CN208063548U - A kind of ceramic circuit board convenient for heat dissipation - Google Patents
A kind of ceramic circuit board convenient for heat dissipation Download PDFInfo
- Publication number
- CN208063548U CN208063548U CN201820577170.XU CN201820577170U CN208063548U CN 208063548 U CN208063548 U CN 208063548U CN 201820577170 U CN201820577170 U CN 201820577170U CN 208063548 U CN208063548 U CN 208063548U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- ceramic circuit
- fixedly connected
- plate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 91
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 37
- 239000004519 grease Substances 0.000 claims description 15
- 238000009423 ventilation Methods 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 5
- 230000006378 damage Effects 0.000 abstract description 6
- 230000032683 aging Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 208000014674 injury Diseases 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- -1 high Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of ceramic circuit boards convenient for heat dissipation, including ceramic circuit board, upper surface on the ceramic circuit board close to right end is fixedly connected with backing plate, the upper surface of the backing plate is fixedly connected with LED bulb, surface electrical behavior on the ceramic circuit board close to left end is connected with driving, the lower surface of the ceramic circuit board is fixedly connected with auxiliary heat dissipation mechanism, the auxiliary heat dissipation mechanism includes plate one and plate two, the upper surface of the plate one and plate two is fixedly connected with the lower surface of ceramic circuit board, the side of the plate two is fixedly connected with heat sink one.The utility model, pass through being used cooperatively between above structure, it solves in actual use, ceramic circuit itself can generate heat after connecting circuit, the heat that LED bulb is sent out simultaneously can also make the operating temperature of ceramic circuit board raising ceramic circuit board, the problem of working at high temperature for a long time and understand the aging of accelerating circuit, while also being easy that integrated circuit is made to damage.
Description
Technical field
The utility model is related to ceramic circuit board technical field of heat dissipation, specially a kind of ceramic circuit boards convenient for heat dissipation.
Background technology
Ceramic circuit board is a kind of utilization thermal conductive ceramic powder and organic bond, less than 250 degrees celsius
A kind of organic ceramic circuit board of lower preparation, as electronic technology is in the gradually intensification of each application field, wiring board is highly integrated
Chemical conversion is inexorable trend, and the integrated package module of height requires good heat dissipation bearing system, and ceramic-like materials are with good
Good high frequency performance and electric property, and the organic substrates such as high, chemical stability and good heat stability do not have with thermal conductivity
Standby performance is the ideal encapsulating material of large scale integrated circuit and power electronics modules of new generation, in high-power LED illumination
Field often uses metal and ceramics etc. to have the material preparation circuit base plate of excellent heat dispersion performance, such as Chinese patent
A kind of full angle light-distribution LED light bulb disclosed in CN204943061U, passes through lampshade, ceramic circuit board, ceramic base, positive and negative anodes
Lamp base is connected with being used cooperatively between the structures such as LED lamp bead, driving and heat dissipation bulb holder base on the ceramic circuit board, has
It is reasonable for structure, it is easy to make, it is suitable for mass production, production is more efficient, relative to traditional light-emitting LED light bulb of full angle,
Ceramic wafer is made into double-sided PCB, then LED is welded on ceramic wafer, structure is more novel, can incorporate modernization
The fields of employment such as household, office, but in actual use, ceramic circuit itself can generate heat after connecting circuit, while LED light
The heat being soaked out can also make ceramic circuit board increase the operating temperature of ceramic circuit board, and electricity can be accelerated for a long time by working at high temperature
The aging on road, while being also easy that integrated circuit is made to damage.
Utility model content
The purpose of this utility model is to provide a kind of ceramic circuit boards convenient for heat dissipation, to conventional apparatus week quiet ceramic electrical
Road plate solves in actual use into improvement, and ceramic circuit itself can generate heat after connecting circuit, while LED bulb is sent out
Heat can also make ceramic circuit board increase ceramic circuit board operating temperature, work at high temperature for a long time can accelerating circuit it is old
The problem of changing, while also being easy that integrated circuit is made to damage.
To achieve the above object, the utility model provides the following technical solutions：A kind of ceramic circuit board convenient for heat dissipation, packet
Include ceramic circuit board, the upper surface on the ceramic circuit board close to right end is fixedly connected with backing plate, the upper surface of the backing plate
It is fixedly connected with LED bulb, the surface electrical behavior on the ceramic circuit board close to left end is connected with driving, the ceramic circuit board
Lower surface be fixedly connected with auxiliary heat dissipation mechanism.
