CN104952818B - A kind of heat-transfer device and electronic equipment - Google Patents
A kind of heat-transfer device and electronic equipment Download PDFInfo
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- CN104952818B CN104952818B CN201510272051.4A CN201510272051A CN104952818B CN 104952818 B CN104952818 B CN 104952818B CN 201510272051 A CN201510272051 A CN 201510272051A CN 104952818 B CN104952818 B CN 104952818B
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Abstract
The invention discloses a kind of heat-transfer device and electronic equipment, which includes: the first end for contacting with heat source；The second end contacted with radiator；Connect the flexible heat-conducting part of the first end and the second end.Heat-conducting medium is provided in the heat-transfer device；The heat for the heat source that the first end obtains is transmitted to the second end by the heat-conducting medium, is distributed by the radiator.Heat-transfer device both ends of the present invention use metal structure, and centre uses heat-conducting part flexible, relative to existing metal heat-conducting tube, there is the heat-transfer device of flexible heat-conducting part to be easy to deformation, can be adapted for the interior spatial structure of distinct electronic apparatuses, easy to use.And flexible material is generally ambroin, relative to metal heat-conducting tube, cost is relatively low, good insulation preformance, not will lead to the short circuit of electronic equipment internal circuit.Electronic equipment of the present invention uses the heat-transfer device, and heat-transfer device is easy to use, is laid out convenient for internal circuit.
Description
Technical field
The present invention relates to technical field of heat dissipation, more specifically, being related to a kind of heat-transfer device and electronic equipment.
Background technique
With the continuous development of science and technology, more and more electronic equipments are applied to daily life and work
In, huge convenience is brought for daily life and work.Increasingly prosperity, the electronic equipment of integrated circuit technology are kept in mind
Miniaturization develops with portability.
When the integrated level of electronic equipment is higher, the semiconductor devices integrated on the chip circuit of electronic equipment is more, chip
The heat generated on circuit is more.And temperature is to influence a key factor of performance of semiconductor device, in order to guarantee chip electricity
The normal table on road works, and generally requires and provides special radiator for chip circuit.
Therefore, in order to guarantee that the normal table of electronic equipment works, many electronic equipments are required to setting radiator, together
When need special thermal conductivity heat pipe that heat is transmitted to radiator by electronic equipment heat source to distribute.
Existing heat conducting pipe is generally metal heat-conducting tube, and metal material is not easy to Bending Deformation, and different electronic equipments needs
The heat conducting pipe of differently curved shape is separately provided, it is therefore, existing in order to be suitable for the space structure of electronic equipment internal
Heat conducting pipe is inconvenient to use.
Summary of the invention
To solve the above problems, the heat conducting pipe has soft the present invention provides a kind of heat-transfer device and electronic equipment
Property heat-conducting part, is readily bent deformation, easy to use.
To achieve the goals above, the invention provides the following technical scheme:
A kind of heat-transfer device, the heat-transfer device include:
First end for being contacted with heat source；
The second end for being contacted with radiator；
Connect the flexible heat-conducting part of the first end and the second end；
Wherein, heat-conducting medium is provided in the heat-transfer device；The heat for the heat source that the first end obtains passes through institute
It states heat-conducting medium and is transmitted to the second end, distributed by the radiator.
Preferably, in above-mentioned heat-transfer device, the first end and the second end are metal parts or thermally conductive pottery
Porcelain component.
Preferably, in above-mentioned heat-transfer device, the flexibility heat-conducting part is plastic hose.
Preferably, in above-mentioned heat-transfer device, the heat-transfer device is internally provided at least one by the first end
The passage of heat extended to the second end；
The heat eliminating medium is filled in the passage of heat, and the heat eliminating medium is thermally conductive carbon material.
Preferably, in above-mentioned heat-transfer device, the heat eliminating medium be fill the full passage of heat graphite powder or
Graphene.
Preferably, in above-mentioned heat-transfer device, the heat-conducting medium is liquid at room temperature.
Preferably, in above-mentioned heat-transfer device, the heat-conducting medium is water or alcohol.
