CN208127198U - Chip set - Google Patents

Abstract

The utility model provides a kind of chip set, is related to photo-coupler technical field, the lower technical problem of the materials'use rate for solving tablet.The chip set includes tablet, the tablet includes multiple supporting bands being parallel to each other, each supporting band includes multiple luminescence chip brackets and multiple sensitive chip brackets, and in each supporting band, and the luminescence chip bracket and the sensitive chip bracket are staggered.Chip set provided by the utility model is in photo-coupler.

Description

Chip set

Technical field

The utility model relates to photo-coupler technical field more particularly to a kind of chip sets.

Background technique

Photo-coupler is a kind of photoelectric subassembly for carrying out transmission telecommunications number using light as medium.In general, the hair of photo-coupler The electric signal of input is converted into optical signal by optical chip, and the optical signal is sent to sensitive chip, and sensitive chip receives the light Back into electric signals output is converted after signal.Since electric signal is to be transmitted to sense from luminescence chip with optical signal in photo-coupler Optical chip, therefore, photo-coupler have good isolation effect to signal noise, can electric signal to avoid transmitting terminal and reception Interfering with each other between the electric signal at end, therefore, photo-coupler are widely used in various circuits.

Photo-coupler includes luminescence chip bracket, sensitive chip bracket, luminescence chip and sensitive chip, wherein shine core Plate rack receives the extraneous electric signal inputted for carrying luminescence chip, and by the pin in luminescence chip bracket, and passes Pass luminescence chip；Sensitive chip bracket is used to carry sensitive chip, and will be photosensitive by the pin in sensitive chip bracket Chip receives the signal output of conversion.It can be seen that luminescence chip bracket and sensitive chip bracket are that photo-coupler realizes its function The important devices of energy.

However, existing luminescence chip bracket and sensitive chip bracket are respectively formed on two tablets, therefore dividing Not Zhi Zuo luminescence chip bracket and when sensitive chip bracket, the material removed from tablet is more, leads to the materials'use of tablet Rate is lower, causes waste of material, considerably increases the production cost of chip set.

In recent years, due to the mass production of photo-coupler, price war between manufacturer so that the profit of photo-coupler by Gradually in meagre profit.Therefore, how to reduce production cost, with promoted photo-coupler profit or increase photo-coupler price it is competing Power is striven, one of the target for falling over each other to make great efforts at current various manufacturers.

Utility model content

The purpose of this utility model is to provide a kind of chip sets, for solving the lower skill of materials'use rate of tablet Art problem.

The utility model provides a kind of chip set comprising tablet, the tablet include multiple branch being parallel to each other Frame band, each supporting band include multiple luminescence chip brackets and multiple sensitive chip brackets, and in each supporting band In, the luminescence chip bracket and the sensitive chip bracket are staggered.

Compared with prior art, chip set provided by the embodiment of the utility model has the following advantages that：

Chip set provided by the embodiment of the utility model, since luminescence chip bracket and sensitive chip bracket are formed in together In one tablet, and luminescence chip bracket and sensitive chip bracket are staggered in the same supporting band, utilize luminescence chip The complementarity of both bracket and sensitive chip bracket shape, can reduce production luminescence chip bracket and when sensitive chip bracket from The quantity of material removed on tablet, improves the materials'use rate of tablet, and reduces the production cost of chip set.

As a kind of improvement of said chip bracket, multiple luminescence chip brackets in each supporting band are arranged at equal intervals It arranges, multiple sensitive chip bracket arranged at equal intervals in each supporting band.

Another kind as said chip bracket improves, and the luminescence chip bracket includes luminescence chip mounting portion, shines Chip pin, and the luminescence chip bending part of connection the luminescence chip mounting portion and luminescence chip pin, the luminous core Piece bending part keeps the luminescence chip mounting portion and the luminescence chip pin non-coplanar.

As the further improvement of said chip bracket, the luminescence chip mounting portion is far from the luminescence chip bending part One end be provided with plush copper.