The auxiliary heat dissipation mechanism includes plate one and plate two, the upper surface of the plate one and plate two with ceramic circuit board
Lower surface is fixedly connected, and the side of the plate two is fixedly connected with heat sink one, and the surface of the heat sink one is fixedly connected with
The upper surface of heat sink two, the heat sink one is fixedly connected with heat conducting bar, is fixed close to the surface of bottom on the heat conducting bar
It is connected with annulus, the lower surface of the annulus is fixedly connected with the upper surface of heat sink one, and face is led on the ceramic circuit board
The lower surface of hot rod open up it is fluted, the ceramic circuit board by the surface activity of groove and annulus connect, the groove
Inner wall is fixedly connected with thermal grease, and the surface of the thermal grease is fixedly connected with the surface of heat conducting bar.
Preferably, the quantity of the plate two is two, and two plates two are with the vertical center symmetric setting of heat sink two.
Preferably, the surface of the heat sink one and plate one offers ventilation hole, and the quantity of ventilation hole is no less than six
It is a.
Preferably, the surface of the heat conducting bar offers external screw thread, the externally threaded surface by thermal grease with it is recessed
The inner wall of slot is flexibly connected.
Preferably, the annulus is truncated cone-shaped annulus, and the relatively small one end of bore is upward on annulus.
Compared with prior art, the beneficial effects of the utility model are as follows：
One, the utility model can be effectively reduced by the setting of auxiliary heat dissipation mechanism when ceramic circuit board works
Temperature avoids the circuit structure in ceramic circuit board by high temperature injury, extends the service life of ceramic circuit board.
Two, the utility model makes auxiliary heat dissipation mechanism and ceramic circuit board establish connection by plate one and plate two, by dissipating
Hot plate one and heat sink two are used cooperatively, since the upper surface of heat sink one and the lower surface of ceramic circuit board are in direct contact,
Make the temperature on ceramic circuit board that can be transferred directly on heat sink one and heat sink two, then passes through heat sink one and heat sink two
It transfers heat in air, realizes level-one heat dissipation.
Three, the utility model by annulus to the thermal grease in groove play the role of seal anti-leak, by heat conducting bar,
Being used cooperatively between annulus, groove and thermal grease, since groove is directly opened in the lower surface of annulus, so ceramic circuit
Heat on plate can be directly conducted on the inner wall of groove, then by thermal grease by the heat transfer on groove inner wall to heat conduction
On bar, then by heat conducting bar heat is reached on heat sink one, finally the heat inside ceramic circuit board is discharged into air,
Realize the two-class heat dissipation to ceramic circuit board.
Four, the utility model solves in actual use by being used cooperatively between above structure, ceramic circuit sheet
It can generate heat after connecting circuit, while the heat that sends out of LED bulb can also make ceramic circuit board increase the work of ceramic circuit board
The problem of making temperature, working at high temperature understand the aging of accelerating circuit for a long time, while also being easy that integrated circuit is made to damage.
Description of the drawings
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the vertical view of the utility model heat conducting bar；
Fig. 3 is the upward view of the utility model groove；
Fig. 4 is the front view of the utility model ventilation hole；
Fig. 5 is the front view of the utility model annulus.
In figure：1- ceramic circuit boards, 2- backing plates, 3-LED light bulbs, 4- drivings, 5- auxiliary heat dissipations mechanism, 6- plates one, 7- plates
Two, 8- heat sinks one, 9- heat sinks two, 10- heat conducting bars, 11- annulus, 12- grooves, 13- thermal greases, 14- ventilation holes, 15-
External screw thread.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
It please refers to Fig.1 to Fig. 5, the utility model provides a kind of technical solution：A kind of ceramic circuit board convenient for heat dissipation, packet
Ceramic circuit board 1 is included, ceramic circuit board 1 is a kind of utilization thermal conductive ceramic powder and organic bond, is taken the photograph less than 250
A kind of organic ceramic circuit board prepared under the conditions of family name's degree, the upper surface on ceramic circuit board 1 close to right end are fixedly connected with pad
Plate 2 avoids LED bulb 3 from directly being contacted with ceramic circuit board 1 by the setting of backing plate 2, reduces and works temperature to ceramic circuit board 1
The upper surface of the influence of degree, backing plate 2 is fixedly connected with LED bulb 3, and LED bulb 3 is that Light Emitting Diode English is single
The abbreviation of word, light emitting diode is a kind of solid state semiconductor devices that can convert electrical energy into visible light, it can be direct
It converts electricity to light, the surface electrical behavior on ceramic circuit board 1 close to left end is connected with driving 4, by the setting of driving 4, avoids
Electric current exceeds maximum rating, influences its reliability, obtains expected brightness requirement, and ensure each LED luminance, coloration one
Cause property, the lower surface of ceramic circuit board 1 is fixedly connected with auxiliary heat dissipation mechanism 5, can by the setting of auxiliary heat dissipation mechanism 5
Temperature when ceramic circuit board 1 works is effectively reduced, avoids the circuit structure in ceramic circuit board 1 by high temperature injury, prolongs
The service life of ceramic circuit board 1 is grown.