Preferably, in above-mentioned heat-transfer device, passage of heat, the passage of heat packet are additionally provided in the heat-transfer device
It includes:
The first chamber of the first end is set；
The second chamber of the second end is set；
At least one first passage and multiple second channels in the flexible heat-conducting part are set；The first passage
Diameter be greater than the second channel diameter；
Wherein, described first passage one end connects the first chamber, and the other end connects the second chamber；Described second
One end of the channel connects the first chamber, and the other end connects the second chamber；Liquid heat conductive in the first chamber
Become gaseous state after medium is heated and the second chamber is transferred to by the first passage, passes through the second channel after condensation
Capillary phenomenon is transmitted back to the first chamber.
Preferably, in above-mentioned heat-transfer device, the flexibility heat-conducting part outer wall is partiting thermal insulation material outer wall.
The present invention also provides a kind of electronic equipment, which includes:
Heat-transfer device described in any of the above embodiments；
The host being connect with the first end of the heat-transfer device；
The radiator being connect with the second end of the heat-transfer device.
As can be seen from the above description, the heat-transfer device that technical solution of the present invention provides includes: for contacting with heat source
One end；The second end for being contacted with radiator；The flexibility for connecting the first end and the second end is thermally conductive
Portion.Wherein, heat-conducting medium is provided in the heat-transfer device；The heat for the heat source that the first end obtains passes through described thermally conductive
Medium is transmitted to the second end, is distributed by the radiator.Heat-transfer device both ends of the present invention use metal knot
Structure, centre use heat-conducting part flexible, relative to existing metal heat-conducting tube, there is the heat-transfer device of flexible heat-conducting part to be easy to shape
Become, can be adapted for the interior spatial structure of distinct electronic apparatuses, it is easy to use.And flexible material is generally ambroin, phase
For metal heat-conducting tube, cost is relatively low, and good insulation preformance, not will lead to the short circuit of electronic equipment internal circuit.
Electronic equipment of the present invention carries out heat transmission using above-mentioned heat-transfer device, and heat-transfer device is easy to use, installation
Simply, and due to not will lead to electronic equipment internal when the flexible heat-conducting part of the heat-transfer device is prepared using insulating materials
Short circuit more convenient for electronic equipment internal circuit layout, while ensure that the safe and stable operation of electronic equipment.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of structural schematic diagram of heat-transfer device provided by the embodiments of the present application；
Fig. 2 is the structural schematic diagram of another heat-transfer device provided by the embodiments of the present application；
Fig. 3 is sectional drawing of the heat-transfer device shown in Fig. 2 along the interface AA '；
Fig. 4 is the structural schematic diagram of a kind of electronic equipment provided by the embodiments of the present application.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Metal heat-conducting tube is on the one hand due to being unlikely to deform, which results in a kind of electronic equipment, when its inner space is certain
When, the internal space restraint by electronic equipment is needed to be set as specific structure by the shape of heat conducting pipe.And metal material
It generally is not easy Bending Deformation, therefore metal heat-conducting tube is inconvenient to use；Meanwhile the higher cost of metal heat-conducting tube；And metal is led
Heat pipe is conductor, not will lead to electronic equipment internal electricity after needing to guarantee the installation of metal heat-conducting tube when designing its shape and structure
Short out road.
In conclusion metal heat-conducting tube, there are at high cost, bending moulding difficulty is big, it is not convenient to use and needs to evade electricity
The problems such as the internal circuit of sub- equipment.
To solve the above-mentioned problems, the embodiment of the present application provides a kind of heat-transfer device, and the heat-transfer device is used for electronics
Equipment cooling connects the host and radiator of electronic equipment, by host heat transfer to the radiator.
With reference to Fig. 1, Fig. 1 is a kind of structural schematic diagram of heat-transfer device provided by the embodiments of the present application, the heat-transfer device packet
It includes: first end 11；The second end 12；And the flexible heat-conducting part of the connection first end 11 and the second end 12
13。
The first end 11 is Heat Conduction Material.The first end 11 is used for and heat source contact.First end shown in Fig. 1
Portion 11 is only to illustrate, and the shape of the first end 11 can be designed according to the contact structures of heat source.
The second end 12 is Heat Conduction Material.The second end 12 is used for the second end contacted with radiator.