Another kind as said chip bracket improves, and the sensitive chip bracket includes sensitive chip mounting portion, photosensitive Chip pin, and the sensitive chip bending part of connection the sensitive chip mounting portion and sensitive chip pin, the photosensitive core Piece bending part keeps the sensitive chip mounting portion and the sensitive chip pin non-coplanar.

It is described in adjacent luminescence chip bracket and sensitive chip bracket as the further improvement of said chip bracket It is connected between luminescence chip pin and the sensitive chip pin by connection strap.

Another kind as said chip bracket improves, and is provided in the tablet between the two neighboring supporting band At least row's cushion hole.

As the further improvement of said chip bracket, the cushion hole is rectangular opening, round hole or slotted eye.

Another kind as said chip bracket improves, and the tablet is aluminum alloy sheet, iron-nickel alloy sheet or copper series alloy Piece.

As the further improvement of said chip bracket, the tablet with a thickness of 0.23mm~0.27mm.

Another kind as said chip bracket improves, the luminescence chip bracket and the sensitive chip bracket with one away from From being parallel to each other and arranged in a crossed manner, and the sense of the luminescence chip mounting portion of the luminescence chip bracket and the sensitive chip bracket Optical chip mounting portion is to be oppositely arranged in a manner of aspectant respectively.

As said chip bracket another kind improve, the luminescence chip pin of the luminescence chip bracket with it is described photosensitive The sensitive chip pin of chip set is arranged in a crossed manner each other with a distance.

Another kind as said chip bracket improves, and the luminescence chip mounting portion of the luminescence chip bracket is embedded in one liang Between adjacent sensitive chip mounting portion, the sensitive chip mounting portion of the sensitive chip bracket is embedded in one liang of adjacent luminous core Between piece mounting portion.

In addition to the utility model described above solve the technical issues of, constitute technical solution technical characteristic and by Outside beneficial effect brought by the technical characteristic of these technical solutions, chip set provided by the utility model can solve its The other technical characteristics and these technical characteristic bring beneficial effects for including in his technical problem, technical solution, will have Further details of explanation is made in body embodiment.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be practical to this New embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below Attached drawing be only that a part of the embodiment of the utility model is not paying creation for those of ordinary skill in the art Property labour under the premise of, can also be obtained according to these attached drawings other attached drawings.

Fig. 1 is the structural schematic diagram of chip set provided by the embodiment of the utility model；

Fig. 2 is the area Tu1Zhong A enlarged drawing；

Fig. 3 is the location diagram in photo-coupler between luminescence chip bracket and sensitive chip bracket.

Description of symbols：

1- chip set, 12- connection strap,

10- tablet, 11- cushion hole,

20- supporting band, 30- luminescence chip bracket,

31- luminescence chip mounting portion, 32- luminescence chip bending part,

33- luminescence chip pin, 34- plush copper,

40- sensitive chip bracket, 41- sensitive chip mounting portion,

42- sensitive chip bending part, 43- sensitive chip pin,

45- luminescence chip, 50- transparent encapsulant glue,

55- sensitive chip, the opaque packaging plastic of 60-,

70- photo-coupler.

Specific embodiment

Existing luminescence chip bracket and sensitive chip bracket are respectively formed on two tablets, therefore in production hair respectively When optical chip bracket and sensitive chip bracket, the material removed from two tablets is more, cause the materials'use rate of tablet compared with It is low, considerably increase the production cost of chip set.

In view of the above-mentioned problems, the utility model embodiment provides a kind of chip set, by luminescence chip bracket and photosensitive Chip set is staggered on same tablet, reduce production luminescence chip bracket and when sensitive chip bracket from tablet institute The quantity of material of removal, improves the materials'use rate of tablet, and reduces the production cost of chip set.

It, below will knot in order to keep the above objects, features, and advantages of the utility model embodiment more obvious and easy to understand The attached drawing in the utility model embodiment is closed, the technical scheme in the utility model embodiment is clearly and completely described. Obviously, described embodiment is only a part of the embodiment of the utility model, instead of all the embodiments.Based on this reality With the embodiment in novel, those of ordinary skill in the art without creative labor it is obtained it is all its Its embodiment belongs to the range of the utility model protection.

