CN107148162A - A kind of pcb board Reflow Soldering carrier storing unit - Google Patents
A kind of pcb board Reflow Soldering carrier storing unit Download PDFInfo
- Publication number
- CN107148162A CN107148162A CN201710196830.XA CN201710196830A CN107148162A CN 107148162 A CN107148162 A CN 107148162A CN 201710196830 A CN201710196830 A CN 201710196830A CN 107148162 A CN107148162 A CN 107148162A
- Authority
- CN
- China
- Prior art keywords
- reflow soldering
- dividing plate
- soldering carrier
- neck
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a kind of pcb board Reflow Soldering carrier storing unit, including Storage tray, the first neck, the second neck, dividing plate, water inlet pipe, outlet pipe, water inlet control valve, outlet water control valve, radiator fan, carriage etc..It in Storage tray by setting neck, Reflow Soldering carrier is positioned in neck, diaphragm internal in neck both sides sets accommodating chamber, accommodating chamber is connected with apopore and inlet opening, Reflow Soldering carrier is radiated using the current in dividing plate accommodating chamber, realize the fast temperature rising of Reflow Soldering carrier, it is to avoid Reflow Soldering carrier expands with heat and contract with cold, influence service life；It carries out radiating treatment by setting radiator fan and carriage in the upper end of Storage tray to the Reflow Soldering carrier in Storage tray, is closed by the air-cooled cold junction that adds water and causes the further fast cooling of Reflow Soldering carrier, good cooling effect；It can be controlled by setting control valve respectively on water inlet pipe and outlet pipe to the water velocity inside dividing plate accommodating chamber, realize fully heat absorption.
Description
Technical field：
The invention belongs to Reflow Soldering carrier technical field, a kind of pcb board Reflow Soldering carrier storing unit is specifically related to.
Background technology：
Current Electronic Product SMT manufacturing, with the specific demand of product practicality, PCB construction needs to diminish thinning.
PCB construction diminishes, and to manufacture the difficulty brought be exactly that must use substantial amounts of auxiliary carrier to coordinate by thinning electron product SMT
It can complete to manufacture, it is also that demand consumption is most that Reflow Soldering carrier, which is that wherein demand consumption is most common, a SMT line volume production
Normal production, Reflow Soldering carrier needs standby 80PCS just can normally run.
And Reflow Soldering carrier is typically installed on the Storage tray provided with resettlement groove or lodging bench when not in use, some lodging benchs
On be additionally provided with railing and help the adjacent Reflow Soldering carrier of isolation, and in actual production, its Reflow Soldering carrier is for a long time in high temperature
Under use, if if Reflow Soldering carrier can not rise again in time, this carrier principle of expanding with heat and contracting with cold, precision carrier, which occurs, tolerance change
Shape occurs extremely, then requires that Reflow Soldering carrier puts long period radiating on lodging bench, can just rise again, then need to lodging bench
Optimize improvement, in order to the fast temperature rising of Reflow Soldering carrier, while improving the utilization rate of Reflow Soldering carrier.
The content of the invention：
Therefore, the technical problems to be solved by the invention are depositing for the Reflow Soldering carrier for being used for pcb board in the prior art
Put platform effect of rising again poor, be easily caused Reflow Soldering carrier and expand with heat and contract with cold, the service life of Reflow Soldering carrier is influenceed, so as to propose one
Plant pcb board Reflow Soldering carrier storing unit.
To reach above-mentioned purpose, technical scheme is as follows：
A kind of pcb board Reflow Soldering carrier storing unit, including：
Storage tray, the Storage tray includes level board and is molded over the vertical plate of the level board rear end, the level board
On form some second necks formed on some first necks, the vertical plate, first neck and second card
Groove is connected.
Dividing plate, the dividing plate is fixed on the both sides of first neck and second neck, and the lower end of the dividing plate is consolidated
It is scheduled on the level board, the rear end of the dividing plate is fixed on the vertical plate, accommodating chamber is formed in the dividing plate, it is described
Formed above the rear end of dividing plate and apopore formed below inlet opening, the rear end of the dividing plate, the inlet opening and it is described go out
Water hole is connected with the accommodating chamber respectively.
