CN204221157U - A kind of reflow oven - Google Patents
A kind of reflow oven Download PDFInfo
- Publication number
- CN204221157U CN204221157U CN201420587835.7U CN201420587835U CN204221157U CN 204221157 U CN204221157 U CN 204221157U CN 201420587835 U CN201420587835 U CN 201420587835U CN 204221157 U CN204221157 U CN 204221157U
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- cooling
- water pipe
- cooling water
- reflow
- reflow oven
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Abstract
The utility model relates to technical field of electronic equipment, discloses a kind of reflow oven, and it comprises reflow device, conveying mechanism, cooling zone and N number of cooling water pipe, and wherein N is natural number; Wherein, reflow device, conveying mechanism and cooling zone are positioned at the furnace chamber of reflow oven, the inlet channel of cooling water pipe is connected with the outlet conduit of a cooling tower, and the outlet conduit of cooling water pipe is connected with the inlet channel of cooling tower, and cooling water pipe through furnace chamber cavity and through cooling zone.The utility model is by arranging the cooling water pipe that many are communicated to the outlet conduit of cooling tower, instead of the compressor used required for refrigeration process in reflow process, thus avoid compressor outside heat radiation problem of causing workshop temperature to rise in process of refrigerastion, decrease and the problem that cooling causes energy waste is carried out to workshop.And cooling water pipe is connected with outlet pipe with the water inlet pipe of cooling tower, forms a cooling water system that can be recycled, greatly saved water for industrial use.
Description
Technical field
The utility model relates to a kind of reflow oven, particularly a kind of reflow oven for workshop.
Background technology
SMT (surface mount technology) is most popular a kind of technology and technique in current Electronic Assemblies industry, it a kind ofly will not have to go between or the shorter surface-assembled components and parts of lead-in wire are arranged on the surface of PCB (printed circuit board (PCB)), and by the circuit load technology of Reflow Soldering in addition welding assembly.Wherein, Reflow Soldering is as completing the indispensable important step of SMT, and its equipment needed thereby reflow oven also receives much concern all the time.
The effect of reflow oven will post the PCB of components and parts by high temperature, cools again, finally make PCB and components and parts reach the equipment of stable bond after the tin cream be attached on PCB is melted.That is, reflow oven in the course of the work, first has the stage of a high-temperature heating, and then has a stage cooled.Under normal circumstances, the realization of reflow oven cooling stage needs by means of cooling system, and compressor is as the core of cooling system, it sucks the refrigerant gas of low-temp low-pressure from air intake duct, after driving piston to compress refrigerant gas by motor rotation, discharge the refrigerant gas of HTHP to blast pipe, for kind of refrigeration cycle provides power, thus realize the kind of refrigeration cycle of compression → condensation (heat release) → expand → evaporate (heat absorption).
But with in the process of compressor cooling, because compressor is placed in workshop together with reflow oven, and compressor in the course of the work can continuous outwardly discharges heat, thus causes the temperature in workshop to raise.Concerning some need the workshop of maintenance specified temp, in workshop, carry out radiating and cooling process with regard to needs again, these energy-conserving and environment-protective certainly will advocated with existing society are runed counter to.
Utility model content
The purpose of this utility model is to provide a kind of reflow oven, make to carry out in the process of Reflow Soldering in workshop, avoid on the one hand causing the problem of workshop temperature rising because compressor outwards dispels the heat in process of refrigerastion, also reduce on the other hand and cause the problem of energy waste because carrying out cooling to workshop.
For solving the problems of the technologies described above, embodiment of the present utility model provides a kind of reflow oven, and described reflow oven comprises reflow device, conveying mechanism, cooling zone and N number of cooling water pipe, and wherein N is natural number; Described reflow device, conveying mechanism and cooling zone are positioned at the furnace chamber of described reflow oven, the inlet channel of described cooling water pipe is connected with the outlet conduit of a cooling tower, the outlet conduit of described cooling water pipe is connected with the inlet channel of described cooling tower, and described cooling water pipe through described furnace chamber cavity and through described cooling zone.