Please refer to Fig. 1 and Fig. 2, a kind of chip set 1 provided by the embodiment of the utility model comprising tablet 10, it is described Tablet 10 includes multiple supporting bands 20 being parallel to each other, and each supporting band 20 includes multiple luminescence chip brackets 30 and multiple photosensitive Chip set 40, and in each supporting band 20, luminescence chip bracket 30 and sensitive chip bracket 40 are staggered.Luminescence chip Bracket 30 includes an at least luminescence chip mounting portion 31 and an at least luminescence chip pin 33, e.g. two luminescence chip installations Portion 31 and two luminescence chip pins 33.Sensitive chip bracket 40 includes that an at least sensitive chip mounting portion 41 and at least one shine Chip pin 43, e.g. three sensitive chip mounting portions 41 and three sensitive chip pins 43.

When it is implemented, tablet 10 is usually conductive metal thin material, such as tablet 10 is aluminum alloy sheet, iron nickel Alloy sheet or copper series alloy piece, such as anaerobic copper sheet, deoxidation copper sheet.The thickness of tablet 10 is generally 0.23mm~0.27mm, excellent Selection of land, tablet 10 with a thickness of 0.25mm.It is formed with multiple supporting bands 20 in tablet 10, includes eight in embodiment illustrated in fig. 1 The supporting band 20 being parallel to each other；Each supporting band 20 includes multiple luminescence chip brackets 30 and multiple sensitive chip brackets 40, and In each supporting band 20, luminescence chip bracket 30 and sensitive chip bracket 40 are staggered, and say in further detail, in a branch In frame band 20, including two pectinate textures, one of pectinate texture is using luminescence chip bracket 30 as comb teeth, another pectination Structure is using sensitive chip bracket 40 as comb teeth, and in the embodiment shown in fig. 1, the left side of each supporting band 20 is formed with photosensitive core Pectinate texture of the plate rack 40 as comb teeth, right side form the pectinate texture using luminescence chip bracket 30 as comb teeth, two combs In the comb teeth of shape structure other side's comb teeth inserted into each other gap, constitutes luminescence chip bracket 30 and sensitive chip bracket 40 is staggered Distribution form.The pectinate texture of luminescence chip bracket 30 includes an at least luminescence chip pin 33, e.g. two luminous cores Piece pin 33.The pectinate texture of sensitive chip bracket 40 includes an at least luminescence chip pin 43, e.g. three sensitive chips Pin 43.

Chip set provided by the embodiment of the utility model, due to luminescence chip bracket 30 and the formation of sensitive chip bracket 40 In the same tablet 10, and luminescence chip bracket 30 and sensitive chip bracket 40 are staggered in the same supporting band 20, Using the complementarity of both luminescence chip bracket 30 and sensitive chip bracket 40 shape, production luminescence chip bracket 30 can be reduced With the quantity of material removed from tablet 10 when sensitive chip bracket 40, the luminescence chip bracket of per unit web material is improved 30 and the density of sensitive chip bracket 40 reduce being produced into for chip set to improve the materials'use rate of tablet 10 This, and promote the competitiveness of photo-coupler price.

In Fig. 1, luminescence chip bracket 30 and sensitive chip bracket 40 are staggered, shining on luminescence chip bracket 30 Sensitive chip mounting portion 41 on chip mounting portion 31 and sensitive chip bracket 40 is adjacent, luminescence chip pin 33 and luminescence chip Pin 43 is adjacent.Luminescence chip mounting portion 31 and sensitive chip mounting portion 41 are fitted into mutually in a manner of staggered, so that hair Optical chip mounting portion 31 can go deep into the gap between adjacent sensitive chip mounting portion 41, and sensitive chip mounting portion 41 can go deep into Gap between adjacent luminescence chip mounting portion 31.In this way, in material material space with upper more efficient.On the other hand, it sends out Optical chip pin 33 can also be staggered with sensitive chip pin 43 with similar mode to be fitted into mutually to increase material material and use Efficiency.

