CN208051097U - A kind of reflow soldering temperature control system - Google Patents
A kind of reflow soldering temperature control system Download PDFInfo
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- CN208051097U CN208051097U CN201721649899.5U CN201721649899U CN208051097U CN 208051097 U CN208051097 U CN 208051097U CN 201721649899 U CN201721649899 U CN 201721649899U CN 208051097 U CN208051097 U CN 208051097U
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- reflow soldering
- temperature control
- thermocouple
- control system
- utility
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Abstract
The utility model discloses a kind of reflow soldering temperature control systems; including the power supply protector, solid-state relay, reflow soldering being sequentially connected electrically; thermocouple is provided in reflow soldering, thermocouple is electrically connected with PID controller, and PID controller is electrically connected with solid-state relay.When utility model works, the temperature of reflow soldering can be accurately controlled, makes reflow soldering homogeneous heating, the pcb board quality processed is more stable.
Description
Technical field
The utility model belongs to technical field of electric control, and in particular to a kind of reflow soldering temperature control system.
Background technology
Reflow soldering is a kind of form of welding, and many surface mount packages can be fixed on by it with minimum thermal stress simultaneously
The side or both sides of printed circuit board.In typical reflux technique, welding agent is applied in the region that printed circuit board is selected.Example
As welding agent is made of the welding particle for being mixed with fluxing agent, adhesive, bonding agent and other ingredients.Surface mount package such as four directions
Flat pieces and the integrated circuit of small shape are forced on applied welding agent.Surface mount package is fixed on printed circuit by adhesive
On plate.After being arranged so that, printed circuit board is conveyed via reflow soldering furnace, many separation are formd in reflow soldering furnace
Vertical area, i.e. preheating zone, recirculating zone and cooling zone.In preheating zone, printed circuit board is heated to the fusing point that temperature is less than solder,
In order to activate the fluxing agent in welding agent and avoid the thermal shock to printed circuit board.After preheating, printed circuit board is conveyed
To recirculating zone, solder reflux, then detaches with welding agent here.Printed circuit board is finally transported to cooling zone, in cooling zone
The cooled solidification of solder to have flowed back, thus form solder joint.
The heating device of reflow soldering is normally on the discharge pipe in reflow soldering at present, by heating device reflux
Then gas heating in stove sprays the air-flow of heat from air hose by the fan blade being arranged at the top of reflow soldering, is sprayed on PCB
On plate, but the reflow soldering temperature of the prior art cannot control, and affect the thermally equivalent of pcb board, cause on pcb board everywhere
Solder joint quality cannot be stablized.
Utility model content
In order to solve the above-mentioned technical problem, the utility model provides a kind of reflow soldering temperature control system, solves back
Fluid welding stove heat is uneven, the problem of influencing pcb board quality stability, reasonable design.
To achieve the goals above, the utility model is realized using following technical scheme：
A kind of reflow soldering temperature control system, including be sequentially connected electrically power supply protector, solid-state relay, Reflow Soldering
Stove, is provided with thermocouple in the reflow soldering, and the thermocouple is electrically connected with PID controller, the PID controller with it is described
Solid-state relay is electrically connected.
Further, the power supply protector is three phase electric power protector.
Further, the thermocouple is K-type thermocouple.
The utility model has the beneficial effects that：
A kind of reflow soldering temperature control system provided by the utility model when work, can accurately control reflow soldering
Temperature, make reflow soldering homogeneous heating, the pcb board quality processed is more stable.
Description of the drawings
Fig. 1 is the principles of the present invention figure；
Specific implementation mode
To keep the purpose of this utility model, feature, advantage more apparent and understandable, with reference to the utility model
Attached drawing in embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that institute below
The embodiment of description is only the utility model a part of the embodiment, and not all embodiments.Based on the reality in the utility model
Example is applied, the every other embodiment that those skilled in the art is obtained shall fall within the protection scope of the present invention.
The present embodiment provides a kind of reflow soldering temperature control systems, as shown in Figure 1, being protected including the power supply being sequentially connected electrically
Device, solid-state relay, reflow soldering are protected, is provided with thermocouple in the reflow soldering, the thermocouple is electrically connected with PID control
Device, the PID controller are electrically connected with the solid-state relay.
Preferably, power supply protector is three phase electric power protector to one as the present embodiment.
Preferably, thermocouple is K-type thermocouple to one as the present embodiment.
Understandably, the PID controller is to carry out deviation tune to entire control system temperature according to PID control principle
Section, the actual value of temperature and the predetermined value of technological requirement are consistent from reflow soldering.Different control laws is suitable for different
Production process, it is necessary to reasonably select corresponding control law, otherwise expected control effect will be not achieved in PID controller.
In more detail, solid-state relay is a kind of novel noncontacting switch device being all made of solid state electrical components,
It utilizes electronic component, such as the switching characteristic of switching transistor, bidirectional triode thyristor semiconductor devices, can reach contactless no fire
The purpose of flower ground make-and-break contact, therefore it is otherwise known as " noncontacting switch ".Solid-state relay is a kind of active device in four ends
Part, two of which terminal are input control end, and in addition both ends are output-controlled end；Its existing amplification driving effect, and have isolation
Effect is well suited for driving high power switch formula executing agency, compared with electromagnetic relay reliability higher, and contactless, long lifespan,
Speed is fast, also small to extraneous interference.
It is above-mentioned although specific embodiments of the present invention are described with reference to the accompanying drawings, but not to this practicality newly
The limitation of type protection domain, those skilled in the art should understand that, based on the technical solution of the present invention, ability
Field technique personnel need not make the creative labor the various modifications or changes that can be made still in the protection model of the utility model
In enclosing.
Claims (3)
1. a kind of reflow soldering temperature control system, which is characterized in that including be sequentially connected electrically power supply protector, solid relay
Device, reflow soldering, thermocouple is provided in the reflow soldering, and the thermocouple is electrically connected with PID controller, the PID controls
Device processed is electrically connected with the solid-state relay.
2. reflow soldering temperature control system according to claim 1, which is characterized in that the power supply protector is three-phase
Power supply protector.
3. reflow soldering temperature control system according to claim 1, which is characterized in that the thermocouple is K-type thermoelectricity
It is even.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721649899.5U CN208051097U (en) | 2017-12-01 | 2017-12-01 | A kind of reflow soldering temperature control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721649899.5U CN208051097U (en) | 2017-12-01 | 2017-12-01 | A kind of reflow soldering temperature control system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208051097U true CN208051097U (en) | 2018-11-06 |
Family
ID=63996851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721649899.5U Active CN208051097U (en) | 2017-12-01 | 2017-12-01 | A kind of reflow soldering temperature control system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208051097U (en) |
-
2017
- 2017-12-01 CN CN201721649899.5U patent/CN208051097U/en active Active
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