which uses, is filled with phase transformation material
The heat conducting pipe of material or the heat conducting pipe for being directly greater than 800w/ (mk) using thermal coefficient, for each element manipulation of equipment and instrument
There is a lower working environment in space, it is necessary to thermal insulation layer be arranged on heat conducting pipe periphery wall.
Other than radiator on computer notebook, in other industry, such as mobile phone, sophisticated electronics instrument, space flight
The fields such as communication can also apply the radiator of the utility model.Heat conducting pipe one end is connect with heat-conducting mode with heat source surface,
The heat conducting pipe other end, i.e. radiating end and cooling fin are connected with heat-conducting mode, are not connected with heat source and cooling fin in heat conducting pipe
Outer wall coat thermal insulation layer；Or coat superconduction thermosphere and thermal insulation layer.Radiating mode：Thermal energy on heat source is conducted through heat conducting pipe to it
Radiating end, radiating end are radiated with convection current or radiation mode to equipment and instrument via cooling fin again.When there is no cooling fin such as, lead
When heat pipe heat radiation end is not required to connect with other device features, then heat conducting pipe radiating end is not required to cladding thermal insulation layer, directly connects with air
Touching heat dissipation.
Test existing notebook computer radiating device, heat conducting pipe outer cladding electrographite lamella and aerosil layer
Radiator, heat conducting pipe only coated silica aerogel layer radiator, by the radiator of this three groups of different structures
Test data test three groups at room temperature, be averaged, be shown in Table one.Test laptop model Asus P43S, temperature
Test uses TOPRIE TP9000 multichannel data recorder.
Table one
As shown in Table 1, the radiator and existing heat dissipation of increase electrographite lamella and aerosil film layer
Device radiation effect compares, and cooling at most decreases by 12.5 degrees Celsius at 5 degrees Celsius or more at key position,
Radiating and cooling effect is obvious；Only increase aerosil film layer, cooling effect is than increasing electrographite lamella and titanium dioxide
The radiating and cooling effect of the radiator of silica aerogel film layer is slightly worse, but at key position cooling extent also at 4 degrees Celsius or more.
By the above test data it is found that increase superconduction thermosphere and thermal insulation layer radiator and only increase thermal insulation layer radiator it is right
Laptop has the effect of radiating and cooling.
Claims (13)
1. a kind of radiator, including heat source, at least one heat conducting pipe；Described heat conducting pipe one end and the heat source are with heat-conducting mode
Connection, it is characterised in that coated in the thermally conductive pipe outer wall except the radiating end that the heat conducting pipe is not connect with the heat source
There is thermal insulation layer；Superconduction thermosphere is provided between the heat conducting pipe and the thermal insulation layer, the thermal coefficient of the superconduction thermosphere is big
In the thermal coefficient of the heat conducting pipe.
2. radiator according to claim 1, it is characterised in that the heat conducting pipe be it is hollow, hollow portion be filled with phase
Become material, and is provided with the capillary pipe structure for allowing liquid state phase change material to be back to the other end from one end.
3. radiator according to claim 1, it is characterised in that in the two sides that the heat source is connect with the heat conducting pipe
Heat source surface on be disposed with superconduction thermosphere and thermal insulation layer, the superconduction thermosphere and thermal insulation layer of the heat source surface are led with described
The superconduction thermosphere and thermal insulation layer on heat pipe are separately connected.
4. radiator according to any one of claims 1 to 3, it is characterised in that the superconduction thermosphere material is metal, stone
Ink, graphene, heat-conducting interface material, heat-conducting silicone grease, thermally conductive mica, thermal conductive ceramic, heat conductive rubber and other Heat Conduction Materials,
With a thickness of 0.01mm-2.0mm.
5. radiator according to claim 4, it is characterised in that the superconduction thermosphere material is artificial graphite flake, thermally conductive
Coefficient is greater than 1000w/ (mk), with a thickness of 0.02mm-0.10mm.