Water inlet pipe and outlet pipe, the water inlet pipe are connected after passing through the vertical plate with the inlet opening, the water inlet pipe
On be provided with water inlet control valve, the outlet pipe is connected after passing through the vertical plate with the apopore, is set on the outlet pipe
It is equipped with outlet water control valve.
Radiator fan and carriage, the carriage are fixedly installed on the upper surface of the vertical plate, the radiating
Fan is slidably arranged in the upper surface of the vertical plate by the carriage.
As the preferred of above-mentioned technical proposal, the horizontal front edge of board of the Storage tray forms limiting plate.
As the preferred of above-mentioned technical proposal, the both sides of the Storage tray are fixedly installed baffle plate.
As the preferred of above-mentioned technical proposal, the dividing plate is ladder type dividing plate, and the height of the plate front end is less than described
The height of dividing plate rear end.
As the preferred of above-mentioned technical proposal, the water inlet pipe and the junction of the inlet opening are provided with the first sealing
Set, the junction of the outlet pipe and the apopore is provided with the second sealing shroud.
As the preferred of above-mentioned technical proposal, the carriage includes rail plate and is arranged on the rail plate
Sliding shoe, the rail plate is fixedly installed on the upper surface of the vertical plate, and the sliding shoe is fixedly connected with the radiating
Fan.
As the preferred of above-mentioned technical proposal, the radiator fan and the carriage are respectively two.
The beneficial effects of the present invention are：Reflow Soldering carrier is positioned over neck by it by setting neck in Storage tray
It is interior, accommodating chamber is set by the diaphragm internal in neck both sides, accommodating chamber is connected with apopore and inlet opening, entered by water inlet pipe
Water, outlet pipe water outlet is radiated using the current in dividing plate accommodating chamber to Reflow Soldering carrier, realizes the quick of Reflow Soldering carrier
Rise again, it is to avoid Reflow Soldering carrier expands with heat and contract with cold, influence service life；It in the upper end of Storage tray by setting radiator fan and cunning
Dynamic device, radiating treatment is carried out to the Reflow Soldering carrier in Storage tray, is closed by the air-cooled cold junction that adds water so that Reflow Soldering carrier enters
One step fast cooling, cooling rate is fast, good cooling effect；It, can by setting control valve respectively on water inlet pipe and outlet pipe
To be controlled to the water velocity inside dividing plate accommodating chamber, fully heat absorption is realized.The present apparatus is simple in construction, easy to operate, real
It is high with property.
Brief description of the drawings：
The following drawings is only intended to, in doing schematic illustration and explanation to the present invention, not delimit the scope of the invention.Wherein：
Fig. 1 is a kind of pcb board Reflow Soldering carrier storing unit structural representation of one embodiment of the invention；
Fig. 2 is a kind of pcb board Reflow Soldering carrier storing unit sectional view of one embodiment of the invention；
Fig. 3 is a kind of pcb board Reflow Soldering carrier storing unit top view of one embodiment of the invention.
Symbol description in figure：
1- Storage trays, 2- dividing plates, 3- water inlet pipes, 4- outlet pipes, 5- water inlet control valves, 6- outlet water control valves, 7- radiation airs
Fan, 8- carriages, 13- limiting plates, 14- baffle plates, the sealing shrouds of 15- first, the sealing shrouds of 16- second, 101- level boards, 102- is erected
Straight panel, the necks of 103- first, the necks of 104- second, 201- accommodating chambers, 202- inlet openings, 203- apopores, 801- rail plates,
802- sliding shoes.
Embodiment：
As shown in Figure 1, Figure 2, Figure 3 shows, a kind of pcb board Reflow Soldering carrier storing unit of the invention, including：
Storage tray 1, the Storage tray 1 includes level board 101 and is molded over the vertical plate 102 of the rear end of level board 101,
Formed on the level board 101 and form some second necks 104, institute on some first necks 103, the vertical plate 102
The first neck 103 is stated to connect with second neck 104.The front end of level board 101 of the Storage tray 1 forms limiting plate 13.