The utility model embodiment in terms of existing technologies, refrigeration machine is replaced to carry out refrigeration process to reflow process by arranging many cooling water pipes, not only avoid and cause the problem of workshop temperature rising because compressor outwards dispels the heat in process of refrigerastion, and minimizing causes the problem of energy waste because carrying out cooling to workshop., N number of cooling water pipe is connected with outlet pipe with the water inlet pipe of cooling tower meanwhile, thus forms a cooling water system that can be recycled, greatly saved water for industrial use.
Further, the water inlet of described N number of cooling water pipe is provided with valve.Because the flow in cooling water pipe also directly affects the cooling effect of cooling water pipe, therefore this design is also conducive to the flow of later stage according to cooling water in the temperature controlled cooling model water pipe of cooling zone.
Further, the water inlet of described N number of cooling water pipe and water outlet are equipped with temperature detector.Be convenient to understand the temperature before and after cooling water turnover reflow oven, thus be conducive to the control of later stage to cooling water temperature.
Further, the volume of described N number of cooling water pipe is equal.The cooling water inflow controlled in each cooling water pipe is equal, and interior area of dissipation is identical at one time to make each cooling water pipe, thus ensure that the equilibrium of each cooling water pipe temperature.
Further, the particular conduit section of described cooling water pipe is provided with the pore running through its upper surface, and described particular conduit section is the part that described cooling water pipe is positioned at cooling zone.The setting of pore is the contact area in order to increase high-temperature gas in cooling water and reflow oven, thus improves cooling velocity.
Further, described conveying mechanism comprises two groups of drives be set in parallel in described furnace chamber, and is arranged on the chain on described drive.Be convenient to carry PCB to be processed.
Further, in the furnace chamber of described reflow oven, be also provided with preheating device, and described preheating device, reflow device and cooling zone are positioned at the top of described conveying mechanism successively.The setting of preheating device is to provide a preheating zone to PCB to be heated and components and parts, PCB and components and parts are made slowly to heat up the high temperature impact adapted to below, also contribute to the volatilization of partial solvent in tin cream and aqueous vapor simultaneously, avoid softening rapidly of tin cream, promote the activation of scaling powder.
Further, temperature detector is equipped with in described preheating device, described reflow device and described cooling zone.Be convenient to understand the temperature of each several part, thus be conducive to the heat time controlling preheating device and reflow device, and the flow of cooling water pipe and the time of cooling in cooling zone.
Further, the inside of described cooling zone is provided with two air blasts, and described two air blasts lay respectively at the two ends of described cooling zone.During refrigeration, the air-flow that air blast produces contributes to the contact accelerating high-temperature gas and cold water pipe, improves cooling effectiveness.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of reflow oven according to the utility model first embodiment;
Fig. 2 is the structural representation being positioned at cooling zone part according to the cooling water pipe of a kind of reflow oven of the utility model first embodiment;
Fig. 3 is the structural representation of a kind of reflow oven according to the utility model second embodiment.
Detailed description of the invention
For making the purpose of this utility model, technical scheme and advantage clearly, below in conjunction with accompanying drawing, each embodiment of the present utility model is explained in detail.But, persons of ordinary skill in the art may appreciate that in each embodiment of the utility model, proposing many ins and outs to make reader understand the application better.But, even without these ins and outs with based on the many variations of following embodiment and amendment, each claim of the application technical scheme required for protection also can be realized.
First embodiment of the present utility model relates to a kind of reflow oven, and as shown in Figure 1, reflow oven 1 comprises preheating device 3, reflow device 4, conveying mechanism 5 and cooling zone 6.Wherein, preheating device 3, reflow device 4, conveying mechanism 5, cooling zone 6 are all positioned at the furnace chamber 2 of reflow oven 1, and conveying mechanism 5 is arranged between the entrance 7 of furnace chamber 2 and outlet 8; Preheating device 3, reflow device 4 and cooling zone 6 are positioned at the top of conveying mechanism 5 successively.