6. radiator according to any one of claims 1 to 3, it is characterised in that the heat-barrier material material be aeroge,
Polyimides, PE film, thermal insulating paper, glass fibre cotton plate/felt, polyurethane foam material, centrifugation removing cellucotton/rock
Cotton, vacuum heat insulation material and other heat-barrier materials, with a thickness of 0.05mm-10mm.
7. radiator according to claim 6, it is characterised in that the heat-barrier material material is aerosil,
Its thermal coefficient is less than 0.03w/ (mk), with a thickness of 0.2mm-1.0mm.
8. a kind of radiator of laptop, including CPU, display card chip, cooling fin, fan have evaporator section and condensation
The heat conducting pipe of section；The evaporator section of the heat conducting pipe is connect with the heat-conducting plate in the CPU and display card chip with heat-conducting mode, described
Condensation segment is connect with the cooling fin with heat-conducting mode；The condensation segment and with heat-conducting mode and the CPU, display chip,
Thermal insulation layer is coated in the thermally conductive pipe outer wall except the position of cooling fin connection；The heat conducting pipe and the thermal insulation layer it
Between be provided with one layer of superconduction thermosphere, the thermal coefficient of the superconduction thermosphere is greater than the thermal coefficient of the heat conducting pipe.
9. radiator according to claim 8, it is characterised in that the CPU, display chip heat-conducting plate not with institute
It states and is disposed with one layer of superconduction thermosphere and thermal insulation layer, the superconduction thermosphere of the CPU, display chip on the surface of heat conducting pipe connection
With thermal insulation layer respectively on the heat conducting pipe superconduction thermosphere and thermal insulation layer connect.
10. according to any radiator of claim 8-9, it is characterised in that the superconduction thermosphere material is metal, stone
Ink, graphene, heat-conducting interface material, heat-conducting silicone grease, thermally conductive mica, thermal conductive ceramic, heat conductive rubber and other Heat Conduction Materials,
With a thickness of 0.05mm-10mm.
11. radiator according to claim 10, it is characterised in that the superconduction thermosphere material is artificial graphite flake, is led
Hot coefficient is greater than 1000w/ (mk), with a thickness of 0.02mm-0.10mm.
12. according to any radiator of claim 8-9, it is characterised in that the heat-barrier material material be aeroge,
Polyimides, PE film, thermal insulating paper, glass fibre cotton plate/felt, polyurethane foam material, centrifugation removing cellucotton/rock
Cotton, vacuum heat insulation material and other heat-barrier materials, with a thickness of 0.05mm-10mm.
13. radiator according to claim 12, it is characterised in that the heat-barrier material material is silica airsetting
Glue, thermal coefficient is less than 0.03w/ (mk), with a thickness of 0.2mm-1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720899070.4U CN208156595U (en) | 2017-07-24 | 2017-07-24 | A kind of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720899070.4U CN208156595U (en) | 2017-07-24 | 2017-07-24 | A kind of radiator |
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| CN208156595U true CN208156595U (en) | 2018-11-27 |
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ID=64413013
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112120287A (en) * | 2019-06-25 | 2020-12-25 | 湖南中烟工业有限责任公司 | Low-temperature smoking set with heat insulation structure |
| WO2022019909A1 (en) * | 2020-07-23 | 2022-01-27 | Hewlett-Packard Development Company, L.P. | Thermal management devices |
-
2017
- 2017-07-24 CN CN201720899070.4U patent/CN208156595U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112120287A (en) * | 2019-06-25 | 2020-12-25 | 湖南中烟工业有限责任公司 | Low-temperature smoking set with heat insulation structure |
| CN112120287B (en) * | 2019-06-25 | 2024-05-14 | 湖南中烟工业有限责任公司 | Low-temperature smoking set with heat insulation structure |
| WO2022019909A1 (en) * | 2020-07-23 | 2022-01-27 | Hewlett-Packard Development Company, L.P. | Thermal management devices |
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