The both sides of the Storage tray 1 are fixedly installed baffle plate 14.
Dividing plate 2, the dividing plate 2 is fixed on the both sides of first neck 103 and second neck 104, the dividing plate 2
Lower end be fixed on the level board 101, the rear end of the dividing plate 2 is fixed on the vertical plate 102, in the dividing plate 2
Form to form above accommodating chamber 201, the rear end of the dividing plate 2 and formed below inlet opening 202, the rear end of the dividing plate 2
Apopore 203, the inlet opening 202 and the apopore 203 are connected with the accommodating chamber 201 respectively.The dividing plate 2 is ladder type
Dividing plate, the height of the front end of dividing plate 2 is less than the height of the rear end of dividing plate 2.
Water inlet pipe 3 and outlet pipe 4, the water inlet pipe 3 are connected after passing through the vertical plate 102 with the inlet opening 202, institute
State and water inlet control valve 5 is provided with water inlet pipe 3, the outlet pipe 4 connects after passing through the vertical plate 102 with the apopore 203
It is logical, it is provided with outlet water control valve 6 on the outlet pipe 4.The junction of the water inlet pipe 3 and the inlet opening 202 is provided with the
One sealing shroud 15, the junction of the outlet pipe 4 and the apopore 203 is provided with the second sealing shroud 16.
Radiator fan 7 and carriage 8, the carriage 8 are fixedly installed on the upper surface of the vertical plate 102, institute
State the upper surface that radiator fan 7 is slidably arranged in the vertical plate 102 by the carriage 8.The carriage 8 includes
Rail plate 801 and the sliding shoe 802 being arranged on the rail plate 801, the rail plate 801 are fixedly installed on described
The upper surface of vertical plate 102, the sliding shoe 802 is fixedly connected with the radiator fan 7.The radiator fan 7 and the slip
Device 8 is respectively two.
A kind of pcb board Reflow Soldering carrier storing unit described in the present embodiment, including Storage tray, the first neck, the second card
Groove, dividing plate, water inlet pipe, outlet pipe, water inlet control valve, outlet water control valve, radiator fan, carriage etc..It passes through in storage
Neck is set on seat, Reflow Soldering carrier is positioned in neck, accommodating chamber is set by the diaphragm internal in neck both sides, accommodated
Chamber is connected with apopore and inlet opening, passes through water inlet tube of intaking, outlet pipe water outlet, using the current in dividing plate accommodating chamber to backflow
Weldering carrier is radiated, and realizes the fast temperature rising of Reflow Soldering carrier, it is to avoid Reflow Soldering carrier expands with heat and contract with cold, and influences service life；
It is carried out at radiating by setting radiator fan and carriage in the upper end of Storage tray to the Reflow Soldering carrier in Storage tray
Reason, is closed by the air-cooled cold junction that adds water and causes the further fast cooling of Reflow Soldering carrier, cooling rate is fast, good cooling effect；It leads to
Cross and control valve is set respectively on water inlet pipe and outlet pipe, the water velocity inside dividing plate accommodating chamber can be controlled, it is real
Now fully heat absorption.The present apparatus is simple in construction, easy to operate, practicality is high.
Obviously, above-described embodiment is only intended to clearly illustrate example, and the not restriction to embodiment.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of change or
Change.There is no necessity and possibility to exhaust all the enbodiments.And the obvious change thus extended out or
Among changing still in the protection domain of the invention.