Specifically, conveying mechanism 5 comprises two drives 9 and a chain 10, and wherein, two drives 9 are set in parallel in the two ends of furnace chamber 2, chain 10 is set on two drives 9, then can synchronously drive chain 10 to move when drive 9 rotates.Heating source 12 is all provided with in preheating device 3 and reflow device 4, for heating PCB to be processed, also be provided with temperature detector 11 in preheating device 3 and reflow device 4, the rising situation of temperature when heating in each device for detecting, is conducive to the heat time controlling each device simultaneously.
Reflow oven 1 also comprises N number of cooling water pipe 15 (illustrate only the situation that N is 1 in Fig. 1), the inlet channel of cooling water pipe 15 is connected with the outlet conduit of a cooling tower (not shown), the outlet conduit of cooling water pipe 15 is connected with the inlet channel of this cooling tower, and cooling water pipe 15 through furnace chamber 2 cavity and through cooling zone 6, namely cooling water pipe 15 and water tower form a cooling water system that can be recycled, thus have greatly saved water for industrial use.In cooling zone 6, N number of cooling water pipe 15 is laid in the top of conveying mechanism 5 side by side, and is also provided with temperature detector 11 in cooling zone 6.Be convenient to understand the temperature of cooling zone 6, thus the flow of cooling water pipe 15 and the time of cooling in controlled cooling model district 6.
In addition, water inlet 16 place of cooling water pipe 15 is provided with valve 13, because the flow in cooling water pipe 15 also directly affects the cooling effect of cooling water pipe 15, therefore this design is also conducive to the flow of later stage according to cooling water in the temperature controlled cooling model water pipe 15 of cooling zone 6.And water inlet 16 and delivery port 17 place of cooling water pipe 15 are equipped with temperature detector 11, the temperature before and after cooling water turnover reflow oven 1 is conveniently understood in this design, thus is conducive to the control of later stage to cooling water temperature.
In addition, the volume of N number of cooling water pipe 15 is equal, thus the cooling water inflow that can control in each cooling water pipe 15 is equal, and interior area of dissipation is identical at one time to make each cooling water pipe 15, and then ensure that the equilibrium of each cooling water pipe 15 temperature.
In addition, the pipeline that cooling water pipe 15 is positioned at cooling zone is also provided with the pore 14 running through its upper surface.The setting of pore 14 is the contacts area in order to increase high-temperature gas in cooling water and reflow oven 1, thus improves cooling velocity.
The implementation procedure of present embodiment is: be first positioned over by PCB to be processed on the conveying mechanism 5 at entrance 7 place of furnace chamber 2, and closes entrance 7 immediately.PCB is transported in preheating device 3 and carries out preheating by conveying mechanism 5.It is worth mentioning that, the setting of preheating device is to provide a preheating zone to PCB to be heated and components and parts, PCB and components and parts are made slowly to heat up the high temperature impact adapted to below, also contribute to the volatilization of partial solvent in tin cream and aqueous vapor simultaneously, avoid softening rapidly of tin cream, promote the activation of scaling powder.When PCB is heated to predetermined temperature by preheating device 3, PCB is transported in reflow device 4 and heats by conveying mechanism 5, when PCB to be heated to the peak temperature of Reflow Soldering by reflow device 4, then stop heating immediately, PCB is transported in cooling zone 6 by conveying mechanism 5, now, opens the valve 13 at water inlet 16 place of N number of cooling water pipe 15, cooling water in cooling tower enters cooling water pipe 15, and Reflow Soldering enters cooling stage.