Equally, the second end 12 shown in Fig. 1 is only to illustrate, and can design the second end 12 according to the contact structures of radiator
Shape.
The flexibility heat-conducting part 13 connects the first end 11 and the second end 12.The flexibility heat-conducting part uses
Flexible Heat Conduction Material preparation.
Wherein, heat-conducting medium 14 is provided in the heat-transfer device.The heat for the heat source that the first end 11 obtains is logical
It crosses the heat-conducting medium 14 and is transmitted to the second end 12, distributed by the radiator.The heat-transfer device is closing
Structure, in order to save the heat-conducting medium.
In heat-transfer device described in the embodiment of the present application, for the ease of the conduction of heat, the first end 11 and described the
Two ends 12 can be metal parts or thermal conductive ceramic component.
The flexibility heat-conducting part 13 can be plastic hose.Plastic hose is easy to deformation moulding, and good insulating, convenient for electricity
Installation, not will lead to electronic equipment internal short circuit inside sub- equipment.
The heat-transfer device is internally provided with what at least one extended from the first end 11 to the second end 12
Passage of heat.The heat eliminating medium 14 is filled in the passage of heat, and the heat eliminating medium 14 can be thermally conductive carbon
Material.
Carbon thermal conductivity of material is excellent, and stablizes, long service life, therefore, using dissipating for carbon material preparation
Thermal medium can have longer service life while making the heat-transfer device have preferable heat-transfer effect.Preferably,
The heat eliminating medium 14 is the graphite powder or graphene for filling the full passage of heat.
Particularly, graphene thermal coefficient with higher can make the heat-transfer device have preferable thermal conductivity
Can, heat from heat source can be transmitted to the second end 12 by the first end 11 faster, improve dissipating for electronic equipment
The thermal efficiency.
Based on embodiment illustrated in fig. 1, it to be this with reference to Fig. 2, Fig. 2 that the embodiment of the present application also provides another heat-transfer devices
Apply for the structural schematic diagram for another heat-transfer device that embodiment provides, the heat-conducting medium 14 in heat-transfer device described in Fig. 2 is liquid
State.
The heat-conducting medium is liquid at room temperature (25 DEG C).When the heat-conducting medium 14 is liquid, institute in order to prevent
The leakage of heat-conducting medium 14 is stated, the heat-transfer device needs for sealing structure.The heat-conducting medium 14 can be water or alcohol.
When the heat-conducting medium 14 is liquid, in order to improve the speed for conducting heat of the heat-transfer device, need
The special passage of heat of setting, forms the circulatory system in the heat-transfer device, so that heat-conducting medium 14 in the heat-transfer device
The circulating heat transfer in the passage of heat.
In Fig. 2 illustrated embodiment, in order to form the circulatory system of the heat-conducting medium 14, the heat-transfer device is also set up
There is passage of heat, the passage of heat includes: the first chamber 21 that the first end 11 is arranged in；It is arranged in the second end
The second chamber 22 in portion 12；At least one first passage 24 and multiple second channels in the flexible heat-conducting part 13 are set
23.The diameter of the first passage 24 is greater than the diameter of the second channel 23.
Wherein, described 24 one end of first passage connects the first chamber 21, and the other end connects the second chamber 22；Institute
It states 23 one end of second channel and connects the first chamber 21, the other end connects the second chamber 22；Positioned at the first chamber
Become gaseous state after interior 21 liquid heat-conducting medium 14 is heated and the second chamber 22 is transferred to by the first passage 24, condenses
The first chamber 21 is transmitted back to by the capillary phenomenon of the second channel 23 afterwards.
In order to preferably realize circulation of the heat-conducting medium 14 in heat-transfer device, the heat-transfer device is in use, make
The level height of one end 11 is higher than the level height of the second end 12.The first passage 24 and the second channel
Diameter can be designed according to the heating power for the electronic equipment that the heat-transfer device is adapted to, and the application is not specifically limited herein.
It is sectional drawing of the heat-transfer device shown in Fig. 2 along the interface AA ' with reference to Fig. 3, Fig. 3, for the ease of inner passage molding, institute
Stating first passage 24 and the second channel 23 is circle, and the first passage 24 is located at the centre bit of the heat-transfer device
It sets, the second channel 23 is evenly distributed on the surrounding of the first passage 24.