Auxiliary heat dissipation mechanism 5 includes plate 1 and plate 27, makes auxiliary heat dissipation mechanism 5 and ceramic electrical by plate 1 and plate 27
Road plate 1 establishes connection, and the quantity of plate 27 is two, and two plates 27 are passed through with the vertical center symmetric setting of heat sink 29
Two plates 27 correspond to two plates 1, a complete fixed frame can be formed by two plates 1 and two plates 27, to auxiliary
Playing a protective role for cooling mechanism 5, two of which plate 27 is helped also to play a supporting role to heat sink 1, plate 1 and plate 27
Upper surface be fixedly connected with the lower surface of ceramic circuit board 1, the side of plate 27 is fixedly connected with heat sink 1, heat sink
1 and the surface of plate 1 offer ventilation hole 14, and the quantity of ventilation hole 14 is no less than six, passes through heat sink 1 and plate
The ventilation hole 14 opened up on one 6, the heat that 5 inside of auxiliary heat dissipation mechanism can be discharged are pulled away by air, realize heat
Transfer, and quantity is no less than the setting of six ventilation holes 14, can improve the radiating efficiency of device entirety, heat sink 1
Surface is fixedly connected with heat sink 29, since the upper surface of heat sink 1 and the lower surface of ceramic circuit board 1 are in direct contact, makes
Temperature on ceramic circuit board 1 can be transferred directly on heat sink 1 and heat sink 29, then pass through heat sink 1 and heat sink
29 transfer heat in air, realize level-one heat dissipation, the upper surface of heat sink 1 is fixedly connected with heat conducting bar 10, heat conducting bar
10 surface offers external screw thread 15, and the surface of external screw thread 15 is flexibly connected by thermal grease 13 with the inner wall of groove 12, leads to
The setting for crossing external screw thread 15 increases the contact area between heat conducting bar 10 and thermal grease 13, improves heat conduction efficiency, leads
It is fixedly connected with annulus 11 close to the surface of bottom on hot rod 10, annulus 11 is truncated cone-shaped annulus, and bore is opposite on annulus 11
Smaller one end upward, by the setting of the relatively small one end of bore upward on the setting of truncated cone-shaped annulus and annulus 11,
The contact area between the inner wall of bottom on annulus 11 and groove 12 can be improved, increases sealing effect, by thermal grease 13
Always it controls in groove 12, the lower surface of annulus 11 is fixedly connected with the upper surface of heat sink 1, on ceramic circuit board 1 just
Fluted 12 are opened up to the lower surface of heat conducting bar 10, ceramic circuit board 1 is connect by groove 12 with the surface activity of annulus 11, recessed
The inner wall of slot 12 is fixedly connected with thermal grease 13, since groove 12 is directly opened in the lower surface of annulus 11, so ceramic electrical
Heat on road plate 1 can be directly conducted on the inner wall of groove 12, then by thermal grease 13 by the heat on 12 inner wall of groove
It is transferred on heat conducting bar 10, then is reached heat on heat sink 1 by heat conducting bar 10, it finally will be inside ceramic circuit board 1
Heat is discharged into air, realizes the two-class heat dissipation to ceramic circuit board 1, the table on the surface and heat conducting bar 10 of thermal grease 13
Face is fixedly connected.
Operation principle：This is convenient for the ceramic circuit board of heat dissipation when in use, the upper surface of heat sink 1 and ceramic circuit board
1 lower surface is in direct contact, and makes the temperature on ceramic circuit board 1 that can be transferred directly on heat sink 1 and heat sink 29, then
It is transferred heat in air by heat sink 1 and heat sink 29, level-one heat dissipation is realized, since groove 12 is directly opened in
The lower surface of annulus 11 so the heat on ceramic circuit board 1 can be directly conducted on the inner wall of groove 12, then passes through the silicon that radiates
Glue 13 reaches heat on heat sink 1 by the heat transfer to heat conducting bar 10 on 12 inner wall of groove, then by heat conducting bar 10,
Finally the heat inside ceramic circuit board 1 is discharged into air, realizes the two-class heat dissipation to ceramic circuit board 1.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of ceramic circuit board convenient for heat dissipation, including ceramic circuit board (1), close to right end on the ceramic circuit board (1)
Upper surface be fixedly connected with backing plate (2), the upper surface of the backing plate (2) is fixedly connected with LED bulb (3), the ceramic electrical
Surface electrical behavior on road plate (1) close to left end is connected with driving (4), it is characterised in that：The lower surface of the ceramic circuit board (1)
It is fixedly connected with auxiliary heat dissipation mechanism (5)；
The auxiliary heat dissipation mechanism (5) includes plate one (6) and plate two (7), the upper surface of the plate one (6) and plate two (7) with
The lower surface of ceramic circuit board (1) is fixedly connected, and the side of the plate two (7) is fixedly connected with heat sink one (8), the heat dissipation
The surface of plate one (8) is fixedly connected with heat sink two (9), and the upper surface of the heat sink one (8) is fixedly connected with heat conducting bar
(10), the surface on the heat conducting bar (10) close to bottom is fixedly connected with annulus (11), the lower surface of the annulus (11) with
The upper surface of heat sink one (8) is fixedly connected, and the lower surface of face heat conducting bar (10) offers recessed on the ceramic circuit board (1)
Slot (12), the ceramic circuit board (1) are connect by groove (12) with the surface activity of annulus (11), the groove (12) it is interior
Wall is fixedly connected with thermal grease (13), and the surface of the thermal grease (13) is fixedly connected with the surface of heat conducting bar (10).
