CN205237279U - Cooling rack is put to STM carrier - Google Patents
Cooling rack is put to STM carrier Download PDFInfo
- Publication number
- CN205237279U CN205237279U CN201521020331.8U CN201521020331U CN205237279U CN 205237279 U CN205237279 U CN 205237279U CN 201521020331 U CN201521020331 U CN 201521020331U CN 205237279 U CN205237279 U CN 205237279U
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- body frame
- stm
- shell
- carrier
- frame
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- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The utility model provides a cooling rack is put to STM carrier, the cooling rack includes: the body frame, be provided with the guide way on the body frame, the guide way is used for placing the PCB board, the shell, with the body frame cooperatees, the body frame embedding in the shell, the shell with the body frame constitutes an accommodation space, heat abstractor, the fixed setting in the accommodation space, it is right to be used for the PCB board dispels the heat. The utility model provides an upgrading transition of the operation of growing out of nothing has been realized to the cooling rack, and it is unstable to have solved present reflow soldering carrier demand quality, and normal production and processing cost is big, produces line reflow soldering carrier and puts in disorder problem, the outward appearance is compact, and the turnover of reflow soldering carrier is convenient, and the radiating effect is good, and convenient to production operation person easy operation, need not to train the professional skill.
Description
Technical field
The utility model relates to Electronic Product SMT and manufactures field, relates in particular to a kind of STMCarrier is put refrigeration bench frame.
Background technology
Electronic Product SMT manufacturing at present, along with the specific demand of product practicality, PCBThe structure attenuation that need to diminish. PCB structure diminishes attenuation to Electronic Product SMT manufacturing bandThe difficulty of coming must be used a large amount of auxiliary carrier cooperations exactly can complete the manufacturing, refluxesWeldering carrier is that wherein demand consumption is the most common is also that demand consumption is maximum, a SMT line volume productionNormal production, Reflow Soldering carrier needs standby 80PCS just can normally move. If fluid welding carrier is longTime is at high temperature used, cannot rise again in time, and this carrier principle of expanding with heat and contracting with cold, precision is carriedTool there will be the abnormal appearance of tolerance distortion.
Utility model content
In view of the above problems, the application has recorded a kind of STM carrier and has put refrigeration bench frame, instituteStating refrigeration bench frame comprises:
Body frame, is provided with gathering sill on described body frame, and described gathering sill is in order to place pcb board;
Shell, matches with described body frame, and described body frame embeds in described shell, described shellForm an accommodation space with described body frame;
Heat abstractor, is fixedly installed in described accommodation space, in order to described pcb board is enteredRow heat radiation;
Preferably, described body frame comprises:
Base plate, is provided with many first gathering sills on described base plate;
Riser, described riser is vertically set on described base plate, and the lower end of described riser is provided withMany the second gathering sills, described the first gathering sill is corresponding one by one with described the second gathering sill, formsDescribed gathering sill;
Louvre, is arranged on the upper end of described riser, and described heat abstractor is by described louvreDescribed PCB is dispelled the heat.
Preferably, on described shell, be provided with multiple through holes.
Preferably, described heat abstractor comprises multiple radiator fans.
Preferably, described radiator fan is fixedly mounted on described riser, described louvre and instituteState radiator fan corresponding one by one.
Preferably, power interface and power switch are installed on described shell, described power interfaceBe electrically connected with described radiator fan, power supply supplies to described radiator fan by described power interfaceElectricity; Described power switch is connected with described power interface, in order to whether to control described power supply to instituteState radiator fan power supply.
Preferably, described body frame is made up of bakelite, and the thickness of described bakelite is 18～22mm.
Preferably, described shell is made up of alloy sheets, and the thickness of described alloy sheets is 2～4mm.
Technique scheme tool has the following advantages or beneficial effect: it is cooling that the utility model providesStand has been realized upgrading transition of the operation of growing out of nothing, and has solved current Reflow Soldering carrier demand productMatter is unstable, and normal production and processing cost is large, produces line Reflow Soldering carrier and puts in disorder problem; OutwardSee compactness, the turnover of Reflow Soldering carrier is convenient, good heat dissipation effect, and operate for production operation personSimple and convenient, without training professional skill.
Brief description of the drawings
With reference to appended accompanying drawing, to describe more fully embodiment of the present utility model. But,Appended accompanying drawing only, for explanation and elaboration, does not form the restriction to the utility model scope.
Fig. 1 is the use state signal that a kind of STM carrier of the utility model is put refrigeration bench frameFigure;
Fig. 2 is that a kind of STM carrier of the utility model is put the structure of body frame in refrigeration bench frame and shownIntention;
Fig. 3 is that the structure that a kind of STM carrier of the utility model is put refrigeration bench frame housing is shownIntention;
Fig. 4 A is that a kind of STM carrier of the utility model is put radiator fan in refrigeration bench frameFront view;
Fig. 4 B is that a kind of STM carrier of the utility model is put radiator fan in refrigeration bench frameRight view;
Fig. 5 A is that a kind of STM carrier of the utility model is put power interface in refrigeration bench frameFront view;
Fig. 5 B is that a kind of STM carrier of the utility model is put power interface in refrigeration bench frameRight view;
Fig. 6 A is that a kind of STM carrier of the utility model is put power switch in refrigeration bench frameFront view;
Fig. 6 B is that a kind of STM carrier of the utility model is put power switch in refrigeration bench frameLeft view.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model STM carrier is put to cooling benchFrame is elaborated.