Claims (7)
1. a kind of pcb board Reflow Soldering carrier storing unit, it is characterised in that including：
Storage tray (1), the Storage tray (1) includes level board (101) and is molded over the vertical plate of the level board (101) rear end
(102), formed on the level board (101) and some are formed on some first necks (103), the vertical plate (102)
Two draw-in groove (104), first neck (103) connects with second neck (104)；
Dividing plate (2), the dividing plate (2) is fixed on the both sides of first neck (103) and second neck (104), described
The lower end of dividing plate (2) is fixed on the level board (101), and the rear end of the dividing plate (2) is fixed on the vertical plate (102)
On, formed in the dividing plate (2) and form inlet opening (202) above accommodating chamber (201), the rear end of the dividing plate (2), it is described
Form apopore (203) below the rear end of dividing plate (2), the inlet opening (202) and the apopore (203) respectively with it is described
Accommodating chamber (201) is connected；
Water inlet pipe (3) and outlet pipe (4), the water inlet pipe (3) through the vertical plate (102) afterwards with the inlet opening (202)
Connection, is provided with water inlet control valve (5) on the water inlet pipe (3), the outlet pipe (4) through the vertical plate (102) afterwards with
Outlet water control valve (6) is provided with apopore (203) connection, the outlet pipe (4)；
Radiator fan (7) and carriage (8), the carriage (8) are fixedly installed on the upper table of the vertical plate (102)
Face, the radiator fan (7) is slidably arranged in the upper surface of the vertical plate (102) by the carriage (8).
2. pcb board Reflow Soldering carrier storing unit according to claim 1, it is characterised in that：The water of the Storage tray (1)
Flat board (101) front end forms limiting plate (13).
3. pcb board Reflow Soldering carrier storing unit according to claim 1, it is characterised in that：The two of the Storage tray (1)
Side is fixedly installed baffle plate (14).
4. pcb board Reflow Soldering carrier storing unit according to claim 1, it is characterised in that：The dividing plate (2) is ladder type
Dividing plate, the height of dividing plate (2) front end is less than the height of the dividing plate (2) rear end.
5. pcb board Reflow Soldering carrier storing unit according to claim 1, it is characterised in that：The water inlet pipe (3) and institute
The junction for stating inlet opening (202) is provided with the first sealing shroud (15), the outlet pipe (4) and the company of the apopore (203)
The place of connecing is provided with the second sealing shroud (16).
6. pcb board Reflow Soldering carrier storing unit according to claim 1, it is characterised in that：Carriage (8) bag
The sliding shoe (802) for including rail plate (801) and being arranged on the rail plate (801), the rail plate (801) is fixed
The upper surface of the vertical plate (102) is arranged on, the sliding shoe (802) is fixedly connected with the radiator fan (7).
7. pcb board Reflow Soldering carrier storing unit according to claim 6, it is characterised in that：The radiator fan (7) and
The carriage (8) is respectively two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710196830.XA CN107148162B (en) | 2017-03-29 | 2017-03-29 | A kind of pcb board Reflow Soldering carrier storing unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710196830.XA CN107148162B (en) | 2017-03-29 | 2017-03-29 | A kind of pcb board Reflow Soldering carrier storing unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107148162A true CN107148162A (en) | 2017-09-08 |
| CN107148162B CN107148162B (en) | 2019-05-24 |
Family
ID=59783509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710196830.XA Active CN107148162B (en) | 2017-03-29 | 2017-03-29 | A kind of pcb board Reflow Soldering carrier storing unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107148162B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413888A (en) * | 2018-12-13 | 2019-03-01 | 奥士康科技股份有限公司 | A kind of PCB automation Reflow Soldering carrier |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103042289A (en) * | 2012-12-31 | 2013-04-17 | 北京中科同志科技有限公司 | Cooling system and reflow welding machine |