In other examples, in order to more effectively with surplus between luminescence chip mounting portion 31 and sensitive chip mounting portion 41 Remaining space.Luminescence chip mounting portion 31 and sensitive chip mounting portion 41 each other can be deeper into mutual gaps, so that shining Chip mounting portion 31 connects with sensitive chip bracket 40, and sensitive chip mounting portion 41 connects with luminescence chip bracket 30.Likewise, Luminescence chip pin 33 can also be with similar mode deeper into mutual gap, so that luminescence chip with sensitive chip pin 43 Pin 33 connects with sensitive chip bracket 40, and sensitive chip pin 43 connects with luminescence chip bracket 30.Such material material structure, The support density that can be manufactured in per unit is higher than previous, and utilization spatially is also more economical.It thus can be same big The number of supports more than prior art method close to half is made on material material.

Another kind as said chip bracket improves, the luminescence chip bracket and the sensitive chip bracket with one away from From being parallel to each other and arranged in a crossed manner, and the sense of the luminescence chip mounting portion of the luminescence chip bracket and the sensitive chip bracket Optical chip mounting portion is to be oppositely arranged in a manner of aspectant respectively.

As said chip bracket another kind improve, the luminescence chip pin of the luminescence chip bracket with it is described photosensitive The sensitive chip pin of chip set is arranged in a crossed manner each other with a distance.

Another kind as said chip bracket improves, and the luminescence chip mounting portion of the luminescence chip bracket is embedded in one liang Between adjacent sensitive chip mounting portion, the sensitive chip mounting portion of the sensitive chip bracket is embedded in one liang of adjacent luminous core Between piece mounting portion.

Chip set provided by the embodiment of the utility model can make with the following method：

Method one is made using etching and processing (Etching) method, and illustratively, manufacturing process includes：It provides first One conductive metal tablet, the metal tablet be usually the metal thin material that thickness is less than 0.5mm, such as 0.25mm thick Anaerobic copper sheet；Since the thickness of the metal tablet is than relatively thin, the supplied materials of metal tablet is generally web-like material strip, by metal When tablet comes into operation, it is generally mounted on coiled strip feeder.Then, pre-treatment, such as removal metal are carried out to metal tablet The grease stain of web surface, the burr at edge, overlap and leveling etc., and be moderately roughened.Next light-sensitive surface is pressed In metal charge on piece, and it is masked, UV exposure；The light-sensitive surface for being not affected by the light area UV is removed therewith, is allowed to expose gold Belong to web material.It is etched later, stripping, the web material of exposing is etched into removal, and to remaining metal tablet part Carry out the chip set as described in can be made into above-described embodiment after the processing such as bending.

Method two is made using punch process (Stamping) method, and illustratively, manufacturing process includes：It mentions first For a conductive metal tablet, which is usually the metal thin material that thickness is less than 0.5mm, such as 0.25mm thickness Anaerobic copper sheet；Since the thickness of the metal tablet is than relatively thin, the supplied materials of metal tablet is generally web-like material strip, will be golden When category tablet comes into operation, it is generally mounted on coiled strip feeder.Then, pre-treatment, such as removal gold are carried out to metal tablet Belong to the grease stain of web surface, the burr at edge, overlap and leveling etc..Next metal tablet is sent into stamping die, benefit Go out chip set described in above-described embodiment with stamping die punch forming.In general,

The method of above two production chip set can be selected according to actual needs, such as need small lot raw Produce, and it is not high to the required precision of chip set when, engraving method can be used；For another example, when needs are produced in enormous quantities and to core When the required precision of plate rack is relatively high, process for stamping can be used.

In a preferred embodiment, multiple 30 arranged at equal intervals of luminescence chip bracket in each supporting band 20, Mei Gezhi Multiple 40 arranged at equal intervals of sensitive chip bracket in frame band, material can further be saved by being designed in this way, in addition, tablet stress It uniformly, is not in stress concentration phenomenon.

When applying chip set provided by the above embodiment in photo-coupler, the core that shines of luminescence chip bracket 30 Piece mounting portion 31 is used to carry luminescence chip, and is received by the luminescence chip pin 33 in luminescence chip bracket 30 extraneous defeated The electric signal entered, and pass to luminescence chip.The sensitive chip mounting portion 41 of sensitive chip bracket 40 is used to carry sensitive chip, And the signal that sensitive chip receives conversion is exported by the sensitive chip pin 43 in sensitive chip bracket 40.