Liquid heat-conducting medium is utilized by the passage of heat inside setting heat-transfer device using the heat-conducting medium of liquid
Phase transformation can quickly transmit heat, improve radiating rate.
In heat-transfer device described in the embodiment of the present application, the flexibility heat-conducting part outer wall is partiting thermal insulation material outer wall.In this way,
On the one hand heat can be prevented to be dispersed into the other positions of electronic equipment in transmittance process on the other hand can be to avoid internal
Portion's circuit causes short circuit.
When the heat-transfer device uses the heat-conducting medium of liquid, in order to enable the first end and the second end
Portion is tightly connected with the flexible heat-conducting part, and the first end and the second end can be set and lead with the flexibility
Hot portion has compared with crossover position.
In the crossover position of the first end and the flexible heat-conducting part, the flexibility heat-conducting part is covered in the first end
Portion is arranged the outer diameter that the flexible heat-conducting part is less than the first end in the internal diameter of the crossover position, utilizes the flexibility
The flexible fastening flexibility heat-conducting part and the first end of heat-conducting part, to realize that first end is being handed over the flexible heat-conducting part
The sealing of folded position.
In the crossover position of the second end and the flexible heat-conducting part, the flexibility heat-conducting part is covered in the second end
Portion is arranged the outer diameter that the flexible heat-conducting part is less than the second end in the internal diameter of the crossover position, utilizes the flexibility
The flexible fastening flexibility heat-conducting part and the second end of heat-conducting part, to realize that the second end and the flexible heat-conducting part are overlapping
The sealing of position.
It, can also be in the crossover position of the first end and the flexible heat-conducting part in order to guarantee preferable sealing effect
And sealant is respectively provided in the crossover position of the second end and the flexible heat-conducting part.
When using liquid heat-conducting medium, in order to guarantee heat-transfer device liquid heat-conducting medium gas when transmitting heat
The second end is transferred to after change faster, the liquid heat-conducting medium of the second end condensation flows back into first end faster, to institute
The passage of heat stated in heat-transfer device carries out vacuumize process, so as to improve the speed for transmitting heat of the heat-transfer device
Degree, when carrying out electronic equipment dissipating heat, further increases radiating rate.
As can be seen from the above description, heat-transfer device described in the embodiment of the present application is intermediate relative to existing metal heat-conducting tube
Part is easy to moulding, can be adapted for the electronic equipment of different internal structure, phase using flexible heat-conducting part, the flexibility heat-conducting part
For the heat conducting pipe of all-metal, install and use more convenient；And using the flexible heat-conducting part of plastic material, at low cost, insulation
Performance is good, in electronic equipment internal using not will lead to electronic equipment internal short circuit, convenient for electronic equipment internal use with
And the safe and stable operation of electronic equipment；Meanwhile by the heat-conducting medium and passage of heat of setting, heat transfer rate is fast, improves
Radiating rate.
The embodiment of the present application also provides a kind of electronic equipment, and with reference to Fig. 4, Fig. 4 is one kind provided by the embodiments of the present application
The structural schematic diagram of electronic equipment, the electronic equipment include: heat-transfer device 42, host 41 and radiator 43.
Wherein, the heat-transfer device is heat-transfer device described in any embodiment of above-described embodiment.The thermally conductive dress
The first end for setting 42 connects the host 41, and the second end of the heat-transfer device 42 connects the radiator 43.