As shown in Figure 1, a kind of STM (SurfaceMountTechnology, surface mountTechnology) carrier puts refrigeration bench frame, comprising:
Body frame 1, is provided with gathering sill on described body frame 1, for placing pcb board 00;
Shell 2, matches with described body frame 1, and described body frame 1 embeds in described shell 2,Shell 2 forms a space structure (accommodation space) with described body frame 1;
Heat abstractor 3, is fixedly installed in the space structure that shell 2 and body frame 1 form, and usesSo that pcb board 00 is dispelled the heat.
Specifically, as shown in Figure 2, described body frame 1 comprises:
Base plate 11, is provided with many first gathering sills 14 on described base plate 11;
Riser 12, described riser 12 is vertically set on described base plate 11, and described riser12 lower end is provided with many second gathering sills 15, the second gathering sill on described riser 1215 is corresponding one by one with the first gathering sill 14 of described base plate 11, forms described gathering sill, usesTo place pcb board 00;
Louvre 13, is arranged on the upper end of described riser 12, and described heat abstractor 3 passes through instituteStating louvre 13 dispels the heat to described pcb board 00.
In the present embodiment, base plate 11 and riser 12 form one " L " type structure, describedThe lower end of riser 12, is provided with many gathering sills, and first on this gathering sill and base plate 11 ledCorresponding one by one to groove 14. When place a pcb board 00 on this refrigeration bench frame time, by this PCBPlate 00 put into any first gathering sill 14 of base plate 11 and this first gathering sill 14 withOn riser 12, in corresponding the second gathering sill 15, these two gathering sills are by this pcb board 00Fixing vertically placement.
In addition, described shell 2 matches with described body frame 1, and described body frame 1 can embed instituteState in shell 2. Shell 2 forms an accommodation space with body frame 1, and heat abstractor 3 fixedly mountsIn this accommodation space. Therefore, the louvre 13 on body frame 1 is a pair of with heat abstractor 3 oneShould, such design is conducive to pcb board 00 to dispel the heat. Meanwhile, as Fig. 3 instituteShow, multiple through holes 21 be set on shell 2, be conducive to the diffusion of heat in accommodation space,Thereby improve the heat radiation function to pcb board 00.
In the present embodiment, as shown in Figure 4 A and 4 B shown in FIG., described heat abstractor 3 can beMultiple radiator fans, described louvre 13 is corresponding one by one with described radiator fan. In addition, mainFrame 1 is mainly made up through nonstandard machined of bakelite, and shell 2 is made up of alloy sheets Bending Processing.Gathering sill on body frame 1 is slotted and is made on base plate 11 and riser 12 by NC machine, gathering sillThe degree of depth be 5.2mm. Preferably, a STM carrier is put on refrigeration bench frame and is arranged 30The gathering sill of individual 5.2mm, connects combination by M4 screw between body frame 1 and shell 2, main4 of the radiator fans that frame 1 back connects, leave power switch and power interface and connect on shell 2Connect. Body frame 1 can select the bakelite of corresponding size to make according to actual demand and manufacture craft,And based on cost of manufacture and many considerations such as technique is simple and easy, can adopt thickness to beThe bakelite of 20mm ± 0.5mm carries out the making of body frame 1, preferably can adopt such asThe bakelite of 19.5mm, 20mm or 20.5mm equidimension is made this body frame. Shell 2 can be complied withSelect the alloy sheets of corresponding size to make according to actual demand and manufacture craft, and based on cost of manufactureAnd many considerations such as technique is simple and easy, can adopt thickness is the alloy sheets of 3mm ± 0.2mm,Good adopt the alloy sheets such as 2.8mm, 3mm or 3.2mm.
Described refrigeration bench frame also comprises power interface (as shown in Fig. 5 A and Fig. 5 B) and power supplySwitch (as shown in Figure 6 A and 6 B), described power interface is arranged on described shell 2,Described power switch is connected with described power interface, in order to control whether work of described radiator fanDo, described power interface is electrically connected with described radiator fan.
Specifically, the hexagon socket head cap screw that radiator fan is M4 by model is fixed on body frame 1,Described louvre 13 is corresponding one by one with described radiator fan. On shell 2, power switch is installedAnd power interface. Specifically, radiator fan leaves with attached way and power interface and power supplyClose connection.