In a preferred embodiment, as shown in figure 3, luminescence chip bracket 30 includes luminescence chip mounting portion 31, shine core Piece pin 33, and the luminescence chip bending part 32 of connection luminescence chip mounting portion 31 and luminescence chip pin 33, luminescence chip Bending part 32 keeps luminescence chip mounting portion 31 and luminescence chip pin 33 non-coplanar.Sensitive chip bracket 40 is pacified including sensitive chip Dress portion 41, sensitive chip pin 43, and the sensitive chip bending of connection sensitive chip mounting portion 41 and sensitive chip pin 43 Portion 42, sensitive chip bending part 42 keep sensitive chip mounting portion 41 and sensitive chip pin 43 non-coplanar.

You need to add is that in order to make luminescence chip bracket 30 and sensitive chip bracket 40 that there is good electricity to lead with hot Body can be arranged electroplated layer in the functional areas of luminescence chip bracket 30 and sensitive chip bracket 40, such as install in luminescence chip It is respectively provided with Gold plated Layer on portion 31 and sensitive chip mounting portion 41, but not limited to this, it can also be in luminescence chip mounting portion 31 and sense Be provided with silver coating on optical chip mounting portion 41, it is silver-plated to belong to the processing of non-precious metal surface relative to gold-plated, be conducive into One step save the cost.

When applying luminescence chip bracket 30 and sensitive chip bracket 40 in photo-coupler 70, luminescence chip bracket 30 It is oppositely arranged with sensitive chip bracket 40, in a preferred embodiment, by cutting for special board, by luminescence chip bracket 30 It cuts off with the coupling part of tablet 10, luminescence chip bracket 30 is welded on tablet 10 after board is overturn, form Fig. 3 institute The arrangement form that the luminescence chip bracket 30 and sensitive chip bracket 40 shown is oppositely arranged；Alternatively, by sensitive chip bracket 40 with The coupling part of tablet 10 is cut off, and sensitive chip bracket 40 is welded on tablet 10 after board is overturn, and is formed shown in Fig. 3 Luminescence chip bracket 30 and the arrangement form that is oppositely arranged of sensitive chip bracket 40.Hair is set on luminescence chip mounting portion 31 Sensitive chip 55, and sensitive chip 55 and 45 face of luminescence chip is arranged in optical chip 45 on sensitive chip mounting portion 41.It shines Luminescence chip 45 is arranged on chip mounting portion 31 to be electrically connected through an at least conducting wire and 33 pin of luminescence chip, sensitive chip peace Sensitive chip 55 is arranged in dress portion 41 to be electrically connected through an at least conducting wire and sensitive chip pin 43.Sensitive chip 55 is for connecing The optical signal that transmitting-receiving optical chip 45 is emitted, and convert it back to electric signal identical with the received electric signal of luminescence chip 45. Firstly, sealing luminescence chip 45 and sensitive chip 55 by transparent encapsulant glue 50.Then, it is sealed by opaque packaging plastic 60 Light packaging plastic 50.That is, between the luminescence chip bracket 30 and sensitive chip bracket 40 and periphery of the two, is provided with the luminous core of cladding Piece mounting portion 31, luminescence chip bending part 32, luminescence chip 45, sensitive chip mounting portion 41, sensitive chip bending part 42 and The transparent encapsulant glue 50 and opaque packaging plastic 60 of sensitive chip 55, luminescence chip pin 33 and sensitive chip pin 43 are located at not Outside transparent encapsulant glue 60.

It should be added that luminescence chip can be infrared light emitting diodes (Infrared light Emitting diode, abbreviation IR LED) chip, sensitive chip can be photistor (Photo transistor, abbreviation PT), however, being not limited thereto, the personnel of this technology well known in the art can be with the component replacement of identical function.