It should be noted that the peak temperature of Reflow Soldering depends on the temperature that the melting temperature of solder and components and parts can bear usually.General peak temperature should will exceed about 25-30 degree than the normal melting point temperature of tin cream, could complete weld job smoothly.If lower than this temperature, then very likely cause the shortcoming of cold welding and moistening badness.
Second embodiment of the present utility model relates to a kind of reflow oven.Second embodiment is on the basis of the first embodiment, done further improvement, main improvements are: as shown in Figure 3, second embodiment is provided with two air blasts 18 in the inside of cooling zone 6, and two air blasts 18 lay respectively at the two ends of cooling zone 6.During refrigeration, the air-flow that air blast 18 produces contributes to the contact accelerating high-temperature gas and cold water pipe, improves cooling effectiveness.
Persons of ordinary skill in the art may appreciate that the respective embodiments described above realize specific embodiment of the utility model, and in actual applications, various change can be done to it in the form and details, and do not depart from spirit and scope of the present utility model.
Claims (10)
1. a reflow oven, is characterized in that, described reflow oven comprises reflow device, conveying mechanism, cooling zone and N number of cooling water pipe, and wherein N is natural number;
Described reflow device, conveying mechanism and cooling zone are positioned at the furnace chamber of described reflow oven, the inlet channel of described cooling water pipe is connected with the outlet conduit of a cooling tower, the outlet conduit of described cooling water pipe is connected with the inlet channel of described cooling tower, and described cooling water pipe through described furnace chamber cavity and through described cooling zone.
2. a kind of reflow oven according to claim 1, is characterized in that, the water inlet of described cooling water pipe is provided with valve.
3. a kind of reflow oven according to claim 1, is characterized in that, water inlet and the water outlet of described cooling water pipe are equipped with temperature detector.
4. a kind of reflow oven according to claim 1, is characterized in that, the volume of described N number of cooling water pipe is equal.
5. a kind of reflow oven according to claim 1, is characterized in that, the particular conduit section of described cooling water pipe is provided with the pore running through its upper surface, and described particular conduit section is the part that described cooling water pipe is positioned at cooling zone.
6. a kind of reflow oven according to claim 1, is characterized in that, described conveying mechanism is arranged between the entrance of described furnace chamber and outlet.
7. a kind of reflow oven according to claim 1, is characterized in that, described conveying mechanism comprises two drives be set in parallel in described furnace chamber, and is arranged on the chain on described drive.
8. a kind of reflow oven according to claim 1, is characterized in that, is also provided with preheating device in the furnace chamber of described reflow oven, and described preheating device, reflow device and cooling zone are positioned at the top of described conveying mechanism successively.
9. a kind of reflow oven according to claim 8, is characterized in that, is equipped with temperature detector in described preheating device, described reflow device and described cooling zone.
10. a kind of reflow oven according to claim 1, is characterized in that, the inside of described cooling zone is also provided with two air blasts, and described two air blasts lay respectively at the two ends of described cooling zone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420587835.7U CN204221157U (en) | 2014-10-11 | 2014-10-11 | A kind of reflow oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420587835.7U CN204221157U (en) | 2014-10-11 | 2014-10-11 | A kind of reflow oven |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204221157U true CN204221157U (en) | 2015-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420587835.7U Expired - Fee Related CN204221157U (en) | 2014-10-11 | 2014-10-11 | A kind of reflow oven |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204221157U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148162A (en) * | 2017-03-29 | 2017-09-08 | 东莞市秦智工业设计有限公司 | A kind of pcb board Reflow Soldering carrier storing unit |
-
2014
- 2014-10-11 CN CN201420587835.7U patent/CN204221157U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148162A (en) * | 2017-03-29 | 2017-09-08 | 东莞市秦智工业设计有限公司 | A kind of pcb board Reflow Soldering carrier storing unit |
| CN107148162B (en) * | 2017-03-29 | 2019-05-24 | 何莹莹 | A kind of pcb board Reflow Soldering carrier storing unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150325 Termination date: 20211011 |