2. a kind of ceramic circuit board convenient for heat dissipation according to claim 1, it is characterised in that：The number of the plate two (7)
Amount is two, and two plates two (7) are with the vertical center symmetric setting of heat sink two (9).
3. a kind of ceramic circuit board convenient for heat dissipation according to claim 1, it is characterised in that：The heat sink one (8)
Ventilation hole (14) is offered with the surface of plate one (6), and the quantity of ventilation hole (14) is no less than six.
4. a kind of ceramic circuit board convenient for heat dissipation according to claim 1, it is characterised in that：The heat conducting bar (10)
Surface offers external screw thread (15), and the surface of the external screw thread (15) passes through the activity of the inner wall of thermal grease (13) and groove (12)
Connection.
5. a kind of ceramic circuit board convenient for heat dissipation according to claim 1, it is characterised in that：The annulus (11) is circle
Platform shape annulus, and the relatively small one end of bore is upward on annulus (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820577170.XU CN208063548U (en) | 2018-04-23 | 2018-04-23 | A kind of ceramic circuit board convenient for heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820577170.XU CN208063548U (en) | 2018-04-23 | 2018-04-23 | A kind of ceramic circuit board convenient for heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208063548U true CN208063548U (en) | 2018-11-06 |
Family
ID=63983459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820577170.XU Expired - Fee Related CN208063548U (en) | 2018-04-23 | 2018-04-23 | A kind of ceramic circuit board convenient for heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208063548U (en) |
-
2018
- 2018-04-23 CN CN201820577170.XU patent/CN208063548U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101307891A (en) | Highly effective radiation LED lamps | |
| CN201576701U (en) | Metal cooling device for LED lamp chip | |
| CN201599769U (en) | LED street lamp with over-current heat-dissipating function | |
| WO2015027884A1 (en) | Led light source module and led bulb lamp comprising module | |
| CN201373367Y (en) | High-power LED light source module adopting semiconductor for cooling | |
| CN100594323C (en) | High power semiconductor lighting lamp | |
| CN207298874U (en) | A kind of radiator of high efficiency long service LED energy-saving lamps | |
| CN208063548U (en) | A kind of ceramic circuit board convenient for heat dissipation | |
| CN201078676Y (en) | LED light fitting with high efficiency and heat sinking | |
| CN206943847U (en) | A kind of LED that can quickly assemble | |
| CN206864500U (en) | It is a kind of based on heat-conducting plate and heat sink cooling LED packaged light source structure | |
| CN209399320U (en) | A kind of wiring board of power light source one | |
| CN213184336U (en) | High performance flip-chip COB structure | |
| CN201396621Y (en) | High-power LED light source structure | |
| CN202056580U (en) | LED (light-emitting diode) floodlighting lamp module | |
| CN208208750U (en) | A kind of three phase rectifier diode (led) module | |
| CN206846345U (en) | A kind of not exposed LED cylinder of electric wire | |
| CN202349651U (en) | Ultrahigh power light-emitting diode (LED) bulb capable of replacing gas discharge lamp | |
| CN202101047U (en) | High-power LED (light-emitting diode) light source module with excellent heat dissipation performance | |
| CN201827855U (en) | High power LED heat dissipation module | |
| CN206055219U (en) | A kind of AC COB alternating currents chip assembly LED lamp | |
| CN108848607A (en) | High thermal conductivity wiring board | |
| CN202601730U (en) | Light emitting diode (LED) semiconductor heat dissipation supporting frame | |
| CN206846367U (en) | A kind of LED high-power bulb lamps | |
| CN208139167U (en) | LED headlamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190614 Address after: 201108 1st and 2nd floors, No. 11 Lane 1058, Zhuxing East Road, Minhang District, Shanghai Patentee after: Shanghai Daolin Industrial Technology Co.,Ltd. Address before: 311800 Sun Jiacun 633, Datang Town, Zhuji City, Shaoxing City, Zhejiang Province Patentee before: Liu Xiai |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181106 |