In a preferred embodiment, the packaging plastic of photo-coupler 70 include positioned at innermost layer the first light-permeable packaging plastic, Second light-permeable packaging plastic and the opaque packaging plastic of third.Illustratively, the luminescence chip of photo-coupler receives electric signal Afterwards, light is emitted according to the intensity of the electric signal, sensitive chip 55 is that relative luminous chip 45 is arranged, and its object is to receive The light that luminescence chip 45 is issued, and back into electric signals output is converted according to the intensity of the light.In order to allow luminescence component Heat be dispersed and protect luminescence component, and consider the transmitting of light simultaneously, just coated and sent out with the first light-permeable packaging plastic In addition the partial region of optical chip 45 and luminescence chip mounting portion 31 can also make the core that shines for protecting fixed luminescence chip The heat that piece generates is dispersed, and facilitates the transmission of light.First light-permeable packaging plastic can be made of silica gel, but and unlimited In this, the first light-permeable packaging plastic can also be made of other with identical function material.

Second light-permeable packaging plastic, that is, transparent encapsulant as shown in Figure 3 glue 50, cladding sensitive chip 55, first can be saturating Light packaging plastic, luminescence chip mounting portion 31 and sensitive chip mounting portion 41, are designed in this way, even if the first light-permeable packaging plastic and Occur that colloid falls off between two light-permeable packaging plastics and there are gaps, in the case where under operation with high pressure, gap will not occur Photo-coupler is set to generate Problem of Failure because of high-voltage breakdown conducting.The opaque packaging plastic of third is i.e. opaque as shown in Figure 3 Packaging plastic 60 coats the second light-permeable packaging plastic, and it is impermeable that luminescence chip pin 33 and sensitive chip pin 43 are exposed to third Except light packaging plastic, the opaque packaging plastic of third be used for stops from outside light, avoid sensitive chip and luminescence chip by It is influenced to extraneous light.

It should be added that the material of the second light-permeable packaging plastic, the opaque packaging plastic of third is preferably asphalt mixtures modified by epoxy resin Rouge, and since the opaque packaging plastic of third is used to stop from external light, it is doped in the opaque packaging plastic of third Photoresist such as carbon black.

In the above-described embodiments, since luminescence chip bracket 30 and sensitive chip bracket 40 are formed on the same tablet, Compared with luminescence chip bracket 30 and sensitive chip bracket 40 are respectively formed on two tablets, luminescence chip bending part 32, sense The bending degree of optical chip bending part 42 can accomplish it is lower, so as to increase the second light-permeable encapsulation glue-line and luminescence chip branch The distance of frame 30 and sensitive chip bracket 40, so that photo-coupler is when by wave soldering machine processing procedure, even if in 260 degree of height Under temperature effect, the second light-permeable encapsulation glue-line expanded by heating can also be reduced by luminescence chip bracket 30 or sensitive chip bracket 40 Burst the risk of packaging plastic.That is, being designed in this way, it can overcome small size light emitting diode that cannot use high temperature wave-soldering Bottleneck, so as to expand occupation rate of market.

In a preferred embodiment, as shown in Figures 2 and 3, luminescence chip mounting portion 31 is far from luminescence chip bending part 33 One end be provided with plush copper 34.Luminescence chip mounting portion 31 is provided with plush copper 34, can be in bonding wire, Weld line pressure plate can press On luminescence chip mounting portion 31 and plush copper 34, so as to preferably fixed luminescence chip bracket 30, and then weldering can be improved Line precision.

Fig. 1 and Fig. 3 are please referred to, in a preferred embodiment, adjacent luminescence chip bracket 30 and sensitive chip bracket 40 In, it is connected between luminescence chip pin 33 and sensitive chip pin 43 by connection strap 12.Specifically, in the same supporting band 20 In, luminescence chip bracket 30 and sensitive chip bracket 40 are being molded, luminescence chip pin 33 and sensitive chip pin 43 remain Have tablet clout, which is generally strip structure, therefore also referred to as connection strap 12, the both ends of the connection strap 12 respectively with Luminescence chip pin 33 and sensitive chip pin 43 connect, and increase the intensity of chip set with this.