The utility model is classified as universal stand, and the Reflow Soldering carrier that can meet all products is returnedPut, greatly reduce SMT and manufacture processing cost, understand SMT with 5S angle and manufactureProduce line be not in disorder, Reflow Soldering carrier SMT manufacture use in had arrangement,Rectifying good ownership processes. The big or small 540MM*400MM*370MM of the utility model entirety,Add up to weight: 12 kilograms, facilitate single resettlement movement to put; Z and Y-direction are spacing for doingIsolation, puts conclusion so can meet the Reflow Soldering carrier of all products. In addition this stand,Realize upgrading transition of the operation of growing out of nothing, solved current Reflow Soldering carrier demand quality notStable, normal production and processing cost is large, produces line Reflow Soldering carrier and puts in disorder problem; Outward appearance is tightGather, the turnover of Reflow Soldering carrier is convenient, good heat dissipation effect, and simple to operate for production operation personConvenient, without training professional skill.
The utility model discloses a kind of refrigeration bench frame and can reduce manufacturing cost, therebyBut improved manufacturing quality, a SMT line volume production is normally produced, and Reflow Soldering carrier needsStandby 60PCS and can normally moving, and the normal service life of Reflow Soldering carrier increases than original30%.
For a person skilled in the art, read after above-mentioned explanation various changes and modificationsUndoubtedly will be apparent. Therefore, appending claims should be regarded as and contains the utility modelTrue intention and whole variations and the correction of scope. Any and institute within the scope of claimsThere are scope of equal value and content, all should think and still belong in intention of the present utility model and scope.
Claims (8)
1. STM carrier is put a refrigeration bench frame, it is characterized in that, described refrigeration bench frame comprises:
Body frame, is provided with gathering sill on described body frame, and described gathering sill is in order to place pcb board;
Shell, matches with described body frame, and described body frame embeds in described shell, and described shell and described body frame form an accommodation space;
Heat abstractor, is fixedly installed in described accommodation space, in order to described pcb board is dispelled the heat.
2. STM carrier according to claim 1 is put refrigeration bench frame, it is characterized in that, described body frame comprises:
Base plate, is provided with many first gathering sills on described base plate;
Riser, described riser is vertically set on described base plate, and the lower end of described riser is provided with many second gathering sills, and described the first gathering sill is corresponding one by one with described the second gathering sill, forms described gathering sill;
Louvre, is arranged on the upper end of described riser, and described heat abstractor dispels the heat to described PCB by described louvre.
3. STM carrier according to claim 1 is put refrigeration bench frame, it is characterized in that, is provided with multiple through holes on described shell.
4. STM carrier according to claim 1 is put refrigeration bench frame, it is characterized in that, described heat abstractor comprises multiple radiator fans.
5. STM carrier according to claim 2 is put refrigeration bench frame, it is characterized in that, described radiator fan is fixedly mounted on described riser, and described louvre is corresponding one by one with described radiator fan.
6. STM carrier according to claim 3 is put refrigeration bench frame, it is characterized in that, power interface and power switch are installed on described shell, and described power interface is electrically connected with described radiator fan, and power supply is powered to described radiator fan by described power interface; Described power switch is connected with described power interface, in order to whether to control described power supply to described radiator fan power supply.
7. STM carrier according to claim 1 is put refrigeration bench frame, it is characterized in that, described body frame is made up of bakelite, and the thickness of described bakelite is 20mm ± 0.5mm.
8. STM carrier according to claim 6 is put refrigeration bench frame, it is characterized in that, described shell is made up of alloy sheets, and the thickness of described alloy sheets is 3mm ± 0.2mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521020331.8U CN205237279U (en) | 2015-12-09 | 2015-12-09 | Cooling rack is put to STM carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521020331.8U CN205237279U (en) | 2015-12-09 | 2015-12-09 | Cooling rack is put to STM carrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205237279U true CN205237279U (en) | 2016-05-18 |
Family
ID=55936358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521020331.8U Expired - Fee Related CN205237279U (en) | 2015-12-09 | 2015-12-09 | Cooling rack is put to STM carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205237279U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106624256A (en) * | 2016-12-30 | 2017-05-10 | 东莞市圣荣自动化科技有限公司 | Reflow soldering carrier storage table with improved structure |
| CN107148162A (en) * | 2017-03-29 | 2017-09-08 | 东莞市秦智工业设计有限公司 | A kind of pcb board Reflow Soldering carrier storing unit |
| CN108296583A (en) * | 2018-02-06 | 2018-07-20 | 海宁双迪电子照明有限公司 | A kind of LED lamp circuit plate Soldering machine |
-
2015
- 2015-12-09 CN CN201521020331.8U patent/CN205237279U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106624256A (en) * | 2016-12-30 | 2017-05-10 | 东莞市圣荣自动化科技有限公司 | Reflow soldering carrier storage table with improved structure |
| CN106624256B (en) * | 2016-12-30 | 2019-03-15 | 孙美玲 | A kind of improved Reflow Soldering carrier lodging bench of structure |
| CN107148162A (en) * | 2017-03-29 | 2017-09-08 | 东莞市秦智工业设计有限公司 | A kind of pcb board Reflow Soldering carrier storing unit |
| CN107148162B (en) * | 2017-03-29 | 2019-05-24 | 何莹莹 | A kind of pcb board Reflow Soldering carrier storing unit |
| CN108296583A (en) * | 2018-02-06 | 2018-07-20 | 海宁双迪电子照明有限公司 | A kind of LED lamp circuit plate Soldering machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160518 Termination date: 20181209 |