| CN203018883U (en) * | 2012-12-31 | 2013-06-26 | 北京中科同志科技有限公司 | Cooling system and reflow oven |
| CN204221157U (en) * | 2014-10-11 | 2015-03-25 | 上海晨兴希姆通电子科技有限公司 | A kind of reflow oven |
| CN205237279U (en) * | 2015-12-09 | 2016-05-18 | 上海斐讯数据通信技术有限公司 | Cooling rack is put to STM carrier |
-
2017
- 2017-03-29 CN CN201710196830.XA patent/CN107148162B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103042289A (en) * | 2012-12-31 | 2013-04-17 | 北京中科同志科技有限公司 | Cooling system and reflow welding machine |
| CN203018883U (en) * | 2012-12-31 | 2013-06-26 | 北京中科同志科技有限公司 | Cooling system and reflow oven |
| CN204221157U (en) * | 2014-10-11 | 2015-03-25 | 上海晨兴希姆通电子科技有限公司 | A kind of reflow oven |
| CN205237279U (en) * | 2015-12-09 | 2016-05-18 | 上海斐讯数据通信技术有限公司 | Cooling rack is put to STM carrier |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109413888A (en) * | 2018-12-13 | 2019-03-01 | 奥士康科技股份有限公司 | A kind of PCB automation Reflow Soldering carrier |
| CN109413888B (en) * | 2018-12-13 | 2024-03-22 | 奥士康科技股份有限公司 | Automatic reflow soldering carrier for PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107148162B (en) | 2019-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204331597U (en) | A kind of high-efficient heat-dissipating computer host box | |
| CN206647156U (en) | A kind of heat dissipation type high automobile exhaust steel pipe | |
| CN204794749U (en) | Inverters | |
| CN114264088A (en) | Absorption tower combining injection and falling film, absorption refrigeration system and operation method thereof | |
| CN206431561U (en) | A kind of cooling circulating water automatic water-replenishing device | |
| CN201138099Y (en) | Direct cooling circulated water refrigerating mechanism | |
| CN113835502A (en) | Liquid cooling system and immersion type cooling installation box thereof | |
| CN206461893U (en) | Big-power transducer water-cooling system and device | |
| CN107148162A (en) | A kind of pcb board Reflow Soldering carrier storing unit | |
| CN106411110A (en) | Heat radiation controllable frequency converter | |
| CN205014696U (en) | Hydrologic cycle formula stepped cooling condenser | |
| CN204189120U (en) | Computing machine circulator bath cooling-down type cabinet | |
| CN203515774U (en) | Secondary water tank and vehicle | |
| CN206178610U (en) | Quick -witted case of circulation heat dissipation | |
| CN206180826U (en) | Controllable converter dispels heat | |
| CN105126379B (en) | A kind of mercury vapour chiller | |
| CN212324589U (en) | Heat dissipation case of switch | |
| CN210463587U (en) | Heat conduction oil heater | |
| CN209386843U (en) | A kind of evaporative condenser oil cooler | |
| CN203880678U (en) | Circulation type optical radiation energy exchange steam generating system | |
| CN107551769B (en) | Vehicle-mounted glycol dewatering device and absorption system | |
| CN205800779U (en) | Two-chamber expansion tank | |
| CN206583348U (en) | A kind of plate-fin heat exchanger plug-in type filming device | |
| CN210441724U (en) | Device for reducing air in PCW water tank from entering PCW system | |
| CN203421834U (en) | Air-source vertical-type heat preservation water tank |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20190419 Address after: 317 700 No. 511 Huangjiao Village, Zhang'an Street, Jiaojiang District, Taizhou City, Zhejiang Province Applicant after: He Yingying Address before: 523000 room 436, Qian Qian building, 27 Guangming Road, Dongcheng District, Dongguan, Guangdong Applicant before: DONGGUAN QINZHI INDUSTRIAL DESIGN Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190620 Address after: 430223 No. 9 Sunshine Avenue, Miaoshan Development Zone, Jiangxia District, Wuhan City, Hubei Province Patentee after: WUHAN SAN FRAN ELECTRONICS Corp. Address before: 510000 B1B2, one, two, three and four floors of the podium building 231 and 233, science Avenue, Guangzhou, Guangdong. Patentee before: BOAO ZONGHENG NETWORK TECHNOLOGY Co.,Ltd. Effective date of registration: 20190620 Address after: 510000 B1B2, one, two, three and four floors of the podium building 231 and 233, science Avenue, Guangzhou, Guangdong. Patentee after: BOAO ZONGHENG NETWORK TECHNOLOGY Co.,Ltd. Address before: 317 700 No. 511 Huangjiao Village, Zhang'an Street, Jiaojiang District, Taizhou City, Zhejiang Province Patentee before: He Yingying |