In a preferred embodiment, referring to Fig. 1, being provided with an at least row in tablet between two neighboring supporting band 20 Cushion hole 11.Illustratively, two column cushion holes are each provided in the two sides of each supporting band 20, each column includes multiple cushion holes 11, the presence of cushion hole 11 can prevent or mitigate chip set warpage, become so as to reduce molded chip set Shape amount.Wherein, cushion hole 11 can be rectangular opening, round hole or slotted eye or combinations thereof.

By above-mentioned technical proposal, the chip set material material design of the utility model at least has following advantages：

(1) the luminescence chip bracket of photo-coupler and photosensitive contact pin bracket are incorporated on the same material material, can promote every list The support density of position material material, increases the utilization rate of material material, makes to expect that material is more economical in use.

(2) production cost that can reduce photo-coupler increases the productive profit of photo-coupler, promotes coupler price unexpectedly Strive power.

In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation The description of mode ", " example ", " specific example " or " some examples " etc. means embodiment or example is combined to describe specific Feature, structure, material or feature are contained at least one embodiment or example of the utility model.In this specification In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.

Finally it should be noted that：The above various embodiments is only to illustrate the technical solution of the utility model, rather than limits it System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should Understand：It is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new The range of each embodiment technical solution of type.

Claims (13)

1. a kind of chip set, which is characterized in that including tablet, the tablet includes multiple supporting bands being parallel to each other, each The supporting band includes multiple luminescence chip brackets and multiple sensitive chip brackets, and in each supporting band, the hair Optical chip bracket and the sensitive chip bracket are staggered.

2. chip set according to claim 1, which is characterized in that multiple luminescence chip branch in each supporting band Frame arranged at equal intervals, multiple sensitive chip bracket arranged at equal intervals in each supporting band.

3. chip set according to claim 1, which is characterized in that the luminescence chip bracket includes luminescence chip installation Portion, luminescence chip pin, and the luminescence chip bending part of connection the luminescence chip mounting portion and luminescence chip pin, it is described Luminescence chip bending part keeps the luminescence chip mounting portion and the luminescence chip pin non-coplanar.

4. chip set according to claim 3, which is characterized in that the luminescence chip mounting portion is far from the luminous core One end of piece bending part is provided with plush copper.

5. chip set according to claim 1, which is characterized in that the sensitive chip bracket includes sensitive chip installation Portion, sensitive chip pin, and the sensitive chip bending part of connection the sensitive chip mounting portion and sensitive chip pin, it is described Sensitive chip bending part keeps the sensitive chip mounting portion and the sensitive chip pin non-coplanar.

6. the chip set according to claim 3 or 5, which is characterized in that adjacent luminescence chip bracket and sensitive chip In bracket, connected between the luminescence chip pin and the sensitive chip pin by connection strap.

7. chip set according to claim 1, which is characterized in that the tablet between the two neighboring supporting band In be provided at least row's cushion hole.

8. chip set according to claim 7, which is characterized in that the cushion hole is rectangular opening, round hole or ellipse Shape hole.

9. chip set according to claim 1, which is characterized in that the tablet be aluminum alloy sheet, iron-nickel alloy sheet or Copper series alloy piece.

10. according to claim 1 or chip set described in 9, which is characterized in that the tablet with a thickness of 0.23mm~ 0.27mm。

11. chip set according to claim 1, which is characterized in that the luminescence chip bracket and the sensitive chip Bracket is parallel to each other and arranged in a crossed manner with a distance, and the luminescence chip mounting portion of the luminescence chip bracket and the photosensitive core The sensitive chip mounting portion of plate rack is to be oppositely arranged in a manner of aspectant respectively.

12. chip set according to claim 11, which is characterized in that the luminescence chip pin of the luminescence chip bracket It is arranged in a crossed manner each other with a distance with the sensitive chip pin of the sensitive chip bracket.

13. chip set according to claim 12, which is characterized in that the luminescence chip of the luminescence chip bracket is installed Portion is embedded between one liang of adjacent sensitive chip mounting portion, and the sensitive chip mounting portion of the sensitive chip bracket is embedded in a two-phase Between adjacent luminescence chip mounting portion.