The electronic equipment is easy to moulding, the side of installing and using using heat-transfer device described in above-described embodiment, heat-transfer device
Just quick；Meanwhile the flexible heat-conducting part of insulating properties can be avoided and cause electronic equipment internal short circuit, ensure that electronic equipment
Safe and stable operation；And since heat-transfer device can quickly transmit heat, therefore the good heat dissipation effect of the electronic equipment, work
Performance is stablized.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (6)
1. a kind of heat-transfer device characterized by comprising
First end for being contacted with heat source；
The second end for being contacted with radiator；
Connect the flexible heat-conducting part of the first end and the second end；
Wherein, heat-conducting medium is provided in the heat-transfer device；The heat for the heat source that the first end obtains is led by described
Thermal medium is transmitted to the second end, is distributed by the radiator；
The heat-conducting medium is liquid at room temperature；The level height height of the first end and the level of the second end are high
Degree；
Passage of heat is additionally provided in the heat-transfer device, the passage of heat includes: first that the first end is arranged in
Chamber；The second chamber of the second end is set；Be arranged at least one first passage in the flexible heat-conducting part with
And multiple second channels；The diameter of the first passage is greater than the diameter of the second channel；
Wherein, described first passage one end connects the first chamber, and the other end connects the second chamber；The second channel
One end connects the first chamber, and the other end connects the second chamber；Liquid heat-conducting medium in the first chamber
Become gaseous state after heated and the second chamber is transferred to by the first passage, passes through the capillary of the second channel after condensation
Phenomenon is transmitted back to the first chamber.
2. heat-transfer device according to claim 1, which is characterized in that the first end is metal with the second end
Component or thermal conductive ceramic component.
3. heat-transfer device according to claim 2, which is characterized in that the flexibility heat-conducting part is plastic hose.
4. heat-transfer device according to claim 1, which is characterized in that the heat-conducting medium is water or alcohol.
5. heat-transfer device according to claim 1, which is characterized in that the flexibility heat-conducting part outer wall is partiting thermal insulation material
Outer wall.
6. a kind of electronic equipment characterized by comprising
The described in any item heat-transfer devices of claim 1-5；
The host being connect with the first end of the heat-transfer device；
The radiator being connect with the second end of the heat-transfer device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510272051.4A CN104952818B (en) | 2015-05-25 | 2015-05-25 | A kind of heat-transfer device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510272051.4A CN104952818B (en) | 2015-05-25 | 2015-05-25 | A kind of heat-transfer device and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104952818A CN104952818A (en) | 2015-09-30 |
| CN104952818B true CN104952818B (en) | 2018-12-14 |
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ID=54167377
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510272051.4A Active CN104952818B (en) | 2015-05-25 | 2015-05-25 | A kind of heat-transfer device and electronic equipment |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110793368A (en) * | 2019-11-14 | 2020-02-14 | 刘溯晓 | Flexible heat conduction module |
| CN113374765B (en) * | 2021-06-04 | 2023-05-09 | 上海复合材料科技有限公司 | High-heat-conductivity flexible structure and connecting method |
| CN114076085B (en) * | 2021-11-24 | 2022-11-11 | 珠海格力电器股份有限公司 | Heat dissipation assembly, compressor and air conditioner |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6184578B1 (en) * | 1990-02-28 | 2001-02-06 | Hughes Electronics Corporation | Graphite composite heat pipe |
| CN1367642A (en) * | 2001-01-23 | 2002-09-04 | 董广计 | Heat-pipe radiating device for heat radiation of microcomputer and electronic equipment |
| CN101173843A (en) * | 2006-11-01 | 2008-05-07 | 富准精密工业(深圳)有限公司 | Flexible heat pipe |
| CN101178173A (en) * | 2007-12-05 | 2008-05-14 | 广州市立本电器有限公司 | Steam generator |
| CN102300440A (en) * | 2010-06-22 | 2011-12-28 | 侯宗志 | Flexible radiating guide tube |
-
2015
- 2015-05-25 CN CN201510272051.4A patent/CN104952818B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6184578B1 (en) * | 1990-02-28 | 2001-02-06 | Hughes Electronics Corporation | Graphite composite heat pipe |
| CN1367642A (en) * | 2001-01-23 | 2002-09-04 | 董广计 | Heat-pipe radiating device for heat radiation of microcomputer and electronic equipment |
| CN101173843A (en) * | 2006-11-01 | 2008-05-07 | 富准精密工业(深圳)有限公司 | Flexible heat pipe |
| CN101178173A (en) * | 2007-12-05 | 2008-05-14 | 广州市立本电器有限公司 | Steam generator |
| CN102300440A (en) * | 2010-06-22 | 2011-12-28 | 侯宗志 | Flexible radiating guide tube |
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| CN104952818A (en) | 2015-09-30 |
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